The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. NEW microSDTM Card Connectors DM3 Series Features Common to the entire Series 1. Extremely small size Small external dimensions and the above-the-board height make the connectors the smallest on the market. 2. Reverse card insertion protection Unique card slot design (patent pending) protects the connector from damage when the card is attempted to be inserted in reverse, allowing it to re-inserted correctly. 3. Effective ground and shield configuration 4-connection points of the metal cover to the printed circuit board assures secure connection of the ground circuit and provides EMI protection. 4. Rigid and strong construction Despite its small size, high-strengths materials used in the connectors produced a strong and rigid structure. 5. Card detection switch * Accessible termination areas Contact solder terminations may be inspected and reworked. DM3D (Push -Pull, manual, without ejection mechanism) * Partial card insertion hold Card will not fall-out even when it is not fully inserted. Full insertion and electrical / mechanical connection is confirmed with a distinct tactile feel. * Accessible termination areas An inner lead system that can be reworked is used in this design. Contact solder terminations may be inspected and reworked. Applications Mobile phone terminals, digital cameras, PDA's, miniature information terminals and any other portable device requiring use of small size high reliability microSD memory card connectors. etc. Card insertion-ejection Series Image Page The card detection switch is Normally Open 6. RoHS compliant All components and materials comply with the requirements of the EU Directive 2002/95/EC DM3AT and DM3B (Push - Push, with ejection mechanism) * Card fall-out prevention DM3AT 2~4 DM3B 5~7 Hinge-manual insertion/ ejection DM3C 8~10 Push-Pull manual insertion/ ejection DM3D 11~13 Push-Push Built-in card tray and the unique push insertion-push ejection mechanism (patent pending) prevent accidental card ejection or fall-out. Despite its small size the connectors will eject the card to a distance of 4.0 mm, allowing easy hold and removal of the card. * Exposed termination leads Easy inspection and rework of the solder termination joints. DM3C (Hinge, Push-Pull, manual, without ejection mechanism) * Simple and reliable card insertion Hinged metal cover provides location and guides the card during the insertion / removal. Closing of the cover confirms the electrical and mechanical connection with a tactile click sensation. * Reliable contact with the card contact pads Unique contact design and card slide action will clean the contact areas of the card. 2008.2 1 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, Card or will beConnectors discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Specifications(DM3 Series) Ratings Current rating: 0.5A Voltage rating: 125V AC Item Operating temperature range: -25c to +85c (Note 1) Operating humidity range: RH 95% max. Storage temperature range : -40c to +85c (Note 2) (No condensation) Specification Conditions 1. Insulation resistance 1000 Mo min. (Initial value) Measure at 500 V DC 2. Withstanding voltage No flashover or insulation breakdown 500 V AC / 1 minute 3. Contact resistance 100mo max. (Initial value) 1mA 4. Vibration No electrical discontinuity of 100 ns or longer No damage, cracks or parts dislocation. Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 3 directions for 2 hours Contact resistance: 40 mo max. (change from initial value) Insulation resistance: 100 Mo min. 5. Humidity 96 hours at of 40 2c, and humidity of 90 to 95% No damage, cracks or parts dislocation. Contact resistance: 40 mo max. (change from initial value) -55c 5 to 35c 85c 5 to 35c Insulation resistance: 100 Mo min. Times: 30 min. 5 min. 30 min. 5 min. No damage, cracks or parts dislocation. 5 cycles 7. Durability Contact resistance: 40 mo max. (change from initial value) 10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B) 5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D) 8. Resistance to soldering heat No deformation of components affecting performance. Reflow : At the recommended temperature profile Manual soldering : 350c for 3 seconds 6. Temperature cycle Note 1: Includes temperature rise caused by current flow. Note 2. The term "storage" refers to products stored for long period prior to mounting and use. Materials and Finishes DM3AT, DM3B Part Material Finish Remarks Insulator LCP Color: Black UL94V-0 Contacts Copper alloy Contact area: Gold plated Lead area: Gold plated ------------------- Guide cover Stainless steel (DM3AT) Copper alloy (DM3B) Lead area: Gold plated ------------------- Other components Stainless steel Piano wire ------------------Nickel plated ------------------- DM3C, DM3D Part Material Finish Remarks Insulator LCP Color: Black UL94V-0 Contacts Copper alloy Contact area: Gold plated Lead area: Gold plated ------------------- Guide cover Stainless steel Tin plated ------------------- Ordering information DM3 AT - SF - PEJ 1 2 3 1 Series name: DM3 2 Connector type : AT Push-Push (ejection mechanism), Top board mounting (Standard) B Push-Push (ejection mechanism), Bottom board mounting (Reverse) 4 3 Termination type : SF Right-angle SMT(Standard) DSF Right-angle SMT(Reverse) 4 Card ejection code : PEJ C Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard) D Push-Pull (no ejection mechanism), Top board mounting (Standard) Number of contacts : 8 2 (Push insert/push eject) None : Manual card insertion/ejection The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Card Connectors DM3AT Push-Push (ejection mechanism), Top board mounting (Standard) #5(CLK) #4(VDD) #3(CMD) #2(CD/DAT3) #1(DAT2) #6(VSS) #7(DAT0) #8(DAT1) 13.85 ( 7.35) ( 3.2 ) CL No. RoHS DM3AT-SF-PEJ 609-0023-2 YES 15.95 (16.75): Card pushed-in for ejection (17:55): Card fully inserted (21.55): Card ejected Part number (15 ) 15.95 1.68 ( 0.8) Outline of the microSD card ( 5.5) ( 11) CL 1 All dimensions: mm 2.90.15 Recommended PCB mounting pattern 0.8 8.2 MAX 1.2 0.15MIN Note 2 3 CL indicates the center line of the microSD card slot. Card detection switch Without the card Card inserted Open Closed 3 9.1 (3.2 ) 1.9 2.7 3.25 3 (B) (A) (B) No conductive traces. 15 CL 0. 1 (A) C 2.8 3 1 1 14.1MAX 14.5 15.1 8.9 MIN 8.2 MIN 1 4.4MAX 6 MIN 14.05 13.3MIN 9.9 7.9 MIN 5.7 MAX 3.7 1.2 0.15MIN 0.7 10 MIN 9.25 MAX 8.65 7.7 1.55 0.7 P=1.1 1.3 All dimensions: mm Example of applications DM3AT-SF-PEJ Portable device 3 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, Card or will beConnectors discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Packaging Specifications Embossed carrier tape dimensions (1,500 pieces per reel) Unreeling direction O1 ( 3.2) 20 32 28.4 (16.35) 14.2 .5 1.75 P= 4 2 All dimensions: mm Reel Dimensions End section Unreeling direction Mounting section Lead section (400mm min.) O380 O80 32.4 Blank section (160mm min.) Embossed carrier tape 4 Blank section (100mm min.) Top cover tape The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Card Connectors DM3B, Push-Push (ejection mechanism), Bottom board mounting (Reverse) #4(VDD) #3(CMO) #5(CLK) #6(VSS) #2(CO/DAT3) #1(DAT2) #7(DAT0) #8(DAT1) 13.85 (6.5) Part number CL No. RoHS DM3B-DSF-PEJ 609-0018-2 YES 0.4 15.1 15.45 (21.55): Card ejected (17:55): Card fully inserted (16.75): Card pushed-in for ejection 16.05 15.95 (15) 1.83 (0.55) Outline of the microSD card (5.5) 1 (11) Recommended PCB mounting pattern P=1.1 0.7 Note 14.75 14.3 3.5 10.05 0.7 3 1 2 7.7MIN 9.7 13.3 1.4 1.9 0.2 0.35MIN 1.2 10MIN 9.25MAX 8.65 7.7 All dimensions: mm CL indicates the center line of the microSD card slot. Card detection switch Without the card Card inserted Open Closed 1 0.5 0.8 3 3.2 C0 .15 1.9 1.5 3.05 (A) (3.2) (B) (A) (B) No conductive traces. All dimensions: mm 8.9 1.2 Example of applications DM3B-DSF-PEJ Portable device 5 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, Card or will beConnectors discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Packaging Specifications Embossed carrier tape dimensions (1,200pieces per reel) Unreeling direction 20 O1 (3.75) 2 32 28.4 (16.35) 14.2 .5 1.75 P=4 All dimensions: mm Reel Dimensions End section Mounting section O80 Blank section (160mm min.) Embossed carrier tape 6 Lead section (400mm min.) 32.4 O380 Unreeling direction Blank section (100mm min.) Top cover tape The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Card Connectors DM3C, Hinge, Push -Pull (no ejection mechanism), Top board mounting (Standard) 13.8 ( 6.9) (0.2) 12 13.9 ( 15.45 ):Card fully inserted 14.1 1.83 0.1 Outline of the microSD card Part number CL No. RoHS DM3C-SF 609-0019-5 YES (5.5) C L (0.93) (1.78) 1 (11) #8(DAT1) #7(DAT0) #6(VSS) #5(CLK) #1(DAT2) #2(CD/DAT3) #3(CMD) All dimensions: mm #4(VDD) Recommended PCB mounting pattern 1.2 1.2 0.55MIN 1.65 Note 4.1MIN 3.5MAX 3 3 2.6 3 1 7.8MAX 12.4 12.9 ( 14.1 ) 14.4 10.1MIN 9.5MAX CL 0.7 P=1.1 1 CL indicates the center line of the microSD card slot. 2 3 ( 3.2 ) 7.7 9.3 1 2.6 12.9 7.8MAX 5.4MIN 1.4 2.9MAX (13.8 ) 8.25MIN 6.3 1.4 2.7 2.7 Card detection switch Without the card Card inserted Open Closed GND(1) GND(1) GND(2) GND(2) GND(3) GND(3) GND(4) GND(4) No conductive traces. All dimensions: mm 2.8 1.5 Example of Use applications DM3C-SF (shown open for card insertion) DM3C-SF (shown closed, with card inserted) Portable device 7 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, Card or will beConnectors discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Packaging Specifications Embossed carrier tape dimensions (1,300pieces per reel) O1 Unreeling direction 20 ( 3.4 ) 32 28.4 14.2 .5 1.75 P= 4 2 All dimensions: mm Reel Dimensions End section Mounting section O80 Blank section (160mm min.) Embossed carrier tape 8 Lead section (400mm min.) 32.4 O380 Unreeling direction Blank section (100mm min.) Top cover tape The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Card Connectors DM3D, Push-Pull (no ejection mechanism), Top board mounting (Standard) 11.95 1.55 CL No. RoHS DM3D-SF 609-0025-8 YES 2.7 0.9 (15) 11.45 ( 15.8 ):Card fully inserted 11.45 9.65 3.35 1 Part number ( 6) (0.7) CL (4.5) (5.5) Outline of the microSD card, fully inserted 1 (11) #8(DAT1) #7(DAT0) #6(VSS) #5(CLK) #1(DAT2) #2(CD/DAT3) #3(CMD) #4(VDD) All dimensions: mm Recommended PCB mounting pattern 8.1MIN 5.05 MIN 2.55 MAX 1 3 1 0.4MIN 1.4 7.5 9.15 10.7 0.8 2 CL indicates the center line of the microSD card slot. Card detection switch Without the card Card inserted Open 1.5 0.8 ( 4.5 ) 1 Closed 1.5 10.2MIN 8.35 8.2MAX 6.85 1.5 6MIN 4MAX Note 1.85 1 (A) 1.75 0.55 CL 1.1 7.7 9.4 10.9 3 (B) (A) (B) No conductive traces. All dimensions: mm Example of applications DM3D-SF Portable device 9 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, Card or will beConnectors discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Packaging Specifications 2 P= 4 16 Unreeling direction 24 22.25 (11.85 ) 11.5 .5 O1 1.75 Embossed carrier tape dimensions (2,000pieces per reel) All dimensions: mm Reel Dimensions Lead section (400mm min.) End section 24.4 Blank section (160mm min.) Mounting section Embossed carrier tape 10 Blank section (100mm min.) O380 O80 Unreeling direction Top cover tape The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DM3 SeriesmicroSDTM Card Connectors Recommended temperature profile (c) Peak:250c MAX 250 230c min. 50 seconds Temperature 200 200c 150 Soldering 150c 90 to 120 seconds Preheating 100 HRS test condition Solder method :Reflow, IR/hot air Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-GRN360-K2-V) Test board :Glass epoxy 60mm100mm1.0mm thick Metal mask :0.12mm thick 50 The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Time (Seconds) Precautions 1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the ejection mechanism and electrical performance of the connector 2. Do not apply excessive force to the connector when handling or after installation on the PC board. 3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards. Follow the correct insertion / ejection procedure for the specific connector in use. Attempts of incorrect insertion of the card may cause damage to the connector or the card. 4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in the un-mounted connector. 5. Mounting on the Flexible Printed Circuit (FPC) To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under the FPC. 6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance. 7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on the connector performance. Refer to applicable Operation Manual listed below for additional precautions. Series Operation Manual Number DM3AT Series ETAD-F0345 DM3B Series ETAD-F0324 DM3C Series ETAD-F0335 DM3D Series ETAD-F0353 11