Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
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Pg. 1 of 11
53111 POWER MOSFET OPTOCOUPLER,
90 V/1 Ω, Hermetically Sealed,
DSCC Approved 5962-9314001,
5962-9314002 and 5962-9314003
Mii
Features:
• Hermetically Sealed 8-Pin Dual-In-Line
package
• Small Size and Weight
• Options: 5mA or 10mA input forward current
• Performance Guaranteed over –55°C to
+125°C Ambient Temperature Range
• AC/DC Signal & Power Switching
• Maximum Average Current
AC/DC: 0.8 A
DC only: 1.6 A
• 1500 VDC Withstand Test Voltage
• High Transient Immunity
• 5 A Output Surge Current
• Shock and Vibration Resistant
• MIL-PRF-38534 Compliant
• Compliant devices are dual marked with the
SMD number and the Micropac part number
Applications:
• Satellite/Space Systems
• Military/High Reliability Systems
• Standard 28 VDC and 48 VDC Load Driver
• Standard 24 VAC Load Driver
• AC/DC Electromechanical and Solid State
Relay Replacement
• I/O Modules
DESCRIPTION
The 53111 is a single channel, hermetically sealed, power MOSFET optocoupler. Low on-resistance of the
MOSFET output, combined with 1500 VDC isolation between input and output, makes this optocoupler ideal for
solid-state relay applications. Operation is specified over the full military temperature range. The part is supplied in
an eight-pin, dual-in-line ceramic package, available as COTS, as fully compliant MIL-PRF-38534 Class H device,
or with custom screening. Lead options support both through-hole and surface-mount assembly. The part is
normally shipped with gold plated leads, but lead finishes per MIL-PRF-38534 are available.
(This device can be purchased without screening for commercial applications or for “Engineering Models”, etc. It
will not be marked with the SMD 5962-93140.)
Functionally, the device operates as a single-pole, normally open (1 Form A) solid-state relay. The device is
actuated by an input current, which can be supplied from standard logic types such as open-collector TTL. The
input current biases a light emitting diode that is optically coupled to an integrated photovoltaic diode array. The
photovoltaic array powers control circuitry that operates the output MOSFETs.
Optimum switching of either AC or DC loads is provided by a configurable output. For AC loads, connection A in
Figure 1 must be used. Connection A will also switch DC loads but connection B, in Figure 1, provides DC-only
operation with the advantages of substantial reduction in on-resistance and twice the output current capability as
that obtained with connection A.
MICROPAC
MICROCIRCUITS PRODUCTS
DIVISION
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
www.micropac.com E-MAIL: microsales@micropac.com Rev C 8/17/06
Pg. 2 of 11
53111 Power MOSFET Optocoupler
___________________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Storage Temperature Range ..................................................................................................................-65°C to +150°C
Operating Ambient Temperature - TA.....................................................................................................-55°C to +125°C
Junction Temperature - TJ........................................................................................................................................150°C
Operating Case Temperature - TC.....................................................................................................................+145°C (1)
Lead Solder Temperature (1.6mm below seating plane).......................................................................... 260°C for 10s
Average Input Current - IF........................................................................................................................................20 mA
Peak Repetitive Input Current - IFpk …(Pulse Width < 100ms; duty cycle < 50%) ...............................................40 mA
Peak Surge Input Current - IFPK surge…(Pulse Width < 0.2ms; duty cycle < 0.1%)........................................100 mA
Reverse Input Voltage - VR ....................................................................................................................................5 V
Average Output Current
Connection A – IO............................................................................................................................................0.8 A
Connection B - IO............................................................................................................................................1.6 A
Single Shot Output Current - Figure 4
Connection A - IOpk surge…(Pulse width < 10ms) ............................................................................................. 5 A
Connection B - IOpk surge…(Pulse width < 10ms) ...........................................................................................10 A
Output Voltage
Connection A - VO............................................................................................................................ -90 V to +90 V
Connection B - VO............................................................................................................................... 0 V to +90 V
Average Output Power Dissipation - Figure 5 ............................................................................................ 800 mW (2)
RECOMMENDED OPERATING CONDITIONS:
PARAMETER SYMBOL DEVICE
TYPE
MIN MAX UNITS
-01 10 20 mA Input Current (on)
IF (ON)
-02 & -03 5 20 mA
Input Voltage (off) VF (OFF) All 0 0.6 VDC
Operating Temperature TA All -55 +125 °C
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
www.micropac.com E-MAIL: microsales@micropac.com Rev C 8/17/06
Pg. 3 of 11
53111 Power MOSFET Optocoupler
ELECTRICAL SPECIFICATIONS
TA = -55°C to +125°C, unless otherwise specified.
Parameter Sym. Min. Typ.* Max. Units Test Conditions Notes
Output Withstand Voltage VO(OFF) 90 110 V
VF = 0.6 V
IO = 10 µA
Output On-Resistance
(Connection A)
0.40
1.0
Ω
IF = 10 mA (for –01)
IF = 5 mA (for –02 & -03)
IO = 800 mA
(pulse duration ≤ 30 ms)
Output On-Resistance
(Connection B)
R(ON)
0.12 0.25
Ω
IF = 10 mA (for –01)
IF = 5 mA (for –02 & -03)
IO = 1.6 A
(pulse duration ≤ 30 ms)
3,
Figure
1
Output Leakage Current IO (OFF) 10-4 10 µA VF = 0.6 V
VO = 90 V
Input Forward Voltage VF 1.0 1.24 1.7 V
IF = 10 mA (for –01)
IF = 5 mA (for –02 & -03)
Input Reverse Breakdown
Voltage VR 5.0 V
IR = 100 µA
Input-Output Insulation II-O 1.0
µA
RH ≤ 45%, t = 5 s
VI-O = 1500 VDC
TA = 25°C
4, 5
Turn-On Time tON 1.25 6.0 ms
IF = 10 mA (for –01)
IF = 5 mA (for –02 & -03)
VDD = 28 VDC
IO = 800 mA
Figure
6
Turn-Off time tOFF 0.02 0.25 ms
IF = 10 mA (for –01)
IF = 5 mA (for –02 & -03)
VDD = 28 VDC
IO = 800 mA
Figure
6
Output Transient
Rejection dVO/dt 1000 V/µs
VPEAK = 50 V
CM = 1000 pF
CL = 15 pF
RM ≥ 1 MΩ
Figure
7
Input-Output Transient
Rejection dVI-O/dt 500
V/µs
VDD = 5 V
VI-O (PEAK) = 50 V
RL = 20 kΩ
CL = 15 pF
Figure
8
* All typical values are at TA = 25ºC, IF (ON) = 10 mA (for -01) or 5 mA (for –02), VF (OFF) = 0.6V unless otherwise
specified.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
www.micropac.com E-MAIL: microsales@micropac.com Rev C 8/17/06
Pg. 4 of 11
53111 Power MOSFET Optocoupler
TYPICAL CHARACTERISTICS
All typical values are at TA = 25°C, IF (ON) = 10mA, VF (OFF) = 0.6V unless otherwise specified.
Parameter Symbol
Test
Conditions
Typ. Units Notes
Output Off-Capacitance CO (OFF) VO = 28 V
f = 1 MHz 145 pF
Output Offset Voltage VOS
IF = 10 mA
IO = 0 mA 2 µV 6
Input Diode Temperature
Coefficient ∆VF /∆TA IF = 10 mA -1.4 mV/°C
Input Capacitance CIN VF = 0 V
f = 1 MHz 20 pF 7
Input-Output
Capacitance CI-O VI-O = 0 V
f = 1 MHz 1.5 pF 4
Input-Output Resistance RI-O VI-O = 500 V
t = 60 s 1013 Ω 4
Notes:
1. Maximum junction to case thermal resistance for the device is 15ºC/W, where case temperature, TC, is
measured at the center of the package bottom.
2. For rating, see Figure 5. The output power PD rating curve is obtained when the part is handling the maximum
average output current IO as shown in Figure 3.
3. During the pulsed RON measurement (IO duration < 30 ms), ambient (TA) and case temperature (TC) are equal.
4. Pins 2 through 3 shorted together and pins 5 through 8 shorted together.
5. This is a momentary withstand test, not an operating condition.
6. VOS is a function of IF and is defined between pins 5 and 8, with pin 5 as the reference. VOS must be measured
in a stable ambient (free of temperature gradients).
7. Zero-bias capacitance measured between the LED anode and cathode.
CAUTION:
Care should be taken not to exceed the maximum output power dissipation, maximum case temperature, and
maximum junction temperature when repetitively switching loads.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
www.micropac.com E-MAIL: microsales@micropac.com Rev C 8/17/06
Pg. 5 of 11
53111 Power MOSFET Optocoupler
CONNECTION A
AC/DC CONNECTION
4
F
-
+
3
2
1
-
Figure 1 - Terminal Connections
5 4 5
CONNECTION B
DC CONNECTION
Case outlines P, X, Y, AND Z
Terminal number Terminal symbol
Connection A Conneciton B
(AC or DC load) (DC load only)
+
6
7
8
NC = No connection
-
+
3
2
1
6
7
8+
-
I
F
V
O
I
O
V
F
I
F
V
VO
O
I
8
6
7
3
5
4
2
1
V
NC
V
NC
V
NC
NC
V
F-
O+
O-
F+
F-
V
NC
VO+
O-
N
VO+
NC
NC
VF+
Figure 2 - Truth Table
ON ON
OFF OFF
INPUT OUTPUT
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
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Pg. 6 of 11
53111 Power MOSFET Optocoupler
I - SURGE - OUTPUT CURRENT - A
PULSE DURATION - ms
CONNECTION - A
OPK
0
10
8
2
4
6
100 1000
10
12
CONNECTION - B
I ≥10 mA
F
Figure 3. Maximum Average Output Current Figure 4. Single Shot (nonrepetitive)
Rating vs. Ambient Temperature. Output Current vs. Pulse Duration.
T - AMBIENT TEMPERATURE - °C
D
DISSIPATION - W
P - OUTPUT POWER
A
-55
0
0.2
CA
θ = 40°C/W
θ = 80°C/W
-25 5
CA
- -
35 65
CONNECTION - A
I ≥10 mA
__
F
0.6
0.4
0.8
95 125 155
1.0
Figure 5. Output Power Rating vs. Ambient Temperature.
-55 -25 -5 35 65 95 125 155
0
0.2
0.4
0.6
0.8
1.2
1.02.0
0.4
1.2
0.8
1.6
2.4
CONNECTION
A
B
T AMBIENT TEMPERATURE - C
o
A
I - OUTPUT CURRENT - AMPS
o
CONNECTION – A / B
IF ≥ 10mA
θCA = 40°C/W
θ
CA
=
80
°
C/
W
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
www.micropac.com E-MAIL: microsales@micropac.com Rev C 8/17/06
Pg. 7 of 11
Vo
PULSE
WIDTH
ON
tOFF
t
10%
= 1 MS
50%50%
DEVICE TYPE 03
90%
F
53111 Power MOSFET Optocoupler
PULSE GEN
(SEE NOTE 1)
200
GND
MONITOR
I
MONITOR
NODE
+
V
-
4
3
GND
5
6
= 25 pF
(SEE NOTE 2)
2
1
7
8
R
V
F
F
M
R
L
VO
CL
DD
F
I
DEVICE TYPES 01 & 02
50%
90%
ON
t
10%
OFF
PULSE
WIDTH = 15 ms
50%
F
I
O
V
t
Figure 6. Switching Test Circuit and Waveform.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
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Pg. 8 of 11
53111 Power MOSFET Optocoupler
1. C INCLUDES PROBE AND FIXTURE CAPACITANCE.
2. R INCLUDES PROBE AND FIXTURE RESISTANCE.
O (PEAK)
OVERSHOOT ON V
t
O
d V
dr
(0.8) V
=t
O (PEAK) IS TO BE < 10%
(0.8) V
OR
f
O (PEAK)
t
90%
M
V
10%
F
-
V
4
3
90%
10%
PULSE
GENERATOR
6
5+-
INPUT
OPEN +
IF
2
1
7
8
M
CRM
MONITOR
NODE
M
V
f
r
O(PEAK)
V
NOTES:
M
M
O(PEAK)
V (MAX) < 5V
t
t
Figure 7. Output Transient Rejection Test Circuit and Waveform.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
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Pg. 9 of 11
53111 Power MOSFET Optocoupler
f
O (ON)
V
I-0 (PEAK)
PULSE
GENERATOR
90%
10%
V
A
+
V
3
4
-
F
+
90%
10%
-
5
6
L
DD
R
IF
18
V
V
L
O
L
r
t tf
2. FOR DEVICE TYPE 01, I =10mA,
FOR DEVICE TYPE 02, I =5mA.
F
F
F
AT A (V = 0 V)
O (OFF)
NOTES:
1. LOAD CAPACITANCE (C )INCLUDES PROBE AND FIXTURE CAPACITANCE.
I-0 (PEAK)
V
1
S
V
VIN
S1
B
C
72
(MAX) < 0.8 V
O (OFF)
AT B (NOTE 2)
I-0 (PEAK)
I-0 (PEAK) IS TO BE < 10%
S
OVERSHOOT ON VOVERSHOOT ON V
dV
dt =
I-0 (0.8) V
tr
O (ON)
V
1
V
(0.8) V
(MIN) > 3.25 V
OR I-0 (PEAK)
t
Figure 8. Input-Output Transient Rejection Test Circuit and Waveform.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
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Pg. 10 of 11
53111 Power MOSFET Optocoupler
.050 (1.27)
.035 (0.89)
.050 (1.27)
.035 (0.89)
.050 (1.27)
.035 (0.89)
.110 (2.79)
.090 (2.29)
.390 (9.91)
.370 (9.41)
.390 (9.91)
.370 (9.41)
.110 (2.79)
.090 (2.29)
.110 (2.79)
.090 (2.29)
.020 (0.51)
MAX.
.020 (.051)
MAX.
.020 (0.51)
MAX.
.050 (1.27)
.030 (0.76)
.020 (0.51)
MIN
.065 (1.65)
.055 (1.40)
.020 (0.51)
MIN
.055 (1.40)
.045 (1.14)
.020 (0.51)
MIN
.013 (0.33)
.007 (0.18)
5°
0°
.150 (3.81) MIN.
.390 (9.91)
.370 (9.41)
SEATING PLANE
.180 (4.57)
MAX
.013 (0.33)
.007 (0.18)
.170 (4.32)
MAX.
.320 (8.13)
MAX
.310 (7.87)
.290 (7.37)
.170 (4.32)
MAX.
.170 (4.32)
MAX.
.047 (1.19)
TYP
.390 (9.91)
.380 (7.87)
.320 (8.13)
MAX
SEATING
PLANE
PIN 1
SYMBOL
ESD
.310 (7.87)
.290 (7.37)
.320 (8.13)
MAX.
31757 USA
XXXXX
53111
Q
Case Outline P
Case Outline X
Case Outline Y
NOTES:
1. PIN 1 IS INDICATED BY THE ESD TRIANGLE MARKED ON THE LID OF THE PACKAGE.
2. DIMENSIONS ARE IN INCHES, (mm).
3. METRIC EQUIVALENTS ARE GIVEN FOR GENERAL INFORMATION ONLY.
4. UNLESS OTHERWISE SPECIFIED, TOLERANCE IS ±.005 (0.13mm).
.140 (3.56)
MAX.
.050 (1.27)
.035 (0.89)
SEATING PLANE
.045 (1.14)
.035 (0.89)
.110 (2.79)
.090 (2.29)
.390 (9.91)
.370 (9.41)
.320 (8.13)
MAX
.013 (0.33)
.007 (0.18)
.310 (7.87)
.290 (7.37)
Case Outline Z
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION • 905 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 494-2281
www.micropac.com E-MAIL: microsales@micropac.com Rev C 8/17/06
Pg. 11 of 11
53111 Power MOSFET Optocoupler
ORDERING GUIDE
The followings are the cross-reference of Micropac part numbers versus Standard Military PIN. Please contact
Micropac for other desired options.
Micropac Part Number Standard Military Drawing PIN Case Outline
53111-1PA 5962-9314001HPA P
53111-1PC 5962-9314001HPC P
53111-1XA 5962-9314001HXA X
53111-1XC 5962-9314001HXC X
53111-1YA 5962-9314001HYA Y
53111-1YC 5962-9314001HYC Y
53111-1ZA 5962-9314001HZA Z
53111-1ZC 5962-9314001HZC Z
53111-2PA 5962-9314002HPA P
53111-2PC 5962-9314002HPC P
53111-2XA 5962-9314002HXA X
53111-2XC 5962-9314002HXC X
53111-2YA 5962-9314002HYA Y
53111-2YC 5962-9314002HYC Y
53111-2ZA 5962-9314002HZA Z
53111-2ZC 5962-9314002HZC Z
53111-3PA 5962-9314003HPA P
53111-3PC 5962-9314003HPC P
53111-3XA 5962-9314003HXA X
53111-3XC 5962-9314003HXC X
