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Maxim > Design Support > App Notes > Wireless and RF > APP 5100
Keywords: layout, pcb, mixed signal, rf pcb, board design, board layout, wireless, printed circuit board, stripline, transmission line
Sep 14, 2011
APPLICATION NOTE 5100
General Layout Guidelines for RF and Mixed-Signal PCBs
By: Michael Bailey
Abstract: This application note provides guidelines and suggestions for RF printed-circuit board (PCB) design and layout, including
some discussion of mixed -signal applications. The material provides "best practices" guidance, and should be used in conjunction
with all other design and manufacturing guidelines that may apply to particular components, PCB manufacturers, and material sets as
applicable.
This application note applies to all of Maxim's wireless products. For more information, please select a wireless or RF product.
Table of Contents
Introduction
RF Transmission Lines
Microstrip
Suspended Stripline
Coplanar Waveguide (Grounded)
Characteristic Impedance
Transmission Line Bends and Corner Compensation
Layer Changes for Transmission Lines
Signal Line Isolation
Ground Planes
Special Consideration on Bias and Ground Layers
Power (Bias) Routing and Supply Decoupling
Selection of Decoupling or Bypass Capacitors
Bypass Capacitor Layout Considerations
Grounding of Shunt Connected Components
IC Ground Plane ("Paddle")
Introduction
This application note provides guidelines and suggestions for RF printed-circuit board (PCB) design and layout, including some
discussion of mixed - signal applications, such as digital, analog, and RF components on the same PCB. The material is arranged by
topic areas and provides "best practices" guidance. It should be used in conjunction with all other design and manufacturing
guidelines that may apply to particular components, PCB manufacturers, and material sets as applicable.
RF Transmission Lines
Many of Maxim's RF components require controlled impedance transmission lines that will transport RF power to (or from) IC pins on
the PCB. These transmission lines can be implemented on a exterior layer (top or bottom), or buried in an internal layer. Guidelines
for these transmission lines include discussions relating to the microstrip, suspended stripline, coplanar waveguide (grounded), and
characteristic impedance. It also describes transmission line bends and corner compensation, and layer changes for transmission
lines.
Microstrip
This type of transmission line consists of fixed -width metal routing (the conductor), along with a solid unbroken ground plane located
directly underneath (on the adjacent layer). For example, a microstrip on Layer 1 (top metal) requires a solid ground plane on Layer
2 (Figure 1). The width of the routing, the thickness of the dielectric layer, and the type of dielectric determine the characteristic
impedance (typically 50Ω or 75Ω).
Page 1 of 14
Figure 1. Microstrip example (isometric view).
Suspended Stripline
This line consists of a fixed- width routing on an inner layer, with solid ground planes above and below the center conductor. The
conductor can be located midway between the ground planes ( Figure 2), or it can be offset (Figure 3). This is the appropriate
method for RF routing on inner layers.
Figure 2. Suspended stripline (end view).
Figure 3. Offset suspended stripline. A variant of the stripline, for PCBs with unequal layer thicknesses (end view).
Coplanar Waveguide (Grounded)
A coplanar waveguide provides for better isolation between nearby RF lines, as well as other signal lines (end view). This medium
consists of a center conductor with ground planes on either side and below (Figure 4).
Figure 4. A coplanar waveguide provides for better isolation between nearby RF lines and other signal lines.
Page 2 of 14
Via "fences" are recommended on both sides of a coplanar waveguide, as shown in Figure 5. This top view provides an example of
a row of ground vias on each top metal gound plane on either side of the center conductor. Return currents induced on the top layer
are shorted to the underlying ground layer.
Figure 5. Via fences are recommended on both sides of a coplanar waveguide.
Characteristic Impedance
There are several calculators available to properly set the signal conductor line width to achieve the target impedance. However,
caution should be used when entering the dielectric constant of the layers. The outer laminated layers of typical PCBs often contain
less glass content than the core of the board, and consequently the dielectric constant is lower. For example, FR4 core is generally
given as εR = 4.2, whereas the outer laminate (prepreg) layers are typically εR = 3.8. Examples given below for reference only, metal
thickness assumed for 1oz copper (1.4 mils, 0.036mm).
Table 1. Examples of Characteristic Impedance
Media Dielectric Layer Thickness in mils
(mm) Center Conductor in mils
(mm) Gap Characteristic
Impedance
Microstrip Prepreg
(3.8) 6 (0.152) 11.5 (0.292) N/A 50.3
10 (0.254) 20 (0.508) 50.0
Diff. Pair Prepreg
(3.8) 6 (0.152) 25 (0.635) 6
(0.152) 50.6
Stripline FR4 (4.5) 12 (0.305) 3.7 (0.094) N/A 50.0
Offset
Stripline Prepreg
(3.9) 6 (0.152) upper,
10 (0.254) lower 4.8 (0.122) N/A 50.1
Coplanar
WG Prepreg
(3.8) 6 (0.152) 14 (0.35) 20
(0.50) 49.7
Transmission Line Bends and Corner Compensation
When transmission lines are required to bend (change direction) due to routing constraints, use a bend radius that is at least 3 times
the center conductor width. In other words:
Bend Radius ≥ 3 × (Line Width).
This will minimize any charactericstic impedance changes moving through the bend.
In cases where a gradually curved bend is not possible, the transmission line can undergo a right-angle bend (noncurved). See
Figure 6. However, this must be compensated to reduce the impedance discontinuity caused by the local increase in effective line
width going through the bend. A standard compensation method is the angled miter, as illustrated below. The optimum microstrip
right -angle miter is given by the formula of Douville and James:
Where M is the fraction (%) of the miter compared to the unmitered bend. This formula is independent of the dielectric constant, and
is subject to the constraint that w/h ≥ 0.25.
Page 3 of 14
Similar methods can be employed for other transmission lines. If there is any uncertaintly as to the correct compensation, the bend
should be modeled using an electromagnetic simulator if the design requires high- performance transmission lines.
Figure 6. When a curved bend is not possible, the transmission line can undergo a right-angle bend.
Layer Changes for Transmission Lines
When layout constraints required that a transmission line move to a different layer, it is recommended that at least two via holes be
used for each transition to minimize the via inductance loading. A pair of vias will effectively cut the transition inductance by 50%,
and the largest diameter via should be utilized that is compatible with the transmission line width. For example, on a 15 -mil
microstrip line, a via diameter (finished plated diameter) of 15 mils to 18 mils would be used. If space does not permit the use of
larger vias, then three transition vias of smaller diameter should be used.
Signal Line Isolation
Care must be taken to prevent unintended coupling between signal lines. Some examples of potential coupling and preventative
measures:
RF Transmission Lines: Lines should be kept as far apart as possible, and should not be routed in close proximity for
extended distances. Coupling between parallel microstrip lines will increase with decreasing separation and increasing parallel
routing distance. Lines that cross on separate layers should have a ground plane keeping them apart. Signal lines that will
carry high power levels should be kept away from all other lines whenever possible. The grounded coplanar waveguide
provides for excellent isolation between lines. It is impractical to achieve isolation better than approximately -45dB between
RF lines on small PCBs.
High-Speed Digital Signal Lines: These lines should be routed separately on a different layer than the RF signal lines,
to prevent coupling. Digital noise (from clocks, PLLs, etc.) can couple onto RF signal lines, and these can be modulated onto
RF carriers. Alternatively, in some cases digital noise can be up/down-converted.
VCC/Power Lines: These should be routed on a dedicated layer. Adequate decoupling/bypass capcitors should be provided
at the main VCC distribution node, as well as at V CC branches. The choice of the bypass capacitances must be made based
on the overall frequency response of the RF IC, and the expected frequency distribution nature of any digital noise from clocks
and PLLs. These lines should also be separated from any RF lines that will transmit large amounts of RF power.
Ground Planes
The recommended practice is to use a solid (continuous) ground plane on Layer 2, assuming Layer 1 is used for the RF components
and transmission lines. For striplines and offset striplines, ground planes above and below the center conductor are required. These
planes must not be shared or assigned to signal or power nets, but must be uniquely allocated to ground. Partial ground planes on a
layer, sometimes required by design constraints, must underlie all RF components and transmission lines. Ground planes must not
be broken under transmission line routing.
Ground vias between layers should be added liberally throughout the RF portion of the PCB. This helps prevent accrual of parasitic
ground inductance due to ground -current return paths. The vias also help to prevent cross-coupling from RF and other signal lines
across the PCB.
Page 4 of 14
Special Consideration on Bias and Ground Layers
The layers assigned to system bias (DC supply) and ground must be considered in terms of the return current for the components.
The general guidance is to not have signals routed on layers between the bias layer and the ground layer.
Figure 7. Incorrect layer assignment: there are signal layers between the bias layer and ground -current return path on ground layer.
Bias line noise can be coupled to the signal layers.
Figure 8. Better layer assignment: there are no signal layers between the bias and ground return layers.
Power (Bias) Routing and Supply Decoupling
A common practice is to use a "star" configuration for the power -supply routes, if a component has several supply connections
(Figure 9). A larger decoupling capacitor (tens of µFds) is mounted at the "root" of the star, and smaller capacitors at each of the
star branches. The value of these latter capacitors depends on the operating frequency range of the RF IC, and their specific
functionality (i.e., interstage vs. main supply decoupling). An example is shown below.
Page 5 of 14
More detailed image (PDF, 2MB)
Figure 9. If a component has several supply connections, the power-supply routes can be arranged in a star configuration.
The "star" configuration avoides long ground return paths that would result if all the pins connected to the same bias net were
connected in series. A long ground return path would cause a parasitic inductance that could lead to unintended feedback loops. The
key consideration with supply decoupling is that the DC supply connections must be electrically defined as AC ground.
Selection of Decoupling or Bypass Capacitors
Real capacitors have limited effective frequency ranges due to their self-resonant frequency (SRF). The SRF is available from the
manufacturer, but sometimes must be characterized by direct measurement. Above the SRF, the capacitor is inductive, and therefore
will not perform the decoupling or bypass function. When broadband decoupling is required, standard practice is to use several
capacitors of increasing size (capacitance), all connected in parallel. The smaller value capacitors normally have higher SRFs (for
example, a 0.2pF value in a 0402 SMT package with an SRF = 14GHz), while the larger values have lower SRFs (for example, a
2pF value in the same package with an SRF = 4GHz). A typical arrangement is depicted in Table 2.
Table 2. Useful Frequency Ranges of Capacitors
Component Capacitance Package SRF Useful Frequency Range*
Ultra -High Range 20pF 0402 2.5GHz 800MHz to 2.5GHz
Very High Range 100pF 0402 800MHz 250MHz to 800MHz
High Range 1000pF 0402 250MHz 50MHz to 250MHz
Midrange 1µF 0402 60MHz 100kHz to 60MHz
Low Range 10µF 0603 600kHz 10kHz to 600kHz
Page 6 of 14
*Low end of useful frequency range defined as less than 5Ω of capacitive reactance.
Bypass Capacitor Layout Considerations
Since the supply lines must be AC ground, it is important to minimize the parasitic inductance added to the AC ground return path.
These parasitic inductances can be caused by layout or component orientation choices, such as the orientation of a decoupling
capacitor's ground. There are two basic methods, shown in Figure 10 and Figure 11.
Figure 10. This configuration presents the smallest total footprint for the bypass capcitor and related vias.
In this configuration, the vias connecting the VCC pad on the top layer to the inner power plane (layer) poentially impede the AC
ground current return, forcing a longer return path with resulting higher parasitic inductance. Any AC current flowing into the VCC pin
passes through the bypass capcitor to its ground side before returning on the inner ground layer. This configuration presents the
smallest total footprint for the bypass capcitor and related vias.
Figure 11. This configuration requires more PCB area.
In this alternate configuration, the AC ground return paths are not blocked by the power -plane vias. Generally this configuration
requires somewhat more PCB area.
Grounding of Shunt-Connected Components
For shunt-connected (grounded) components (such as power- supply decoupling capacitors), the recommended practice is to use at
least two grounding vias for each component (Figure 12). This reduces the effect of via parasitic inductance. Via ground "islands"
can be used for groups of shunt-connected components.
Page 7 of 14
Figure 12. Using at least two grounding vias for each components reduces the effect of via parasitic inductance.
IC Ground Plane ("Paddle")
Most ICs require a solid ground plane on the component layer (top or bottom of PCB) directly underneath the component. This
ground plane will carry DC and RF return currents through the PCB to the assigned ground plane. The secondary function of this
component "ground paddle" is to provide a thermal heatsink, so the paddle should include the maximum number of thru vias that are
allowed by the PCB design rules. The example below shows a 5 × 5 array of via holes embedded in the central ground plane (on
the component layer) directly under the RF IC (Figure 13). The maximum number of vias that can be accomodated by other layout
considerations should be used. These vias are ideally thru-vias (i.e., penetrate all the way through the PCB), and must be plated. If
possible, the vias should be filled with thermally conductive paste to enhance the heatsink (the paste is applied after via plating and
prior to final board plating).
Figure 13. A 5 × 5 array of via holes embedded in the central ground plane directly under the RF IC.
Please see our Wireless and RF Products page for more information.
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MAX2694 GPS/GNSS Low-Noise Amplifiers
MAX2695 WLAN/WiMax Low-Noise Amplifiers
MAX2740 Integrated GPS Receiver and Synthesizer
MAX2745 Single-Chip Global Positioning System Front-End Downconverter -- Free Samples
MAX2750 2.4GHz Monolithic Voltage- Controlled Oscillators -- Free Samples
MAX2750AUA 2.4GHz Monolithic Voltage- Controlled Oscillator for Automotive
MAX2751 2.4GHz Monolithic Voltage- Controlled Oscillators -- Free Samples
MAX2752 2.4GHz Monolithic Voltage- Controlled Oscillators -- Free Samples
MAX2769 Universal GPS Receiver -- Free Samples
MAX2769B Universal GPS Receiver -- Free Samples
MAX2828 Single-/Dual -Band 802.11a/b/g World-Band Transceiver ICs -- Free Samples
MAX2829 Single-/Dual -Band 802.11a/b/g World-Band Transceiver ICs -- Free Samples
MAX2830 2.4GHz to 2.5GHz 802.11g/b RF Transceiver with PA and Rx/Tx/Diversity
Switch
MAX2831 2.4GHz to 2.5GHz, 802.11g RF Transceivers with Integrated PA
MAX2832 2.4GHz to 2.5GHz, 802.11g RF Transceivers with Integrated PA -- Free Samples
MAX2837 2.3GHz to 2.7GHz Wireless Broadband RF Transceiver -- Free Samples
MAX2838 3.3GHz to 3.8GHz Wireless Broadband RF Transceiver -- Free Samples
MAX2839 2.3GHz to 2.7GHz MIMO Wireless Broadband RF Transceiver -- Free Samples
MAX2839AS 2.3GHz to 2.7GHz MIMO Wireless Broadband RF Transceiver
MAX2842 3.3GHz to 3.9GHz MIMO Wireless Broadband RF Transceiver -- Free Samples
MAX2850 5GHz, 4-Channel MIMO Transmitter -- Free Samples
MAX2851 5GHz, 5-Channel MIMO Receiver -- Free Samples
MAX2852 5GHz Receiver -- Free Samples
MAX2900 200mW Single-Chip Transmitter ICs for 868MHz/915MHz ISM Bands -- Free Samples
MAX2901 200mW Single-Chip Transmitter ICs for 868MHz/915MHz ISM Bands -- Free Samples
MAX2902 200mW Single-Chip Transmitter ICs for 868MHz/915MHz ISM Bands -- Free Samples
MAX2903 200mW Single-Chip Transmitter ICs for 868MHz/915MHz ISM Bands -- Free Samples
MAX2904 200mW Single-Chip Transmitter ICs for 868MHz/915MHz ISM Bands -- Free Samples
MAX2990 10kHz to 490kHz OFDM -Based Power Line Communications Modem -- Free Samples
MAX3518 DOCSIS 3.0 Upstream Amplifier -- Free Samples
MAX3524 Low-Noise, High -Linearity Broadband Amplifier -- Free Samples
MAX3541 Complete Single-Conversion Television Tuner -- Free Samples
MAX3542 Complete Single-Conversion Television Tuner -- Free Samples
MAX3543 Multiband Analog and Digital Television Tuner -- Free Samples
MAX3544 Multiband Digital Television Tuner -- Free Samples
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MAX3580 Direct-Conversion TV Tuner -- Free Samples
MAX3654 47MHz to 870MHz Analog CATV Transimpedance Amplifier -- Free Samples
MAX4000 2.5GHz 45dB RF -Detecting Controllers -- Free Samples
MAX4001 2.5GHz 45dB RF -Detecting Controllers -- Free Samples
MAX4002 2.5GHz 45dB RF -Detecting Controllers -- Free Samples
MAX4987AE Overvoltage-Protection Controller with USB ESD Protection -- Free Samples
MAX4987BE Overvoltage-Protection Controller with USB ESD Protection
MAX5879 14 -Bit, 2.3Gsps Direct RF Synthesis DAC with Selectable Frequency Response
MAX5894 14 -Bit, 500Msps, Interpolating and Modulating Dual DAC with CMOS Inputs -- Free Samples
MAX66901-K00 High -Frequency Developers Kit for ISO 14443B and ISO 15693 RFID Keys
MAX7030 Low-Cost, 315MHz, 345MHz, and 433.92MHz ASK Transceiver with Fractional-
N PLL -- Free Samples
MAX7031 Low-Cost, 308MHz, 315MHz, and 433.92MHz FSK Transceiver with Fractional-
N PLL -- Free Samples
MAX7032 Low-Cost, Crystal -Based, Programmable, ASK/FSK Transceiver with
Fractional-N PLL -- Free Samples
MAX7033 315MHz/433MHz ASK Superheterodyne Receiver with AGC Lock -- Free Samples
MAX7034 315MHz/434MHz ASK Superheterodyne Receiver -- Free Samples
MAX7036 300MHz to 450MHz ASK Receiver with Internal IF Filter -- Free Samples
MAX7042 308MHz/315MHz/418MHz/433.92MHz Low-Power, FSK Superheterodyne
Receiver -- Free Samples
MAX7044 300MHz to 450MHz High -Efficiency, Crystal -Based +13dBm ASK Transmitter -- Free Samples
MAX7049 High-Performance, 288MHz to 945MHz ASK/FSK ISM Transmitter -- Free Samples
MAX7057 300MHz to 450MHz Frequency- Programmable ASK/FSK Transmitter -- Free Samples
MAX7058 315MHz/390MHz Dual -Frequency ASK Transmitter -- Free Samples
MAX7060 280MHz to 450MHz Programmable ASK/FSK Transmitter -- Free Samples
MAX8805 600mA/650mA PWM Step -Down Converters in 2mm x 2mm WLP for WCDMA
PA Power
MAX8805W 600mA/650mA PWM Step -Down Converters in 2mm x 2mm WLP for WCDMA
PA Power
MAX8805X 600mA/650mA PWM Step -Down Converters in 2mm x 2mm WLP for WCDMA
PA Power
MAX8805Y 600mA/650mA PWM Step -Down Converters in 2mm x 2mm WLP for WCDMA
PA Power
MAX8805Z 600mA/650mA PWM Step -Down Converters in 2mm x 2mm WLP for WCDMA
PA Power
MAX9930 2MHz to 1.6GHz 45dB RF- Detecting Controllers and RF Detector -- Free Samples
MAX9931 2MHz to 1.6GHz 45dB RF- Detecting Controllers and RF Detector -- Free Samples
MAX9932 2MHz to 1.6GHz 45dB RF- Detecting Controllers and RF Detector -- Free Samples
MAX9933 2MHz to 1.6GHz 45dB RF- Detecting Controllers and RF Detector -- Free Samples
MAX9947 AISG Integrated Transceiver -- Free Samples
MAX9957 Fast Dual Driver for ATE with Waveform Shaping -- Free Samples
MAX9981 825MHz to 915MHz, Dual SiGe High -Linearity Active Mixer -- Free Samples
MAX9982 825MHz to 915MHz, SiGe High -Linearity Active Mixer -- Free Samples
MAX9984 SiGe High - Linearity, 400MHz to 1000MHz Downconversion Mixer with LO
Buffer/Switch -- Free Samples
MAX9985 Dual, SiGe, High-Linearity, 700MHz to 1000MHz Downconversion Mixer with
LO Buffer/Switch -- Free Samples
MAX9985A Dual, SiGe, High-Linearity, 700MHz to 1000MHz Downconversion Mixer with
LO Buffer/Switch
MAX9986 SiGe High - Linearity, 815MHz to 995MHz Downconversion Mixer with LO
Buffer/Switch -- Free Samples
MAX9986A SiGe High - Linearity, 815MHz to 1000MHz Downconversion Mixer with LO
Buffer/Switch -- Free Samples
MAX9987 +14dBm to +20dBm LO Buffers/Splitters with ±1dB Variation -- Free Samples
MAX9988 +14dBm to +20dBm LO Buffers/Splitters with ±1dB Variation -- Free Samples
MAX9989 +14dBm to +20dBm LO Buffers with ±1dB Variation -- Free Samples
MAX9990 +14dBm to +20dBm LO Buffers with ±1dB Variation -- Free Samples
MAX9993 High-Linearity 1700MHz to 2200MHz Down- Conversion Mixer with LO
Buffer/Switch -- Free Samples
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MAX9994 SiGe High - Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO
Buffer/Switch
-- Free Samples
MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with
LO Buffer/Switch -- Free Samples
MAX9995A Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with
LO Buffer/Switch
MAX9996 SiGe High - Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO
Buffer/Switch -- Free Samples
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Application Note 5100: http://www.maxim-ic.com/an5100
AN5100, AN 5100, APP5100, Appnote5100, Appnote 5100
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