MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
DShort-Circuit Protection
DWide Common-Mode and Differential
Voltage Ranges
DNo Frequency Compensation Required
DLow Power Consumption
DNo Latch-Up
DDesigned to Be Interchangeable With
Motorola MC1558/MC1458 and Signetics
S5558/N5558
description/ordering information
The MC1458 and MC1558 are dual
general-purpose operational amplifiers, with each
half electrically similar to the μA741, except that
offset null capability is not provided.
The high-common-mode input voltage range and
the absence of latch-up make these amplifiers
ideal for voltage-follower applications. The
devices are short-circuit protected and the
internal frequency compensation ensures stability
without external components.
ORDERING INFORMATION
TA
VIOmax
AT 25°CPACKAGEORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (P) Tube MC1458P MC1458P
0°C to 70°C
6 mV
SOIC (D)
Tube MC1458D
MC1458
0°C to 70°C6 mV SOIC (D) Tape and reel MC1458DR MC1458
SOP (PS) Tape and reel MC1458PSR M1458
CDIP (JG) Tube MC1558JG MC1558JG
55°C to 125°C5 mV CDIP (JGB) Tube MC1558JGB MC1558JGB
55 C to 125 C
5 mV
LCCC (FK) Tube MC1558FK MC1558FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Copyright © 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
2
3
4
8
7
6
5
1OUT
1IN
1IN+
VCC
VCC+
2OUT
2IN
2IN+
(TOP VIEW)
MC1458 . . . D, P, OR PS PACKAGE
MC1558 . . . JG PACKAGE
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN
NC
NC
1IN
NC
1IN+
NC
MC1558 ...FK PACKAGE
NC
1OUT
NC
NC NC
NC
V
NC
NC No internal connection
CC+
V
2IN+
CC
(TOP VIEW)
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
symbol (each amplifier)
+
IN+
OUT
IN
schematic (each amplifier)
IN
IN + OUT
VCC +
VCC
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC+ (see Note 1): MC1458 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC1558 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VCC (see Note 1): MC1458 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC1558 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (either input, see Notes 1 and 3) ±15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 5 and 6): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
P package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package 95°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJC (see Notes 7 and 8): FK package 5.61°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
JG package 14.5°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: JG package 300°C. . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, or PS package 260°C. . . . . . . . . . . . .
Storage temperature range, Tstg 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC.
2. Differential voltages are at IN+ with respect to IN.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output can be shorted to ground or either power supply. For the MC1558 only, the unlimited duration of the short circuit applies
at (or below) 125°C case temperature or 70°C free-air temperature.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
recommended operating conditions
MIN MAX UNIT
VCC±Supply voltage ±5±15 V
T
Operating free air temperature range
MC1458 0 70
°C
TAOperating free-air temperature range MC1558 55 125 °C
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
electrical characteristics at specified free-air temperature, VCC± = ±15 V
PARAMETER
TEST CONDITIONS
MC1458 MC1558
UNIT
PARAMETER TEST CONDITIONS
MIN TYP MAX MIN TYP MAX UNIT
Input offset voltage
V 0
25°C 1 6 1 5
mV
VIO Input offset voltage VO = 0 Full range 7.5 6 mV
Input offset current
V 0
25°C 20 200 20 200
nA
IIO Input offset current VO = 0 Full range 300 500 nA
Input bias current
V 0
25°C 80 500 80 500
nA
IIB Input bias current VO = 0 Full range 800 1500 nA
Common-mode input 25°C±12 ±13 ±12 ±13
V
VICR
Common mode input
voltage range Full range ±12 ±12 V
RL = 10 kΩ25°C±12 ±14 ±12 ±14
Maximum peak output RL 10 kΩFull range ±12 ±11
V
VOM
Maximum peak output
voltage swing RL = 2 kΩ25°C±10 ±13 ±10 ±13 V
RL 2 kΩFull range ±10 ±10
Lar
g
e-si
g
nal differential
R 2 kΩV ±10 V
25°C 20 200 50 200
V/mV
AVD
Large signal differential
voltage amplification RL 2 kΩ,VO = ±10 V Full range 15 25 V/mV
BOM
Maximum-output-swing
bandwidth
(closed loop)
RL = 2 kΩ,VO ±10 V,
AVD = 1, THD 5% 25°C 14 14 kHz
B1Unity-gain bandwidth 25°C 1 1 MHz
φmPhase margin AVD = 1 25°C 65 65 deg
Gain margin 25°C11 11 dB
riInput resistance 25°C 0.3 2 0.3* 2 MΩ
roOutput resistance VO = 0, See Note 9 25°C 75 75 Ω
CiInput capacitance 25°C 1.4 1.4 pF
zic
Common-mode input
impedance f = 20 Hz 25°C 200 200 MΩ
Common-mode VI
C
= VI
C
R min, 25°C 70 90 70 90
dB
CMRR
Common mode
rejection ratio
VIC = VICR min
,
VO = 0 Full range 70 70 dB
Supply-voltage
sensitivity
V
CC
= ±9 V to ±15 V, 25°C 30 150 30 150
V/V
kSVS sensitivity
(ΔVIO/ΔVCC)
VCC = ±9 V to ±15 V
,
VO = 0 Full range 150 150 μV/V
Vn
Equivalent input noise
voltage (closed loop)
AVD = 100, RS = 0,
f = 1 kHz, BW = 1 Hz 25°C 45 45 nV/Hz
IOS
Short-circuit output
current 25°C±25 ±40 ±25 ±40 mA
Suppl
y
current
V 0 No load
25°C 3.4 5.6 3.4 5
mA
ICC
Supply current
(both amplifiers) VO = 0, No load Full range 6.6 6.6 mA
Total power dissipation
V 0 No load
25°C 100 170 100 150
mW
PD
Total power dissipation
(both amplifiers) VO = 0, No load Full range 200 200 mW
VO1/VO2 Crosstalk attenuation 25°C 120 120 dB
*On products compliant to MIL-PRF-38535, this parameter is not production tested.
All characteristics are specified under open-loop operating conditions with zero common-mode input voltage, unless otherwise specified. Full
range for MC1458 is 0°C to 70°C and for MC1558 is 55°C to 125°C.
NOTE 9: This typical value applies only at frequencies above a few hundred hertz because of the effect of drift and thermal feedback.
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
operating characteristics, VCC ± = ±15 V, CL = 100 pF, TA = 25°C (see Figure 1)
PARAMETER
TEST CONDITIONS
MC1458 MC1558
UNIT
PARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT
t
Rise time VI = 20 mV, RL = 2 kΩ, 0.3 0.3 μs
trOvershoot factor VI = 20 mV, RL = 2 kΩ5 5 %
SR Slew rate at unity gain VI = 10 V, RL = 2 kΩ0.5 0.5 V/μs
PARAMETER MEASUREMENT INFORMATION
+
VI
0 V
Input
Output
RL = 2 kΩ
CL = 100 pF
Test Circuit
Input Voltage
Waveform
Figure 1. Rise-Time, Overshoot, and Slew-Rate Waveform and Test Circuit
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9760301Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9760301QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
MC1458D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
MC1458PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
MC1458PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458PSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1458PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC1558FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
MC1558JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
MC1558JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
MC1558P OBSOLETE PDIP P 8 TBD Call TI Call TI
SN98212P OBSOLETE PDIP P 8 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MC1558, MC1558M :
Catalog: MC1558
Military: MC1558M
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MC1458DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
MC1458DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
MC1458PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MC1458DR SOIC D 8 2500 367.0 367.0 35.0
MC1458DR SOIC D 8 2500 340.5 338.1 20.6
MC1458PSR SO PS 8 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated