SPECIFICATION
(Reference sheet)
· Supplier : Samsung electro-mechanics · Samsung P/N :
· Product : Multi-layer Ceramic Capacitor · Description : CAP, 10㎊, 500V, ± 5%, C0G, 1206
CL 31 C100 J G F N N N F
① ②③ ④ ⑤ ⑥ ⑦ ⑧⑨⑩⑪
①Series Samsung Multi-layer Ceramic Capacitor
②Size 1206 (inch code) L: 3.20 ± 0.15 mm W: 1.60 ± 0.15 mm
③Dielectric C0G ⑧Inner electrode
④Capacitance 10
㎊
Termination
⑤Capacitance Plating (Pb Free)
tolerance ⑨Product Normal
⑥Rated Volt age 500 V ⑩Special Reserved for future use
⑦Thickness 1.25 ± 0.15 mm ⑪Packaging Embossed Type, 13" reel
B. Structure and dimension
Sn 100%
Cu
Ni
CL31C100JGFNNNF
A. Samsung Part Number
Samsung P/N
(Lead Free)
Dimension(㎜)
LWT
± 5%
CL31C100JGFNNNF 3.20 ± 0.15 1.60 ± 0.15 1.25 ± 0.15 0.50 ± 0.30
BW
C. Samsung Reliability Test and Judgement condition
Capacitance Within specified tolerance
Q600 min
Insulation 10,000Mohm or 500Mohm×㎌Rated Voltage 60~120 sec.
Resistance Whichever is smaller
Appearance No abnormal exterior appearance Microscop (X10)
Withstanding No dielectric breakdown or of the rated voltage
Voltage mechanical breakdown
Temperature C0G
Characteristics (From -55℃ to 125℃, Capacitance change should be within ±30PPM/℃)
Adhesive Strength No peeling shall be occur on the 500g×F, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : Bending to the limit (1mm)
within ±5% or ±0.5㎊ whichever is large
r
with 1.0mm/sec.
Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly 245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance t o Capacitance change : Solder pot : 270±5℃, 10±1sec.
Soldering heat within ±2.5% or ±0.25㎊ whichever is larger
Tan δ, IR : initial spec.
Vibration Test Capacitance change : Amplitude : 1.5mm
within ±2.5% or ±0.25㎊ whichever is larger From 10㎐ to 55㎐ (return : 1min.)
Tan δ, IR : initial spec. 2hours ´ 3 direction (x, y, z)
Moisture Capacitance change : With rated voltage
Resistance within ±7.5% or ±0.75㎊ whichever is larger 40±2℃, 90~95%RH, 500+12/-0hrs
Q : 133.33 min
IR : 500Mohm or 25Mohm × ㎌
Whichever is smaller
High Temperature Capacitance change : With of the rated voltage
Resistance within ±3% or ±0.3㎊ whichever is large
r
Max. operating temperature
Q : 300 min 1000+48/-0hrs
IR : 1,000Mohm or 50Mohm × ㎌
Whichever is smaller
Temperature Capacitance change : 1 cycle condition
Cycling within ±2.5% or ±0.25㎊ whichever is larger Min. operating temperature →25℃
Tan δ, IR : initial spec. →Max. operating temperature →25℃
5 cycle test
※ The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
150%
1㎒±10% / 0.5~5Vrms
Performance Test condition
150%
MLCC Pr
o
E. Recom
m
(Sub
s
☞ Materi
a
☞
☞ Caution
o
duct Ma
m
ended T
E
strate for b
Si
z
l : Glass ep
: Copper
f
: Abnormal
nual
E
ST PCB
Size co
d
02
03
05
10
21
31
32
43
55
nding stren
z
e code
02
03
05
10
21
31
32
43
55
oxy substra
oil (T=0.03
ty can occu
( Adhesive
d
e Si
z
0.
0.
1.
0
1.
2.
0
3.
3.
4.
5.
gth test)
Size (mm)
0.4 × 0.2
0.6 × 0.3
1.0 × 0.5
1.6 × 0.8
2.0 × 1.25
3.2 × 1.6
3.2 × 2.5
4.5 × 3.2
5.7 × 5.0
e ☞
5
㎜) ☞
r if lead-ba
s
strength of
z
e (mm)
.
4 × 0.2
.
6 × 0.3
0. × 0.5
.
6 × 0.8
0
× 1.25
.
2 × 1.6
.
2 × 2.5
.
5 × 3.2
.
7 × 5.0
a
0.2
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
hickness :
: S
o
ed solder (
d
b
termination
)
a
b
0.20 0.
1
0.30 0.
3
0.40 0.
5
1.00 1.
0
1.20 1.
4
2.20 1.
4
2.20 1.
4
3.50 1.
7
4.50 1.
7
(S
u
b c
0.6 0.
2
0.9 0.
3
1.5 0.
5
3.0 1.
2
4.0 1.
6
5.0 2.
0
5.0 2.
9
7.0 3.
7
8.0 5.
6
T
=1.6 ㎜ (T=
o
lder resist
SD 6704)
)
b
c
1
70.26
3
00.30
5
50.50
0
01.20
4
01.65
4
02.00
4
02.90
7
53.70
7
55.60
u
bstrate for
R
d
2
5.0
3
5.0
5
5.0
2
5.0
6
55.0
0
5.0
9
5.0
7
5.0
6
5.0
0.8 ㎜ for
0
ith 3% silve
Reliability t
e
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
0
3/05)
r
is used.
e
st)
e
a
c
3
MLCC Pr
o
1. Packa
g
This sp
e
When
c
1-1. Figur
1-2. Qua
n
Type
MLCC
o
duct Ma
g
ing
cification
ustomers r
e
n
tity
Size Code
Inch(mm)
0402 (01005)
0603 (0201)
1005 (0402)
1608 (0603)
2012 (0805)
3216 (1206)
3225 (1210)
4520 (1808)
4532 (1812)
5750 (2220)
nual
pplies to t
e
quire, the
s
Chip
Thickness
0.2 mm
0.3 mm
0.5 mm
0.8 mm
T≤0.85 mm
T≥1.0 mm
T≤0.85 mm
T≥1.0 mm
T≤1.6 mm
T≥2.0 mm
T≤1.6 mm
T≥2.0 mm
T≤2.0 mm
T>2.0 mm
T≥2.5 mm
ping of M
pecificatio
Tap ing Ty
p
PAPER
PAPER
PAPER
PAPER
PAPER
EMBOSSE
D
PAPER
EMBOSSE
D
EMBOSSE
D
EMBOSSE
D
EMBOSSE
D
EMBOSSE
D
EMBOSSE
D
EMBOSSE
D
EMBOSSE
D
L
CC
may be c
p
ePitch 7
2mm
2mm
2mm
4mm
4mm
D
4mm
4mm
D
4mm
D
4mm
D
4mm
D
8mm
D
8mm
D
8mm
D
8mm
D
8mm
h
anged un
d
Plastic
inches reel
20k
10K
10K
4K
4K
2K
4K
2K
2K
1K
2k
1k
-
-
-
er the agr
Plastic
10 inches reel
-
-
-
10K
10K
6K
10K
4K
4K
4K
-
-
-
-
-
e
ement.
[u
Plas
t
13 inch
e
100
K
50
K
50
K
15K /
1
15K /
1
10
K
10
K
10
K
10
K
4K
8k
4k
4K
2K
2K
nit:pcs]
t
ic
s reel
K
K
K
1
0K
1
0K
K
K
K
K
4
MLCC Product Manual
1-3. Tape Size
1-3-1. Cardboard(Paper) tape : 4mm pitch
[unit:mm]
Size
Inch(mm) A B W F E P1 P2 P0 D t
0603
(1608)
1.00
±0.10
1.90
±0.10
8.00
±0.30
3.50
±0.05
1.75
±0.10
4.00
±0.10
2.00
±0.05
4.00
±0.10
φ1.50
+0.10/-0
1.1
Below
0805
(2012)
1.55
±0.10
2.30
±0.10
1206
(3216)
2.05
±0.10
3.60
±0.10
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
1-3-2. Cardboard(Paper) tape : 2mm pitch
[unit:mm]
Size
Inch(mm) A B W F E P1 P2 P0 D t
01005
(0402)
0.25
±0.02
0.46
±0.02
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0.25
±0.02
0201
(0603)
0.38
±0.03
0.68
±0.03
0.35
±0.03
0402
(1005)
0.62
±0.05
1.12
±0.05
0.60
±0.05
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10
0.37
±0.03
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
5
MLCC Product Manual
1-3-3. Embossed(Plastic) tape
[unit:mm]
Size
Inch(mm) A B W F E P1 P2 P0 D t1 t0
01005
(0402)
0.23
±0.02
0.45
±0.02
4.00
±0.05
1.80
±0.02
0.90
±0.05
1.00
±0.02
1.00
±0.02
2.00
±0.03
φ0.80
±0.04 0.35
Below
0.50
Below
015008
(05025)
0.32
±0.03
0.58
±0.03
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0603
(1608)
1.05
±0.15
1.90
±0.15
4.00
±0.10
φ1.50
+0.10
/-0
2.50
Below
0.60
Below
0805
(2012)
1.45
±0.20
2.30
±0.20
1206
(3216)
1.90
±0.20
3.50
±0.20
1210
(3225)
2.80
±0.20
3.60
±0.20
1808
(4520)
2.30
±0.20
4.90
±0.20
12.0
±0.30
5.60
±0.05
8.00
±0.10
3.80
Below
1812
(4532)
3.60
±0.20
4.90
±0.20
2220
(5750)
5.50
±0.20
6.20
±0.20
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10 8.00
±0.30
3.50
±0.05
4.00
±0.10
2.50
Below
0306
(0816)
1.10
±0.20
1.90
±0.20
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
6
MLCC Pr
o
1-3-4. Reel
Symbol
7”Reel
10”Reel
13”Reel
1-4. Cove
r
1-4-1. Peel
-
10 g
1-4-2. Mea
s
-Ta
p
(IE
* If t
o
duct Ma
Size
Tape Wid
t
4mm
8mm
12mm
8mm
8mm
12mm
tape pee
-
off force
.f ≤ peel-o
f
urement M
p
ing Packag
C 60286-3
P
he static el
nual
t
h A
φ178±2.
φ178±2.
φ178±2.
φ258±2.
φ330±2.
φ330±2.
l-off force
f
f force ≤ 7
0
ethod
ing design :
ackaging o
ctricity of S
B
0 MINφ50
0 MINφ50
0 MINφ50
0 MINφ70
0 MINφ70
0 MINφ70
0
g.f
Packaging
componen
T process
C
φ13±0.5
φ13±0.5
φ13±0.5
φ13±0.5
φ13±0.5
φ13±0.5
design follo
ts for auto
causes any
D
21±0.8
21±0.8
21±0.8
21±0.8
21±0.8
21±0.8
s IEC 602
atic handli
problems, p
E
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
8
6-3 standar
d
n
g - parts 3)
lease conta
W
5±0.5
10±1.5
13±0.5
10±1.5
10±1.5
13±0.5
d.
c
t us.
[unit:mm]
t
1.2±0.2
0.9±0.2
1.2±0.2
1.8±0.2
1.8±0.2
2.2±0.2
7
MLCC Pr
o
1-5. BOX
1-5-1. Pac
k
REE
L
Lab
e
1)
2)
3)
4)
5)
6)
1-5-2. Box
1) Dou
2) Avo
i
3) Re
m
※ If sp
1-5-3. 7" B
o
- Inner
- Oute
r
o
duct Ma
package
k
aging Label
L
& Box Typ
e
e
l includes t
h
Chip size
Temp e ratur
Nominal C
Model Na
m
LOT Numb
Q’ty
Packaging
ble packagi
i
d any dam
a
m
ark informa
t
ecial packa
o
x packagin
g
r
Box (7" x 5
r
Box (7" x
2
nual
e
e informati
Characteri
a
pacitance
m
e
r & Reel N
g with the
a
ges during
t
ion of cont
ing is requi
g
REEL )
2
0 REEL)
o
n as below
.
s
tics
u
mber
paper type
ransportati
nts on inn
red, please
w
.
of inner bo
n by car, a
r box and
c
ontact us.
- I
-
and outer
rplane and
o
uter box
nner Box (7
"
-
Outer Box
b
ox.
s
hip.
"
x 10 REEL)
(7" x 60 RE
E
[ Unit :
m
E
L)
m
m ]
8
MLCC Product Manual
1-5-4. 13” Box packaging
- Inner Box (13" x 4 REEL) - Outer Bo
x (13" x 20 REEL)
1-6. Chip Weight
Size(L/W)
Inch(mm)
Size(T)
(mm) Temp. Weight
(mg/pc)
Size(L/W)
Inch(mm)
Size(T)
(mm) Temp. Weight
(mg/pc)
01005
(0402)
0.20 C0G 0.082 0201
(0603)
0.30 C0G 0.233
0.20 X7R 0.083 0.30 X7R 0.285
0.20 X5R 0.093 0.30 X5R 0.317
0402
(1005)
0.50 C0G 1.182 0603
(1608)
0.80 C0G 4.615
0.50 X7R 1.559 0.80 X7R 5.522
0.50 X5R 1.560 0.80 X5R 5.932
0805
(2012)
0.65 C0G 7.192 1206
(3216)
1.25 C0G 28.086
1.25 X7R 16.523 1.60 X7R 54.050
1.25 X5R 16.408 1.60 X5R 45.600
1210
(3225)
2.50 X7R 116.197 1808
(4520)
1.25 C0G 47.382
2.50 X5R 121.253 1.25 X7R 63.136
1812
(4532) 1.25 X7R 96.697 2220
(5750) 1.60 X7R 260.897
The weight of product is typical value per size, for more details, please contact us.
9
MLCC Product Manual
2. Product Characteristic data
2-1. Capacitance
The capacitance is the ratio of the change in an electric charge according to voltage change.
Due to the fact that the capacitance may be subject to change with the measured voltage and
frequency, it is highly recommended to measure the capacitance based on the following
conditions.
2-1-1. Measure capacitance with voltage and frequency specified in this document.
Regarding the voltage/frequency condition for capacitance measurement of each MLCC model,
please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document.
The following table shows the voltage and frequency condition according to the capacitance
range.
[The voltage and frequency condition according to MLCC the capacitance range]
◆Class I
Capacitance Frequency Voltage
≤ 1,000 pF 1 MHz ± 10%
0.5 ~ 5 Vrms
> 1,000 pF 1 kHz ± 10%
◆Class II
Capacitance Frequency Voltage
≤ 10 ㎌ 1 kHz ± 10% 1.0 ± 0.2 Vrms
> 10 ㎌ 120 Hz ± 20% 0.5 ± 0.1 Vrms
Exception* 1 kHz ± 10% 0.5 ± 0.1 Vrms
Capacitance shall be measured after the heat treatment of 150+0/-10℃
for 1hr, leaving at room temperature for 24±2hr. (Class II)
2-1-2. It is recommended to use measurement equipment with the ALC (Auto Level Control) option.
The reason is that when capacitance or measurement frequency is high, the output voltage of
measurement equipment can be lower than the setting voltage due to the equipment limitation.
Note that when capacitance or measurement frequency is excessively high, the measurement
equipment may show ALC off warning and provide a lower output voltage than the setting
voltage even with ALC option selected. It is necessary to ensure the output voltage of
measurement equipment is the same as the setting voltage before measuring capacitance.
10
MLCC Product Manual
2-1-3. Capacitance value of high dielectric constant (Class II) MLCC changes with applied AC and DC
voltage. Therefore, it is necessary to take into account MLCC’s AC voltage characteristics and DC-
bias voltage characteristics when applying MLCC to the actual circuit.
2-1-4. The capacitance is in compliance with the EIA RS-198-1-F-2002.
2-2. Tan δ (DF)
2-2-1. An ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of
electrode. DF (Dissipation Factor) is defined as the ratio of loss energy to stored energy and
typically being calculated as percentage.
2-2-2. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy.
The equation can be described as 1/DF. Normally the loss characteristic of Class I MLCC is
presented in Q, since the DF value is so small whereas the loss characteristic of Class II MLCC is
presented in DF.
2-2-3. It is recommended to use Class I MLCC for applications to require good linearity and low loss
such as coupling circuit, filter circuit and time constant circuit.
2-3. Insulation Resistance
Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties.
Insulation resistance is defined as the ratio of a leakage current to DC voltage.
2-3-1. When applying DC voltage to MLCC, a charging current and a leakage current flow together at
the initial stage of measurement. While the charging current decreases, and insulation resistance
(IR) in MLCC is saturated by time. Therefore, insulation resistance shall be measured 1 minute after
applying the rated voltage.
2-4. Capacitance Aging
The aging characteristic is that the high dielectric (Class II) MLCC decreases capacitance
value over time. It is also necessary to consider the aging characteristic with voltage and
temperature characteristics when Class II MLCC is used in circuitry.
11
MLCC Pr
o
2-4-1. In g
e
follo
w
diffe
2-4-2. Afte
r
sho
u
2-5. Tem
p
Pleas
e
capac
2-5-1. It is
Cha
r
[ Exam
o
duct Ma
neral, agin
w
ing graph.
rent models
heat treat
ld be consi
erature C
e
consider t
e
itance chan
necessary t
acteristics”
ple of Temp
* Sample
nual
g
causes ca
p
Please che
c
.
m
ent (150 °
C
ered again
aracterist
mperature
g
es which is
check the
f
or the tem
p
erature Cha
: 10uF, Rate
acitance to
k with SEM
, 1hour), th
from the ti
[ Example
* Sam
p
cs of Cap
haracteristi
caused by
alues speci
erature and
acteristics (
voltage 6.
decrease li
O for mor
capacitan
e of heat t
of Capacita
le : C0G, X
citance (
cs of capaci
a change in
fied in secti
o
capacitanc
5R) ]
3V *
early with t
e
details, sin
e decrease
reatment.
n
ce Aging ]
7
R, X5R
T
CC)
tance since
ceramic di
e
o
n “C. Relia
b
change ra
[ E
x
Sample : 10
e log of ti
e the valu
by aging i
the electric
lectric cons
ility test C
ge of MLC
ample of Bi
uF, Rated v
e as show
may vary
recovered,
a
l characteri
s
t
ant by tem
p
o
ndition–Te
m
C
.
a
s TCC ]
o
ltage 6.3V
n
in the
b
etween
so aging
tics such a
p
erature.
m
perature
s
12
MLCC Pr
o
2-5-2. Whe
tem
p
MLC
C
2-5-3. In a
d
2-6. Self-
h
It is
n
(Equi
2-6-1. Whe
or p
u
insul
2-6-2. The
circu
Ther
e
1) T
h
A
C
2) T
h
o
duct Ma
n selecting
erature an
C
.
d
dition, Bias
eating Te
ecessary t
valent Serie
n MLCC is
lse current
ating prope
reliability of
it, even the
fore, make
e surface t
or Pulse v
h
e rise in in
c
nual
MLCC, it is
TCC of ML
TCC of ML
mperature
design the
Resistance
sed in an A
flows throu
rties.
MLCC may
AC voltage
su
r
e to che
c
mperature
ltage is ap
rease by se
*
S
ecessary to
C
C, since th
e
C
C should b
e
system, wit
)
of MLCC
w
voltage o
h MLCC. S
be affected
o
r
the puls
e
k the follo
f MLCC m
p
lied.
l
f-heating o
f
[ Examp
ample : X5
consider t
applied te
taken into
considerin
hen AC vol
pulse volt
h
ort-circuit
m
by MLCC b
e
voltage is
ing conditi
st stay with
f
MLCC mus
t
le of Ripple
10uF, Rat
e heat char
m
perature
m
account wh
g self-heati
n
age or puls
ge circuit, s
m
ay be occ
u
ing used in
ithin the r
o
ns.
in the maxi
t
not excee
d
current ]
d voltage 6
cteristics o
ay change
en DC volta
n
g generate
d
voltage is
e
lf-heating i
u
rred by the
an AC volt
a
nge of rate
um operat
d
20℃
.
3V
f
a system,
r
the capacit
a
ge is applie
d
d
by the ES
R
applied to
s generated
degradatio
ge or puls
d voltage.
ing temper
oom
a
nce of
d
to MLCC.
R
M
LCC.
when AC
n
of M
L
CC’s
e
voltage
a
ture after
13
MLCC Pr
o
2-7. DC
&
It is
r
diele
c
2-7-1. Plea
s
parti
capa
char
a
2-7-2. It is
sinc
e
AC
v
o
duct Ma
&
AC Volta
g
equired to
tric consta
e ensure th
cular, when
citance tole
cteristics a
necessary t
the capaci
v
oltage.
nual
g
e Charac
t
onsider vol
n
t MLCC(Cla
e capacitan
high dielec
r
ance, a sys
t
d aging ch
*
consider t
ance value
[
E
*
S
t
eristics
age charac
ss II) is cha
n
e change i
ric constant
em should
a
racteristics
[ Example o
f
Sample : X5
e AC volta
f high diel
E
xample of
A
ample : X5
eristics in t
ged by ap
s
within the
type MLCC
e designe
of MLCC.
f DC Bias ch
a
R 10uF, Rate
e character
ctric const
A
C voltage
c
10uF, Rat
e circuit si
lied DC &
allowed op
e
(Class II) is
d
with consi
d
a
racteristics
]
d voltage 6.
istics of ML
nt type ML
haracteristi
d voltage 6
ce the capa
A
C voltage.
rating rang
used in circ
d
ering DC v
o
3
V
C and the
C (Class II)
c
s ]
.
3V
citance val
e
of a syste
m
u
it with nar
r
ltage, tem
C voltage
varies with
e of high
m
. In
ow allowed
p
erature
o
f a system,
the applied
14
MLCC Pr
o
2-8. Impe
Elect
r
curre
(Z=V
/
cons
i
Ther
e
MLC
C
2-8-1. MLC
incr
e
The
from
2-8-2. MLC
(Equ
i
freq
u
com
e
2-8-3. SRF
indu
c
2-8-4. The
Whe
imp
e
o
duct Ma
dance Cha
ical impeda
nt (I) when
I). Impeda
sting of the
fore, it is r
C
based on
t
C operates
ases ( X_C=
resistance (
the loss of
C operates
ivalent Seri
ency increa
s from the
(Self Reson
tive reacta
impedance
n using the
dance of lo
nual
racteristic
nce (Z) of
voltage (
ce extends
real part o
e
quired to d
e
he frequen
s a capacit
1/j2πfC ) w
E
SR; Equival
e
its dielectri
c
s an induc
s Inductanc
ses ( X_L=j
loss of its e
nt Frequen
ce(XL) canc
f MLCC ca
network an
a
capacitan
[
*
LCC is the
) is applied.
he concept
resistance
sign circuit
c
y ( Z = R +
r in the lo
ere f is fre
nt Series R
c
material.
or in the hi
). The reac
πf∙ESL ). Th
lectrode m
y) of MLCC
el each oth
be measu
lyzer, pleas
c
e caused b
Example of
I
Sample : X
easureme
It is define
of resistan
R) and the
with consi
jX )
frequency
uency and
sistance) o
h frequenc
ance (XL) o
resistance
e
tal.
is the freq
r and the i
ed by a ne
e note that
b
y the AC v
o
I
mpedance
c
R 1uF, Rate
t of the op
as the rati
c
e to AC ci
r
c
maginary p
d
eration of t
h
and its rea
is capacit
MLCC in t
and the i
MLCC in t
(ESR) of M
ency where
pedance
work analy
the small-si
g
ltage chara
haracteristic
voltage 6.3
osition tha
of the vol
uits and is
rt of reacta
e impedan
tance (XC)
a
nce.
h
e low frequ
e
ductance o
e high freq
CC in the h
its capaciti
f MLCC has
er or an im
g
nal input
m
teristic of
s
]
V
MLCC pre
age to the
complex n
nce (X) as
e characte
ecreases a
ency mainl
MLCC is c
uency incre
a
igh frequen
e reactanc
only ESR a
edance an
m
a
y
lead to
M
LCC.
s
ents to a
c
urrent
umber
Z
=R+jX.
r
istics of
s
frequenc
y
comes
a
lled ESL
a
ses as
c
y mainl
y
(XC) and
SRF.
a
lyzer.
t
he
15
MLCC Pr
o
3. Electri
c
3-1. Dera
t
MLC
C
are la
derat
e
test v
o
3-1-1. The
follo
w
3-1-2. The
MLC
C
give
s
defi
n
o
duct Ma
al & Me
t
ing
with the te
beled as “d
d as show
ltage at 15
derated ML
w
ing graph.
“Temperatu
C including
the maxim
ed in secti
nual
c
hanical
C
st voltage a
rated MLC
in the foll
0% of the r
C should
r
e of MLCC”
self-heating
um operati
o
n “3-2. App
[Exa
m
C
aution
100% of t
.” For this t
wing graph
ted voltag
e applied w
in the x-ax
i
effect. The
g voltage
lied Voltag
ple of dera
* Vmax
* Only the
D
e rated vol
pe of MLC
for the equ
in the hig
ith the dera
i
s of the gr
a
“Voltage D
f MLCC wit
e
.”
ting graph
≤ Derated
erating ma
age in the
, the volta
ivalent life t
temperatu
ting voltag
ph below i
rating Rati
reference
or derated
Voltage
rked model
igh tempe
e and tem
ime of a no
r
e resistanc
and tempe
dicates the
o
” in the y-a
x
o the maxi
M
LCC]
s
ature resist
erature sho
rmal MLCC
e
test.
rature as sh
surface tem
x
is of the g
r
m
um voltag
e
a
nce test
uld be
w
ith the
own in the
perature of
r
aph below
(Vmax) as
16
MLCC Pr
o
3-2. Appl
i
The
a
3-2-1. Cau
t
·Fo
r
n
o
· Fo
r
sh
o
· Ab
n
M
L
DC V
o
3-2-2. Effe
c
· Ele
c
th
e
· Do
w
diel
e
abo
u
· Ple
a
pr
e
(1) Surg
e
Whe
n
indu
c
elect
r
surg
e
(2) ESD
Sinc
e
com
p
o
duct Ma
ed Voltag
ctual appli
ions by typ
DC voltag
t exceed th
AC voltage
uld not ex
ormal volt
L
CC.
o
ltage
t of EOS (El
trical Over
electrical
n time of
e
ctric shock
c
t a failure
se use cau
paring ML
e
the overc
e the overs
ical short f
e
current int
o
(Electrostati
the voltag
ared to the
nual
e
d voltage
s of voltag
or DC+AC
rated volt
or pulse v
eed the rat
ge such as
[Ty
p
AC Volta
ectrical Ove
tress such
hort failure
LCC is vari
aused by E
f MLCC in a
t
ion not to
a
C for testin
rrent cause
hooting ph
ilure in ML
o
MLCC.
Discharge)
of the stat
surge, ESD
n MLCC sh
applied to
voltage, DC
ge of MLC
ltage, the p
d voltage
surge volta
p
es of Volta
g
ge D
C
r
stress)
a
s a surge v
o
caused by t
ed with the
S can acc
market at
pply excess
or evaluat
by surge i
nomenon
C
C. Therefor
e
c electricity
can cause
uld not ex
MLCC
voltage or
C
.
ea
k
-to-pea
k
o
f MLCC.
e, static el
e Applied
+AC Volta
o
ltage or E
O
he dielectri
applied vol
lerate heati
he early sta
ive electrica
i
ng.
s applied to
f voltage as
e
, it is nece
s
is very hig
amage to
eed the rat
he maximu
value of A
ctricity sho
o the Capa
g
e 1 DC+
A
S can caus
breakdow
age and th
ng on the d
ge.
l overstress
MLCC, the
shown in t
sary to be
h
but the qu
LCC with l
e
d voltage s
value of
voltage or
ld not exce
c
itor]
C Voltage
e
damages t
o
n
in MLCC.
room tem
ielectric. Th
e
including s
influx of cur
e graph be
c
areful to pr
e
antity of el
o
w capacita
n
et in the sp
D
C + AC vol
pulse volta
ed the rate
2
DC+Pul
MLCC, res
p
erature an
d
refore, it c
ike voltage
rent into M
low and res
event the i
ctric charge
n
ce as show
n
e
cifications.
tage should
g
e
d
voltage of
se Voltage
ulting in
d
a
a
n bring
MLCC whe
L
CC can
ult in the
flux of
is small
n
in the
n
17
MLCC Pr
o
follo
w
high
[ E
x
3-3. Vibr
a
Plea
s
Man
a
Whe
and
3-4. Shoc
k
Mech
a
Do n
o
When
preve
n
3-5. Piez
o
MLCC
const
a
MLCC
o
duct Ma
ing graph,
capacitance
ample of S
a
tion
s
e check th
e
a
ge MLCC
n
n MLCC is
u
consider sp
e
k
nical stress
t use a dro
piling up
nt cracks or
o
-electric P
may gener
nt MLCC (
may cause
nual
whereas su
MLCC.
rge applied
e
types of vi
b
ot to gener
u
sed in a vib
cial MLCC
caused by
a
ped MLCC
r handling
any other
henomen
a
te a noise
d
lass Ⅱ) at
a noise if
M
ge with lot
to MLCC ]
b
ration and
te resonan
ration envir
s
uch as Soft
-
a
drop may
to avoid an
rinted circu
amages to
o
n
ue to vibra
C or Pulse
LCC is affec
of electric
shock, and
e and avoi
o
nment, ple
a
-
term, etc.
cause dam
y quality an
d
it boards, d
t
he MLCC.
tion at spe
c
ircuits.
ted by any
harge qua
[ Example
the status o
any kind
se make s
a
ges to a di
e
reliability
not hit M
ific frequen
echanical
tity can cau
of ESD appl
* Simulati
o
f
resonance.
o
f impact to
u
re to conta
c
e
lectric or a
eterioratio
CC with th
y when usi
ibrations o
se damage
ied to MLC
o
n for ESD
8
.
terminals.
t us for th
crack in ML
n
.
corners of
g the high
r shocks.
s
to even
C
]
8
kV
e
situation
C
C
a PCB to
dielectric
18
MLCC Pr
o
4. Proce
s
4-1. Mou
n
4-1-1. Mou
It is
r
is a
p
4-1-2. Cau
t
Plea
s
PCB.
loca
t
4-1-3. Cau
t
If M
L
Mou
o
duct Ma
s
s of Mou
n
ting
nting positi
o
recommend
p
plied.
Not r
ions during
e take the
Select the
t
ion and a d
ions during
CC is mou
nt MLCC as
nual
nting an
d
o
n
ed to locat
ecommend
mounting
n
ollowing m
ounting lo
irection of
mounting
ted near a
far from th
e
N
d
Solderin
g
the major
e
d
ear the cut
asures to e
cation sho
LCC moun
n
ear screw
crew hole,
e
screw hol
e
N
ot recomm
g
xis of MLC
o
ut
ffectively re
w
n below, si
n
ed near th
he board d
e
s as possibl
m
ended
in parallel
Rec
o
uce the str
ce the mec
cutting lin
e
flection m
a
e.
Recom
m
to the direc
o
mmended
ess generat
anical stres
e
.
a
y be occurr
e
ended
tion in whic
d from the
s
s is affecte
d
r
ed by scre
w
h the stress
cutting of
d
by a
w
torque.
19
MLCC Product Manual
4-2. Caution before Mounting
4-2-1. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from
the reel.
4-2-2. Check the capacitance characteristics under actual applied voltage.
4-2-3. Check the mechanical stress when actual process and equipment is in use.
4-2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly.
Heat treatment must be done prior to measurement of capacitance.
4-2-5. Check the solderability of MLCC that has passed shelf life before use.
4-2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC.
4-3. Cautions during Mounting with Mounting (pick-and-place) Machines
4-3-1. Mounting Head Pressure
Excessive pressure may cause cracks in MLCC.
It is recommended to adjust the nozzle pressure within the maximum value of 300g.f.
Additional conditions must be set for both thin film and special purpose MLCC.
4-3-2. Bending Stress
When using a two-sided substrate, it is required to mount MLCC on one side first before
mounting on the other side due to the bending of the substrate caused by the mounting head.
Support the substrate as shown in the picture below when MLCC is mounted on the other side.
If the substrate is not supported, bending of the substrate may cause cracks in MLCC.
4-3-3. Suction nozzle
Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of
the nozzle. This may cause cracks in MLCC due to the excessive force during mounting.
If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during
positioning.
A regular inspection such as maintenance, monitor and replacement for the suction nozzle and
mounting claw should be conducted.
20
MLCC Pr
o
4-4. Reflo
MLCC
poten
There
f
For t
h
4-4-1. Refl
o
Use
c
Pre-
h
on
M
to t
h
As f
o
thre
e
time
s
MLC
C
o
duct Ma
w solderi
is in a dire
c
n
tial mechan
ore, MLCC
e reason, t
Refl
o
o
w Profile
c
aution not
eating is n
LCC. The t
h
e minimum
.
r reflow sol
times. Ple
. Care mus
C as they c
nual
n
g
t contact
ical stress c
a
ay be con
h
e mountin
g
M
w solderin
to exceed t
cessary for
mperature
.
dering, it is
se check wi
be exercis
n be affect
ith the diss
a
used by th
e
t
aminated b
process m
u
M
ethod
g
Over
a
Loc
a
[Reflow
S
e peak te
all constitu
ifference b
recommen
h us when
d especiall
d by therm
lved solder
sudden te
b
y the locati
o
st be closel
all heating
a
l heating
oldering C
perature (2
nts includi
etween the
ed to keep
the number
for the ult
al stress m
during sold
perature c
n moveme
y monitore
C
I
n
VP
S
L
o
nditions]
0℃) and ti
g the PCB
PCB and th
the numbe
of reflow s
r
a-small size
,
o
re easily.
ering, whic
h
hange.
n
t and flux.
d
.
lassificatio
n
frared rays
Hot plate
(Vapor pha
Air heater
Laser
L
ight beam
e (30sec)
o prevent t
componen
r
of reflow s
o
ldering ne
,
thin film a
n
h
may be ex
n
s
e)
a
s shown.
e mechani
t surface m
ldering to
ds to exce
d high cap
p
osed to
al damages
st be kept
less than
d three
a
citance
21
MLCC Product Manual
4-4-2. Reflow temperature
The following quality problem may occur when MLCC is mounted with a lower temperature than
the reflow temperature recommended by a solder manufacturer. The specified peak temperature
must be maintained after taking into consideration the factors such as the placement of
peripheral constituent and the reflow temperature.
･Drop in solder wettability
･Solder voids
･Potential occurrence of whisker
･Drop in adhesive strength
･Drop in self-alignment properties
･Potential occurrence of tombstones
4-4-3. Cooling
Natural cooling with air is recommended.
4-4-4. Optimum solder flux for reflow soldering
· Overly the thick application of solder pastes results in an excessive solder fillet height.
This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which
may cause cracks in MLCC.
·Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to
isolate from PCB
· Check if solder has been applied uniformly after soldering is completed.
· It is required to design a PCB with consideration of a solder land pattern and its size to apply an
appropriate amount of solder to MLCC. The amount of the solder at the edge may impact
directly on cracks in MLCC.
· The design of a suitable solder land is necessary since the more the solder amount is,
the larger the force MLCC experiences and the higher the chance MLCC cracks.
Too Much Solder
large stress may cause cracks
Not enough solder
Weak holding force may cause bad
connections or detaching of the capacitor
22
MLCC Pr
o
4-5. Flow
4-5-1. Flo
w
T
a
I
n
r
e
P
e
x
4-5-2. Cau
t
·W
h
inter
the
m
surf
a
· If t
may
valu
e
term
o
duct Ma
soldering
w
profile
ake caution
case of flo
commende
lease conta
ceptions t
ion before
en a sudde
nal deform
echanical
ce of MLCC
he flow tim
be deterior
may be dr
ination.
nual
not to exce
w soldering
d to use.
t us before
at may be
low solderi
heat is ap
tion of ML
amages on
must be k
is too lon
a
ted by the
o
pped by w
[Flow S
o
ed peak te
,
only 1608(
0
use the typ
c
aused.
n
g
lied to ML
C. Preheati
MLCC. The
pt to the m
or the flo
leaching ph
eak adhesio
ldering Co
perature (2
603inch), 2
e of high c
C, the mec
g all the co
temperatur
inimum.
temperatu
enomenon
n between
n
ditions]
60℃) and ti
012(0805in
pacitance a
anical rigi
nstituents i
difference
e is too hig
f the outer
he internal
me (5sec) a
s
h), 3216(12
d thin film
ity of MLCC
cluding PC
between th
h, the adhe
s
terminatio
t
ermination
s
shown.
6inch) case
MLCC for s
is deterior
is required
solder an
ive strengt
n
, or the ca
p
and the ou
t
size are
o
me
a
ted by the
to prevent
d
the
h
with PCB
acitance
t
er
23
MLCC Product Manual
4-6. Soldering Iron
Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature
soldering iron tip may come into a direct contact with the ceramic body of MLCC due to the
carelessness of an operator. Therefore, the soldering iron must be handled carefully, and close
attention must be paid to the selection of the soldering iron tip and to temperature control of the
tip.
4-6-1. How to use a soldering Iron
· In order to minimize damages on MLCC, preheating MLCC and PCB is necessary.
A hot plate and a hot air type preheater should be used for preheating
. Do not cool down MLCC and PCB rapidly after soldering.
· Keep the contact time between the outer termination of MLCC and the soldering iron as short as
possible. Long soldering time may cause problems such as adhesion deterioration by the
leaching phenomenon of the outer termination.
Variation of
Temp.
Soldering
Temp.(℃)
Pre-heating
Time(sec)
Soldering
Time(sec)
Cooling
Time(sec)
ΔT ≤ 130 300±10℃ max ≥60 ≤4 -
* Control Δ T in the solder iron and preheating temperature.
Condition of Iron facilities
Wattage Tip diameter Soldering time
20W max 3 ㎜ max 4sec max
* Caution - Iron tip should not contact with ceramic body directly
Lead-free solder: Sn-3.0Ag-0.5CU
4-6-2. How to use a spot heater
Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and
the PCB, which is likely to lessen the thermal shocks.
For a high density PCB, a spot heater can prevent the problem to connect between a solder iron
and MLCC directly.
· If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the
thermal stress. Follow the conditions set in the table below to prevent this problem.
·The spot heater application angle as shown in the figure is recommended to create a suitable
solder fillet shape.
24
MLCC Product Manual
4-6-3. Cautions for re-work
·Too much solder amount will increase the risk of PCB bending or cause other damages.
· Too little solder amount will result in MLCC breaking loose from the PCB due to the
inadequate adhesive strength.
·Check if the solder has been applied properly and ensure the solder fillet has a proper shape.
*Soldering wire below ø0.5mm is required for soldering.
4-7. Cleaning
4-7-1. In general, cleaning is unnecessary if rosin flux is used.
When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning
fluids, thereby affecting the performance of MLCC.
This means that the cleansing solution must be carefully selected and should always be new.
4-7-2. Cautions for cleaning
MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong
during cleaning. When high pressure cleaning equipment is used, test should be done for the
cleaning equipment and its process before the cleaning in order to avoid damages on MLCC.
Distance 5㎜ ≤
Hot Air Application angle 45℃
Hot Air Temperature Nozzle Outlet 400℃ ≥
Application Time 10s＞
25
MLCC Product Manual
4-8. Cautions for using electrical measuring probes
·Confirm the position of the support pin or jig when checking the electrical performance of MLCC
after mounting on the PCB.
· Watch for PCB bending caused by the pressure of a test-probe or other equipment.
· If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may
be damaged.
· Avoid PCB flexing by using the support pin on the back side of the PCB.
· Place equipment with the support pin as close to the test-probe as possible.
· Prevent shock vibrations of the board when the test-probe contacts a PCB.
Not recommended Recommended
4-9. Printed Circuit Board Cropping
· Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC
on the PCB.
·The stress as shown may cause cracks in MLCC when cutting the board.
·Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit.
· Avoid these types of stresses applied to MLCC.
[Bending] [Twisting]
4-9-1. Cautions for cutting PCB
Check a cutting method of PCB in advance.
The high density board is separated into many individual boards after the completion of soldering.
If the board is bent or deformed during separation, MLCC may be cracked.
Carefully select a separation method that minimizes the deformation of the PCB.
26
MLCC Product Manual
4-10. Assembly Handling
4-10-1. Cautions for PCB handling
Hold the edges of the board mounted with MLCC with both hands since holding with one hand
may bend the board.
Do not use dropped boards, which may degrade the quality of MLCC.
4-10-2. Mounting other components
Pay attention to the following conditions when mounting other components on the back side of
The board after MLCC has been mounted on the front side.
When the suction nozzle is placed too close to the board, board deflection stress may be
applied to MLCC on the back side, resulting in cracks in MLCC.
Check if proper value is set on each chip mounter for a suction location, a mounting gap and a
suction gap by the thickness of components.
4-10-3. Board mounting components with leads
If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder
joint may be cracked.
Pay attention to the following:
· Reduce the stress on the board during insertion by increasing the size of the lead insertion
hole.
· Insert components with leads into the board after fixing the board with support pins or a
dedicated jig.
· Support the bottom side of the board to avoid bending the board.
· Check the status of the height of each support pin regularly when the support pins are used.
Not recommended Recommended
27
MLCC Product Manual
4-10-4. Socket and / or connector attach / detach
Since the insertion or removal from sockets and connectors may cause the board to bent, make
sure that MLCC mounted on the board should not be damaged in this process.
4-10-5. Fastening screw
When attaching a shield on a board, the board may be bent during a screw tightening work
Pay attention to the following conditions before performing the work.
·Plan the work to prevent the board from bending
·Use a torque driver to prevent over-tightening of the screw.
· Since the board may be bent by soldering, use caution in tightening the screw.
4-11. Adhesive selection
Pay attention to the following if an adhesive is used to position MLCC on the board before
soldering.
4-11-1. Requirements for Adhesives
·They must have enough adhesive strength to prevent MLCC from slipping or moving during
the handling the board.
· They must maintain their adhesive strength when exposed to soldering temperatures.
· They should not spread when applied to the PCB.
· They should have a long pot life.
· They should hardened quickly.
· They should not corrode the board or MLCC materials.
· They should be an insulator type that does not affect the characteristic of MLCC.
·They should be non-toxic, not harmful, and particularly safe when workers touch the adhesives.
4-11-2. Caution before Applying Adhesive
Check the correct application conditions before attaching MLCC to the board with an adhesive.
If the dimension of land, the type of adhesives, the amount of coating, the contact surface areas,
the curing temperature, or other conditions are not appropriate, it may degrade the MLCC
performance.
28
MLCC Product Manual
4-11-3. Cautions for selecting Adhesive
Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded.
In addition, MLCC may be cracked by the difference in contractile stress caused by the different
contraction rate between MLCC and the adhesive.
4-11-4. Cautions for the amount of applied adhesive and curing temperature
·The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the a
mounting defect in MLCC
· Excessive use of the adhesive may cause a soldering defect, loss of electrical connection,
incorrect curing, or slippage of a mounting position, thereby an inflow of the adhesive onto a
land section should be avoided.
· If the curing temperature is too high or the curing time is too long, the adhesive strength will
be degraded. In addition, oxidation both on the outer termination (Sn) of MLCC and the
surface of the board may deteriorate the solderability.
4-12. Flux
4-12-1. The excessive amount of flux generates excessive flux gases which may deteriorate solderability.
Therefore, apply the flux thin and evenly as a whole.
4-12-2. Flux with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not
done properly. Therefore, use flux with a halogen content of 0.1% max.
4-12-3. Strong acidic flux can degrade the MLCC performance
4-12-4. Check the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the
mounting process.
4-13. Coating
4-13-1. Crack caused by Coating
A crack may be caused in the MLCC due to amount of the resin and stress of thermal
contraction of the resin during coating process.
During the coating process, the amount of resin and the stress of thermal contraction of the
resin may cause cracks in MLCC
The difference of thermal expansion coefficient between the coating, or a molding resin may
cause destruction, deterioration of insulation resistance or dielectric breakdown of MLCC such
as cracks or detachment, etc.
29
MLCC Product Manual
4-13-2. Recommended Coating material
· A thermal expansion coefficient should be as close to that of MLCC as possible.
·A silicone resin can be used as an under-coating to buffer the stress.
· The resin should have a minimum curing contraction rate.
· The resin should have a minimum sensitivity (ex. Epoxy resin).
· The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is
used in a high humidity condition.
· Do not use strong acid substances due to the fact that coating materials inducing a family of
halogen substances and organic acid may corrode MLCC.
30
MLCC Product Manual
5. Design
5-1. Circuit design
When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the
drop in insulation resistance. Therefore, it is required to install safety equipment such as a fuse to
prevent additional accidents when MLCC is short-circuited, otherwise, electric short and fire may
occur. This product is not a safety guaranteed product..
5-2. PCB Design
5-2-1. Unlike lead type components, SMD type components that are designed to be mounted directly
on the board are fragile to the stress. In addition, they are more sensitive to mechanical and
thermal stress than lead type components.
5-2-2. MLCC crack by PCB material type
A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal
expansion and contraction, resulting in cracks in MLCC. Even though MLCC is mounted on a
board with a fluorine resin or on a single-layered glass epoxy, cracks in MLCC may occur.
5-3. Design system evaluation
5-3-1. Evaluate the actual design with MLCC to make sure there is no functional issue or violation of
specifications of the finished goods.
5-3-2. Please note that the capacitance may differ based on the operating condition of the actual system
since Class 2 MLCC capacitance varies with applied voltage and temperature.
5-3-3. Surge resistance must be evaluated since the excessive surge caused by the inductance of the
actual system may apply to MLCC.
5-3-4. Note the actual MLCC size and the termination shape.
31
MLCC Pr
o
5-4 Land
d
The re
c
R
F
o
duct Ma
imension
ommende
eflow Fo
Chi
p
Size
[mm]
0402
0603
1005
1608
2012
3216
3225
4532
5750
low Foot
Chip Size
[mm]
1608
2012
3216
nual
land dime
o
tprint
Chi
p
Tol.
[mm]
± 0.02
± 0.03
± 0.05
± 0.07
± 0.09
± 0.05
± 0.07
± 0.10
± 0.15
± 0.20
± 0.30
± 0.40
± 0.10
± 0.15
± 0.20
± 0.25
± 0.30
±0.10
±0.15
±0.20
±0.25
±0.30
±0.20
±0.30
-
-
-
p
rint
Chip Tol.
[mm]
-
-
-
sion is det
a
[mm]
0.14~0.20
0.16~0.20
0.18~0.26
0.20~0.28
0.22~0.30
0.35~0.40
0.37~0.42
0.40~0.45
0.40~0.45
0.45~0.50
0.45~0.50
0.50~0.55
0.50~0.55
0.55~0.60
0.60~0.65
0.65~0.70
0.70~0.75
0.70~0.75
0.75~0.80
0.80~0.85
0.85~0.90
0.90~0.95
1.70~1.90
1.80~2.00
2.00~2.40
2.80~3.20
4.00~4.60
a
[mm]
0.60~1.00
1.00~1.20
2.00~2.40
rmined by
b
[mm]
0.14~0.22
0.24~0.32
0.24~0.32
0.25~0.35
0.25~0.35
0.37~0.47
0.37~0.47
0.37~0.47
0.40~0.50
0.40~0.50
0.42~0.52
0.45~0.55
0.60~0.65
0.62~0.67
0.65~0.70
0.70~0.75
0.75~0.80
0.75~0.80
0.80~0.85
0.85~0.90
0.95~1.00
1.05~1.10
0.85~1.00
0.95~1.10
1.00~1.40
1.40~1.80
1.70~2.30
b
[mm]
0.60~0.80
0.80~1.20
1.00~1.20
valuating t
c
[mm]
0.20~0.26
0.30~0.35
0.32~0.37
0.35~0.39
0.35~0.39
0.50~0.55
0.52~0.58
0.55~0.60
0.60~0.65
0.65~0.70
0.70~0.75
0.75~0.80
0.80~0.85
0.85~0.90
0.90~0.95
0.95~1.00
1.00~1.05
1.25~1.30
1.30~1.35
1.35~1.40
1.40~1.45
1.45~1.50
1.60~1.80
1.70~1.90
1.80~2.20
2.40~3.00
4.10~4.90
c
[mm]
0.60~0.80
0.80~1.20
1.00~1.40
e actual SE
(
a+2b
)
min
0.42
0.64
0.66
0.7
0.72
1.09
1.11
1.14
1.2
1.25
1.29
1.4
1.7
1.79
1.9
2.05
2.2
2.2
2.35
2.5
2.75
3
3.4
3.7
4
5.6
7.4
(a+2b)
min
1.8
2.6
4.0
T
and a bo
a
(a+2b)
max
0.64
0.84
0.9
0.98
1
1.34
1.36
1.39
1.45
1.5
1.54
1.65
1.85
1.94
2.05
2.2
2.35
2.35
2.5
2.65
2.9
3.15
3.9
4.2
5.2
6.8
9.2
(a+2b)
max
2.6
3.6
4.8
rd.
32
MLCC Product Manual
6. Others
6-1. Storage environment
6-1-1. Recommendation for temperature/humidity
Even taping and packaging materials are designed to endure a long-term storage, they should
be stored with a temperature of 0~40°C and an RH of 0~70% otherwise, too high temperatures
or humidity may deteriorate the quality of the product rapidly.
As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is,
the better the solderability is.
As the temperature difference may cause dew condensation during the storage of the product,
it is a must to maintain a temperature control environment
6-1-2. Shelf Life
An allowable storage period should be within 6 months from the outgoing date of delivery in
consideration of solderability. As for products in storage over 6 months, please check solderability
before use.
6-2. Caution for corrosive environment
As corrosive gases may deteriorate the solderability of MLCC outer termination, it is a must to
store MLCC in an environment without gases. MLCC that is exposed to corrosive gases may cause
its quality issues due to the corrosion of plating layers and the penetration of moisture.
6-3. Equipment in operation
6-3-1. Do not touch MLCC directly with bare hands to prevent an electric shock or damage.
6-3-2. The termination of MLCC shall not be contacted with a conductive object (short –circuit).
Do not expose MLCC to conductive liquid containing acidic or alkaline material.
6-3-3. Do not use the equipment in the following conditions.
(1) Exposure to water or oil
(2) Exposure to direct sunlight
33
MLCC Product Manual
(3) Exposure to Ozone or ultra-violet radiation.
(4) Exposure to corrosive gas (e.g. hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas)
(5) Exposure to vibration or mechanical shock exceeding specified limit
(6) Exposure to high humidity
6-3-4. If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug
from the power source.
If the equipment is not switched off or unplugged, serious damage may occur due to the
continuous power supply. Please be careful with the high temperature in this condition.
6-4. Waste treatment
In case of scrapping MLCC, it is incinerated or buried by a licensed industrial waste company.
When scrapping MLCC, it is recommended to incinerate or bury the scrappage by a licensed
industrial waste company.
6-5. Operating temperature
The operating temperature limit is determined by the specification of each models.
6-5-1. Do not use MLCC over the maximum operating temperature.
Pay attention to equipment’s temperature distribution and the seasonal fluctuation of ambient
temperature.
6-5-2. The surface temperature of MLCC cannot exceed the maximum operating temperature including
self-heating effects.
6-6. Transportation
The performance of MLCC may be affected by transportation conditions.
6-6-1. MLCC shall be protected from excessive temperature, humidity and a mechanical force during
transportation.
34
MLCC Product Manual
During transportation, the cartons shall not be deformed and the inner packaging shall be
protected from excessive external forces.
6-6-2. Do not apply excessive vibrations, shocks or excessive forces to MLCC.
· If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack.
· When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a
tweezer, etc, MLCC may crack or become short-circuited.
6-6-3. MLCC may crack and become non-functional due to the excessive shocks or dropping during
transportation
.
6-7. Notice
Some special products are excluded from this document.
Please be advised that this is a standard product specification for a reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
35
MLCC Product Manual
Caution of Application
Disclaimer
The products listed as follows are NOT designed and manufactured for any use and applications set
forth below.
Please note that any misuse of the products deviating from products specifications or information
provided in this Spec sheet may cause serious property damages or personal injury.
① Aerospace/Aviation equipment
② Automotive of Transportation equipment (vehicles，trains，ships，etc)
③ Military equipment
④ Atomic energy-related equipment
⑤ Undersea equipment
⑥ Any other applications with the same as or similar complexity or reliability to the applications
Limitation
Please contact us with usage environment information such as voltage, current, temperature, or other
special conditions before using our products for the applications listed below. The below application
conditions require especially high reliability products to prevent defects that may directly cause damages
or loss to third party's life, body or property.
If you have any questions regarding this 'Limitation'，you should first contact our sales
personnel or application engineers.
① Medical equipment
② Disaster prevention/crime prevention equipment
③ Power plant control equipment
④Traffic signal equipment
⑤ Data-processing equipment
⑥ Electric heating apparatus，burning equipment
⑦ Safety equipment
⑧Any other applications with the same as or similar complexity or reliability to the applications
36