1
2008.2
microSD™ Card Connectors
DM3 Series
NEW
■Features
◆Common to the entire Series
1. Extremely small size
Small external dimensions and the above-the-board height
make the connectors the smallest on the market.
2. Reverse card insertion protection
Unique card slot design (patent pending) protects the
connector from damage when the card is attempted to be
inserted in reverse, allowing it to re-inserted correctly.
3. Effective ground and shield configuration
4-connection points of the metal cover to the printed circuit
board assures secure connection of the ground circuit and
provides EMI protection.
4. Rigid and strong construction
Despite its small size, high-strengths materials used in the
connectors produced a strong and rigid structure.
5. Card detection switch
The card detection switch is Normally Open
6. RoHS compliant
All components and materials comply with the requirements
of the EU Directive 2002/95/EC
◆DM3AT and DM3B (Push - Push, with
ejection mechanism)
·
Card fall-out prevention
Built-in card tray and the unique push insertion-push ejection
mechanism (patent pending) prevent accidental card ejection or
fall-out.
Despite its small size the connectors will eject the card to a
distance of 4.0 mm, allowing easy hold and removal of the card.
·Exposed termination leads
Easy inspection and rework of the solder termination joints.
◆DM3C (Hinge, Push-Pull, manual, without
ejection mechanism)
·Simple and reliable card insertion
Hinged metal cover provides location and guides the card
during the insertion / removal. Closing of the cover confirms
the electrical and mechanical connection with a tactile click
sensation.
·Reliable contact with the card contact pads
Unique contact design and card slide action will clean the
contact areas of the card.
·
Accessible termination areas
Contact solder terminations may be inspected and reworked.
◆DM3D (Push -Pull, manual, without
ejection mechanism)
·Partial card insertion hold
Card will not fall-out even when it is not fully inserted. Full
insertion and electrical / mechanical connection is confirmed
with a distinct tactile feel.
·
Accessible termination areas
An inner lead system that can be reworked is used in this design.
Contact solder terminations may be inspected and reworked.
■Applications
Mobile phone terminals, digital cameras, PDA's, miniature
information terminals and any other portable device
requiring use of small size high reliability microSD memory
card connectors. etc.
Card insertion-ejection
Push-Push
Hinge-manual
insertion/
ejection
Push-Pull
manual insertion/
ejection
DM3AT
DM3B
DM3C
DM3D
2~4
5~7
8~10
11~13
Series Image Page
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DM3 Series●microSD™ Card Connectors
2
DM3 AT – SF – PEJ
■Specifications(DM3 Series)
Ratings
Current rating: 0.5A
Voltage rating: 125V AC
Operating temperature range: -25ç to +85ç (Note 1)
Storage temperature range : -40ç to +85ç (Note 2)
Operating humidity range: RH 95% max.
(No condensation)
■Ordering information
1 42 3
Measure at 500 V DC
500 V AC / 1 minute
1mA
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
3 directions for 2 hours
96 hours at of 40 ± 2ç, and humidity of 90 to 95%
-55ç ➝5 to 35ç ➝85ç ➝5 to 35ç
Times: 30 min. ➝5 min. ➝30 min. ➝5 min.
5 cycles
10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B)
5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D)
Reflow : At the recommended temperature profile
Manual soldering : 350ç for 3 seconds
1000 Mø min. (Initial value)
No flashover or insulation breakdown
100mø max. (Initial value)
No electrical discontinuity of 100 ns or longer
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
Insulation resistance: 100 Mø min.
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
Insulation resistance: 100 Mø min.
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
No deformation of components affecting performance.
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
5. Humidity
6. Temperature cycle
7. Durability
8. Resistance to
soldering heat
Item Specification Conditions
Note 1: Includes temperature rise caused by current flow.
Note 2. The term "storage" refers to products stored for long period prior to mounting and use.
Series name: DM3
Connector type :
AT Push-Push (ejection mechanism), Top board mounting (Standard)
B Push-Push (ejection mechanism), Bottom board mounting (Reverse)
C Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard)
D Push-Pull (no ejection mechanism), Top board mounting (Standard)
Number of contacts : 8
Termination type :
SF Right-angle SMT(Standard)
DSF Right-angle SMT(Reverse)
Card ejection code : PEJ
(Push insert/push eject)
None : Manual card
insertion/ejection
1
4
2
3
■Materials and Finishes
Remarks
UL94V-0
-------------------
-------------------
-------------------
Part Material Finish
Insulator
Contacts
Guide cover
Other components
LCP
Copper alloy
Stainless steel (DM3AT)
Copper alloy (DM3B)
Stainless steel
Piano wire
Color: Black
Contact area: Gold plated
Lead area: Gold plated
Lead area: Gold plated
-------------------
Nickel plated
DM3AT, DM3B
Remarks
UL94V-0
-------------------
-------------------
Part Material Finish
Insulator
Contacts
Guide cover
LCP
Copper alloy
Stainless steel
Color: Black
Contact area: Gold plated
Lead area: Gold plated
Tin plated
DM3C, DM3D
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
3
DM3 Series●microSD™ Card Connectors
● Example of applications
DM3AT-SF-PEJ
Portable device
■Recommended PCB mounting pattern
8.2 MAX
8.65
1.3
15.1
0.15
14.1MAX
2.7
0.8
2.8
1
1.9
( 3.2 )
3.259.1
9.25 MAX
MIN
7.7 1.55
P=1.1
0.7 1
1.2
14.5
0.15MIN
1.2
3.7
9.9
14.05
7.9MIN
0.7
13.3MIN
0.15MIN
8.2MIN
4.4MAX
6MIN
5.7MAX
8.9 MIN
3
3
3
1
C
10
L
C
C
L
indicates the center line of the
microSD card slot.
No conductive traces.
Card inserted
Card detection switch
Without the card
Open Closed
(A) (B) (A) (B)
1
3
2
Note
All dimensions: mm
■DM3AT Push-Push (ejection mechanism), Top board mounting (Standard)
Part number CL No. RoHS
DM3AT-SF-PEJ 609-0023-2 YES
( 3.2 )
( 7.35 )
#1(DAT2)
#2(CD/DAT3)
#3(CMD)
#4(VDD)
#5(CLK)
#6(VSS)
#7(DAT0)
#8(DAT1)
13.85
2.9±0.15
( 15 )
( 0.8 )
(16.75): Card pushed-in for ejection
(17:55): Card fully inserted
(21.55): Card ejected
15.95
( 11 )
( 5.5 )
1.68
15.95
1
L
C
Outline of
the microSD card
All dimensions: mm
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DM3 Series●microSD™ Card Connectors
4
■Packaging Specifications
( 3.2 )
32
28.4
P=4
2
1.75
Ø1.5
20
14.2
( 16.35
)
Unreeling direction
● Embossed carrier tape dimensions (1,500 pieces per reel)
● Reel Dimensions
Top cover tape
Embossed carrier tape
End section Mounting section Lead section (400mm min.)
Blank section
(100mm min.)
Blank section
(160mm min.)
32.4
Ø380
Ø80
Unreeling direction
All dimensions: mm
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
5
DM3 Series●microSD™ Card Connectors
● Example of applications
■DM3B, Push-Push (ejection mechanism), Bottom board mounting (Reverse)
Part number CL No. RoHS
DM3B-DSF-PEJ 609-0018-2 YES
15.45
15.1
(15)
15.95
13.85
(6.5) 0.4
1.83
(0.55)
#8(DAT1)#1(DAT2)
#7(DAT0)
#2(CO/DAT3)
#6(VSS)
#5(CLK)#4(VDD)
#3(CMO)
(5.5)
(11)
16.05
(16.75): Card pushed-in for ejection
(17:55): Card fully inserted
(21.55): Card ejected
1
Outline of
the microSD card
■Recommended PCB mounting pattern
10MIN
9.25MAX
8.65
7.7
1.9
1±0.05 P=1.1
0.7
0.7
1.28.9
0.5
3.05
1.5 (3.2)
0.2
0.35MIN
3.5
7.7MIN
9.7
0.8
3.2
1.9
13.3
14.3
C0.15
14.75 1.4
1.2
1
3
C
L
indicates the center line of the
microSD card slot.
No conductive traces.
Card inserted
Card detection switch
Without the card
Open Closed
(A) (B) (A) (B)
1
3
2
Note
All dimensions: mm
All dimensions: mm
DM3B-DSF-PEJ
Portable device
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DM3 Series●microSD™ Card Connectors
6
Top cover tape
Embossed carrier tape
End section Mounting section Lead section (400mm min.)
Blank section
(100mm min.)
Blank section
(160mm min.)
Ø80
Ø380
32.4
Unreeling direction
■Packaging Specifications
32
28.4
(16.35)
14.2 1.75
Ø1.5
P=4
2
20 Unreeling direction
(3.75)
● Embossed carrier tape dimensions (1,200pieces per reel)
● Reel Dimensions
All dimensions: mm
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
7
DM3 Series●microSD™ Card Connectors
■Recommended PCB mounting pattern
( )3.2
1.4
6.3 1.65
2.7 2.7 1.2
14.4
12.9
2.6
12.9
2.6
2.89.31 1.5
1.2
1.4
0.7
P=1.1
7.7
9.5MAX
10.1MIN
3.5MAX
4.1MIN
L
C
12.4
( 14.1 )
( 13.8 )
2.9MAX
8.25MIN 0.55MIN
7.8MAX
7.8MAX
5.4MIN
33
3
1
● Example of Use applications
■
DM3C, Hinge, Push -Pull (no ejection mechanism), Top board mounting (Standard)
Part number CL No. RoHS
DM3C-SF 609-0019-5 YES
( 1.78 )
( 0.93 )
C
L
12
0.1
( 0.2 )
13.9
( 15.45 ):Card fully inserted
14.1
13.8
( 11 )
( 5.5 )
( 6.9 )
1.83
#1(DAT2)
#2(CD/DAT3)
#3(CMD)
#4(VDD)
#5(CLK)
#6(VSS)
#7(DAT0)
#8(DAT1)
1
Outline of
the microSD card
All dimensions: mm
All dimensions: mm
DM3C-SF (shown open for
card insertion)
DM3C-SF (shown closed,
with card inserted)
Portable device
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
8
DM3 Series●microSD™ Card Connectors
Top cover tape
Embossed carrier tape
End section Mounting section Lead section (400mm min.)
Blank section
(100mm min.)
Blank section
(160mm min.)
Ø80
Ø380
32.4
Unreeling direction
■Packaging Specifications
32
28.4
P=4
2
1.75
Ø1.5
20
14.2
Unreeling direction
( 3.4
)
● Embossed carrier tape dimensions (1,300pieces per reel)
● Reel Dimensions
All dimensions: mm
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
9
DM3 Series●microSD™ Card Connectors
● Example of applications
■Recommended PCB mounting pattern
1.5
1.75
1.5
1.1
7.7
7.5
9.15
10.7
6.85
1.5
8.35
1
0.55
9.4
10.9
0.8
0.8
8.1MIN
1
1.85
0.4MIN 2.55 MAX
( 4.5 )
5.05MIN
4MAX
6MIN
8.2MAX
10.2MIN
1.4
3
C
L1
C
L
indicates the center line of the
microSD card slot.
No conductive traces.
Card inserted
Card detection switch
Without the card
Open Closed
(A) (B) (A) (B)
1
3
2
Note
■DM3D, Push-Pull (no ejection mechanism), Top board mounting (Standard)
Part number CL No. RoHS
DM3D-SF 609-0025-8 YES
9.65
( 0.7 )
( 15 )
( 5.5 )
3.35
11.95
11.45
11.45
1.55
2.7
#8(DAT1)
#7(DAT0)
#6(VSS)
#5(CLK) #4(VDD)
#3(CMD)
#2(CD/DAT3)
#1(DAT2)
( 11 )
( 6 )
( 4.5 )
0.9
1
( 15.8 ):Card fully inserted
C
L1
Outline of the
microSD card,
fully inserted
All dimensions: mm
All dimensions: mm
DM3D-SF
Portable device
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DM3 Series●microSD™ Card Connectors
10
Lead section (400mm min.)
Mounting section
End section
Top cover tape
Blank section
(100mm min.)
Embossed carrier tape
Blank section
(160mm min.)
24.4
Ø380
Ø80
Unreeling direction
■Packaging Specifications
Unreeling direction
2
24
22.25
11.5 1.75
Ø1.5
16
( 11.85 )
P=4
● Embossed carrier tape dimensions (2,000pieces per reel)
● Reel Dimensions
All dimensions: mm
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
11
DM3 Series●microSD™ Card Connectors
● Refer to applicable Operation Manual listed below for additional precautions.
Series
DM3AT Series
DM3B Series
DM3C Series
DM3D Series
ETAD-F0345
ETAD-F0324
ETAD-F0335
ETAD-F0353
Operation Manual Number
■Recommended temperature profile
■Precautions
1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the
ejection mechanism and electrical performance of the connector
2. Do not apply excessive force to the connector when handling or after installation on the PC board.
3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards.
Follow the correct insertion / ejection procedure for the specific connector in use.
Attempts of incorrect insertion of the card may cause damage to the connector or the card.
4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in
the un-mounted connector.
5. Mounting on the Flexible Printed Circuit (FPC)
To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under
the FPC.
6.
Small visible residual manufacturing fluids or tooling marks do not affect connector's performance.
7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on
the connector performance.
HRS test condition
Solder method :Reflow, IR/hot air
Environment :Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-GRN360-K2-V)
Test board :Glass epoxy 60mm∞100mm∞1.0mm thick
Metal mask :0.12mm thick
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
Temperature
50
90 to 120 seconds
Preheating
50
seconds
Soldering
Time (Seconds)
(ç)
100
150
200
250
150ç
200ç
230ç min.
Peak:250ç MAX
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.