1
Rectifier Device Data

  
The SWITCHMODE Power Rectifier employs the Schottky Barrier principle in
a large area metal–to–silicon power diode. State–of–the–art geometry features
epitaxial construction with oxide passivation and metal overlay contact. Ideally
suited for use as rectifiers in very low–voltage, high–frequency switching power
supplies, free wheeling diodes and polarity protection diodes.
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Matched Dual Die Construction
High Junction Temperature Capability
High dv/dt Capability
Excellent Ability to Withstand Reverse Avalanche Energy
Transients
Guardring for Stress Protection
Epoxy Meets UL94, VO at 1/8
Electrically Isolated. No Isolation Hardware Required.
UL Recognized File #E69369
Mechanical Characteristics
Case: Epoxy, Molded
Weight: 1.9 grams (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes: 260°C Max. for 10
Seconds
Shipped 50 units per plastic tube
Marking: B20200
MAXIMUM RATINGS, PER LEG
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200 Volts
Average Rectified Forward Current Per Leg
(Rated VR) TC = 125°C Per Package IF(AV) 10
20 Amps
Peak Repetitive Forward Current, Per Leg
(Rated VR, Square Wave, 20 kHz) TC = 90°CIFRM 20 Amps
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 150 Amps
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) IRRM 1.0 Amp
Operating Junction Temperature and Storage Temperature TJ, Tstg 65 to +150 °C
Voltage Rate of Change (Rated VR) dv/dt 10,000 V/µs
THERMAL CHARACTERISTICS, PER LEG
Thermal Resistance — Junction to Case RθJC 3.5 °C/W
SWITCHMODE is a trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
Motorola, Inc. 1996
Order this document
by MBRF20200CT/D

SEMICONDUCTOR TECHNICAL DATA
21
3

SCHOTTKY BARRIER
RECTIFIER
20 AMPERES
150 and 200 VOLTS
CASE 221D–02
ISOLATED TO–220
Motorola Preferred Device
1
3
2
Rev 1
MBRF20200CT
2Rectifier Device Data
ELECTRICAL CHARACTERISTICS, PER LEG
Rating Symbol Max Unit
Maximum Instantaneous Forward Voltage (1)
(iF = 10 Amp, TC = 25°C)
(iF = 10 Amp, TC = 125°C)
(iF = 20 Amp, TC = 25°C)
(iF = 20 Amp, TC = 125°C)
vF0.9
0.8
1.0
0.9
Volts
Maximum Instantaneous Reverse Current (1)
(Rated dc Voltage, TC = 25°C)
(Rated dc Voltage, TC = 125°C)
iR1.0
50
mA
DYNAMIC CHARACTERISTICS, PER LEG
Capacitance (VR = –5.0 V, TC = 25°C, Freq. = 1.0 MHz) CT500 pF
(1) Pulse Test: Pulse Width = 300 µs, Duty Cycle 2.0%
Figure 1. Typical Forward Voltage (Per Leg)
100
70
50
20
10
7
5
2
10.2 0.4 0.6 0.8 1
TJ = 125
°
C
TJ = 100
°
C
TJ = 25
°
C
vF, INSTANTANEOUS VOLTAGE (VOLTS)
TJ = 150
°
C
I , INSTANEOUS FORWARD CURRENT (AMP)
F
I , REVERSE CURRENT ( A)
R
µ
VR, REVERSE CURRENT (VOLTS)
10,000
1,000
100
10
1
0.1
0.01 20 40 60 80 100 120 140 160 180 200
TJ = 125
°
C
TJ = 100
°
C
TJ = 150
°
C
TJ = 25
°
C
Figure 2. Typical Reverse Current (Per Leg)
0
MBRF20200CT
3
Rectifier Device Data
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.110
MIN
Figure 3. Screw or Clip Mounting Position
for Isolation Test Number 1
* Measurement made between leads and heatsink with all leads shorted together.
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
CLIP 0.107
MIN
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.107
MIN
Figure 4. Clip Mounting Position
for Isolation Test Number 2 Figure 5. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION**
4–40 SCREW
PLAIN W ASHER
HEATSINK
COMPRESSION W ASHER
NUT
CLIP
HEATSINK
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw
torque of 6 to 8 in .lbs is sufficient to provide maximum power dissipation capability . The compression washer helps to maintain a con-
stant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in .lbs
will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in .lbs without adversely affecting the pack-
age. However , in order to positively ensure the package integrity of the fully isolated device, Motorola does not recommend exceeding
10 in .lbs of mounting torque under any mounting conditions.
Figure 6. Typical Mounting Techniques
Figure 6a. Screw–Mounted Figure 6b. Clip–Mounted
**For more information about mounting power semiconductors see Application Note AN1040.
MBRF20200CT
4Rectifier Device Data
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.621 0.629 15.78 15.97
INCHES
B0.394 0.402 10.01 10.21
C0.181 0.189 4.60 4.80
D0.026 0.034 0.67 0.86
F0.121 0.129 3.08 3.27
G0.100 BSC 2.54 BSC
H0.123 0.129 3.13 3.27
J0.018 0.025 0.46 0.64
K0.500 0.562 12.70 14.27
L0.045 0.060 1.14 1.52
N0.200 BSC 5.08 BSC
Q0.126 0.134 3.21 3.40
R0.107 0.111 2.72 2.81
S0.096 0.104 2.44 2.64
U0.259 0.267 6.58 6.78
–B–
–Y–
G
N
DL
KH
A
F
Q
3 PL
123
M
B
M
0.25 (0.010) Y
SEATING
PLANE
–T–
U
CS
JR
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
CASE 221D–02
(ISOLATED TO–220)
ISSUE D
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MBRF20200CT/D