Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 LM3881 Simple Power Sequencer With Adjustable Timing 1 Features 3 Description * * * * * * * The LM3881 Simple Power Sequencer offers the easiest method to control power up and power down of multiple power supplies (switching or linear regulators). By staggering the start-up sequence, it is possible to avoid latch conditions or large inrush currents that can affect the reliability of the system. 1 Easiest Method to Sequence Rails Power-Up and Power-Down Control Tiny Footprint Low Quiescent Current of 80 A Input Voltage Range of 2.7 V to 5.5 V Output Invert Feature Timing Controlled by Small Value External Capacitor Available in VSSOP-8 package, the Simple Sequencer contains a precision enable pin and three open-drain output flags. When the LM3881 is enabled, the three output flags will sequentially release, after individual time delays, thus permitting the connected power supplies to start up. The output flags will follow a reverse sequence during power down to avoid latch conditions. Time delays are defined using an external capacitor and the output flag states can be inverted by the user. 2 Applications * * * * * * Security Cameras Servers Networking Elements FPGA Sequencing Microprocessor and Microcontroller Sequencing Multiple Supply Sequencing Device Information(1) PART NUMBER LM3881 PACKAGE VSSOP (8) BODY SIZE (NOM) 3.00 mm x 3.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Typical System Application DEVICE 1 Input Supply LM3881 EN VCC Enable EN DEVICE 2 FLAG1 FLAG2 Invert INV EN FLAG3 GND DEVICE 3 EN 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... Handling Ratings ...................................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 8 7.4 Device Functional Modes........................................ 13 8 Application and Implementation ........................ 15 8.1 Application Information............................................ 15 8.2 Typical Application ................................................. 15 9 Power Supply Recommendations...................... 18 10 Layout................................................................... 18 10.1 Layout Guidelines ................................................. 18 10.2 Layout Example .................................................... 18 11 Device and Documentation Support ................. 20 11.1 11.2 11.3 11.4 Device Support...................................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 20 20 20 20 12 Mechanical, Packaging, and Orderable Information ........................................................... 20 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (April 2013) to Revision D * Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 4 Changes from Revision B (April 2013) to Revision C * 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 13 Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 5 Pin Configuration and Functions VSSOP Package 8-Pin DGK Top View VCC EN GND INV 1 8 2 7 FLAG1 LM3881 3 6 5 4 FLAG2 FLAG3 TADJ Pin Functions PIN NAME NO. I/O DESCRIPTION VCC 1 I Input Supply EN 2 I Precision Enable GND 3 - Ground INV 4 I Output Logic Invert TADJ 5 O Timer Adjust FLAG3 6 O Open-Drain Output 3 FLAG2 7 O Open-Drain Output 2 FLAG1 8 O Open-Drain Output 1 Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 3 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) (2) MIN MAX UNIT -0.3 6.0 V Junction Temperature 150 C Lead Temperature (Soldering, 5 s) 260 C VCC, EN, INV, TADJ, FLAG1, FLAG2, FLAG3 to GND (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 6.2 Handling Ratings Tstg Storage temperature range V(ESD) (1) Electrostatic discharge MIN MAX UNIT -65 150 C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 2 kV JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX 2.7 5.5 EN, INV, TADJ, FLAG1, FLAG2, FLAG3 to GND -0.3 VCC + 0.3 V Junction Temperature -40 125 C VCC to GND UNIT V 6.4 Thermal Information LM3881 THERMAL METRIC (1) DGK UNIT 8 PINS RJA Junction-to-ambient thermal resistance 224.5 RJC(top) Junction-to-case (top) thermal resistance 107.6 RJB Junction-to-board thermal resistance 145.3 JT Junction-to-top characterization parameter 31.8 JB Junction-to-board characterization parameter 143.7 (1) 4 C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 6.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted). Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C and are provided for reference purposes only. TJ = -40C to +125C, VCC = 3.3 V, unless otherwise specified. PARAMETER IQ TEST CONDITIONS MIN (1) Operating Quiescent Current TYP (2) MAX (1) 80 110 A 0.001 1 A 0.4 V UNIT OPEN-DRAIN FLAGS IFLAG FLAGx Leakage Current VFLAGx = 3.3 V VOL FLAGx Output Voltage Low IFLAGx = 1.2 mA TIME DELAYS ITADJ_SRC TADJ Source Current 4 12 20 A ITADJ_SNK TADJ Sink Current 4 12 20 A VHTH High Threshold Level 1.0 1.22 1.4 V VLTH Low Threshold Level 0.3 0.5 0.7 TCLK Clock Cycle TD1, TD4 Flag Time Delay TD2, TD3, TD5, TD6 Flag Time Delay CADJ = 10 nF 1.2 9 V ms 10 8 Clock cycles Clock cycles ENABLE PIN VEN EN Pin Threshold IEN EN Pin Pullup Current VEN = 0 V 1.0 1.22 1.5 7 V A INV PIN VIH_INV Invert Pin VIH VIL_INV Invert Pin VIL (1) (2) 90% VCC V 10% VCC V Limits are 100% production tested at 25C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL). Typical numbers are at 25C and represent the most likely parametric norm. Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 5 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com 6.6 Typical Characteristics 80.4 82 80.2 80 IQ (PA) IQ (PA) VCC = 3.3 V unless otherwise specified. 80.0 79.8 79.6 2.5 78 76 3.0 3.5 4.0 4.5 5.0 74 -50 5.5 -25 9.56 1.230 9.55 1.225 9.54 1.220 9.52 1.210 9.51 0 25 50 50 75 100 125 9.53 1.215 -25 25 Figure 2. Quiescent Current vs Temperature 1.235 TD (ms) VEN (V) Figure 1. Quiescent Current vs VCC 1.205 -50 0 TEMPERATURE (C) VCC (V) 75 100 9.50 2.5 125 3 3.5 4 4.5 5 5.5 VIN (V) TEMPERATURE (C) Figure 3. Enable Threshold vs Temperature Figure 4. Time Delay vs VIN (CADJ = 10 nF Nominal) 9.75 1 9.70 0.8 VFLAG (V) TD (ms) 9.65 9.60 0.6 0.4 9.55 0.2 9.50 9.45 -50 -25 0 25 50 75 100 0 125 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 TEMPERATURE (C) VIN (V) Figure 5. Time Delay vs Temperature (CADJ = 10 nF Nominal) 6 Figure 6. VFLAG vs VIN (INV Low, RFLAG = 100 k) Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 Typical Characteristics (continued) VCC = 3.3 V unless otherwise specified. 1 0.8 VFLAG (V) VCC = 3.3V 0.6 VCC = 5V 0.4 0.2 0 0 1 2 3 4 5 IFLAG (mA) Figure 7. FLAG Voltage vs Current Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 7 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com 7 Detailed Description 7.1 Overview The LM3881 Simple Power Sequencer provides a simple solution for sequencing multiple rails in a controlled manner. An established clock signal facilitates control of the power up and power down of three open-drain FET output flags. These flags permit connection to shutdown or enable pins of linear regulators and/or switching regulators to control the operation of the power supplies. This allows design of a complete power system without the concern of large inrush currents or latch-up conditions that can occur during an uncontrolled startup. An invert (INV) pin reverses the logic of the output flags. This pin should be tied to a logic output high or low and not allowed to remain open circuit. The following discussion assumes the INV pin is held low such that the flag output is active high. 7.2 Functional Block Diagram VCC FLAG1 7 PA EN + TD1 - TD2 Timing Delay Generation 1.22V FLAG2 TD3 TD4 Sequence Control TD5 TD6 Clock FLAG3 TADJ GND INV 7.3 Feature Description 7.3.1 Adjustable Timing A small external timing capacitor is connected to the TADJ pin that establishes the clock waveform. This capacitor is linearly charged/discharged by a fixed current source/sink, denoted ITADJ_SRC / ITADJ_SNK, of magnitude 12 A between predefined voltage threshold levels, denoted VLTH and VHTH, to generate the timing waveform as shown in Figure 8. 8 Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 Feature Description (continued) High Threshold Level, VHTH = 1.22V TADJ Low Threshold Level, VLTH = 0.5V TCLK Figure 8. TADJ Pin Timing Waveform Thus, the clock cycle duration is directly proportional to the timing capacitor value. Considering the TADJ voltage threshold levels and the charge/discharge current magnitude, it can be shown that the timing capacitor-clock period relationship is typically 120 s/nF. For example, a 10-nF capacitor sets up a clock period of 1.2 ms. The timing sequence of the LM3881 is controlled by the enable (EN) pin. Upon power up, all the flags are held low until the precision enable pin exceeds its threshold. After the EN pin is asserted, the power-up sequence will commence and the open-drain flags will be sequentially released. An internal counter will delay the first flag (FLAG1) from rising until a fixed time period, denoted by TD1 in Figure 9, elapses. This corresponds to at least nine, maximum 10, clock cycles depending on where EN is asserted relative to the clock signal. Upon release of the first flag, another timer will begin to delay the release of the second flag (FLAG2). This time delay, denoted TD2, corresponds to exactly eight clock periods. Similarly, FLAG3 is released after time delay TD3, again eight clock cycles, has expired. Accordingly, a TADJ capacitor of 10 nF generates typical time delays TD2 and TD3 of 9.6 ms and TD1 of from 10.8 ms to 12.0 ms. The power-down sequence is the same as power up, but in reverse order. When the EN pin is deasserted, a timer will begin that delays the third flag (FLAG3) from pulling low. The second and first flag will then follow in a sequential manner after their appropriate time delays. These time delays, denoted TD4, TD5, TD6, are equal to TD1, TD2, TD3, respectively. For robustness, the pulldown FET associated with each flag is designed such that it can sustain a short circuit to VCC. EN FLAG1 FLAG2 FLAG3 TADJ TD1 TD2 TD3 9 Clock Cycles 8 Clock Cycles 8 Clock Cycles Figure 9. Power-Up Sequence, INV Low Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 9 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com Feature Description (continued) EN FLAG1 FLAG2 FLAG3 TADJ TD1 TD2 TD3 9 Clock Cycles 8 Clock Cycles 8 Clock Cycles Figure 10. Power-Up Sequence, INV High EN FLAG1 FLAG2 FLAG3 TADJ TD4 TD5 TD6 9 Clock Cycles 8 Clock Cycles 8 Clock Cycles Figure 11. Power-Down Sequence, INV Low 10 Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 Feature Description (continued) EN FLAG1 FLAG2 FLAG3 TADJ TD4 TD5 TD6 9 Clock Cycles 8 Clock Cycles 8 Clock Cycles Figure 12. Power-Down Sequence, INV High 7.3.2 Enable Circuit The enable circuit is designed with an internal comparator, referenced to a bandgap voltage (1.22 V), to provide a precision threshold. This allows the timing to be set externally using a capacitor as shown in Figure 13. Alternatively, sequencing can be based on a certain event such as a line voltage reaching 90% of its nominal value by employing a resistor divider from VCC to Enable. 7 PA EN 1.22V + - Enable CEN Figure 13. Precision Enable Circuit Using the internal pullup current source to charge the external capacitor CEN, the time delay while the enable voltage reaches the required threshold, assuming EN is charging from 0V, can be calculated by the equation as follows. Tenable_delay = 1.22V x CEN 7 PA (1) Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 11 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com Feature Description (continued) EN 1.22V 0V Tenable delay Figure 14. Enable Delay Timing A resistor divider can also be used to enable the LM3881 based on exceeding a certain VCC supply voltage threshold. Take care when sizing the resistor divider to include the effects of the internal EN pullup current source. The supply voltage for which EN is asserted is given by REN1 * - 7 PA (R llR ) EN1 EN2 VCCENABLE = 1.22V 1 + (c) REN2 (2) Input Supply (2.7V - 5.5V) LM3881 REN1 VCC EN FLAG1 FLAG2 INV FLAG3 REN2 TADJ CADJ GND Figure 15. Enable Based On Input Supply Level One of the features of the EN pin is that it provides glitch free operation. The timer will start counting at a rising threshold, but will always reset if the EN pin is deasserted before the first output flag is released. This is illustrated in Figure 16, assuming INV is low. EN FLAG1 TD1 Figure 16. Enable Glitch Timing, INV Low 12 Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 Feature Description (continued) If the EN pin remains high for the entire power up sequence, then the part will operate as shown in the standard timing diagrams. However, if the EN signal is deasserted before the power-up sequence completes, the part will enter a controlled shutdown. This allows the system to initiate a controlled power sequence, preventing any latch conditions to occur. Figure 17 describes the flag sequence if the EN pin is deasserted after FLAG1 releases, but before the entire power-up sequence is completed. INV is assumed low. EN FLAG1 FLAG2 FLAG3 TADJ TD4 TD1 9 Clock Cycles < 8 Clock Cycles 9 Clock Cycles EN FLAG1 FLAG2 FLAG3 TADJ TD1 TD2 9 Clock Cycles 8 Clock Cycles < 8 Clock Cycles TD4 TD5 9 Clock Cycles 8 Clock Cycles Figure 17. Incomplete Sequence Timing, INV Low 7.4 Device Functional Modes 7.4.1 Power Up with EN Pin The timing sequence of the Simple Power Sequencer is controlled entirely by the enable (EN) pin. Upon power up, all the flags are held low until this precision enable is pulled high. After the EN pin is asserted, the power-up sequence will commence. Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 13 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com Device Functional Modes (continued) 7.4.2 Power Down with EN Pin When EN pin is deasserted, the power down sequence will commence. A timer will begin that delays the third flag (FLAG3) from pulling low. The second and first flag will then follow in a sequential manner after their appropriate delays. 7.4.3 Noninverted Output Mode When the INV pin is tied to a logic output low, the logic mode of the output flags is active high. This mode is useful to sequence power supplies which have an active high enable input. 7.4.4 Inverted Output Mode When the INV pin is tied to a logic output high, the logic mode of the output flags is active low. This mode is useful to sequence power supplies which have an active low enable input. 14 Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information 8.1.1 Open-Drain Flags Pullup The Simple Power Sequencer contains three open-drain output flags which need to be pulled up for proper operation. 100-k resistors can be used as pullup resistors. 8.1.2 Enable the Device See Enable Circuit. 8.1.3 Timing Adjust See Adjustable Timing. 8.2 Typical Application 8.2.1 Simple Sequencing of Three Power Supplies The Simple Power Sequencer is used to implement a power-up (1 - 2 - 3) and power-down (3 - 2 - 1) sequence of three power supplies. Figure 18. Typical Application Circuit Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 15 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com Typical Application (continued) 8.2.1.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters Design Parameter Example Value Input Supply voltage range 2.7 V to 5.5 V Flag Output voltage, EN high Input Supply Flag Output voltage, EN low 0V Flag Timing Delay, TD1 10.8 ms - 12.0 ms Flag Timing Delay, TD2 and TD3 9.6 ms Power-Up Sequence 1-2-3 Power-Down Sequence 3-2-1 8.2.1.2 Detailed Design Procedure Table 2. Evaluation Board Bill of Materials Ref Des Description Case Size Manufacturer Manufacturer P/N U1 LM3881 Sequencer MSOP-8 Texas Instruments LM388 R1 100 k 0603 Vishay Dale CRCW06031003F-e3 R2 100 k 0603 Vishay Dale CRCW06031003F-e3 R3 100 k 0603 Vishay Dale CRCW06031003F-e3 CADJ 10 nF 10% X7R 16 V 0603 Murata GRM188R71C103KA01 A timing capacitor of CADJ = 10 nF generates typical time delays TD2 and TD3 of 9.6 ms and TD1 of between 10.8 ms and 12.0 ms. The INV pin is tied to GND so that the output flags are active high. See Adjustable Timing for calculating the value for CADJ. 8.2.1.3 Application Curves Figure 19. Power-Up Sequence, CADJ = 10 nF 16 Figure 20. Power-Down Sequence, CADJ = 10 nF Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 Figure 21. Power-Up Sequence, TADJ Open Figure 22. Power-Down Sequence, TADJ Open 8.2.2 Sequencing Using Independent Flag Supply For applications requiring a flag output voltage that is different from the VCC, a separate Flag Supply may be used to pullup the open-drain outputs of the Simple Power Sequencer. This is useful when interfacing the flag outputs with inputs that require a different voltage than VCC. The designer must ensure the Flag Supply voltage is within the range specified in the Recommended Operating Conditions. Figure 23. Sequencing Using Independent Flag Supply Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 17 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com 9 Power Supply Recommendations The VCC pin should be located as close as possible to the input supply (2.7V - 5.5V). An input capacitor is not required but is recommended when noise might be present on the VCC pin. A 0.1 F ceramic capacitor may be used to bypass this noise. 10 Layout 10.1 Layout Guidelines * * Pullup resistors should be connected between the flag output pins and a positive input supply, usually VCC. An independent flag supply may also be used. These resistors should be placed as close as possible to the Simple Power Sequencer and the flag supply. Minimal trace length is recommended to make the connections. A typical value for the pullup resistors is 100k. For very tight sequencing requirements, minimal and equal trace lengths should be used to connect the flag outputs to the desired inputs. This will reduce any propagation delay and timing errors between the flag outputs along the line. 10.2 Layout Example Figure 24 and Figure 25 are layout examples for the LM3881. These examples are taken from the LM3881EVAL. An optional component, assigned reference designator R4, is placed on the bottom side of the PCB to facilitate connection of INV to GND. Figure 24. LM3881 Top 18 Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 LM3881 www.ti.com SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 Layout Example (continued) Figure 25. LM3881 Bottom Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 19 LM3881 SNVS555D - JANUARY 2008 - REVISED DECEMBER 2014 www.ti.com 11 Device and Documentation Support 11.1 Device Support 11.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 11.2 Trademarks All trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.4 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 20 Submit Documentation Feedback Copyright (c) 2008-2014, Texas Instruments Incorporated Product Folder Links: LM3881 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM3881MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STBB LM3881MME/NOPB ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STBB LM3881MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STBB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. 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TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2014 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Apr-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing LM3881MM/NOPB VSSOP DGK 8 LM3881MME/NOPB VSSOP DGK LM3881MMX/NOPB VSSOP DGK SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Apr-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3881MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM3881MME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0 LM3881MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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