HLMP-1350 Low Profile T-1 (3 mm) LED Lamps Data Sheet HLMP-1350, HLMP-1450, HLMP-1550 Description Features This family of diffused solid state lamps is especially suited for applications where small package size is required without sacrificing luminous intensity. The HLMP-1350 is a red tinted lamp providing a wide viewing angle. The HLMP-1450 and HLMP-1550 are similar products in yellow and green respectively. * Low profile height * Small T-1 size diameter 3.18 mm (0.125 inch) * High intensity * IC compatible * Choice of 3 bright colors High Efficiency Red Yellow High Performance Green Package Dimensions Selection Guide Part Number Luminous Intensity Iv (mcd) Min. Typ. Max. Test Condition (mA) Typical Viewing Angle[1] (Degrees), 2q1/2 Dominant Wavelength[2] HLMP-1350 1.3 2.3 10.0 55 626 HLMP-1350-C00xx 1.3 2.3 10.0 55 626 HLMP-1450 1.4 2.2 10.0 55 585 HLMP-1450-B00xx 1.4 2.2 10.0 55 585 HLMP-1550 1.0 3.1 20.0 55 569 HLMP-1550-A00xx 1.0 3.1 20.0 55 569 HLMP-1550-BC0xx 1.6 2.8 20.0 55 569 5.2 Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial intensity. 2. The dominant wavelength, ld , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Part Numbering System HLMP - x x xx - x x x xx Mechanical Option 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle 50: 55 degrees Color Options 3: GaP HER 4: GaP Yellow 5: GaP Green Package Options 1: T-1 (3 mm 2 Absolute Maximum Ratings Parameter HER Yellow Green Units Peak Forward Current 90 60 90 mA Average Forward Current 25 20 25 mA DC Current 30 20 30 mA Reverse Voltage 5 5 5 V Transient Forward Current (10 sec Pulse) 500 500 500 A LED Junction Temperature 110 110 110 C Operating Temperature Range -55 to +100 -55 to +100 -20 to +100 C Storage Temperature Range -55 to +100 Notes: 1. See Figure 5 (HER/Orange), 10 (Yellow), or 15 (Green/Emerald Green) to establish pulsed operating conditions. 2. For Red, Orange, and Green series derate linearly from 50C at 0.5 mA/C. For Yellow series derate linearly from 50C at 0.2 mA/C. 3. For Red, Orange, and Green series derate power linearly from 25C at 1.8 mW/C. For Yellow series derate power linearly from 50C at 1.6 mW/C. 4. The transient peak current is the maximum nonrecurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. 3 Electrical Characteristics at TA = 25C Symbol Description Device HLMP Min. Typ. Max. Units Test Conditions 21/2 Included Angle Between Half Intensity Points 1350 1450 1550 55 55 55 Deg. Note 1 peak Peak Wavelength 1350 1450 1550 635 583 565 nm Note 2 d Dominant Wavelength 1350 1450 1550 626 585 569 nm 1/2 Spectral Line Halfwidth 1350 1450 1550 40 36 28 nm s Speed of Response 1350 1450 1550 90 90 500 ns C Capacitance 1350 1450 1550 11 15 18 pF VF = 0 f = 1 MHz RJ-PIN Thermal Resistance 1350 1450 1550 290 C/W Junction to Cathode Lead VF Forward Voltage 1350 1450 1550 1.6 1.6 1.6 V IF = 10 mA VR Reverse Breakdown Voltage 1350 1450 1550 5.0 5.0 5.0 V IR = 100 A v Luminous Efficacy 1350 1450 1550 lumens/ watt Note 3 1.9 2.0 2.1 145 500 595 3.0 3.0 3.0 Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in watts/steradian, may be found from the equation I e = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 4 RELATIVE INTENSITY 1.0 HIGH PERFORMANCE GREEN YELLOW TA = 25 C HIGH EFFICIENCY RED 0.5 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. High Efficiency Red HLMP-1350 Figure 2. Forward current vs. forward voltage characteristics. Figure 3. Relative luminous intensity vs. DC forward current. Figure 5. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings) Figure 6. Relative luminous intensity vs. angular displacement. 5 Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LED current. Yellow HLMP-1450 Figure 9. Relative efficiency (luminous intensity per unit current) vs. peak current. Figure 7. Forward current vs. forward voltage characteristics. Figure 8. Relative luminous intensity vs. DC forward current. Figure 10. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings) Figure 11. Relative luminous intensity vs. angular displacement. 6 Green HLMP-1550 Figure 12. Forward current vs. forward voltage characteristics. Figure 13. Relative luminous intensity vs. forward current. Figure 15. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings) Figure 16. Relative luminous intensity vs. angular displacement. 7 Figure 14. Relative efficiency (luminous intensity per unit current) vs. peak LED current. Intensity Bin Limits Intensity Bin Limits, continued Color Bin Intensity Range (mcd) Min. Max. Color Bin Intensity Range (mcd) Min. Max. Red C 1.5 2.4 Yellow B 1.6 2.5 D 2.4 3.8 C 2.5 4.0 E 3.8 6.1 D 4.0 6.5 F 6.1 9.7 E 6.5 10.3 G 9.7 15.5 F 10.3 16.6 H 15.5 24.8 G 16.6 26.5 I 24.8 39.6 H 26.5 42.3 J 39.6 63.4 I 42.3 67.7 K 63.4 101.5 J 67.7 108.2 L 101.5 162.4 K 108.2 173.2 M 162.4 234.6 L 173.2 250.0 N 234.6 340.0 M 250.0 360.0 O 340.0 540.0 N 360.0 510.0 P 540.0 850.0 O 510.0 800.0 Q 850.0 1200.0 P 800.0 1250.0 R 1200.0 1700.0 Q 1250.0 1800.0 S 1700.0 2400.0 R 1800.0 2900.0 T 2400.0 3400.0 S 2900.0 4700.0 U 3400.0 4900.0 T 4700.0 7200.0 V 4900.0 7100.0 U 7200.0 11700.0 W 7100.0 10200.0 V 11700.0 18000.0 X 10200.0 14800.0 W 18000.0 27000.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Maximum tolerance for each bin limit is 18%. 8 Maximum tolerance for each bin limit is 18%. Intensity Bin Limits, continued Color Categories Color Bin Intensity Range (mcd) Min. Max. Green A 1.1 1.8 B 1.8 2.9 C 2.9 4.7 D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Color Green Yellow Orange Tolerance for each bin limit is 0.5 nm. Maximum tolerance for each bin limit is 18%. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag 9 Category # 6 5 4 3 2 1 3 2 4 5 1 2 3 4 5 6 7 8 Lambda (nm) Min. 561.5 564.5 567.5 570.5 573.5 582.0 584.5 587.0 589.5 592.0 597.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 Max. 564.5 567.5 570.5 573.5 576.5 584.5 587.0 589.5 592.0 593.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 619.5 Precautions: Lead Forming * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through hole sizes for LED component leads: * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: Pre-heat Temperature Wave Soldering 105 C Max. Manual Solder Dipping - Pre-heat Time Peak Temperature 30 sec Max. 250 C Max. - 260 C Max. Dwell Time 3 sec Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE TEMPERATURE - C 250 Diagonal 0.646 mm (0.025 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME - SECONDS Figure 17. Recommended wave soldering profile. 10 LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 90 100 For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2811EN 5989-4255EN May 31, 2006