SP3232EBCA-L/TR - Sipex Corporation

True +3.0V to +5.5V RS-232 Transceiver s

SP3222EB/3232EB

DESCRIPTION

■ Meets true EIA/TIA-232-F Standards

from a +3.0V to +5.5V power supply

■ 250kbps Transmission Rate Under Load

■ 1µA Low-Power Shutdown with Receivers

Active (SP3222EB)

■ Interoperable with RS-232 down to +2.7V

power source

■ Enhanced ESD Specifications:

±15kV Human Body Model

±15kV IEC1000-4-2 Air Discharge

±8kV IEC1000-4-2 Contact Discharge

SELECTION TABLE

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The SP3222EB/3232EB series is an RS-232 transceiver solution intended for portable or

hand-held applications such as notebook or palmtop computers. The SP3222EB/3232EB

series has a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors

in 3.3V operation. This charge pump allows the SP3222EB/3232EB series to deliver true RS-

232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222EB/

3232EB are 2-driver/2-receiver devices. This series is ideal for portable or hand-held

applications such as notebook or palmtop computers. The ESD tolerance of the SP3222EB/

3232EB devices are over ±15kV for both Human Body Model and IEC1000-4-2 Air discharge

test methods. The SP3222EB device has a low-power shutdown mode where the devices'

driver outputs and charge pumps are disabled. During shutdown, the supply current falls to

less than 1µA.

NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.

NOTE 2: Driver Input hysteresis is typically 250mV.

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional

operation of the device at these ratings or any other

above those indicated in the operation sections of

the specifications below is not implied. Exposure to

absolute maximum rating conditions for extended

periods of time may affect reliability and cause

permanent damage to the device.

VCC ...................................................... -0.3V to +6.0V

V+ (NOTE 1) ...................................... -0.3V to +7.0V

V- (NOTE 1) ....................................... +0.3V to -7.0V

V+ + |V-| (NOTE 1)...........................................+13V

ICC (DC VCC or GND current)......................... ±100mA

Input Voltages

TxIN, EN ............................................ -0.3V to +6.0V

RxIN .................................................................. ±25V

Output Voltages

TxOUT ........................................................... ±13.2V

RxOUT ..................................... -0.3V to (VCC + 0.3V)

Short-Circuit Duration

TxOUT .................................................... Continuous

Storage Temperature ...................... -65°C to +150°C

Power Dissipation Per Package

20-pin SSOP (derate 9.25mW/oC above +70oC)........750mW

18-pin PDIP (derate 15.2mW/oC above +70oC) .......1220mW

18-pin SOIC (derate 15.7mW/oC above +70oC) ....... 1260mW

20-pin TSSOP (derate 11.1mW/oC above +70oC)...... 890mW

16-pin SSOP (derate 9.69mW/oC above +70oC)........775mW

16-pin PDIP (derate 14.3mW/oC above +70oC) .......1150mW

16-pin Wide SOIC (derate 11.2mW/oC above +70oC) .... 900mW

16-pin TSSOP (derate 10.5mW/oC above +70oC)...... 850mW

16-pin nSOIC (derate 13.57mW/°C above +70°C) ...... 1086mW

SPECIFICATIONS

Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, C1 to

C4=0.1µF

PARAMETER MIN. TYP. MAX. UNITS CONDITIONS

DC CHARACTERISTICS

Supply Current 0.3 1.0 mA no load, TAMB = +25°C, VCC = 3.3V,

TxIN = VCC or GND

Shutdown Supply Current 1.0 10 µASHDN = GND, TAMB = +25°C,

VCC = +3.3V, TxIN = VCC or GND

LOGIC INPUTS AND RECEIVER OUTPUTS

Input Logic Threshold LOW GND 0.8 V TxIN, EN, SHDN, Note 2

Input Logic Threshold HIGH 2.0 VCC VV

CC = 3.3V, Note 2

2.4 V VCC = 5.0V, Note 2

Input Leakage Current ±0.01 ±1.0 µATxIN, EN, SHDN, TAMB = +25°C,

VIN = 0V to VCC

Output Leakage Current ±0.05 ±10 µAreceivers disabled, VOUT = 0V to VCC

Output Voltage LOW 0.4 V IOUT = 1.6mA

Output Voltage HIGH VCC-0.6 VCC-0.1 V IOUT = -1.0mA

DRIVER OUTPUTS

Output Voltage Swing ±5.0 ±5.4 V 3kΩ load to ground at all driver

outputs, TAMB = +25°C

Output Resistance 300 ΩVCC = V+ = V- = 0V, TOUT = +2V

Output Short-Circuit Current ±35 ±60 mA VOUT = 0V

Output Leakage Current ±25 µAV

OUT = ±12V,VCC= 0V,

or 3.0V to 5.5V, drivers disabled

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SPECIFICATIONS (continued)

Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX , C1 to

C4=0.1µF. Typical Values apply at VCC = +3.3V or +5.5V and TAMB = 25oC.

Figure 1. Transmitter Output Voltage vs Load

Capacitance. Figure 2. Slew Rate vs Load Capacitance.

Figure 3. Supply Current vs Load Capacitance when

Transmitting Data.

TYPICAL PERFORMANCE CHARACTERISTICS

Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers

loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.

0500 1000 2000 3000 4000 5000

Slew rate (V/µs)

Load Capacitance (pF)

- Slew

+ Slew

T1 at 250Kbps

T2 at 15.6Kbps

All TX loaded 3K // CLoad

Figure 4. Supply Current vs Supply Voltage.

-2

-4

-6

2.7 3 3.5 4 4.5 5

Supply Voltage (V)

Transmitter Output

Voltage (V)

TxOUT -

TxOUT +

T1 at 250Kbps

T2 at 15.6Kbps

All TX loaded 3K // 1000 pF

Figure 5. Transmitter Output Voltage vs Supply

Voltage.

Supply Current (mA)

Load Capacitance (pF)

0 1000 2000 3000 4000 5000

250Kbps

125Kbps

20Kbps

T1 at Full Data Rate

T2 at 1/16 Data Rate

All TX loaded 3K // CLoad

-2

-4

-6

01000 2000 3000 4000 5000

TxOUT +

TxOUT -

Transmitter Output

Voltage (V)

Load Capacitance (pF)

T1 at 250Kbps

T2 at 15.6Kbps

All TX loaded 3K // CLoad

2.7 3 3.5 4 4.5 5

Supply Current (mA)

Supply Voltage (V)

1 T ransmitter at 250Kbps

1 T ransmitter at 15.6Kbps

All transmitters loaded with 3K // 1000pf

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Table 1. Device Pin Description

Figure 7. Pinout Configuration for the SP3232EB

Figure 6. Pinout Configurations for the SP3222EB

V-

417

SHDN

C1+

V+

C1-

C2+

C2-

N.C.

R1IN

GND

VCC

T1OUT

N.C.

10 11

R2IN

R2OUT

SP3222EB

T2OUT T1IN

T2IN

R1OUT

SSOP/TSSOP

V-

415

SHDN

C1+

V+

C1-

C2+

C2-

R1IN

GND

T1OUT

910

R2IN

SP3222EB

T2OUT T2IN

T1IN

R1OUT

DIP/SO

R2OUT

V-

413

C1+

V+

C1-

C2+

C2-

R1IN

R2IN

GND

VCC

T1OUT

T2IN

SP3232EB

T1IN

R1OUT

R2OUT

T2OUT

Figure 8. SP3222EB Typical Operating Circuits

Figure 9. SP3232EB Typical Operating Circuit

SP3222EB

GND

T1IN

T2IN

T1OUT

T2OUT

C1+

C1-

C2+

C2-

V+

V-

0.1µF

+*C3

0.1µF

17 RS-232

OUTPUTS

RS-232

INPUTS

LOGIC

INPUTS

5kΩ

R1IN

R1OUT

5kΩ

R2IN

R2OUT

LOGIC

OUTPUTS

EN 20

SHDN

*can be returned to

either V

or GND

SSOP

TSSOP

SP3222EB

GND

T1IN

T2IN

T1OUT

T2OUT

C1+

C1-

C2+

C2-

V+

V-

0.1µF

+*C3

0.1µF

15 RS-232

OUTPUTS

RS-232

INPUTS

LOGIC

INPUTS

5kΩ

R1IN

R1OUT

5kΩ

R2IN

R2OUT

LOGIC

OUTPUTS

EN 18

SHDN

*can be returned to

either V

or GND

DIP/SO

SP3232EB

GND

T1IN

T2IN

T1OUT

T2OUT

C1+

C1-

C2+

C2-

V+

V-

0.1µF

+*C3

0.1µF

7RS-232

OUTPUTS

RS-232

INPUTS

LOGIC

INPUTS

5kΩ

R1IN

R1OUT

12 13

5kΩ

R2IN

R2OUT

LOGIC

OUTPUTS

*can be returned to

either V

or GND

DESCRIPTION

The SP3222EB/3232EB transceivers meet the

EIA/TIA-232 and V.28/V.24 communication

protocols and can be implemented in battery-

powered, portable, or hand-held applications

such as notebook or palmtop computers. The

SP3222EB/3232EB devices all feature Sipex's

proprietary on-board charge pump circuitry that

generates 2 x VCC for RS-232 voltage levels

from a single +3.0V to +5.5V power supply.

This series is ideal for +3.3V-only systems,

mixed +3.3V to +5.5V systems, or +5.0V-only

systems that require true RS-232 performance.

The SP3222EB/3232EB series have drivers that

operate at a typical data rate of 250kbps fully

loaded.

The SP3222EB and SP3232EB are 2-driver/2-

receiver devices ideal for portable or hand-held

applications. The SP3222EB features a 1µA

shutdown mode that reduces power consump-

tion and extends battery life in portable systems.

Its receivers remain active in shutdown mode,

allowing external devices such as modems to be

monitored using only 1µA supply current.

THEORY OF OPERATION

The SP3222EB/3232EB series are made up of

three basic circuit blocks: 1. Drivers, 2.

Receivers, and 3. the Sipex proprietary charge

pump.

Drivers

The drivers are inverting level transmitters that

convert TTL or CMOS logic levels to ±5.0V

EIA/TIA-232 levels inverted relative to the in-

put logic levels. Typically, the RS-232 output

voltage swing is ±5.5V with no load and at least

±5V minimum fully loaded. The driver outputs

are protected against infinite short-circuits to

ground without degradation in reliability. Driver

outputs will meet EIA/TIA-562 levels of ±3.7V

with supply voltages as low as 2.7V.

The drivers can guarantee a data rate of 250kbps

fully loaded with 3KΩ in parallel with 1000pF,

ensuring compatibility with PC-to-PC commu-

nication software.

The slew rate of the driver output is internally

limited to a maximum of 30V/µs in order to

meet the EIA standards (EIA RS-232D 2.1.7,

Paragraph 5). The transition of the loaded

output from HIGH to LOW also meets the

monotonicity requirements of the standard.

Figure 10 shows a loopback test circuit used to

the RS-232 drivers. Figure 11 shows the test

results of the loopback circuit with all drivers

active at 120kbps with RS-232 loads in parallel

with 1000pF capacitors. Figure 12 shows the

test results where one driver was active at

250kbps and all drivers loaded with an RS-232

receiver in parallel with a 1000pF capacitor. A

solid RS-232 data transmission rate of 250kbps

provides compatibility with many designs in

personal computer peripherals and LAN appli-

cations.

The SP3222EB driver's output stages are turned

off (tri-state) when the device is in shutdown

mode. When the power is off, the SP3222EB

device permits the outputs to be driven up to

±12V. The driver's inputs do not have pull-up

resistors. Designers should connect unused in-

puts to VCC or GND.

In the shutdown mode, the supply current falls

to less than 1µA, where SHDN = LOW. When

the SP3222EB device is shut down, the device's

driver outputs are disabled (tri-stated) and the

charge pumps are turned off with V+ pulled

down to VCC and V- pulled to GND. The time

required to exit shutdown is typically 100µs.

Connect SHDN to VCC if the shutdown mode is

not used.

Figure 11. Driver Loopback Test Results at 120kbps Figure 12. Driver Loopback Test Results at 250 kbps

Figure 10. SP3222EB/3232EB Driver Loopback Test Circuit

SP3222EB

SP3232EB

GND

TxIN TxOUT

C1+

C1-

C2+

C2-

V+

V-

0.1µF

+C3

0.1µF

LOGIC

INPUTS

5kΩ

RxIN

RxOUT

LOGIC

OUTPUTS

EN* *SHDN

1000pF

* SP3222EB only

Receivers

The receivers convert EIA/TIA-232 levels to

TTL or CMOS logic output levels. The

SP3222EB receivers have an inverting tri-state

output. These receiver outputs (RxOUT) are tri-

stated when the enable control EN = HIGH. In

the shutdown mode, the receivers can be active

or inactive. EN has no effect on TxOUT. The

truth table logic of the SP3222EB driver and

receiver outputs can be found in Table 2.

Since receiver input is usually from a transmis-

sion line where long cable lengths and system

interference can degrade the signal, the inputs

have a typical hysteresis margin of 300mV. This

ensures that the receiver is virtually immune to

noisy transmission lines. Should an input be left

unconnected, a 5kΩ pulldown resistor to ground

will commit the output of the receiver to a HIGH

state.

Charge Pump

The charge pump is a Sipex–patented design

(5,306,954) and uses a unique approach com-

pared to older less–efficient designs. The charge

pump still requires four external capacitors, but

uses a four–phase voltage shifting technique to

attain symmetrical 5.5V power supplies. The

internal power supply consists of a regulated

dual charge pump that provides output voltages

5.5V regardless of the input voltage (VCC) over

the +3.0V to +5.5V range.

In most circumstances, decoupling the power

supply can be achieved adequately using a 0.1µF

bypass capacitor at C5 (refer to Figures 8 and 9).

In applications that are sensitive to power-sup-

ply noise, decouple VCC to ground with a capaci-

tor of the same value as charge-pump capacitor

C1. Physically connect bypass capacitors as

close to the IC as possible.

The charge pumps operate in a discontinuous

mode using an internal oscillator. If the output

voltages are less than a magnitude of 5.5V, the

charge pumps are enabled. If the output voltage

exceed a magnitude of 5.5V, the charge pumps

are disabled. This oscillator controls the four

phases of the voltage shifting. A description of

each phase follows.

Phase 1

— VSS charge storage — During this phase of

the clock cycle, the positive side of capacitors

C1 and C2 are initially charged to VCC. Cl+ is

then switched to GND and the charge in C1– is

transferred to C2–. Since C2+ is connected to

VCC, the voltage potential across capacitor C2

is now 2 times VCC.

Phase 2

— VSS transfer — Phase two of the clock con-

nects the negative terminal of C2 to the VSS

storage capacitor and the positive terminal of C2

to GND. This transfers a negative generated

voltage to C3. This generated voltage is regu-

lated to a minimum voltage of -5.5V. Simulta-

neous with the transfer of the voltage to C3, the

positive side of capacitor C1 is switched to VCC

and the negative side is connected to GND.

Phase 3

— VDD charge storage — The third phase of the

clock is identical to the first phase — the charge

transferred in C1 produces –VCC in the negative

terminal of C1, which is applied to the negative

side of capacitor C2. Since C2+ is at VCC, the

voltage potential across C2 is 2 times VCC.

Phase 4

— VDD transfer — The fourth phase of the clock

connects the negative terminal of C2 to GND,

and transfers this positive generated voltage

across C2 to C4, the VDD storage capacitor.

Table 2. SP3222EB Truth Table Logic for Shutdown

and Enable Control

NDHSNETUOxTTUOxR

00 etats-irTevitcA

01 etats-irTetats-irT

10 evitcAevitcA

11 evitcAetats-irT

This voltage is regulated to +5.5V. At this

voltage, the internal oscillator is disabled. Si-

multaneous with the transfer of the voltage to

C4, the positive side of capacitor C1 is switched

to VCC and the negative side is connected to

GND, allowing the charge pump cycle to begin

again. The charge pump cycle will continue as

long as the operational conditions for the inter-

nal oscillator are present.

Since both V+ and V– are separately generated

from VCC; in a no–load condition V+ and V– will

be symmetrical. Older charge pump approaches

that generate V– from V+ will show a decrease in

the magnitude of V– compared to V+ due to the

inherent inefficiencies in the design.

The clock rate for the charge pump typically

operates at 250kHz. The external capacitors can

be as low as 0.1µF with a 16V breakdown

voltage rating.

ESD Tolerance

The SP3222EB/3232EB series incorporates

ruggedized ESD cells on all driver output and

receiver input pins. The ESD structure is

improved over our previous family for more

rugged applications and environments sensitive

to electrostatic discharges and associated

transients. The improved ESD tolerance is at

least ±15kV without damage nor latch-up.

There are different methods of ESD testing

applied: a) MIL-STD-883, Method 3015.7

b) IEC1000-4-2 Air-Discharge

c) IEC1000-4-2 Direct Contact

The Human Body Model has been the generally

accepted ESD testing method for semiconduc-

tors. This method is also specified in MIL-STD-

883, Method 3015.7 for ESD testing. The premise

of this ESD test is to simulate the human body’s

potential to store electrostatic energy and

discharge it to an integrated circuit.

The simulation is performed by using a test

model as shown in Figure 18. This method

will test the IC’s capability to withstand an

ESD transient during normal handling such as

in manufacturing areas where the ICs tend to

be handled frequently.

The IEC-1000-4-2, formerly IEC801-2, is

generally used for testing ESD on equipment

and systems. For system manufacturers, they

must guarantee a certain amount of ESD

protection since the system itself is exposed to

the outside environment and human presence.

The premise with IEC1000-4-2 is that the

system is required to withstand an amount of

static electricity when ESD is applied to points

and surfaces of the equipment that are

accessible to personnel during normal usage.

The transceiver IC receives most of the ESD

current when the ESD source is applied to the

connector pins. The test circuit for IEC1000-4-2

is shown on Figure 19. There are two methods

within IEC1000-4-2, the Air Discharge method

and the Contact Discharge method.

With the Air Discharge Method, an ESD

voltage is applied to the equipment under

test (EUT) through air. This simulates an

electrically charged person ready to connect a

cable onto the rear of the system only to find

an unpleasant zap just before the person

touches the back panel. The high energy

potential on the person discharges through

an arcing path to the rear panel of the system

before he or she even touches the system. This

energy, whether discharged directly or through

air, is predominantly a function of the discharge

current rather than the discharge voltage.

Variables with an air discharge such as

approach speed of the object carrying the ESD

potential to the system and humidity will tend to

change the discharge current. For example, the

rise time of the discharge current varies with

the approach speed.

Figure 13. Charge Pump — Phase 1

Figure 14. Charge Pump — Phase 2

Figure 15. Charge Pump Waveforms

Figure 16. Charge Pump — Phase 3

Figure 17. Charge Pump — Phase 4

Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V

T[]

+6V

a) C

b) C

GND

-6V

= +5V

–5V –5V

+5V

Storage Capacitor

–

––

VCC = +5V

–10V

VSS Storage Capacitor

VDD Storage Capacitor

C1C2

–

––

= +5V

–5V

+5V

–5V

Storage Capacitor

–

––

= +5V

+10V

Storage Capacitor

–

––

The Contact Discharge Method applies the ESD

current directly to the EUT. This method was

devised to reduce the unpredictability of the

ESD arc. The discharge current rise time is

constant since the energy is directly transferred

without the air-gap arc. In situations such as

hand held systems, the ESD charge can be

directly discharged to the equipment from a

person already holding the equipment. The

current is transferred on to the keypad or the

serial port of the equipment directly and then

travels through the PCB and finally to the IC.

The circuit models in Figures 18 and 19

represent the typical ESD testing circuits used

for all three methods. The CS is initially charged

with the DC power supply when the first

switch (SW1) is on. Now that the capacitor is

charged, the second switch (SW2) is on while

SW1 switches off. The voltage stored in the

capacitor is then applied through RS, the current

limiting resistor, onto the device under test

(DUT). In ESD tests, the SW2 switch is pulsed

so that the device under test receives a duration

of voltage.

Figure 18. ESD Test Circuit for Human Body Model

Figure 19. ESD Test Circuit for IEC1000-4-2

SW1 SW2

Device

Under

Test

DC Power

Source

SW1 SW2

and

add up to 330Ω for IEC1000-4-2.

and

add up to 330Ω for IEC1000-4-2.

Contact-Discharge Module

SW1 SW2

Device

Under

Test

DC Power

Source

SW1 SW2

Contact-Discharge Module

Figure 20. ESD Test Waveform for IEC1000-4-2

30A

I ➙

15A

t=30ns

t ➙

t=0ns

Device Pin Human Body IEC1000-4-2

Tested Model Air Discharge Direct Contact Level

Driver Outputs ±15kV ±15kV ±8kV 4

Receiver Inputs ±15kV ±15kV ±8kV 4

Table 3. Transceiver ESD Tolerance Levels

For the Human Body Model, the current

limiting resistor (RS) and the source capacitor

(CS) are 1.5kΩ an 100pF, respectively. For

IEC-1000-4-2, the current limiting resistor (RS)

and the source capacitor (CS) are 330Ω an

150pF, respectively.

The higher CS value and lower RS value in the

IEC1000-4-2 model are more stringent than the

Human Body Model. The larger storage capacitor

injects a higher voltage to the test point when SW2

is switched on. The lower current limiting resistor

increases the current charge onto the test point.

PACKAGE: PLASTIC SHRINK

SMALL OUTLINE

(SSOP)

DIMENSIONS (Inches)

Minimum/Maximum

(mm) 20–PIN

0.068/0.078

(1.73/1.99)

0.002/0.008

(0.05/0.21)

0.010/0.015

(0.25/0.38)

0.278/0.289

(7.07/7.33)

0.205/0.212

(5.20/5.38)

0.0256 BSC

(0.65 BSC)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

16–PIN

0.068/0.078

(1.73/1.99)

0.002/0.008

(0.05/0.21)

0.010/0.015

(0.25/0.38)

0.239/0.249

(6.07/6.33)

0.205/0.212

(5.20/5.38)

0.0256 BSC

(0.65 BSC)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

ALTERNATE

END PINS

(BOTH ENDS)

D1 = 0.005" min.

(0.127 min.)

PACKAGE: PLASTIC

DUAL–IN–LINE

(NARROW)

A = 0.210" max.

(5.334 max).

LA2

A1 = 0.015" min.

(0.381min.)

e = 0.100 BSC

(2.540 BSC) e

= 0.300 BSC

(7.620 BSC)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

16–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

0.780/0.800

(19.812/20.320)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

18–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

0.880/0.920

(22.352/23.368)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC)

(WIDE)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

16–PIN

0.090/0.104

(2.29/2.649)

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.398/0.413

(10.10/10.49)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

18–PIN

0.090/0.104

(2.29/2.649))

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.447/0.463

(11.35/11.74)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC)

(NARROW)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

h x 45°

16–PIN

0.053/0.069

(1.346/1.748)

0.004/0.010

(0.102/0.249)

0.013/0.020

(0.330/0.508)

0.386/0.394

(9.802/10.000)

0.150/0.157

(3.802/3.988)

0.050 BSC

(1.270 BSC)

0.228/0.244

(5.801/6.198)

0.010/0.020

(0.254/0.498)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

Gage

Plane

1.0 OIA

0.169 (4.30)

0.177 (4.50)

0.252 BSC (6.4 BSC)

0’-8’ 12’REF

0.039 (1.0)

e/2

0.039 (1.0)

0.126 BSC (3.2 BSC)

0.007 (0.19)

0.012 (0.30)

0.033 (0.85)

0.037 (0.95)

0.002 (0.05)

0.006 (0.15)

0.043 (1.10) Max

(θ3)

1.0 REF

0.020 (0.50)

0.026 (0.75) (θ1)

0.004 (0.09) Min

0.010 (0.25)

(θ2)

0.008 (0.20)

DIMENSIONS

in inches (mm) Minimum/Maximum

Symbol 14 Lead 16 Lead 20 Lead 24 Lead 28 Lead 38 Lead

D 0.193/0.201 0.193/0.201 0.252/0.260 0.303/0.311 0.378/0.386 0.378/0.386

(4.90/5.10) (4.90/5.10) (6.40/6.60) (7.70/7.90) (9.60/9.80) (9.60/9.80)

e 0.026 BSC 0.026 BSC 0.026 BSC 0.026 BSC 0.026 BSC 0.020 BSC

(0.65 BSC) (0.65 BSC) (0.65 BSC) (0.65 BSC) (0.65 BSC) (0.50 BSC)

PACKAGE: PLASTIC THIN

SMALL OUTLINE

(TSSOP)

ORDERING INFORMATION

Model Temperature Range Package Type

SP3222EBCA .......................................... 0˚C to +70˚C.......................................... 20-Pin SSOP

SP3222EBCP .......................................... 0˚C to +70˚C............................................18-Pin PDIP

SP3222EBCT........................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC

SP3222EBCY .......................................... 0˚C to +70˚C........................................ 20-Pin TSSOP

SP3222EBEA.......................................... -40˚C to +85˚C........................................ 20-Pin SSOP

SP3222EBEP.......................................... -40˚C to +85˚C..........................................18-Pin PDIP

SP3222EBET .......................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC

SP3222EBEY.......................................... -40˚C to +85˚C...................................... 20-Pin TSSOP

SP3232EBCA .......................................... 0˚C to +70˚C.......................................... 16-Pin SSOP

SP3232EBCP .......................................... 0˚C to +70˚C............................................16-Pin PDIP

SP3232EBCT........................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC

SP3232EBCN .......................................... 0˚C to +70˚C......................................... 16-Pin nSOIC

SP3232EBCY .......................................... 0˚C to +70˚C........................................ 16-Pin TSSOP

SP3232EBEA.......................................... -40˚C to +85˚C........................................ 16-Pin SSOP

SP3232EBEP.......................................... -40˚C to +85˚C..........................................16-Pin PDIP

SP3232EBET .......................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC

SP3232EBEN ......................................... -40˚C to +85˚C....................................... 16-Pin nSOIC

SP3232EBEY.......................................... -40˚C to +85˚C...................................... 16-Pin TSSOP

Corporation

SIGNAL PROCESSING EXCELLENCE

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the

application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.

Sipex Corporation

Headquarters and

Sales Office

233 South Hillview Drive

Milpitas, CA 95035

TEL: (408) 934-7500

FAX: (408) 935-7600

Sales Office

22 Linnell Circle

Billerica, MA 01821

TEL: (978) 667-8700

FAX: (978) 670-9001

e-mail: sales@sipex.com

Please consult the factory for pricing and availability on a Tape-On-Reel option.