Low IQ, Low Dropout 500mA Fixed Voltage Regulator
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Features
Design with an internal P-channel MOSFET pass
transistor, the APL5501/2/3 maintain a low supply current,
independent of the load current and dropout voltage. Other
features include reverse current protection, thermal-shut-
down protection, and current-limit protection to ensure
specified output current and controlled short-circuit
current. The APL5501/2/3 regulators come in a miniature
SOT-23-5, SOT-89, SOT-89-5, SOT-223, SOP-8, TO-252-
3, and TO-252-5 packages.
Applications
• Notebook Computer
• PDA or Portable Equipments
• Noise-Sensitive Instrumentation Systems
• Low Noise : 50µVRMS (100Hz to 100kHz)
• Low Quiescent Current : 50µA (No load)
• Low Dropout Voltage : 170mV (@500mA)
• Very Low Shutdown Current : < 0.5µA
• Fixed Output Voltage : 1.3V ~ 3.4V
• Stable with 4.7µF Output Capacitor
• Stable with Aluminum, Tantalum, or Ceramic
Capacitors
• Reverse Current Protection
• No Protection Diodes Needed
• Built-In Thermal Protection
• Built-In Current-Limit Protection
• Controlled Short Circuit Current : 150mA
• Fast Transient Response
• Short Setting Time
• SOT-23-5, SOT-89, SOT-89-5, SOT-223, SOP-8
TO-252-3, and TO-252-5 Packages
• Lead Free and Green Devices Available
(RoHS Compliant)
Pin Configuration
SOT-89 (Top View)SOP-8 (Top View)
General Description
The APL5501/2/3 are micropower, low noise, low drop-
out linear regulators. Operate from 2.7V to 6V input volt-
age and deliver up to 500mA. Typical output noise is just
50µVRMS with the addition of an external 0.1µF bypass ca-
pacitor in BP pin and typical dropout voltage is only 170mV
at 500mA loading. Designed for use in battery-powered
system, the low 50µA quiescent current makes it an ideal
choice.
APL5501
VIN GND VOUT
1 2 3
TAB is GND
SOT-89-5 (Top View)
VIN
GND
VOUT
1 2 3
5 4
SHDNBP GND
1
2
3
4 5
6
7
8IN
GND
GND
SHDN BYP
GND
GND
OUT
SOT-23-5 (Top View)
1
2
3 4
5VIN
GND
SHDN BP
VOUT
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw2
Ordering and Marking Information
Pin Configuration (Cont.)
SOT-223 (Top View)
APL5501
APL5502
SOT-89 (Top View)SOT-223 (Top View)
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
TO-252-3 (Top View)
GND
1 2 3
VOUT
VIN
SOT-223 (Top View)
APL5503
VOUT
GNDVIN
1 2 3
TAB is GND
GND VIN VOUT
1 2 3
TAB is VIN
VOUT
VIN
GND
1 2 3
TAB is VIN
VIN
GNDVOUT
1 2 3
TAB is GND
BP
VOUT
GND
VIN
1 2 3 4 5
TAB is GND
SHDN
TO-252-5 (Top View)
Package Code
B : SOT-23-5 D : SOT-89 D5 : SOT-89-5
U : TO-252-3 U5 : TO-252-5 V : SOT-223
K : SOP-8
Operating Ambient Temperature Range
C : 0 to 70 oC
Handling Code
TR : Tape & Reel
Voltage Code :
13 : 1.3V ~ 34 : 3.4V
Assembly Material
G : Halogen and Lead Free Device
APL5501/2/3
Handling Code
Temperature Range
Package Code
Voltage Code
13
APL5501/2/3
XXXXX
APL5501/2/3 - 13 U :XXXXX - Date Code , 13 - 1.3V
XXXXX - Date Code , 13 - 1.3V
APL5501/2/3
XXXXX13
APL5501/2/3 - 13 D/V/K :
Assembly Material
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw3
Symbol Parameter Typical Value Unit
RTH,JA
Thermal Resistance - Junction to Ambient SOT-89
SOT-223
SOP-8
SOT-23-5
180
135
150
260
°C/W
RTH,JC
Thermal Resistance - Junction to Case SOT-89
SOT-223
SOP-8
SOT-23-5
38
15
20
130
°C/W
TJ Operating Junction Temperature Control Section
Power Transistor
0 to 125
0 to 150 °C
Product Name Marking Product Name Marking Product Name Marking
APL5501-13B 517X APL5501-21B 51FX APL5501-28B 51MX
APL5501-14B 518X APL5501-22B 51GX APL5501-29B 51NX
APL5501-15B 519X APL5501-23B 51HX APL5501-30B 51OX
APL5501-16B 51AX APL5501-24B 51IX APL5501-31B 51PX
APL5501-17B 51BX APL5501-25B 51JX APL5501-32B 51QX
APL5501-18B 51CX APL5501-26B 51KX APL5501-33B 51RX
APL5501-19B 51DX APL5501-27B 51LX APL5501-34B 51SX
APL5501-20B 51EX
Absolute Maximum Ratings
Symbol Parameter Rating Unit
VIN, VOUT Input Voltage or Out Voltage 6.5 V
SHDN Shutdown Control Pin 6.5 V
PD Power Dissipation Internally Limited W
TSTG Storage Temperature Range -65 to +150 °C
TL Maximum Lead Soldering Temperature, 10 Seconds 260 °C
Marking Information
SOT-23-5 package
The last character “X” in the marking is for data code.
Thermal Characteristic
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw4
Electrical Characteristics
APL5501/2/3
Symbol Parameter Test Conditions Min. Typ. Max.
Unit
VIN Input Voltage 2.7 - 6 V
VOUT Output Voltage VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT -2%
VOUT VOUT +2%
V
ILIMIT Circuit Current Limit VIN=4.3V - 0.7 - A
ISHORT Short Current VOUT=0V - 200 - mA
IOUT Load Current
500 - - mA
REGLINE Line Regulation VOUT+0.5V< VCC<6.0V, IOUT = 1mA - 4 10 mV
REGLOAD Load Regulation VIN =VOUT+1.0V,
0mA< IOUT < IMAX - 1
0.1 6 mV
%
1.3V≤VOUT<1.5V
1.3V<-VOUT<1.5V
- 1100 1300 mV
1.5V≤VOUT<2V - 900 1050
2V≤VOUT<2.5V - 500 700
VDROP Dropout Voltage (Note 1) IOUT =500mA
2.5V≤VOUT<3.4V - 280 380
PSRR Ripple Rejection F≤1kHz, 1Vpp at VIN = VOUT+1.0V
COUT=10nf 55 65 - dB
No load - 50 100 µA
IQ Quiescent Current IOUT=500mA - 370 450
Shutdown Supply Current
(Note 2) Shutdown = low
IOUT=0, VCC =6.0V - 0.01 1 µA
100Hz<f<100kHz, typical load, CBP=0.01µF
,
COUT = 1µF - 50 - µVrms
Noise (Note2) 100Hz<f<100kHz, typical load, CBP=0.1µF,
COUT = 1µF - 40 -
CBP=0.01µF,COUT=1µF, no load - 7 - ms
Shutdown Recovery Delay
(Note 2) CBP=0.1µF,COUT=1µF, no load - 70 -
OTS Over Temperature
Shutdown - 150 - °C
Over Temperature
Shutdown Hysteresis Hysteresis - 10 - °C
TC Output Voltage
Temperature Coefficient - 50 - ppm/
°C
COUT Output Capacitor 4.2 4.7 5.2 µF
ESR 0.02 0.1 1 Ohm
Shutdown Input
Threshold (Note 2) VOUT+1.0V< VIN <6.0V 0.4 0.7 1.6 V
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF, SHDN=VIN, TJ=0 to 125°C.
Typical values refer to TJ=25°C.
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw5
Electrical Characteristics (Cont.)
APL5501/2/3
Symbol Parameter Test Conditions Min. Typ. Max.
Unit
ISHDN Shutdown input Bias
Current (Note2) VSHDN =VIN - 0.01 100 nA
Input Reverse Leakage
Current VOUT-VIN=0.1V - 0.1 0.5 µA
Reverse Protection
Threshold - 11 50 mV
Note 1 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V
Note 2 : For 5-pin devices only.
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF, SHDN=VIN, TJ=0 to 125°C.
Typical values refer to TJ=25°C.
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw6
0
0.5
1
1.5
2
2.5
3
3.5 44.5 55.5 6
0
0.5
1
1.5
2
2.5
3
3.5
0 1 2 3 4 5 6
0
50
100
150
200
250
300
350
0123456
0
50
100
150
200
250
300
350
400
0150 300 450 600 750 900
Typical Operating Characteristics
Input Voltage (V)
Current Limit (mA)
Ground Pin Current vs. Load Current (µA)
Output Current (mA)
Input Voltage (V)
Ground Pin Current vs. Load Current (µA)
Input Voltage (V)
Output Voltage (V)
APL5501/2/3-33
APL5501/2/3-33
APL5501/2/3-33
APL5501/2/3-33
Input Voltage vs. Output VoltageGround Pin Current vs. Input Voltage
Current Limit vs. Input VoltageGround Pin Current vs. Output Current
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw7
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
0100 200 300 400 500
0.4
0.5
0.6
0.7
0.8
0.9
1
33.5 44.5 55.5 6
-12
-10
-8
-6
-4
-2
0
00.5 11.5 22.5 3
SHDN Threshold Voltage (V)
Input Voltage (V)
PSRR vs. Frequency
Frequency (HZ)
PSRR (dB) Output Current (µA)
Output Voltage (V)Output Current (mA)
Dropout Voltage (mV)
VIN=0V
VIN=0V
APL5501/2/3-33
APL5501/2/3-33
Dropout Voltage vs. Output CurrentOutput Current vs. Output Voltage
APL5501/2/3-33
SHDN Threshold Voltage vs. Input Voltage
VOUT=1.5V
VOUT=1.8V
VOUT=2.5V
VOUT=3.3V
Typical Operating Characteristics (Cont.)
-100
+0
-90
-80
-70
-60
-50
-40
-30
-20
-10
20 200k100 1k 10k 100k
IOUT =50mA
COUT=10µF
CBP=0.1µF
VIN=4V
VIN=5V
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw8
0
50
100
150
200
250
300
350
400
450
500
00.1 0.2 0.3 0.4
Output Noise
Time (s)
VOUT (50µV/div)
Output Noise vs. Bypass Capacitor
Output Noise (µV)
Bypass Capacitor (µF)
Time (1ms/div)
VOUT
vSHDN
Shutdown Exit Delay
Time (20ms/div)
VOUT
vSHDN
CBP=100nF
No Load
Shutdown Exit Delay APL5501/2/3-33
3.3V
4V
3.3V
4V
0V
0V
0V
0V
CBP=10nF
No Load
APL5501/2/3-33
APL5501/2/3-33
Typical Operating Characteristics (Cont.)
-100u
100u
-80u
-60u
-40u
-20u
0
20u
40u
60u
80u
010m
2m 4m 6m 8m
VIN=4.3V
IOUT =0mA
COUT=10µF
CBP=0.1µF
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw9
0.001
0.01
0.1
1
0150 300 450 600 750 900
VOUT
COUT=1µF
No Load
Entering Shutdown
Time (200ms/div)
VOUT=3.3V
Region of Stable ESR vs. Load Current
Load Current (mA)
COUT ESR (Ω)
unstable
stable
APL5501/2/3-33
APL5501/2/3-33
3.3V
4V
0V
0V
3.25
3.27
3.29
3.31
3.33
3.35
-40 040 80 120
Temperature (°C )
Output Voltage (V)
APL5501/2/3-33
Output Voltage vs. Temperature
Time (40µs/div)
VOUT
VIN
Line-Transient Response
Output Voltage (20mV/div)
APL5901/2-33
4V
3V
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw10
COUT=1µF
VIN=VOUT+1V
Time (10µs/div)
APL5501/2/3-33
IOUT=1mA~500mA
Output Voltage (50mV/div)
Load-Transient Response
VOUT
PIN
NO. NAME I/O FUNCTION
1 VIN I Supply voltage input.
3 SHDN (Note 3)
I Shutdown control pin, low = off , high = normal. Don’t leave open.
2 GND
Ground pins of the circuitry, and all ground pins must be soldered to PCB
with proper power dissipation.
4 BP(Note 3) O Bypass signal pin in fixed output type device
5 VOUT O Output pin of the regulator.
Note 3: These pins do not exist in 3-pin package.
Pin Description
Typical Application Circuit
Typical Operating Characteristics (Cont.)
BP
VOUT
VIN
GND
SHDN
VOUT
CIN
1µFoff
on
APL5501/2/3
INPUT
2.7V to 6V
0.1µFCBP
COUT
4.7µF
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw11
The APL5501/2/3 load-transient response graphs in typi-
cal characteristics show the transient response. A step
change in the load current from 0mA to 500mA at 1µs will
cause a 100mV transient spike. Larger output capacitor
and lower ESR can reduce transient spike.
Application Information
Load-Transient Consideration
Reverse Current Protection
Current Limit
The APL5501/2/3 have current-limit protection. The ouptut
voltage will drop close to zero volt when load current
reaches the limit, and then the load current will be limited
at 150mA after output voltage is below 0.7V. When the
load current back to the value where limiting started, the
output voltage and current will return to normal value.
When output is shortened to the ground, the APL5501/2/
3 will keep short circuit current at 150mA.
Input-Output (Dropout) Voltage
The minimum input-output voltage difference (dropout)
determines the lowest usable supply voltage. In battery-
powered systems, this will determine the useful end-of-
life battery voltage. Because the APL5501/2/3 uses a p-
channel MOSFET pass transistor, the dropout voltage is
the function of drain-to-source on-resistance (RDS(ON)) mul-
tiplied by the load current.
Shutdown/Enable
The APL5501/2/3 has an active high enable function.
Force EN high (>1.6V) enables the regulator, EN low (<0.
4V) disables the regulator and enter the shutdown mode.
In shutdown mode, the quiescent current can reduce
below 1µA. The EN pin cannot be floating, a floating EN
pin may cause an indeterminate state on the output. If it
is no use, connect to VIN for normal operation.
Capacitor Selection and Regulator Stability
The APL5501/2/3 use at least a 1µF capacitor on the input,
and this capacitor can be Aluminum, Tantalum, or Ce-
ramic capacitor. The input capacitor with larger value and
lower ESR provides better PSRR and line-transient
response. The output capacitor also can use Aluminum,
Tantalum, or Ceramic capacitor, and a minimum value of
1µF and ESR above 0.06Ω is recommended. The curve
of the stable region in typical characteristics shows the
appropriate output capacitor ESR for different load cur-
rent stable operation. A larger output capacitor can reduce
noise and improve load-transient response, stability, and
PSRR. Note that some ceramic dielectrics exhibit large
capacitance and ESR variation with temperature. When
using this capacitor, a minimum 10µF or more may be
required to ensure the stability at low temperature
operation. Use a bypass capacitor at BP pin for low output
nvise. Increasing the capacitance will slightly decrease
the output noise but increase the start-up time.
The APL5501/2/3 have an internal reverse protection, they
do not need an external Schottky diode to connect the
regulator input and output. If the output voltage is forced
above the input voltage by more than 11mV, the IC will be
shutdown and the ground pin current is below 0.1µA.
Thermal protection limits total power dissipation in the
device. When the junction temperature exceeds
TJ=+150oC, the thermal sensor generates a logic signal
to turn off the pass transistor and allows IC to cool. When
the IC’s junction temperature is down by 10oC, the ther-
mal sensor will turn the pass transistor on again, result-
ing in a pulsed output during continuous thermal
protection. Thermal protection is designed to protect the
APL5501/2/3 in the event of fault conditions. For continu-
ous operation, do not exceed the absolute maximum junc-
tion temperature of TJ=+150oC.
Thermal Protection
Operating Region and Power Dissipation
The thermal resistance of the case to circuit board, and
the rate of air flow all control the APL5501/2/3’s maxi-
mum power dissipation. The power dissipation across
the device is PD = IOUT (VIN-VOUT) and the maximum power
dissipation is:
PDMAX = (TJ-TA) / (θJC +θCA)
where TJ-TA is the temperature difference between the
junction and ambient air, θJC is the thermal resistance of
the package, and θCA is the thermal resistance through
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw12
Operating Region and Power Dissipation (Cont.)
the printed circuit board, copper traces, and other materi-
als to the ambient air.
The GND pin of the APL5501/3 provides an electrical con-
nection to ground and channeling heat away. If power
dissipation is large, connect the GND pin to the ground
using a large pad or ground plane, can improve the prob-
lem of over heat of IC.
Application Information (Cont.)
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw13
Package Information
SOT-23-5
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
S
Y
M
B
O
L
A1
A2
A
0.00
0.90
SOT-23-5
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°
8
°
0
°
8
°
0
bc
e1
0
L
VIEW A
0.25
GAUGE PLANE
SEATING PLANE
A
A2A1
e
D
E
E1
SEE
VIEW A
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw14
Package Information
SOP-8
S
Y
M
B
O
LMIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0
°
8
°
0
°
8
°
D
e
E
E1
SEE VIEW A
cb
h X 45
°
A
A1A2
L
VIEW A
0.25
SEATING PLANE
GAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw15
Package Information
SOT-223
A
A2
VIEW A
0.25
L
GAUGE PLANE
SEATING PLANE
A1
D
E
e1
e
b2
E1
SEE
VIEW A
c
b
°
0
S
Y
M
B
O
LMIN. MAX.
1.80
0.02
0.66 0.84
2.90 3.10
0.23 0.33
0.10
6.70
A
A1
b
b2
c
D
E
E1
e
MILLIMETERS
A2 1.50 1.70
2.30 BSC
SOT-223
3.30 3.70
6.30 6.70
7.30
0.091 BSC
MIN. MAX.
INCHES
0.071
0.001
0.059 0.067
0.026 0.033
0.114 0.122
0.009 0.013
0.264
0.130 0.146
0.248 0.264
0.287
0.004
0
L0.75 0.030
e1 4.60 BSC 0.181 BSC
°
10
°
0
°
10
°
0
Note : 1. Follow from JEDEC TO-261 AA.
2. Dimension D and E1 are determined at the outermost extremes
of the plastic exclusive of mold flash, tie bar burrs, gate burrs,
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw16
Package Information
SOT-89
S
Y
M
B
OMIN. MAX.
MILLIMETERS
SOT-89
MIN. MAX.
INCHES
A
C
e1
e
B
B1
D
D1
H
EL
E1
1.60
0.44
0.35 0.44
4.40 4.60
1.62 1.83
0.56
2.13
A
B
C
D
D1
E
E1
e
e1
B1 0.36 0.48
3.00 BSC
3.94 4.25
2.29 2.60
2.29
0.118 BSC
0.063
0.017
0.014 0.019
0.014 0.017
0.173 0.181
0.064 0.072
0.084
0.155 0.167
0.090 0.102
0.090
0.022
L0.89 0.035
H
1.50 BSC 0.059 BSC
1.40
1.20 0.047
0.055
L
Note : Follow JEDEC TO-243 AA.
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw17
Package Information
SOT-89-5
S
Y
M
B
OMIN. MAX.
MILLIMETERS
SOT-89-5
MIN. MAX.
INCHES
B
1.60
0.36
0.35 0.44
4.40 4.60
1.62 1.83
0.56
2.13
A
B
C
D
D1
E
E1
e
e1 3.00 BSC
3.94 4.25
2.29 2.60
2.29
0.118 BSC
0.063
0.014
0.014 0.017
0.173 0.181
0.064 0.072
0.084
0.155 0.167
0.090 0.102
0.090
0.022
L0.89 0.035
H
1.50 BSC 0.059 BSC
1.40
1.20 0.047
0.055
L
D
D1
e1
e
EL
E1
AC
H
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw18
Package Information
TO-252-3
S
Y
M
B
O
LMIN. MAX.
2.39
4.95 5.46
0.46 0.61
0.13
5.33
A
A1
b3
c
c2
D
D1
E
MILLIMETERS
b0.50 0.89
2.29 BSC
TO-252-3
4.57
6.35 6.73
6.22
0.090 BSC
MIN. MAX.
INCHES
0.094
0.020 0.035
0.195 0.215
0.018 0.024
0.210
0.180
0.250 0.265
2.18
0.245
0.086
0.005
E1
0.035
0.070
0.410
L3
H
L
e
9.40
0.90
0.46 0.89
1.78
10.41 0.370
0.035
0.018
0.040
L4 1.02
0.150
3.81
0.89 2.03 0.035 0.080
0 8°
0°8°
0°
0
0.25
GAUGE PLANE L
A1
VIEW A
SEATING PLANE
L4 L3
D
E
e
b3
H
A
SEE VIEW A
c2
bc
E1
D1
6.00
Note : Follow JEDEC TO-252 .
6.00
0.236
0.236
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw19
Package Information
TO-252-5
S
Y
M
B
O
LMIN. MAX.
2.39
4.32 5.46
0.46 0.61
0.13
5.33
A
A1
b3
c
c2
D
D1
E
MILLIMETERS
b0.50 0.89
1.27 BSC
TO-252-5
4.57
6.35 6.73
6.22
0.050 BSC
MIN. MAX.
INCHES
0.094
0.020 0.035
0.170 0.215
0.018 0.024
0.210
0.180
0.250 0.265
2.18
0.245
0.086
0.005
E1
0.035
0.070
0.410
L3
H
L
e
9.40
1.40
0.46 0.89
1.78
10.41 0.370
0.055
0.018
0.150
3.81
0.89 2.03 0.035 0.080
00
°
8
°
0
°
8
°
0
0.25
GAUGE PLANE L
A1
VIEW A
SEATING PLANE
L3
D
E
b3
H
A
SEE VIEW A
c2
bc
E1
D1
e
6.00
6.00
0.236
0.236
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw20
Application A H T1 C d D W E1 F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-23-5
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
Application A H T1 C d D W E1 F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOP-8
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
Application A H T1 C d D W E1 F
320.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.00±0.30
1.75±0.10
5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-223
4.00±0.10
8.00±0.10
2.00±0.50
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.90±0.20
7.50±0.20
2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
A
B
W
F
T
P0
OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw21
Application A H T1 C d D W E1 F
178.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-89
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
4.80±0.20
4.50±0.20
1.80±0.20
Application A H T1 C d D W E1 F
178.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-89-5
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
4.80±0.20
4.50±0.20
1.80±0.20
Application A H T1 C d D W E1 F
330.0±2.00
50 MIN.
16.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
16.0±0.30
1.75±0.10
7.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
TO-252-3
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.80±0.20
10.40±0.20
2.50±0.20
Application A H T1 C d D W E1 F
330.0±2.00
50 MIN.
16.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
16.0±0.30
1.75±0.10
7.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
TO-252-5
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.80±0.20
10.40±0.20
2.50±0.20
(mm)
Carrier Tape & Reel Dimensions (Cont.)
Devices Per Unit
Package Type Unit Quantity
SOT-23-5 Tape & Reel 3000
SOP-8 Tape & Reel 2500
SOT-223 Tape & Reel 2500
SOT-89 Tape & Reel 1000
SOT-89-5 Tape & Reel 1000
TO-252-3 Tape & Reel 2500
TO-252-5 Tape & Reel 2500
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw22
Taping Direction Information
SOT-23-5
SOP-8
SOT-223
USER DIRECTION OF FEED
USER DIRECTION OF FEED
USER DIRECTION OF FEED
SOT-89
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw23
Taping Direction Information
SOT-89-5
TO-252-3
TO-252-5
USER DIRECTION OF FEED
USER DIRECTION OF FEED
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw24
Reflow Condition (IR/Convection or VPR Reflow)
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec
HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C
TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V
Latch-Up JESD 78 10ms, 1tr > 100mA
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
ts
Preheat
Tsmax
Tsmin
TL
TP
25
Temperature
Time
Critical Zone
TL to TP
°
Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate
(TL to TP) 3°C/second max. 3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL) 183°C
60-150 seconds 217°C
60-150 seconds
Peak/Classification Temperature (Tp)
See table 1 See table 2
Time within 5°C of actual
Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp.
Rev. B.4 - Jan., 2009
APL5501/2/3
www.anpec.com.tw25
Classification Reflow Profiles (Cont.)
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350
<2.5 mm 240 +0/-5°C 225 +0/-5°C
≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
