Datasheet 1.2V to VCC-1V, 0.55A 1ch Ultra Low Dropout Linear Regulator BD3507HFV General Description Key Specifications BD3507HFV is an ultra-low dropout linear regulator, which operates at a low input supply. The output voltage can be set by the VREF terminal and can be synchronized with other power supplies. BD3507HFV can make up a highly efficient system due to the implementation of an ultra-low dropout N-channel MOSFET with RON=300m (Typ).This IC utilizes a power package with radiation fins, making it useable for regulation with a load of up to 550mA. BD3507HFV is suitable as power supply for chipset bus but it can also be used as a high side switch (RON = 300m/lOUT = 550mA) of a low-voltage power supply line. External ceramic capacitors can be used as output capacitors for compact applications. Input Voltage Range: Supply Voltage Range: Output Current: ON-Resistance: Standby Current: Operating Temperature Range: Package 1.2V to VCC-1V 4.5V to 5.5V 550mA (Max) 300m(Typ) 0A (Typ) -10C to +100C W(Typ) x D(Typ) x H(Max) Features High-accuracy buffer circuit (adjustable from 0.65V to 2.7V) Thermal Shutdown Protection Circuit Enable function Over-Current Protection Undervoltage Lockout Protection Output Ceramic Capacitors HVSOF6 1.60mm x 3.00mm x 0.75mm Applications Notebook PC, desktop PC, digital camera, digital home appliances Typical Application Circuit and Block Diagram VCC VCC IN IN UVLO UVLO Current Limit CL VREF + VREF EN UVLO Enable EN OUT EN EN Ceramic Capacitor EN EN TSD Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211114001 OUT TSD UVLO TSD EN UVLO GND This product has no designed protection against radioactive rays 1/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Pin Configuration Pin Descriptions TOP VIEW VCC EN IN 1 2 3 6 5 4 GND VREF OUT Pin No. Pin Name PIN Function 1 VCC 2 EN Enable input pin 3 IN Input voltage pin 4 OUT Output pin 5 VREF Reference voltage input pin 6 GND Ground pin reverse FIN VCC pin Heat sink Description of Blocks 1. AMP AMP is an error amplifier that compares the reference voltage (VREF) with OUT and drives the output N-Channel FET. The frequency characteristics are optimized so that ceramic capacitors can be used as output capacitors and high-speed transient response can be achieved. The input voltage range of the AMP section is GND-2.7V and the output voltage range of the AMP section is GND-VCC. When the regulator is OFF or UVLO, the output is brought to LOW level and the output of the N-Channel FET is turned OFF. 2. EN EN is a logic input pin which controls the regulator ON or OFF. When the regulator is OFF, the circuit current is maintained to 0A to reduce the standby current of the device. In addition, EN turns ON the FET that discharges VREF and OUT to remove excess electric charge, and prevent malfunction of the IC at the output side. Since the EN pin has no electrical connection to the VCC terminal (as in the case where there is and ESD diode), it does not depend on the input sequence. 3. UVLO UVLO turns OFF the output to prevent output voltage from malfunctioning at the time when VCC voltage drops. Same with EN, UVLO discharges VREF and OUT. When the voltage exceeds the threshold voltage (3.8V, Typ), UVLO turns the output ON. 4. Current Limit When the output is ON and the output current exceeds the set current limit threshold (0.6A or more), the output voltage is attenuated to protect the IC on the load side. When current decreases, the output voltage is restored to the allowable value. 5. Soft Start Adding external resistor and capacitor to VREF pin can achieve soft-start. The output rises in synchronism with VREF pin until the time constant that is determined by C and R. Overshoot of output voltage or inrush current can be prevented. 6. VREF VREF is a reference voltage input pin and sets the output voltage. Since there is no electrical connection to the VCC terminal (as in the case where there is and ESD diode), it does not depend on the input sequence. 7. TSD (Thermal Shut down) In order to prevent thermal breakdown and thermal runaway of the IC, the output is turned OFF when chip temperature exceeds the threshold temperature. When the temperature decreases below the threshold temperature, the output is restored. While the TSD circuit is designed to protect the IC in the occurrence of extreme heat, thermal design should consider not to exceed Tj(max). 8. IN The IN line acts as the major current supply line, and is connected to the output N-Channel FET drain. Since there is no electrical connection with the VCC terminal, as in the case when an ESD diode is connected, so its operation does not depend on the input sequence. However, because of the body diode of the output N-Channel FET, there is electrical connection (diode connection) between IN and OUT. Consequently, when the output is turned ON and OFF by IN, reverse current flows, in which case care must be taken. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Absolute Maximum Ratings (Ta=25C) Parameter Symbol Rating Unit (Note1) V Input Voltage1 VCC 6.0 Input Voltage2 VIN 6.0 (Note1) V VEN (Note1) V (Note 2) W Enable Input Voltage 6.0 Power Dissipation1 Pd1 0.85 Power Dissipation2 Pd2 1.40 (Note 3) W Operating Temperature Range Topr -10 to +100 C Storage Temperature Range Tstg -55 to +150 C Tjmax +150 C Maximum Junction Temperature (Note 1) Provided Pd is not exceeded. (Note 2) When mounted on a 70mm x 70mm x 1.6mm glass epoxy substrate (copper foil area: 2%). Derate by 6.8 mW/C in the case of Ta25C. (Note 3) When mounted on a 70mm x 70mm x 1.6mm glass epoxy substrate (copper foil area: 18%). Derate by 11.2 mW/C in the case of Ta25C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=25C) Parameter Input Voltage1 Input Voltage2 Rating Symbol VCC Unit Min Max 4.5 5.5 V VIN 1.2 VCC-1 V VREF 0.65 2.7 V EN Input Voltage VEN -0.3 +5.5 V Output Current IOUT 0 550 mA VREF Setup Voltage Electrical Characteristics (Unless otherwise noted, Ta=25C, VCC=5V, VIN=1.8V, VVREF=1.2V, VEN=3V) Standard Value Parameter Symbol Min Typ Max Unit Conditions Circuit Current ICC - 0.4 0.7 mA Standby Current1 ISTB - 0 10 A VEN=0V Standby Current2 IINSTB - 0 10 A VEN=0V Output Voltage1 VOUT1 1.188 1.200 1.212 V IOUT=0mA Output Voltage2 VOUT2 1.188 1.200 1.212 V Output Voltage3 VOUT3 1.176 1.200 1.224 V Output Voltage4 VOUT4 2.475 2.500 2.525 V Output Voltage5 VOUT5 2.475 2.500 2.525 V Output Voltage6 VOUT6 2.450 2.500 2.550 V IOUT=300mA IOUT=0mA to 550mA VCC=4.5V to 5.5V Ta=-10C to +100C (Note 4) VIN=3.3V, VVREF=2.5V IOUT=0mA VIN=3.3V, VVREF=2.5V IOUT=300mA VIN=3.3V, VVREF=2.5V IOUT=0mA to 550mA VCC=4.5V to 5.5V Ta=-10C to +100C (Note 4) Over-Current Protect ICL 600 - - mA Output ON-Resistance RON - 300 550 m High Level Enable Input Voltage VENHIGH 2.0 - - V EN: Sweep-up Low Level Enable Input Voltage VENLOW -0.2 - +0.8 V EN: Sweep-down Enable Pin Input Current IEN - 7 10 A VEN=3V UVLO OFF Voltage VUVLO 3.5 3.8 4.1 V VCC: Sweep-up UVLO Hysteresis Voltage VHYS 100 160 220 mV VCC: Sweep-down VREF Pin Bias Current IVREF -0.1 - +0.1 A VVREF=0V to 2.7 V VREF Discharge ON-Resistance RONREF - 1.0 2.0 k Output Discharge ON-Resistance RONDIS - 0.1 0.3 k (Note 4) (Note 4) Not 100% tested www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV ISTB (A) Circuit Current : ICC (mA) Typical Performance Curves Temperature : Ta (C) Temperature : Ta (C) Figure 2. ISTB vs Temperature IIN (mA) IINSTB (A) Figure 1. Circuit Current vs Temperature Temperature : Ta (C) Temperature : Ta (C) Figure 3. IIN vs Temperature www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 4. IINSTB vs Temperature 4/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Typical Performance Curves - continued IODIS (mA) Output Voltage : VOUT (V) VOUT=1.2V Temperature : Ta (C) Temperature : Ta (C) Figure 5. Output Voltage vs Temperature Figure 6. Output Discharge Current (IODIS) vs Temperature IREFDIS (mA) Enable Pin Input Current : IEN (A) VVREF=1.2V Temperature : Ta (C) Temperature : Ta (C) Figure 8. Enable Pin Input Current vs Temperature Figure 7. VREF Discharge Current (IREFDIS) vs Temperature www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Typical Performance Curves - continued Output ON-Resistance : RON (m) Output ON-Resistance RON[m] : RON (m) 500 450 2.5V 400 1.8V 350 300 250 1.2V 200 4 4.5 5 5.5 6 Temperature : Ta (C) VCC[V] Input Voltage 1 : VCC (V) Figure 9. Output ON-Resistance vs Input Voltage 1 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 10. Output ON-Resistance vs Temperature 6/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Typical Waveforms EN EN VREF VREF OUT OUT Figure 11. Startup Waveform Figure 12. Shutdown Waveform VCC VCC EN EN VREF VREF OUT OUT Figure 13. Input Sequence 1 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 14. Input Sequence 2 7/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Typical Waveforms - continued VCC VCC EN EN VREF VREF OUT OUT Figure 15. Input Sequence 3 Figure 16. Input Sequence 4 VCC VCC EN EN VREF VREF OUT OUT Figure 17. Input Sequence 5 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 18. Input Sequence 6 8/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Typical Waveforms - continued VOUT VOUT IOUT IOUT Figure 20. Transient Response (550mA to 0mA/s) Figure 19. Transient Response (0mA to 550mA/s) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Timing Chart EN ON/OFF IN VCC EN VREF OUT VCC t ON/OFF IN hysteresis VCC EN VREF OUT t VREF Synchronous Action IN CC EN VREF OUT t www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Application Information 1. Application Setting Method VCC VR GND VCC C1 R1 VREF VREF EN ON/OFF R2 C4 VIN IN OUT C2 Vo C3 Ceramic Capacitor Part No Value Notes for Use R1/R2 22k/11k The output voltage can be set by external reference voltage (VR) and value of output voltage setting resistors (R1, R2). Output voltage can be computed by VR x R2/(R1+R2) but it is recommended to use at the resistance value (total: about 10 k) which is not susceptible to V REF bias current (100nA). 22F Connect the output capacitor between OUT terminal and GND terminal without fail in order to stabilize output voltage. The output capacitor has a role to compensate for the phase of loop gain and to reduce output voltage fluctuation when load is rapidly changed. When there is an insufficient capacitor value, there is a possibility to cause oscillation, and when the equivalent serial resistance (ESR) of the capacitors is large, output voltage fluctuation is increased when load is rapidly changed. About 22F ceramic capacitors are recommended but output capacitor greatly depends on temperature and load conditions. In addition, when various capacitors are connected in series, the total phase allowance of loop gain becomes insufficient, and oscillation may result. Thorough confirmation at application temperature and under load range conditions is requested. 1F The input capacitor plays a part to lower output impedance of a power supply connected to input terminals (VCC). When output impedance of this power supply increases, the input voltages (VCC) become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection characteristics. The use of capacitors of about 1F with low ESR, which provide less capacity value changes caused by temperature changes, is recommended. But since the input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, thorough confirmation under the application temperature and load range, is requested. C2 10F The input capacitor plays a part to lower output impedance of a power supply connected to input terminals (IN). When output impedance of this power supply increases, the input voltages (V IN) become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection characteristics. The use of capacitors of about 10F with low ESR, which provide less capacity value changes caused by temperature changes, is recommended. But since input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, thorough confirmation under the application temperature and load range, is requested. C4 1F In this IC, the output voltage startup time can be set by VREF terminal capacitor (C4) and R1 and R2 values. When EN terminal is "High" or UVLO is reset, the desired output voltage is reached by the time constant determined by C4, R1, and R2. It is recommended to use capacitors (B special) with small capacitance variations caused by temperature change for C4. C3 C1 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV 2. Directions for Pattern Layout of PCB BD3507HFV Evaluation Board Circuit U1 GND VCC 1 BD3507HFV VCC GND C1 VCC EN SW 2 EN VIN 3 VREF OUT IN C3 B 6 D 3 5 0 5 7 H C5 F V Part No VR R5_1 R5_2 Vo 4 C4_1 BD3507HFV Evaluation Board Application Components Part No Value Company Parts Name VREF C4_2 Value Company Parts Name U1 - ROHM BD3507HFV C1 1F MURATA GRM18 Series R5_1 22k ROHM MCR03 Series C3 10F MURATA GRM21 Series R5_2 11k ROHM MCR03 Series C4_1 22F MURATA GRM31 Series 1F MURATA GRM18 Series C4_2 C5 BD3507HFV Evaluation Board Layout Silk Screen TOP Layer Mid Layer 2 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Mid Layer 1 Bottom Layer 12/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV 3. Heat Loss In thermal design, consider the temperature range wherein the IC is guaranteed to operate and apply appropriate margins. The temperature conditions that need to be considered are listed below: (1) Ambient temperature Ta shall be not more than 100C. (2) Chip junction temperature Tj shall be not more than 150C. Chip junction temperature Tj can be considered as follows: Chip junction temperature Tj is found from ambient temperature Ta: Chip junction temperature Tj is found from IC surface temperature Tc under actual application conditions: Tj Tc j c W <Reference value> j-c: HVSOF6 30C/W Tj Ta j a W <Reference value> j-a: HVSOF6 147.1C/W Single-layer substrate (substrate surface copper foil area:2%) 89.3C/W Single-layer substrate (substrate surface copper foil area:18%) 73.5C/W Single-layer substrate (substrate surface copper foil area:51%) Substrate size 70 x 70 x 1.6mm3 It is recommended to layout multiple VIAs, for heat radiation, in the GND pattern of reverse (of IC) when there is the GND pattern in the inner layer (in using multi-layer substrate). This package is so small (size: 1.0 mm x 1.6 mm) to layout the VIA at the bottom of IC. Spreading the pattern and increasing the number of VIA, as shown in the figure below, can achieve the most heat radiation characteristics. It is recommended that the size and number of VIA are designed suitable for the actual application (see figure below). Most of heat loss in BD3507HFV occurs at the output N-Channel FET. Power loss is determined by multiplying the voltage between VIN and VOUT by the output current. Be sure to confirm the IN and OUT voltages used and output current conditions, and check with the thermal derating characteristics. As this IC employs the power PKG, the thermal derating characteristics significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be used. Power dissipation (W) = {Input voltage (VIN) - Output voltage (VOUT VREF)} x IOUT (average) Ex.) If VIN = 1.8V, VOUT=1.2V, and IOUT (average) = 0.5 A, the power dissipation is given by the following: Power dissipation W 1.8V 1.2V 0.5 A 0.3W www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV 4. Example of Application Circuit Specifications: High side switch of low-voltage power supply line (1.2V - 2.5V) Characteristics: RON = 300 m, lOUT(max) = 550 mA, with soft start function and overheat protection circuit equipped. Example Circuit VCC VCC GND VCC C1 R1 VREF VREF EN ON/OFF C4 VIN IN OUT C2 Vo C3 Ceramic Capacitor Power Dissipation HVSOF 6 2.5 Power Dissipation Pd (W) 2.0 1.70W 1.5 1.40W 1.0 0.85W 0.5 0.0 0 25 50 75 100 125 150 Ambient TemperatureTa (C) :PCB 1st layer (Cu-area : 2%) ja = 147.1C/W :PCB 1st layer (Cu-area : 18%) ja = 89.3C/W :PCB 1st layer (Cu-area : 51%) ja = 73.5C/W PCB size : 70mm x 70mm x 1.6mm www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV I/O Equivalent Circuits Pin 2 (EN) Pin 1 (VCC) VCC Pin 3 (IN) IN Pin 4 (OUT) Pin 5 (VREF) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Operational Notes - continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 21. Example of monolithic IC structure 13. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. BD3507HFV TSD on Temperature [C] (typ) Hysteresis Temperature [C] (typ) 175 -15 14. Capacitor across output and GND In the event a large capacitor is connected across output and GND, when VCC and IN are short-circuited with 0V or GND for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1000F between output and GND. 15. Input terminals (VCC,IN,EN,VREF) In the present IC, EN terminal, IN terminal, VCC terminal, and VREF terminal have an independent construction. In addition, in order to prevent malfunction at the time of low input, the UVLO function is equipped with the VCC terminal. They begin to start output voltage when all the terminals reach threshold voltage without depending on the input order of input terminals. 16. Heat sink Heatsink is connected to SUB, which should be short-circuited to GND. which offers lower thermal resistance. Solder the heatsink to a pc board properly, 17. Operating range Within the operating range, the operation and function of the circuits are generally guaranteed at an ambient temperature within the range specified. The values specified for electrical characteristics may not be guaranteed, but drastic change may not occur to such characteristics within the operating range. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Operational Notes - continued 18. For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc. 19. In the event that load containing a large inductance component is connected to the output terminal, and generation of back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode. (Example) OUTPUT PIN HVSOF6 land pattern MIE b2 D3 e E3 L2 Unit: mm Land Pitch e Land Space MIE Land Length l2 Land Width b2 0.50 2.20 0.55 0.25 Pad Length D3 Pad Width E3 1.60 1.60 In actually designing, optimize in accordance with the condition. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Ordering Information B D 3 5 0 7 Part Number H F V - Package HFV: HVSOF6 TR Packaging and forming specification TR: Embossed tape and reel Marking Diagram HVSOF6 (TOP VIEW) Part Number Marking B E LOT Number 1PIN MARK www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 HVSOF6 20/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 BD3507HFV Revision History Date Revision 02.Nov.2015 001 Changes New Release www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/21 TSZ02201-0J2J0A601090-1-2 02.Nov.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd3507hfv - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd3507hfv HVSOF6 3000 3000 Taping inquiry Yes