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Features
* Meet ROHS, Green Product.
* Extra Thin (0.80H mm) Chip LED
* Ultra Bright InGaN Chip LED
* Package In 8mm Tape On 7" Diameter Reels.
* EIA STD package.
* I.C. compatible.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared Reflow Solder Process.
Package Dimensions
Part no. Lens Source Color
LTST-C190TBKT Water Clear InGaN Blue
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.
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Absolute Maximum Ratings At Ta=25℃
℃℃
℃
Parameter LTST-C190TBKT
Unit
Power Dissipation 76 mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width) 100 mA
DC Forward Current 20 mA
Operating Temperature Range -20°C to + 80°C
Storage Temperature Range -30°C to + 100°C
Infrared Soldering Condition 260°C For 10 Seconds
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Suggestion Profile:
Suggestion IR Reflow Profile For Pb Free Process
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Electrical Optical Characteristics At Ta=25℃
℃℃
℃
Parameter Symbol Part No.
LTST-
Min. Typ. Max. Unit Test Condition
Luminous Intensity IV C190TBKT
28.0 - 180.0 mcd IF = 20mA
Note 1
Viewing Angle 2θ1/2 C190TBKT
130 deg Note 2 (Fig.6)
Peak Emission Wavelength
λP C190TBKT
468 nm Measurement
@Peak (Fig.1)
Dominant Wavelength λd C190TBKT
465.0 - 475.0 nm IF = 20mA
Note 3
Spectral Line Half-Width Δλ C190TBKT
25 nm
Forward Voltage VF C190TBKT
2.80 - 3.80 V IF = 20mA
Reverse Current IR C190TBKT
10 μA VR = 5V
Note 5
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.
4. Caution in ESD:
Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic
glove when handling the LED. All devices, equipment and machinery must be properly grounded.
5. Reverse voltage (VR) condition is applied to IR test only. The device is not designed for reverse operation.
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Bin Code List
Part No. : LTST-C190TBKT Page : 5 of 12
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Forward Voltage Unit: V @20mA
Bin Code Min. Max.
D7 2.80 3.00
D8 3.00 3.20
D9 3.20 3.40
D10 3.40 3.60
D11 3.60 3.80
Tolerance on each Forward Voltage bin is +/-0.1 volt
Luminous Intensity Unit : mcd @20mA
Bin Code Min. Max.
N 28.0 45.0
P 45.0 71.0
Q 71.0 112.0
R 112.0 180.0
Tolerance on each Intensity bin is +/-15%
Dominant Wavelength Unit : nm @20mA
Bin Code Min. Max.
AC 465.0 470.0
AD 470.0 475.0
Tolerance for each Dominate Wavelength bin is +/- 1nm
LITE-ON TECHNOLOGY CORPORATION
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Typical Electrical / Optical Characteristics Curves
(25 °C Ambient Temperature Unless Otherwise Noted)
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Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol
at normal temperature for
less one minute.
Suggest Soldering Pad Dimensions
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
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Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-3000 pieces per reel.
3. Minimum packing quantity is 500 pcs for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.
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Part No. : LTST-C190TBKT Page : 9 of 12
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1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The package is sealed:
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within
one year, while the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than one week should be baked at about 60 deg C
for at least 20 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering Soldering iron
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
Temperature
Soldering time 300°C Max.
3 sec. Max.
(one time only)
Soldering notes:
Because different board designs use different number and types of devi
ces, solder pastes, reflow ovens, and
circuit boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper
guidelines and
PCB-specific characterization.
LITE-ON Runs both component-level verification using in-house
KYRAMX98
reflow chambers and
board-level assembly.
The results of this testing are verified through post-reflow reliability testing.
Profiles used at LITE-ON are based on JEDEC standards to ensure
that all packages can be successfully and
reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards.
You can use this example as a generic target to set up your reflow process.
You should adhere to the JEDEC profile limits as well as specifications and
recommendations from the
solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
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Part No. : LTST-C190TBKT Page : 10 of 12
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5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low
forward voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP
product.
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7. Reliability Test
Classification
Test Item
Test Condition Reference Standard
Operation Life Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B
JIS C 7021:B-11
High Temperature
Storage Ta= 105±5℃
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008
JIS C 7021:B-10
Endurance
Test
Low Temperature
Storage Ta= -55±5℃
*Test Time=1000HRS (-24HRS,+72H RS)
JIS C 7021:B-12
Temperature
Cycling
105℃ ～ 25℃ ～ -55℃ ～ 25℃
30mins 5mins 30mins 5mins
10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4
Thermal
Shock
IR-Reflow In-Board, 2 Times
85 ± 5℃ ～ -40℃ ± 5℃
10mins 10mins 10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011
Solder
Resistance T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A
MIL-STD-750D:2031
JIS C 7021:A-1
IR-Reflow
Pb Free Process
Ramp-up rate(217 to Peak) +3 / second max℃ ℃
Temp. maintain at 175(±25) 180 seconds max℃
Temp. maintain above 217 60℃-150 seconds
Peak temperature range 260 +0/℃-5℃
Time within 5°C of actual Peak Temperature (tp)
10~30 seconds
Ramp-down rate +6 /second max℃
MIL-STD-750D:2031.2
J-STD-020D
Environmental
Test
Solderability
T.sol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
JIS C 7021:A-2
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
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9. Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel
strap or conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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