TDA6107Q/N2 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1999 Jun 18

File under Integrated Circuits, IC02

1999 Oct 26

INTEGRATED CIRCUITS

TDA6107Q

Triple video output amplifier

1999 Oct 26 2

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

FEATURES

•Typical bandwidth of 5.5 MHz for an output signal of

60 V (p-p)

•High slew rate of 900 V/µs

•No external components required

•Very simple application

•Single supply voltage of 200 V

•Internal reference voltage of 2.5 V

•Fixed gain of 50

•Black-Current Stabilization (BCS) circuit

•Thermal protection.

GENERAL DESCRIPTION

The TDA6107Q includes three video output amplifiers in

oneplasticDIL-bent-SIL9-pinmediumpower(DBS9MPF)

package (SOT111-1), using high-voltage DMOS

technology, and is intended to drive the three cathodes of

a colour CRT directly. To obtain maximum performance,

the amplifier should be used with black-current control.

ORDERING INFORMATION

BLOCK DIAGRAM

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA6107Q DBS9MPF plastic DIL-bent-SIL medium power package with ﬁn; 9 leads SOT111-1

handbook, full pagewidth

MGK278

TDA6107Q

VDD

1, 2, 3

9, 8, 7 Voc(3),

Voc(2),

Voc(1)

5Io(m)

MIRROR 5

DIFFERENTIAL

STAGE

VIP

REFERENCE

CURRENT

SOURCE

Vi(1),

Vi(2),

Vi(3) Ra

3×

CASCODE 1

CASCODE 2

MIRROR 2

1×

MIRROR 4

MIRROR 3

MIRROR 1

THERMAL

PROTECTION

CIRCUIT

1×

Fig.1 Block diagram (one amplifier shown).

1999 Oct 26 3

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

PINNING

SYMBOL PIN DESCRIPTION

Vi(1) 1 inverting input 1

Vi(2) 2 inverting input 2

Vi(3) 3 inverting input 3

GND 4 ground (ﬁn)

Iom 5 black-current measurement output

VDD 6 supply voltage

Voc(3) 7 cathode output 3

Voc(2) 8 cathode output 2

Voc(1) 9 cathode output 1

handbook, halfpage

Vi(1)

Vi(2)

Vi(3)

GND

Iom

VDD

Voc(3)

Voc(2)

Voc(1)

TDA6107Q

MGK277

Fig.2 Pin configuration.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages measured with respect to pin 4 (ground);

currents as speciﬁed in Fig.1; unless otherwise speciﬁed.

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is

desirable to take normal precautions appropriate to handling MOS devices (see

“Handling MOS Devices”

QUALITY SPECIFICATION

Quality specification

“SNW-FQ-611 part D”

is applicable and can be found in the

“Quality reference Handbook”

The handbook can be ordered using the code 9397 750 00192.

SYMBOL PARAMETER MIN. MAX. UNIT

VDD supply voltage 0 250 V

Viinput voltage at pins 1 to 3 0 12 V

Vo(m) measurement output voltage 0 6 V

Vo(c) cathode output voltage 0 VDD V

Tstg storage temperature −55 +150 °C

Tjjunction temperature −20 +150 °C

Ves electrostatic handling

Human Body Model (HBM) −2000 V

Machine Model (MM) −300 V

1999 Oct 26 4

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

THERMAL CHARACTERISTICS

Note

1. An external heatsink is necessary.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient 56 K/W

Rth(j-ﬁn) thermal resistance from junction to ﬁn note 1 11 K/W

Rth(h-a) thermal resistance from heatsink to ambient 18 K/W

Thermal protection

The internal thermal protection circuit gives a decrease of

the slew rate at high temperatures: 10% decrease at

130 °C and 30% decrease at 145 °C (typical values on the

spot of the thermal protection circuit).

handbook, halfpage

−40

Ptot

(W)

40 80 160120

Tamb (°C)

MBH989

(1)

(2)

Fig.3 Power derating curves.

(1) Infinite heatsink.

(2) No heatsink.

handbook, halfpage

MGK279

5 K/W

outputs

fin

thermal protection circuit

6 K/W

Fig.4 Equivalent thermal resistance network.

1999 Oct 26 5

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

CHARACTERISTICS

Operating range: Tj=−20 to +150 °C; VDD = 180 to 210 V. Test conditions: Tamb =25°C; VDD = 200 V;

Vo(c1) =V

o(c2) =V

o(c3) =1⁄2VDD; CL= 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W

(measured in test circuit of Fig.8); unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Iqquiescent supply current 5.9 6.9 7.9 mA

Vref(int) internal reference voltage

(input stage) −2.5 −V

Riinput resistance −3.6 −kΩ

G gain of ampliﬁer 47.5 51.0 55.0

∆G gain difference −2.5 0 +2.5

VO(c) nominal output voltage at

pins 7, 8 and 9 (DC value) Ii=0µA 116 129 142 V

∆VO(c)(offset) differential nominal output

offset voltage between

pins 7 and 8, 8 and 9 and

9 and 7 (DC value)

Ii=0µA−05V

∆V

o(c)(T) output voltage temperature

drift at pins 7, 8 and 9 −−10 −mV/K

∆Vo(c)(T)(offset) differential output offset

voltage temperature drift

between pins 7 and 8,

8 and 9 and 7 and 9

−0−mV/K

Io(m)(offset) offsetcurrentofmeasurement

output Io(c) =0µA;

1.5V<V

i< 5.5 V;

3V<V

o(m) <6V

−50 −+50 µA

∆Io(m)/∆Io(c) linearity of current transfer −100 µA<I

o(c) < 100 µA;

1.5V<V

i< 5.5 V;

3V<V

o(m) <6V

0.9 1.0 1.1

at CRT discharge;

Io(c) = 1 mA;

1.5V<V

i< 5.5 V;

3V<V

o(m) < 5.4 V

−1.0 −

Io(c)(max) maximum peak output current

(pins 7, 8 and 9) 50V<V

o(c) <V

DD −50 V −20 −mA

Vo(c)(min) minimum output voltage

(pins 7, 8 and 9) Vi= 7.0 V; note 1 −−10 V

Vo(c)(max) maximum output voltage

(pins 7, 8 and 9) Vi= 1.0 V; note 1 VDD −15 −−V

Ssmall signal bandwidth

(pins 7, 8 and 9) Vo(c) = 60 V (p-p) −5.5 −MHz

BLlarge signal bandwidth

(pins 7, 8 and 9) Vo(c) = 100 V (p-p) −4.5 −MHz

1999 Oct 26 6

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

Notes

1. See also Fig.5 for the typical DC-to-DC transfer of VIto VO(c).

2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.

tPco cathode output propagation

time 50% input to 50% output

(pins 7, 8 and 9)

Vo(c)( = 100 V (p-p) square

wave; f <1 MHz;

tr=t

f=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

−60 −ns

∆tPco difference in cathode output

propagationtime 50% input to

50% output (pins 7 and 8,

7 and 9 and 8 and 9)

Vo(c) = 100 V (p-p) square

wave; f < 1 MHz;

tr=t

f=40ns

(pins 1, 2 and 3)

−10 0 +10 ns

to(r) cathode output rise time

10% output to 90% output

(pins 7, 8 and 9)

Vo(c) = 50 to 150 V square

wave; f < 1 MHz; tf=40ns

(pins 1, 2 and 3); see Fig.6

67 91 113 ns

to(f) cathode output fall time

90% output to 10% output

(pins 7, 8 and 9)

Vo(c) = 150 to 50 V square

wave; f < 1 MHz; tr=40ns

(pins 1, 2 and 3); see Fig.7

67 91 113 ns

tst settling time 50% input to

99% < output < 101%

(pins 7, 8 and 9)

Vo(c) = 100 V (p-p) square

wave; f < 1 MHz;

tr=t

f=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

−−350 ns

SR slew rate between

50Vto(V

DD −50 V)

(pins 7, 8 and 9)

Vi= 4 V (p-p) square wave;

f < 1 MHz; tr=t

f=40ns

(pins 1, 2 and 3)

−900 −V/µs

Ovcathode output voltage

overshoot (pins 7, 8 and 9) Vo(c) = 100 V (p-p) square

wave; f < 1 MHz;

tr=t

f=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

−2−%

PSRR power supply rejection ratio f < 50 kHz; note 2 −55 −dB

αct(DC) DC crosstalk between

channels −50 −dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Oct 26 7

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

handbook, halfpage

Vo(c)

(V)

22.5 46

(V)

200

160

120

129

MBH988

Fig.5 Typical DC-to-DC transfer of VIto VO(c).

1999 Oct 26 8

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

150

140

100

151

149

tst

Ov (in %)

3.08

4.04

2.12

to(r)

tPco

Vo(c)

(V)

MGK280

Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.

1999 Oct 26 9

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

Ov (in %)

MGK281

150

140

100

3.08

4.04

2.12

Vo(c)

(V)

tst

to(f)

tPco

Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.

1999 Oct 26 10

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

External ﬂashover protection

For sufficient flashover protection it is necessary to apply

an external diode and 100 Ω resistor for each channel.

See application note

“Application and Product description

of TDA6107Q/N1”

(report number AN96072).

To limit the diode current an external 1 kΩ carbon

high-voltage resistor in series with the external diode and

a 2 kV spark gap are needed (for this resistor value, the

CRT has to be connected to the main PCB).

VDD must be decoupled to GND:

1. With a capacitor >20 nF with good HF behaviour

(e.g. foil); this capacitor must be placed as close as

possible to pins 6 and 4, but definitely within 5 mm.

2. With a capacitor >3.3 µF on the picture tube base

print.

Switch-off behaviour

The switch-off behaviour of the TDA6107Q is controllable.

This is due to the fact that the output pins of the

TDA6107Q are still under control of the input pins for low

power supply voltages (approximately 30 V and higher).

Bandwidth

The addition of the flash resistor produces a decreased

bandwidth and increases rise and fall times.

Dissipation

Regarding dissipation, distinction must first be made

between static dissipation (independent of frequency) and

dynamic dissipation (proportional to frequency).

The static dissipation of the TDA6107Q is due to voltage

supply currents and load currents in the feedback network

and CRT.

The static dissipation Pstat equals:

Where:

VDD = supply voltage

IDD = supply current

VO(c) = DC value of cathode voltage

IO(c) = DC value of cathode current.

The dynamic dissipation Pdyn equals:

Where:

CL= load capacitance

Cint = internal load capacitance (≈4 pF)

fi= input frequency

Vo(c)(p-p) = output voltage (peak-to-peak value)

δ= non-blanking duty cycle.

The IC must be mounted on the picture tube base print to

minimize the load capacitance CL.

Pstat VDD IDD 3V

O(c) IO(c)

××+×=

Pdyn 3V

DD CLCint

+()f

o(c)(p-p) δ×××××=

1999 Oct 26 11

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

MGK282

2 MΩ

22 µF

22 nF

probe 1

100 kΩ

6.8 pF

C10

20 nF

C7 10 µF

3.2 pF

136 pF

C11

VIP

REFERENCE

Vi(1) Vof

Iom

Voc(1)

VDD

2 MΩ

22 µF

22 nF

probe 2

100 kΩ

6.8 pF

C13

3.2 pF

C12

136 pF

C14

Vi(2) Vof

Iom

Voc(2)

2 MΩ

TDA6107Q

22 µF

22 nF

probe 3

100 kΩ

4 V

6.8 pF

C16

3.2 pF

C15

136 pF

C17

Vi(3) Vof

Iom

Vo(m)

Voc(3)

Fig.8 Test circuit.

Current sources J1, J2 and J3 are to be tuned so that Vo(c) of pins 9, 8 and 7 is set to 100 V.

1999 Oct 26 12

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

INTERNAL CIRCUITRY

handbook, full pagewidth

7, 8, 9

MGK283

esd

6.8 Vesd

esd

GND VDD

esd

from

input

circuit

from

input

circuit

from

control

circuit

from black

current

measurement

circuit

from

control

circuit

to black current

measurement circuit

to black current

measurement circuit

to black current

measurement circuit

to black current

measurement circuit

esd

TDA6107Q

(1)

esd

flash

to cascode

stage

1, 2, 3

bias

(1) All pins have an energy protection for positive or negative overstress situations.

Fig.9 Internal pin configuration.

1999 Oct 26 13

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

PACKAGE OUTLINE

UNIT A A3b1D12

bcD

(1) E(1) Z(1)

eLPP

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 18.5

17.8 8.7

8.0

15.5

15.1 1.40

1.14 0.67

0.50 1.40

1.14 0.48

0.38 21.8

21.4 21.4

20.7 6.48

6.20 3.4

3.2

2.54

2.54 1.0 65

5.9

5.7

4.4

4.2

3.9

3.4 15.1

14.9

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT111-1 92-11-17

95-03-11

0 5 10 mm

scale

0.25

q1q2

seating plane

pin 1 index

DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1

max. max.

3.7

1999 Oct 26 14

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

SOLDERING

Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual

soldering.Amorein-depthaccountofsoldering ICs canbe

found in our

“Data Handbook IC26; Integrated Circuit

Packages”

(document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of

through-hole mount IC packages on a printed-circuit

board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds.

Thetotalcontacttime ofsuccessivesolder wavesmust not

exceed 5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PACKAGE SOLDERING METHOD

DIPPING WAVE

DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1999 Oct 26 15

Philips Semiconductors Product speciﬁcation

Triple video output ampliﬁer TDA6107Q

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999 68

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Printed in The Netherlands 545004/200/04/pp16 Date of release: 1999 Oct 26 Document order number: 9397 750 06485