1N5711WS
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
• Low Forward Voltage Drop
• Guard Ring Construction for Transient Protection
• Fast Switching Speed
• Low Capacitance
• Surface Mount Package Ideally Suited for Automated Insertion
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
Mechanical Data
• Case: SOD-323
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: Cathode Band
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.004 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 70 V
RMS Reverse Voltage VR(RMS) 49 V
Forward Continuous Current IFM 15 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) PD 150 mW
Thermal Resistance, Junction to Ambient Air (Note 1) RθJA 650 °C/W
Operating Temperature Range TJ -55 to +125 °C
Storage Temperature Range TSTG -55 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Breakdown Voltage (Note 2) V(BR)R 70 ⎯ ⎯ V IR = 10μA
Reverse Leakage Current (Note 2) IR ⎯ ⎯ 200 nA VR = 50V
Forward Voltage Drop VF ⎯ ⎯ 0.41
1.00 V IF = 1.0mA
IF = 15mA
Total Capacitance CT ⎯ ⎯ 2.0 pF VR = 0V, f = 1.0MHz
Reverse Recovery Time trr ⎯ ⎯ 1.0 ns IF = IR = 5.0mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
1N5711WS
Document number: DS31033 Rev. 12 - 2 1 of 3
www.diodes.com July 2008
© Diodes Incorporated