SPECIFICATION
Supplier : Samsung electro-mechanics Samsung P/N : CL31B333KFESNNE
Product : Multi-layer Ceramic Capacitor Description : CAP, 33, 350V, ±10%, X7R, 1206
CL 31 B 333 K F E S N N E
⑧⑨⑩
Series Samsung Multi-layer Ceramic Capacitor
Size 1206 (inch code) L: 3.2 ± 0.2 mm W: ± 0.2 mm
Dielectric X7R Inner electrode
Capacitance 33 Termination
Capacitance ±10 % Plating (Pb Free)
tolerance Product Normal
Rated Voltage 350 V Special Reserved for future use
Thickness 1.1 ± 0.15 mm Packaging Embossed Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance Within specified tolerance 1±10% 1.0±0.2Vrms
Tan δ (DF) 0.025 max.
Insulation More than 100Rated Voltage 60±5 sec.
Resistance
Appearance No abnormal exterior appearance Microscope (×10)
Withstanding No dielectric breakdown or Apple the 500 voltage for 1~5 sec
Voltage mechanical breakdown Ch
a
Charge/ Discharge current : 50mA max
Temperature X7R
Characterisitcs (From -55 to 125, Capacitance change shoud be within ±15%)
Adhesive Strength No peeling shall be occur on the 1000gF, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
Solderability More than 75% of terminal surface 1) Sn63Pb37 solder
is to be soldered newly 235±5, 5±0.5sec.
2) SnAg3.0Cu0.5 solder
245±5, 3±0.3sec.
(preheating : 80~120 for 10~30sec.)
Resistance to Capacitance change : within ±10% Solder pot : 260±5, 10±1sec.
Soldering heat Tan δ, IR : initial spec.
A. Samsung Part Number
Performance Test condition
1.6
Sn 100%
Cu/Ag-Epoxy
Ni
Vibration Test Capacitance:Within the specigic tolerance Amplitude : 1.5mm
Tan δ, IR : initial spec. From 10 to 55 (return : 1min.)
2hours × 3 direction (x, y, z)
Humidity Capacitance change : within ±15% 40±2, 90~95%RH, 500+12/-0hrs
Tan δ : 0.05 max
IR : 10Mohm
Moisture Capacitance change : within ±15% With rated voltage
Resistance Tan δ : 0.05 max 40±2, 90~95%RH, 500+12/-0hrs
IR : 10Mohm
High Temperature Capacitance change : within ±15% With rated voltage
Resistance Tan δ : 0.05 max Max. operating temperature
IR : 10Mohm 1000+48/-0hrs
Charge/ Discharge current : 50mA max
Temperature Capacitance change : within ±7.5% 1 cycle condition
Cycling Tan δ : 0.025 max Min. operating temperatu
r
25
IR : More than 100Max. operating temperature 25
5 cycle test
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5, 10sec. Max )
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
Performance Test condition