Products Catalog
www.r-theta.com
STANDARD
ISO 9001 - 2000 REGISTERED
www.r-theta.com
Standard products offered in this catalog are Heat Sinks for board
level IC’s, Surface Mount and Thru-Hole Discrete semiconductor
packages, Extruded heat sinks, Fabfin and Aluminum Extrusion pro-
files. Thermal interface materials include silicone and non-silicone
Thermal Compounds, Sil-Pads and Adhesive tapes.
R-theta also offers a complete line of high performance patented,
aluminum alloy heat sinks without the use of glue and are available
through R-Theta’s extensive line. The company has developed leading
edge heat sink technology that eliminates volumetric constraints of
one-piece extrusions. By mechanically swaging the parts together
there is no deterioration in perform-
ance compared to a solid block of
aluminum. R-Theta heat sinks mean
greater thermal design flexibility by
offering the same co-efficient of
thermal expansion for the entire
heat sink. R-Theta heat sinks allow
you to maximize heat cooling by
pushing the thermal envelope for
greater productivity.
Call and ask for your copy of the
Navigator 1-800-388-5428 or
check us out on the web at
www.r-theta.com
has been a global leader for over 25 years in the
design and manufacturing of innovative thermal management
solutions serving a broad range of markets. Major markets
include telecommunications, computers, industrial controls,
power conversion, transportation, medical, alternative energy and
aerospace.
R-Theta’s powerful software “R-Tools” provides on-line thermal
modeling of heat sinks for semiconductors in natural or forced
convection for air cooled, as well as, liquid-cooled cold plates.
The interface is friendly, with only minimal parameters needed to
be specified. Users can register free on-line for R-Tools on the R-
Theta web site www.r-theta.com .
The Navigational Tool For
On-Line Heatsink Design
www.r-theta.com
NAVIGATOR
ISO 9001 - 2000 REGISTERED
Table of Contents
1
Table of Contents
www.r-theta.com
Heat sinks for IC Packages (Integrated Circuit )
Board Level Heat Sinks
BGA Pgs. 2 - 4
DIP Pg. 4
Surface Mount Discrete Semiconductor Packages
D-PAK TO-252, TO-263, TO-268 Pg. 5
Thru-Hole Discrete Semiconductor Packages
TO-220 and TO-262 Pgs. 6 - 7
TO-220 and TO-202 Pgs. 8 - 11
TO-220, TO-218, TO-247 and Multiwatt Pgs. 12 - 13
Extruded Heat Sinks for DC/DC Converters & Solid State Relays
High Power Semiconductor Packages
DC/DC converter Full-Brick Pg. 14
DC/DC converter Half-Brick Pg. 15
Solid State Relays (Fabfin) Pg. 16
Fabfin Heat Sinks for IGBT and High Power Devices
Mechanically Bonded (Swaged) Heat Sinks Pg. 17
Polar Interface Materials
Thermal compound (silicone) Pg. 18
Thermal compound (non-silicone) Pg. 19
Sil-Pads Pg. 20
Adhesive Tapes Pg. 21
Aluminum Extrusion Profiles
Extrusion characteristics table Pg. 22
Extrusion Profiles Pg. 23
Index By Part Number Pg. 25
Index by Device Cooled Pg. 24
R-theta Thermal Solutions Inc. believes that information provided in
this product catalog is accurate as of publication date. Product testing
for proper performance in customer applications is recommended for
all component designs. The physical properties reported herein are
representative of performance values obtained by standard predictive
and testing methods. R-Theta is a manufacturer of heat dissipation
products and reserves the right to make changes to its products with-
out notice to improve the design of performance characteristics.
Cat#600220
Heat Sinks for IC Packages
Omnidirectional Pin Fin Heat Sink for 21 mm BGAs
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2
The omnidirectional pin fin heat
sink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Aluminum, Black Anodized
Part Number Base Dimensions mm ( in.) Sq. Height “A” mm (In.)
RT5025B00000 21 (.827) 6.4 (.250)
RT5035B00000 21 (.827) 8.9 (.350)
RT5045B00000 21 (.827) 11.4 (.450)
RT5060B00000 21 (.827) 15.2 (.600)
Omnidirectional Pin Fin Heat Sink for 25 mm BGAs
The omnidirectional pin fin heat
sink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Aluminum, Black Anodized
Part Number Base Dimensions mm ( in.) Sq. Height “A” mm (In.)
RT5125B00000 25 (.984) 6.4 (.250)
RT5135B00000 25 (.984) 8.9 (.350)
RT5145B00000 25 (.984) 11.4 (.450)
RT5160B00000 25 (.984) 15.2 (.600)
Omnidirectional Pin Fin Heat Sink for 28 mm BGAs
The omnidirectional pin fin heat
sink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes. Aluminum, Black Anodized
Part Number Base Dimensions mm ( in.) Sq. Height “A” mm (In.)
RT5625B00000 27.9 (1.100) 6.4 (.250)
RT5635B00000 27.9 (1.100) 8.9 (.350)
RT5645B00000 27.9 (1.100) 11.4 (.450)
RT5660B00000 27.9 (1.100) 15.2 (.600)
Heat Sinks for IC Packages
Omnidirectional Pin Fin Heat Sink for 35 mm BGAs
www.r-theta.com
3
The omnidirectional pin fin heat
sink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Aluminum, Black Anodized
Part Number Base Dimensions mm( in. Sq) Height “A” mm (In.)
RT5325B00000 35 (1.378) 6.4 (.250)
RT5335B00000 35 (1.378) 8.9 (.350)
RT5345B00000 35 (1.378) 11.4 (.450)
RT5360B00000 35 (1.378) 15.2 (.600)
Omnidirectional Pin Fin Heat Sink for 40 mm BGAs
The omnidirectional pin fin heat
sink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Aluminum, Black Anodized
Omnidirectional Pin Fin Heat Sink for 45 mm BGAs
The omnidirectional pin fin heat
sink is available in three standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Aluminum, Black Anodized
Part Number Base Dimensions mm( in. Sq) Height “A” mm (In.)
RT5526B00000 40.6 (1.600) 6.6 (.260)
RT5553B00000 40.6 (1.600) 13.3 (.525)
Part Number Base Dimensions mm( in. Sq) Height “A” mm (In.)
RT5235B00000 44.5 (1.750) X 43.2 (1.700) 8.9 (.350)
RT5240B00000 44.5 (1.750) X 43.2 (1.700) 10.2 (.400)
RT5265B00000 44.5 (1.750) X 43.2 (1.700) 16.5 (.650)
Heat Sinks for IC Packages
Unidirectional Fin Heat Sink for 35 mm BGAs
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4
The omnidirectional pin fin heat
sink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes. Aluminum, Black Anodized
Part Number Base Dimensions mm( in. Sq) Height “A” mm (In.)
RT5425B00000 35 (1.378) 6.4 (.250)
RT5435B00000 35 (1.378) 8.9 (.350)
RT5445B00000 35 (1.378) 11.4 (.450)
RT5460B00000 35 (1.378) 15.2 (.600)
Unidirectional epoxy attach heat sink for 14 and 16 pin dip packages
Unidirectional epoxy attach fin to
heat sink attaches to 14 and 16 pin
DIP packages quickly and easily. May be
added before or after final board
assembly, no additional board space is
required. Available in two fin directions.
Aluminum, Black Anodized
Part Number
RT5470B00000
RT5475B00000 RT5470B00000 RT5475B00000
5
Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without con-
tacting the device like traditional thru
hole heat sinks. The device and the
heat sink are soldered directly to a
modified drain pad creating a thermal
transfer path from package tab to the
heat sink.
0.64 (0.025) Thick Copper, Tin Plated
Surface Mount Discrete Semiconductor Pkgs.
Part Number
RT1750D00000
Surface mount heat sink for D2-PAK (TO-263) package semiconductors
Surface mount heat sink for D2-PAK
(TO-263) package semiconductors
remove the heat indirectly without con-
tacting the device like traditional thru
hole heat sinks. The device and the heat
sink are soldered directly to a modified
drain pad creating a thermal transfer
path from package tab to the heat sink.
0.65 (0.026) Thick Copper, Tin Plated
Part Number
RT1755D00000
Surface mount heat sink for D3-PAK (TO-268) package semiconductors
Surface mount heat sink for D3-PAK
(TO-268) package semiconductors
remove the heat indirectly without con-
tacting the device like traditional thru
hole heat sinks. The device and the heat
sink are soldered directly to a modified
drain pad creating a thermal transfer
path from package tab to the heat sink.
1.00 (0.039) Thick Copper, Tin Plated
Part Number
RT1760D00000
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6
Plug In style heat sink with two self-locking clips for TO-220 & TO-262
Plug in style heat sink with two self
locking clips and mounting hole to
firmly hold the device to the heat sink
ensuring maximum metal to metal ther-
mal contact. Available with solderable
mounting tabs for both horizontal and
vertical mounting to the PC board.
Thru Hole Discrete Semiconductor Packages
www.r-theta.com
Plug In style heat sink featuring four self-locking clips for TO-220 and TO-262
Plug in style heat sink features
four self locking clips to firmly hold
the device to the heat sink ensuring
maximum metal to metal thermal con-
tact. Available with solderable mounting
tabs for both horizontal and vertical
mounting to the PC board.
Fig. A Fig. B
Fig. A Fig. B
Part Number Description Fig.
Dia. of PCB Plated
Thru hole for Tab
RT1000B00000 Slim plug in heat sink without tab A N/A
RT1000B03100 With single tab for horizontal mounting A1.75 (0.069)
RT1000B04000 With single tab for vertical mounting B1.75 (0.069)
Aluminum, Black Anodized
Part Number Description Fig.
Dia. of PCB Plated
Thru hole for Tab
RT1002B00000 Slim plug in heat sink without tab A N/A
RT1002B03100 With single tab for horizontal mounting A1.75 (0.069)
RT1002B04000 With single tab for vertical mounting B1.75 (0.069)
Aluminum, Black Anodized
7
Economy, narrow base, low profile channel style heat sink for TO-220
Economy, narrow base, low profile
channel style heat sink is perfect for
use on printed circuit boards with 0.500
inch centering. When mounted horizon-
tally, the total height of the heat sink is
just 9.65 (0.380).
Thru Hole Discrete Semiconductor Packages
www.r-theta.com
Aluminum, Black Anodized
Channel style heat sink featuring twisted fins for TO-220
Channel style heat sink features
twisted fins for increased air turbu-
lence for better cooling. Includes three
device mounting options, hole, slot or
clip and wave solderable tin plated tabs
for easy attachment to the PC board.
Popular Option: Device Mounting Clip Part Number: RT1460U00000 (Order Separately)
Aluminum, Black Anodized
Plug In style heat sink featuring two self-locking clips for TO-220 & TO-262
Plug in style heat sink features two
self locking clips to firmly hold the
device to the heat sink ensuring maxi-
mum thermal contact. Available with
solderable mounting tabs for both hori-
zontal and vertical mounting to the PC
board.
Fig. A Fig. B
Part Number Fig. Mounting
Dia. of PCB Plated
Thru hole for Tabs
RT1100B03400 A Hole 2.36 (0.093)
RT1110B03400 B Slot 2.36 (0.093)
Fig. A Fig. B
Part Number Description Fig.
Dia. of PCB Plated
Thru hole for Tabs
RT1050B00000 Plug in style heat sink A N/A
RT1050B03100 With horizontal mounting tab A1.75 (0.069)
RT1050B04000 With vertical mounting tab B1.75 (0.069)
Aluminum, Black Anodized
Part Number
RT1300B00000
8
Thru Hole Discrete Semiconductor Packages
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Thin profile space saving twisted fin heat sink for TO-220
Thin profile space savings twisted
fin heat sink for vertical mounting
TO-220 devices. Features staked on sol-
derable mounting tabs for easy attach-
ment to the PC board.
Part Number Fig.
Dia. of PCB Plated
Thru hole for Tabs
RT1600B03400 A 2.39 (0.094)
Aluminum, Black Anodized
Channel style heat sink with three integrated tabs for a variety of devices
Channel style heat sink with three
integrated tabs for greater stability
and slotted mounting hole to accom-
modate a variety of device lead
lengths. Mounting tabs are designed
twisted to mount to PCB. Aluminum, Black Anodized
Channel style heat sink featuring device mounting hole/slot for a variety of devices
Channel style heat sink features
device mounting hole or slot to
accommodate a variety of device lead
lengths. Mounting tabs are Tin Finish
for soldering to PCB.
Aluminum, Black Anodized
Fig. A Fig. B
Part Number Fig. Mounting
Dia. of PCB Plated
Thru hole for Tabs
RT1550B03400 A Slot 2.05 (0.081)
RT1560B03400 B Hole 2.05 (0.081)
Part Number
RT1500B00000
9
Thru Hole Discrete Semiconductor Packages
www.r-theta.com
Hat section style heat sink for TO-220
Hat section style heat sinks are low
profile and perfect for use on printed
circuit cards with 0.500 inch centering
between boards. For higher power
application the RT1200 hat can be
added to the RT1150 or RT1250 for
double sided cooling of a TO-220
device.
Aluminum, Black Anodized
Part Number Description Fig.
RT1150B00000
Wide hat section
heat sink A
RT1200B00000
Top mount hat heat
sink with cut out B
RT1250B00000
Dual Device hat
section heat sink C
RT1150 - Figure A RT1200 - Figure B
RT1250 - Figure C
Lightweight, channel style heat sink featuring twisted fins for TO-220
Lightweight, channel style heat
sink featuring twisted fins designed
for mounting horizontally or vertically
on a PC board.
Aluminum, Black Anodized
Part Number
RT1700B00000
Part Number Description “A” mm (In.)
Dia. of PCB Plated
Thru hole for Tab
RT1350B00000 Slim, low cost channel style heat sink 6.35 (0.250) N/A
RT1360B00000 Slim, low cost channel style heat sink 9.53 (0.375) N/A
RT1360B04000 With solderable tab 9.53 (0.375) 1.73 (0.068)
RT1370B00000 Slim, low cost channel style heat sink 12.70 (0.500) N/A
RT1370B04000 With solderable tab 12.70 (0.500) 1.73 (0.068)
10
Compact low cost channel style
heat sink is notched to accommodate
the TO-202 center tab packages.
Available in two fin heights.
Thru Hole Discrete Semiconductor Packages
www.r-theta.com
Aluminum, Black Anodized
Compact low cost channel style heat sink for TO-220
Compact low cost channel style
heat sink is ideal where space and
cost are limited. Available in three fin
heights with or without solderable
mounting tab.
Compact low cost channel style heat sink for TO-202
Part Number “A” mm (In.)
RT1400B00000 9.53 (0.375)
RT1410B00000 12.70 (0.500)
Extruded heat sink with large radial fins for TO-202 and TO-220
Extruded heat sink with large radi-
al fins features equal channel widths
on both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on device
leads. Available in four heights for TO-
202 and TO-220 devices.
Aluminum, Black Anodized
Part Number Device “A” mm (In.)
Dia. of PCB Plated
Thru hole for Tabs
RT3410B02500 TO-202, TO-220 24.50 (1.00) 2.67 (0.105)
RT3415B02500 TO-202, TO-220 38.20 (1.50) 2.67 (0.105)
RT3420B02500 TO-202, TO-220 50.80 (2.00) 2.67 (0.105)
RT3425B02500 TO-202, TO-220 63.50 (2.50) 2.67 (0.105)
Aluminum, Black Anodized
11
Thru Hole Discrete Semiconductor Packages
www.r-theta.com
Channel style heat sink with wide mounting surface for a variety of devices
Channel style heat sink with wide
mounting surface and selection of
lengths to accept a variety of devices.
Models accommodate one or two
devices.
Aluminum, Black Anodized
Part Number Fig. “A” Dim mm (In.) “B” Dim mm (In.) “C” Dim mm (In.)
RT1650B00000 A 18.03 (0.710) 12.32 (0.485) N/A
RT1660B00000 B 29.97 (1.180) 11.68 (0.460) N/A
RT1670B00000 B 29.97 (1.180) 12.19 (0.480) 10.16 (0.400)
Extruded heat sink with radial fins and notched base for TO-202 and TO-220
Extruded heat sink with radial fins
and notched base features equal
channel widths on both sides for single
or dual device mounting. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in four
heights for TO-202 and TO-220 devices.
Aluminum, Black Anodized
Part Number Device “A” mm (In.)
Dia. of PCB Plated
Thru hole for Tabs
RT3310B02500 TO-202, TO-220 24.50 (1.00) 2.67 (0.105)
RT3315B02500 TO-202, TO-220 38.20 (1.50) 2.67 (0.105)
RT3320B02500 TO-202, TO-220 50.80 (2.00) 2.67 (0.105)
RT3325B02500 TO-202, TO-220 63.50 (2.50) 2.67 (0.105)
Fig. A Fig. B
RT1660B00000, RT1670B00000RT1650B00000
12
Thru Hole Discrete Semiconductor Packages
www.r-theta.com
Extruded heat sink with radial fins for TO-220, TO-218 and TO-247
Extruded heat sink with radial fins
feature equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting to eliminate stress on device
leads. Available in four heights for TO-
220, TO-218, and TO-247 devices.
Aluminum, Black Anodized
Part Number Device
“A” Dim
mm (In.)
“B” Dim
mm (In.)
“C” Dim
mm (In.)
“D” Dim
mm (In.)
“E” Dim
mm (In.)
Dia. of PCB Plated
Thru hole for Tabs
RT3010B02500 TO-218, TO-247 25.40 (1.00) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
RT3110B02500 TO-220 25.40 (1.00) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
RT3015B02500 TO-218, TO-247 38.10 (1.50) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
RT3115B02500 TO-220 38.10 (1.50) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
RT3020B02500 TO-218, TO-247 50.80 (2.00) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
RT3120B02500 TO-220 50.80 (2.00) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
RT3025B02500 TO-218, TO-247 63.50 (2.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
RT3125B02500 TO-220 63.50 (2.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
Flat back extruded heat sink fea-
tures solderable pins which allow
vertical mounting without stress on the
device leads. Available in three heights
for TO-220 and TO-218 devices.Aluminum, Black Anodized
Flat back extruded heat sink with solderable pins for TO-220 & TO-218
Part Number Device
“A” Dim
mm (In.)
“B” Dim
mm (In.)
Dia. of PCB Plated
Thru hole for Tabs
RT3210B02500 TO-220 25.40 (1.00) 18.29 (0.720) 2.67 (0.105)
RT3211B02500 TO-218 25.40 (1.00) 21.59 (0.850) 2.67 (0.105)
RT3215B02500 TO-220 38.10 (1.50) 18.29 (0.720) 2.67 (0.105)
RT3216B02500 TO-218 38.10 (1.50) 21.59 (0.850) 2.67 (0.105)
RT3220B02500 TO-220 50.80 (2.00) 18.29 (0.720) 2.67 (0.105)
RT3221B02500 TO-218 50.80 (2.00) 21.59 (0.850) 2.67 (0.105)
13
Thru Hole Discrete Semiconductor Packages
www.r-theta.com
High power extruded heat sink with large radial fins for TO-220 and Multiwatt
High power extruded heat sink
with large radial fins and increased
fin count for additional cooling capacity.
Solderable pins allow vertical mounting
without stress on device leads. Available
in four heights for TO-220 and multi-
watt devices.
Extruded heat sink with large radial fins for TO-220, TO-218 and TO-247
Extruded heat sink with large radi-
al fins features equal channel widths
on both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminates stress on
device leads. Available in four heights
for TO-220,TO-218 and TO-247 devices.
Aluminum, Black Anodized
Note: Notch optional see chart below
Part Number “A” Dim mm (In.)
Dia. of PCB Plated
Thru hole for Tabs
RT3810B02500 25.40 (1.00) 2.67 (0.105)
RT3815B02500 38.10 (1.50) 2.67 (0.105)
RT3820B02500 50.80 (2.00) 2.67 (0.105)
RT3825B02500 63.50 (2.50) 2.67 (0.105)
Aluminum, Black Anodized
Part Number Device “A” Dim mm (In.) “B” Dim mm (In.) Base Notch
Dia. of PCB Plated
Thru hole for Tabs
RT3609B02500 TO-220 25.40 (1.00) 18.29 (0.720) No Notch 2.67 (0.105)
RT3610B02500 TO-218, TO-247 25.40 (1.00) 21.59 (0.850) No Notch 2.67 (0.105)
RT3710B02500 TO-218, TO-247 25.40 (1.00) 21.59 (0.850) Notch 2.67 (0.105)
RT3615B02500 TO-218, TO-247 38.10 (1.50) 21.59 (0.850) No Notch 2.67 (0.105)
RT3715B02500 TO-218, TO-247 38.10 (1.50) 21.59 (0.850) Notch 2.67 (0.105)
RT3620B02500 TO-218, TO-247 50.80 (2.00) 21.59 (0.850) No Notch 2.67 (0.105)
RT3720B02500 TO-218, TO-247 50.80 (2.00) 21.59 (0.850) Notch 2.67 (0.105)
RT3625B02500 TO-218, TO-247 63.50 (2.50) 21.59 (0.850) No Notch 2.67 (0.105)
RT3725B02500 TO-218, TO-247 63.50 (2.50) 21.59 (0.850) Notch 2.67 (0.105)
14
Extruded Heat Sinks for DC/DC Converters
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Heat sinks for “Full-Brick” DC/DC Converters
Heat sinks for “Full-Brick” DC/DC Converters
Standard mounting slots mate with Vicor DC/DC converters.
Optimized aluminum extruded fin construction transfers heat efficiently
and keeps converter modules cool in both forced and natural convec-
tion applications.
Three fin heights and two flow directions, vertical and horizontal are
available.
Aluminum, Clear trivalent chromate finish is standard.
Polar Thermal interface materials are available. Contact the factory to
select the material for your application.
Part Number Fig.
Footprint Dimensions
mm (in.)
Height
mm (in.)
Fin
Orientation
Number
of fins
RT3830C00000 A 116.8 (4.60) x 61.0 (2.40) 22.9 (0.90) Horizontal 8
RT3835C00000 B 61.0 (2.40) x 116.8 (4.60) 22.9 (0.90) Vertical 16
RT3840C00000 C 61.0 (2.40) x 116.8 (4.60) 17.8 (0.70) Vertical 16
RT3845C00000 D 61.0 (2.40) x 116.8 (4.60) 10.2 (0.40) Vertical 16
RT3830C00000 RT3845C00000
RT3840C00000
RT3835C00000
Figure A Figure D
Figure B
Figure C
15
Extruded Heat Sinks for DC/DC Converters
www.r-theta.com
Heat sinks for “Half-Brick” DC/DC Converters
Heat sinks for “Half-Brick” DC/DC Converters
Standard mounting slots mate with Vicor and the majority of “half-
brick” DC/DC converters on the market.
Optimized aluminum extruded fin construction transfers heat efficiently
and keeps converter modules cool in both forced and natural convec-
tion applications.
Two fin heights and two flow directions, vertical and horizontal are
available.
Aluminum, Clear trivalent chromate finish is standard.
Polar Thermal interface materials available. Contact the factory to
select the material for your application.
Part Number Fig.
Footprint Dimensions
mm (in.)
Height
mm (in.)
Fin
Orientation
Number
of fins
RT3850C00000 A 57.9 (2.28) x 61.0 (2.40) 22.9 (0.90) Horizontal 8
RT3855C00000 B 61.0 (2.40) x 57.9 (2.28) 22.9 (0.90) Vertical 8
RT3860C00000 C 60.5 (2.38) x 57.4 (2.26) 10.7 (0.42) Vertical 8
RT3850C00000
RT3855C00000
RT3860C00000
Figure A
Figure B
Figure C
16
Standard Heat Sinks for Solid State Relays
www.r-theta.com
Extruded Heat Sink for Solid State Relays
Extruded Heat Sink for Solid State Relays features
Four standard mounting slots accommodate easy assembly.
Two 8-32 threaded thru holes can accept one solid state relay with 1.875
center distance.
Fins on outerside of mounting channel optimizes heat transfer.
Thermal interface compounds and pad materials available see pages 18-20
or contact the factory to select the correct material for your application.
Aluminum, Clear trivalent chromate finish
Fabfin High Performance Heat sink for Solid State Relays features
Four standard mounting slots accommodate easy assembly.
Six 8-32 threaded thru holes can accept three solid state relay with 1.875
center distance.
High fin density construction provides excellent heat transfer characteristics.
Thermal interface compounds and pad materials available see pages 18-20
or contact the factory to select the correct material for your application.
Aluminum, Clear trivalent chromate finish
Fabfin High Performance Heat Sink for Solid State Relays
Part Number
Footprint Dimensions
mm (in.)
Height
mm (in.)
RT3975C00000 139.7 (5.500) x 120.65 (4.75) 66.68(2.625 )
Part Number
Footprint Dimensions
mm (in.)
Height
mm (in.)
RT3980C00000 152.40 (6.00) x 149.10 (5.87) 88.39 (3.480)
SOURCE AREA
320.5
31.8
257
133.4
3.2
158.9 158.9
305
368.50
6.90
25.4
7.60
127.1
MODAL #
FIN STYLE
WT WITHOUT FAN 10.4 kg 8.8 kg
BASE AREA 78,387 mm
2
78,387 mm
2
TOTAL CSA 10,889 mm
2
8,981 mm
2
TOTAL PERIMETER 7,800 mm 7,929 mm
TECHNICAL DATA
FFC305T13A30AS 118B FFC305T13A30AC118B
SERRATED CORRUGATED
SOURCE AREA
456.5
31.8
393
133.4
3.2
158.9 158.9
305
368.50
6.90
25.4
7.60
127.1
MODAL #
FIN STYLE
WT WITHOUT FAN 15.5 kg 13.2 kg
BASE AREA 119,865 mm
2
119,865 mm
2
TOTAL CSA 16,574 mm
2
13,766 mm
2
TOTAL PERIMETER 11,991 mm 12,578 mm
TECHNICAL DATA
FFC305T13A46AS118B FFC305T13A46AC118B
SERRATED CORRUGATED
158.9 158.9
305
368.50
6.90
25.4
7.60
127.1
SOURCE AREA
184.5
31.8
121
133.4
3.2
MODAL #
FIN STYLE
WT WITHOUT FAN 5.4 kg 4.7 kg
BASE AREA 36,774 mm236,774 mm2
TOTAL CSA 5,091 mm24,242 mm2
TOTAL PERIMETER 3,683 mm 3,749 mm
TECHNICAL DATA
FFC305T13A14AS118B FFC305T13A14AC118B
SERRATED CORRUGATED
17
FABFIN Heat Sinks for IGBT and High Power Devices
www.r-theta.com
FABFIN Standards - Various Widths Available in Serrated or Corrugated Fins
FFC SERIES WITH SIDE FASTENED LEGS AND FAN BRACKET
The R-Theta®range of stan-
dard Fabfin®forced convec-
tion cooled heat sinks (FFC
series) was developed to
incorporate standard 119mm
square axial fans. The fin
spacing of 8.51 mm was
selected to provide a 20:1
ratio, the practical heat trans-
fer limit for cooling Power
Semiconductors in typical
ambient conditions. The stan-
dard FFC series shown will
accept 1, 2, 3 or 4 (not
shown) fans. Available in
many finishes.
The serrated fin thickness of
2.4mm provides near opti-
mum performance when
using industry standard axial
fans. If some level of per-
formance de-rating is accept-
able (approximately 20%)
then we recommend that
corrugated fins be used.
These have a thickness of
1.5 mm and are designated
by ordering the ‘AC’ part
numbers. The use of corru-
gated fins provides a weight
savings of approximately
15% and will increase sur-
face area by 7% compared
with a straight fin of the
same height.
The push/pull (PP) option is
common for applications
where fan redundancy is
important. We recommend
the use of ball bearing fan(s),
specifically for the “pull” end,
in order to maximize the fan
life due to the elevated oper-
ating temperatures. The
additional weight of the fan
can be offset by using the
corrugated fins, if applicable.
The adjacent graphs provide
a performance guide for heat
generating devices ranging in
size from point source to
60% coverage.
18
Polar Interface Materials
www.r-theta.com
Polar Silicone Thermal Compound
Polar Silicone Thermal Compound
Polar RT7002 - RT7080 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resist-
ance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and
evaporation. It is designed for applications where a silicone thermal interface material is required.
Key Features
Good Thermal Conductivity (0.80 W/mok)
Low Interface Thermal Resistance - (0.05 oC-In 2/W)
Thin Bond lines to < 1 mil.
Low bleed and evaporation
Benefits
Non-Toxic.
Reworkable/Easy to Remove.
Easy to apply by dispensing or Screen printing/stencil.
Typical Applications
Applied to the base and mounting studs of transistors, diode and silicon controlled rectifiers.
Can be used as a high-voltage corona suppressant/non-flammable coating, in connections for fly back transformers located
in TV sets and similar design applications.
Used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating
assemblies to chassis; mounting power resistors; and for any devices where efficient cooling is required in major industries
including, electronic (computer, appliance, wireless, etc.) automotive and electrical.
Part Number Description Package Size & Type
RT7002U00000 Silicone Compound 2 Oz. Jar
RT7004U00000 Silicone Compound 4 Gram Pack
RT7005U00000 Silicone Compound 5 Oz. Tube
RT7008U00000 Silicone Compound 8 Oz. Jar
RT7010U00000 Silicone Compound 10 CC Syringe
RT7080U00000 Silicone Compound 5 lb Quart Jar
Typical Properties RT7002 - RT7080
Viscosity: Thixotropic Paste
Specific Gravity, @ 25o C 2.2
Color: White
Evaporation, @ 200oC, 24 Hrs., %/Wt. 0.6
Thermal Conductivity, (ASTM D5470)
W/m.oK 0.80
Thermal Resistance (oC-in2/W) 0.05
Electrical Properties:
Dielectric strength (ASTM D150)
0.05” gap, V/mil 390
Volume Resistivity (ASTM D257)
Ohm-cm. 2.8 x 1014
Operating Temperature Range -55oC to 205oC
Shelf Life 5 Years
Polar Non-Silicone Thermal Compound
Polar RT7102 - RT7180 is grease-like Non-Silicone, non-migrating material heavily impregnated with heat-conductive metal oxides.
This formulation provides high thermal conductivity, low bleed and high temperature stability.
Key Features Non-Silicone offers advantages of no creep or migration over wide temperature range.
Low Interface Thermal Resistance - (0.03oC-in2/W)
High Thermal Conductivity, High dielectric strength.
Exceptionally low bleed and evaporation.
Meets MIL-C-47113 & MIS-19846 specifications.
Polar RT7203 is grease-like Non-Silicone based reworkable, silver filled thermally and electrically conductive grease. Engineered with
specially selected pure silver particles to maximize particle-to-particle contact for most efficient heat transfer and low resistivity.
Key Features Thermally and Electrically Conductive
Low Interface Thermal Resistance - (0.005oc-in2/W)
High Thermal Conductivity, (7.0 W/moK)
Low Resistivity, (< 0.01 Ohm-cm)
Exceptionally low bleed and evaporation.
Non-Silicone offers advantages of no creep or migration over wide temperature range.
Polar RT7280 is grease-like Non-Silicone, non-migrating material thickened with heat conductive fillers, low bleed and high temperature
stability.
Key Features Formulated with low viscosity for easy dispensing and screen printing/stencil, and automated dispensing.
Thin bond lines of 1-2 mil.
Non-Silicone offers advantages of no creep or migration over wide temperature range.
Low Interface Thermal Resistance - (0.03oC-in2/W)
High Thermal Conductivity, High dielectric strength.
Exceptionally low bleed and evaporation.
Meets MIL-C-47113 & MIS-19846 specifications.
Benefits Will not harden, dry out or melt.
Will not contaminate solder bath or other devices.
Non-toxic.
Reworkable and easy to apply, remove and dispense.
Typical Applications Used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; mounting
power resistors; and for any devices where efficient cooling is required in major industries including, electronic
(computer, appliance, wireless, etc.) automotive and electrical.
19
Polar Interface Materials
www.r-theta.com
Polar Non-Silicone Thermal Compound
Part Number Description Package Size & Type
RT7102U00000 Non-Silicone Compound 2 Oz. Jar
RT7104U00000 Non-Silicone Compound 4 Oz. Tube
RT7110U00000 Non-Silicone Compound 10 CC Syringe
RT7180U00000 Non-Silicone Compound 5 lb Quart Jar
RT7203U00000 Non-Silicone Compound 3 CC Syringe
RT7280U00000 Non-Silicone Compound LV 5 lb Quart Jar
Typical Properties RT7102-RT7180 RT7203 RT7280
Viscosity: Thixotropic Paste Thixotropic Paste Thixotropic Paste
Specific Gravity, @ 25oC 2.7 4.0 2.4
Color: White Silver/Gray Blue
Evaporation, @ 200oC, 24 Hrs.,%/Wt. 0.3 0.4 0.6
Thermal Conductivity, (ASTM D5470)
W/m.oK 1.0 7.0 0.80
Thermal Resistance (oC-in2/W) 0.03 0.005 0.03
Electrical Properties:
Dielectric strength (ASTM D150)
0.05” gap, V/mil 350 N/A 310
Volume Resistivity (ASTM D257)
Ohm-cm. 1.8 x 1014 <0.010 1.54 x 1014
Operating Temperature Range -55oC to 200oC -55oC to 200oC -55oC to 200oC
Shelf Life 5 Years 5 Years 5 Years
20
Polar Interface Materials
www.r-theta.com
Polar Thermally Conductive Sil-Pads
Polar Sil-Pad is a composite of silicone rubber and fiberglass. The material is specially formulated for use as a thermally conductive
insulator.
Key Features Surfaces are pliable and allow complete surface contact with excellent heat dissipation. The reinforcing
fiberglass provides excellent cut-through resistance.
Benefits Thermal impedance 1.13oC-in2/W(@50 psi)
Excellent mechanical and physical characteristics.
Flame retardant
Typical Applications Used in power supplies, power semiconductors, automotive electronics, telecommunications and motor
controls.
Configurations Available are sheet form, die-cut parts, and roll form; with or without pressure sensitive adhesive.
Typical Properties POLAR SIL-PAD
Color Gray
Thickness, mm (in.) .18 + .025 (.007 + .001)
Thermal Performance
TO-220 Test @ 50 psi oC/W 5.14
Thermal Impedance (oc-in2/W) 1.13
Thermal Conductivity, (W/m-k nominal) 0.9
Voltage Breakdown, (Vac) 3500
Continuous Use Temperature (oc) -60 to 180
Construction Silicone / Fiberglass
Part
Number TO Package
“A” Dim
mm (In.)
“B” Dim
mm (In.)
“C” Dim
mm (In.)
“D” Dim
mm (In.)
Adhesive on
one side
RT7200U10000 TO-220 (Clip Mount) 19.1(.750) 12.7(.500) No
RT7210U10000 TO-220 19.1(.750) 12.7(.500) 4.8(.187) 3.7(.147) No
RT7220U10000 TO-220 19.1(.750) 12.7(.500) 4.8(.187) 3.2(.125) No
RT7230U10000 TO-218 21.8(.860) 18.8(.740) 5.1(.200) 4.1(.160) No
RT7240U10000 TO-247 25.4(1.000) 19.1(.750) 7.6(.300) 3.6(.140) No
RT7250U10000 TO-247 29.0(1.140) 20.6(.810) 9.0(.355) 3.7(.147) No
Note: Contact R-Theta for other configurations and materials
21
Polar Interface Materials
www.r-theta.com
Polar Thermally Conductive Adhesive Tapes
Ceramic or metal packages
T405 thermal tape consists of a high bond strength, pressure-sensitive acrylic adhesive, loaded with aluminum oxide and coated onto
a 0.050 mm (0.002 inch) aluminum foil carrier. The aluminum foil provides added thermal conductivity for applications where electri-
cal isolation is not required.
T412 thermal tape consists of a high bond strength, pressure-sensitive acrylic adhesive, loaded with titanium diboride and applied to
an expanded aluminum carrier. The combination of filler, expanded metal and embossed surface enhances both tape conformability and
thermal performance.
Plastic packages
T410 tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a 0.05 mm
(0.002 inch) aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent
adhesion to silicone-contaminated plastics and other low energy surfaces.
T411 tape consists of a high bond strength pressure-sensitive adhesive with an expanded aluminum mesh carrier layer. The mesh carrier
allows the tape to conform to curved surfaces of plastic molded IC packages, providing a high adhesive strength attachment for heat
sinks. The high performance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces.
Typical Properties T405 T412
Carrier Aluminum Expanded Al
Color White Grey
Thickness, mm (in.) 0.152 ( 0.006) 0.229 (0.009)
Thermal Impedance @<1 psi,
oc-in2/W (oc-cm2/W)
0.5
(3.4)
0.25
(1.7)
Thermal Conductivity, W/m-k 0.50 1.40
Voltage Breakdown, Vac N/A N/A
Volume Resistivity, ohm-cm N/A 1.3 x 10-2
Flammability Rating (E140244) V-O Not Rated
Lap Shear Adhesion, psi (MPa) 135 (0.931) 70 (0.483)
Die Shear Adhesion, psi (MPa)
Aluminum 25oc
150oc
Aluminum Oxide Substrate 25oc
150oc
125 (0.862)
55 (0.379)
145 (1.00)
60 (0.414)
135 (0.931)
25 (0.172)
125 (0.862)
40 (0.276)
Creep Adhesion, days
25oc, 12 psi (0.083MPa)
150oc, 12 psi (0.083MPa)
>50
>50
>50
>50
Adhesive CTE, ppm/oc, -40 to +150oc 400 400
Typical Properties T410 T411
Carrier Aluminum Foil Aluminum Mesh
Adhesive (to heat sink side) Acrylic Silicone
Color (to heat sink side) White Clear (Silver)
Adhesive (onto component side) Silicone Silicone
Color (to component side) Clear (Silver) Clear (Silver)
Thickness, mm (in.) 0.18 (0.007) 0.28 (0.011)
Thermal Impedance @<1 psi,
oc-in2/W (oc-cm2/W)
1.1
(7.1)
1.0
(6.5)
Operating Temperature Range, oc- 50 to +150 - 50 to +150
Voltage Breakdown, Vac N/A N/A
Volume Resistivity, ohm-cm N/A N/A
Lap Shear Adhesion, psi (MPa) 60 (0.414) 14 (0.094)
Die Shear Adhesion, psi (MPa)
Steel/FR4 25oc
125oc
170 (1.172)
40 (0.276)
80 (0.552)
20 (0.138)
How to order Example P/N RT5635B000 _ _ (Last two digits tape option)
Ordering Code Tape Option
05 T405
10 T410
11 T411
12 T412
1. Part Number RT5635B00000
2. Choose a tape option T405 (05), T410 (10), T411 (11) or T412 (12)
3. Then add the ordering code (05,10,11,12) to your part number (by replacing the
last two digits.)
For Example: To order tape option T410 (10) with the part number RT5635B00000
the completed part number to order would be RT5635B00010.
22
Aluminum Extrusion Profiles
www.r-theta.com
Extruded Aluminum Heat Sink Profiles
Note: There are many more sizes and styles available. Consult the website for a complete listing.
EXTRUSION CHARACTERISTICS TABLE
THE MULTI-PURPOSE ALLOY - 6063 -T5
6063 is a multi-purpose alloy that is most widely used for heat sinks and architectural hardware because it is
extrudable into complex shapes and lends itself to anodized coating. The T5 temper provides sufficient hardness
for ease of machinability. 6063-T5 is the aluminum extrusion most commonly used by R-Theta.
After entering the URL listed below, click on a part number to view an image of the Extrusion. Sort the table by
clicking on the columns titles. Selected part number is displayed beside the send quote button.
http://www.r-theta.com/products_aircooled_extrusion_create.asp
R-THETA OFFERS A BROAD RANGE OF EXTRUSION PROFILES
If you cannot locate an extrusion profile that meets your requirements, contact the factory or web site for
additional profiles that have become available or alternatives. If a custom solution is required R-Theta will
assist you to design a new profile that meets your requirements both mechanical and Thermal.
Six foot ( 72” ) lengths are standard; however, other lengths are available.
Profile
Number
Part Number To
Order (72”)
Perimeter
mm (in)
Weight
Kg/m (lb/ft)
Thermal Resistance
oC/W/3”
9000 RT9000U07200 927 (36.5) 4.0 (2.7) 1.8
9001 RT9001U07200 1,422 (56) 5.1 (3.4) 1.5
9002 RT9002U07200 2,487 (97.9) 13.8 (9.3) 0.7
9003 RT9003U07200 1,590 (62.6) 7.1 (4.8) 1.1
9004 RT9004U07200 1,854 (73.0) 10.4 (7.0) 1.0
9005 RT9005U07200 2,817 (110.9) 27.8 (18.7) 0.7
9006 RT9006U07200 1,979 (77.9) 7.6 (5.1) 0.9
9007 RT9007U07200 2,543 (100.1) 10.6 (7.1) 0.7
9008 RT9008U07200 1,481 (58.3) 3.6 (2.4) 1.2
9009 RT9009U07200 1,011 (39.8) 4.0 (2.7) 1.5
9010 RT9010U07200 2,339 (92.1) 24.4 (16.4) 0.8
9011 RT9011U07200 990 (39.0) 4.5 (3.0) 1.6
9012 RT9012U07200 2,941 (115.8) 17.6 (11.8) 0.5
9013 RT9013U07200 3,400 (133.8) 13.1 (8.8) 0.8
9014 RT9014U07200 1,278 (50.3) 6.1 (4.1) 1.4
9015 RT9015U07200 2,042 (80.4) 10.0 (6.7) 0.9
9016 RT9016U07200 2,223 (87.5) 11.0 (7.4) 0.8
9017 RT9017U07200 2,954 (116.3) 11.3 (7.6) 0.5
9018 RT9018U07200 2,316 (91.2) 16.5 (11.1) 0.8
9019 RT9019U07200 2,804 (110.4) 17.6 (11.8) 0.6
9020 RT9020U07200 2,286 (90.0) 16.1 (10.8) 0.9
9021 RT9021U07200 1,344 (52.9) 5.3 (3.6) 1.4
9022 RT9022U07200 1,886 (74.3) 6.1 (4.1) 0.8
9023 RT9023U07200 399 (15.7) 1.7 (1.2) 4.1
9024 RT9024U07200 2,736 (107.7) 8.8 (5.9) 1.2
9025 RT9025U07200 1,711 (67.4) 7.7 (5.2) 0.8
9026 RT9026U07200 1,503 (59.2) 6.6 (4.4) 0.9
9027 RT9027U07200 1,094 (43.1) 6.8 (4.6) 1.6
REFER TO TABLE ON PAGE 22
5 EASY STEPS TO CONFIGURE EXTRUSION
STEP 1: LOG ONTO www.r-theta.com
STEP 2: SELECT “PRODUCTS” ON MENU BAR
STEP 3: SELECT “AIRCOOLED” ON DROP DOWN MENU
STEP 4: SELECT “CREATE AN EXTRUSION”
STEP 5: SELECT “EXTRUSION CONFIGUATOR
Select Extrusion to obtain detailed section information
Thermal Modeling of any “comb” Extrusion can be simulated at http://r-tools.r-theta.com
Extruded Aluminum Heat Sink Profiles
9027 9022 9014 9001
9013 9006
9026
9002
23
Aluminum Extrusion Profiles
www.r-theta.com
9003 9017 9025 9024
9020
9015
9007 9010
9004
90129019 9005
9008 9018 9021 9016
9023 9011 9009 9000
Index by Device Cooled
24
Index by Device Cooled
www.r-theta.com
R-Theta No. Page No.
RT3010B02500 12
RT3015B02500 12
RT3020B02500 12
RT3025B02500 12
RT3610B02500 13
RT3615B02500 13
RT3620B02500 13
RT3625B02500 13
RT3710B02500 13
RT3715B02500 13
RT3720B02500 13
RT3725B02500 13
R-Theta No. Page No.
RT1000B00000 6
RT1000B03100 6
RT1000B04000 6
RT1002B00000 6
RT1002B03100 6
RT1002B04000 6
RT1050B00000 7
RT1050B03100 7
RT1050B04000 7
DC/DC Converters
DIPS
R-Theta No. Page No.
Full-Brick
RT3830C00000 14
RT3835C00000 14
RT3840C00000 14
RT3845C00000 14
Half-Brick
RT3850C00000 15
RT3855C00000 15
RT3860C00000 15
R-Theta No. Page No.
RT5470B00000 4
RT5475B00000 4
IC Packages, BGAs
R-Theta No. Page No.
RT5025B00000 2
RT5035B00000 2
RT5045B00000 2
RT5060B00000 2
RT5125B00000 2
RT5135B00000 2
RT5145B00000 2
RT5160B00000 2
RT5235B00000 3
RT5240B00000 3
RT5265B00000 3
RT5325B00000 3
RT5335B00000 3
RT5345B00000 3
RT5360B00000 3
RT5425B00000 4
RT5435B00000 4
RT5445B00000 4
RT5460B00000 4
RT5526B00000 3
RT5553B00000 3
RT5625B00000 2
RT5635B00000 2
RT5645B00000 2
RT5660B00000 2
Multiwatt
R-Theta No. Page No.
RT3810B02500 13
RT3815B02500 13
RT3820B02500 13
RT3825B02500 13
SMT
R-Theta No. Page No.
D-Pak TO-252
RT1750D00000 5
D2Pak TO-263
RT1755D00000 5
D3Pak TO-268
RT1760D00000 5
Solid State Relays
R-Theta No. Page No.
RT3975C00000 16
RT3980C00000 16
TO-202
R-Theta No. Page No.
RT3310B02500 11
RT3315B02500 11
RT3320B02500 11
RT3325B02500 11
RT3410B02500 10
RT3415B02500 10
RT3420B02500 10
RT3425B02500 10
TO-218
R-Theta No. Page No.
RT1660B00000 11
RT1670B00000 11
RT3010B02500 12
RT3015B02500 12
RT3020B02500 12
RT3025B02500 12
RT3211B02500 12
RT3216B02500 12
RT3221B02500 12
RT3610B02500 13
RT3615B02500 13
RT3620B02500 13
RT3625B02500 13
RT3710B02500 13
RT3715B02500 13
RT3720B02500 13
RT3725B02500 13
TO-220
R-Theta No. Page No.
RT1000B00000 6
RT1000B03100 6
RT1000B04000 6
RT1002B00000 6
RT1002B03100 6
RT1002B04000 6
RT1050B00000 7
RT1050B03100 7
RT1050B04000 7
RT1100B03400 7
RT1110B03400 7
RT1150B00000 9
RT1200B00000 9
RT1250B00000 9
RT1300B00000 7
RT1350B00000 10
RT1360B00000 10
RT1360B04000 10
RT1370B00000 10
RT1370B04000 10
RT1400B00000 10
RT1410B00000 10
RT1500B00000 8
RT1550B03400 8
RT1560B03400 8
RT1600B03400 8
RT1650B00000 11
TO-220 (Continued)
R-Theta No. Page No.
RT1660B00000 11
RT1670B00000 11
RT1700B00000 9
RT3110B02500 12
RT3115B02500 12
RT3120B02500 12
RT3125B02500 12
RT3210B02500 12
RT3215B02500 12
RT3220B02500 12
RT3310B02500 11
RT3315B02500 11
RT3320B02500 11
RT3325B02500 11
RT3410B02500 10
RT3415B02500 10
RT3420B02500 10
RT3425B02500 10
RT3609B02500 13
RT3810B02500 13
RT3815B02500 13
RT3820B02500 13
RT3825B02500 13
TO-247
TO-262
Index by Part Number
25
Index by Part Number
www.r-theta.com
RT1000B00000 6
RT1000B03100 6
RT1000B04000 6
RT1002B00000 6
RT1002B03100 6
RT1002B04000 6
RT1050B00000 7
RT1050B03100 7
RT1050B04000 7
RT1100B03400 7
RT1110B03400 7
RT1150B00000 9
RT1200B00000 9
RT1250B00000 9
RT1300B00000 7
RT1350B00000 10
RT1360B00000 10
RT1360B04000 10
RT1370B00000 10
RT1370B04000 10
RT1400B00000 10
RT1410B00000 10
RT1460U00000 7
RT1500B00000 8
RT1550B03400 8
RT1560B03400 8
RT1600B03400 8
RT1650B00000 11
RT1660B00000 11
RT1670B00000 11
RT1700B00000 9
RT1750D00000 5
RT1755D00000 5
RT1760D00000 5
RT3010B02500 12
RT3015B02500 12
RT3020B02500 12
RT3025B02500 12
RT3110B02500 12
RT3115B02500 12
RT5045B00000 2
RT5060B00000 2
RT5125B00000 2
RT5135B00000 2
RT5145B00000 2
RT5160B00000 2
RT5235B00000 3
RT5240B00000 3
RT5265B00000 3
RT5325B00000 3
RT5335B00000 3
RT5345B00000 3
RT5360B00000 3
RT5425B00000 4
RT5435B00000 4
RT5445B00000 4
RT5460B00000 4
RT5470B00000 4
RT5475B00000 4
RT5526B00000 3
RT5553B00000 3
RT5625B00000 2
RT5635B00000 2
RT5645B00000 2
RT5660B00000 2
RT7002U00000 18
RT7004U00000 18
RT7005U00000 18
RT7008U00000 18
RT7010U00000 18
RT7080U00000 18
RT7102U00000 19
RT7104U00000 19
RT7110U00000 19
RT7180U00000 19
RT7200U10000 20
RT7203U00000 19
RT7210U10000 20
RT7220U10000 20
RT7230U10000 20
RT7240U10000 20
RT7250U10000 20
RT7280U00000 19
RT9000U07200 22
RT9001U07200 22
RT9002U07200 22
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FabFin
Hollowfin
Mixed Metals
Hypercool
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Other Products Available From R-Theta Thermal Solutions Inc.
Aquasink
AC/DC Fans
R-theta also offers a complete line of
high performance , aluminum and copper
alloy heat sinks and AC/DC fans.
Consult R-theta for more details.
FabFin
The Navigational Tool For
On-Line Heatsink Design
www.r-theta.com
NAVIGATOR
ISO 9001 - 2000 REGISTERED
www.r-theta.com
6220 Kestrel Rd., Mississauga, ON CANADA L5T 1Y9
voice 905.795.0077 fax 905.795.2508 toll free 1.800.388.5428 website www.r-theta.com
STANDARD
Products Catalog
ISO 9001 - 2000 REGISTERED