Datasheet Operational Amplifiers Ultra Low Power CMOS Operational Amplifiers BU7265G BU7265SG BU7266xxx BU7266Sxxx General Description Key Specifications Supply Voltage Range(single supply): +1.8V to +5.5V Supply Current: BU7265/BU7265SG 0.35A(Typ) BU7266xxx/BU7266Sxxx t0.7A(Typ) Temperature Range: BU7265G/BU7466xxx ttt-40C to +85C BU7265SG/BU7266Sxxx -40C to +105C Input Offset Current: 1pA (Typ) Input Bias Current: 1pA (Typ) The BU7265G/BU7266xxx are ultra low supply current input output full swing CMOS operational amplifiers. The BU7265SG/BU7266Sxxx have an extended operating temperature range. They have low operating supply voltage and low input bias current. There are suitable for portable equipment and sensor amplifiers. Features Ultra Low Supply Current Low Operating Supply Voltage Wide operating temperature Range (BU7265SG/BU7266Sxxx) Low Input Bias Current Packages SSOP5 SOP8 SSOP-B8 MSOP8 Applications Battery-powered Equipment Portable Equipment Consumer Equipment Sensor Amplifiers jW(Typ) x D(Typ) x H(Max) M-B2.90mm x 2.80mm x 1.25mm jMS-jj5.00mm x 6.20mm x 1.71mm 5M3.00mm x 6.40mm x 1.35mm -5SB2.90mm x 4.00mm x 0.90mm Simplified Schematic VDD Vbias IN+ Class AB control OUT IN- Vbias VSS Figure 1. Simplified Schematic Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211114001 This product has no designed protection against radioactive rays. 1/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Pin Configuration BU7265G, BU7265SG: SSOP5 IN+ 1 5 VDD Pin Name 1 IN+ 2 VSS + - VSS 2 3 IN- 4 OUT 5 VDD Pin No. Pin Name 1 OUT1 2 IN1- 3 IN1+ 4 OUT 3 IN- Pin No. BU7266F, BU7266SF: SOP8 BU7266FV, BU7266SFV: SSOP-B8 BU7266FVM, BU7266SFVM: MSOP8 VCC 8 VDD OUT1 1 CH1 -IN1 IN1- 2 7 OUT2 OUT2 - + +IN1 IN1+ 3 -IN2 6 IN2- CH2 + - VEE VSS +IN2 5 IN2+ 4 4 VSS 5 IN2+ 6 IN2- 7 OUT2 8 VDD Package SSOP5 SOP8 SSOP-B8 MSOP8 BU7265G BU7265SG BU7266F BU7266SF BU7266FV BU7266SFV BU7266FVM BU7266SFVM Ordering Information B U 7 2 6 x x x x x - Packaging and forming specification E2: Embossed tape and reel (SOP8/SSOP-B8) TR: Embossed tape and reel (SSOP5/MSOP8) Package G : SSOP5 F : SOP8 FV : SSOP-B8 FVM : MSOP8 Part Number BU7265G BU7265SG BU7266xxx BU7266Sxxx xx Line-up Topr Channels 1ch -40C to +85C 2ch 1ch -40C to +105C 2ch www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Package Orderable Part Number SSOP5 Reel of 3000 BU7265G-TR SOP8 Reel of 2500 BU7266F-E2 SSOP-B8 Reel of 2500 BU7266FV-E2 MSOP8 Reel of 3000 BU7266FVM-TR SSOP5 Reel of 3000 BU7265SG-TR SOP8 Reel of 2500 BU7266SF-E2 SSOP-B8 Reel of 2500 BU7266SFV-E2 MSOP8 Reel of 3000 BU7266SFVM-TR 2/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Absolute Maximum Ratings (TA=25) Symbol Parameter Supply Voltage Power Dissipation Rating BU7265SG BU7266Sxxx - 0.54 (Note 1,5) - - 0.55 (Note 2,5) - 0.55 (Note 2,5) SSOP-B8 - 0.50 (Note 3,5) - 0.50 (Note 3,5) MSOP8 - 0.47 (Note 4,5) - 0.47 (Note 4,5) BU7265G BU7266xxx SSOP5 0.54 (Note 1,5) SOP8 VDD-VSS PD +7 Unit V W Differential Input Voltage(Note 6) Input Common-mode Voltage Range Input Current (Note 7) VID VDD - VSS V VICM (VSS - 0.3) to VDD + 0.3 V II 10 mA Operating Supply Voltage Vopr +1.8 to +5.5 V Operating Temperature Topr Storage Temperature Maximum Junction Temperature Tstg -55 to +125 C TJmax +125 C -40 to +85 -40 to +105 C (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) To use at temperature above TA=25C reduce 5.4mW/C. To use at temperature above TA=25C reduce 5.5mW/C. To use at temperature above TA=25C reduce 5.0mW/C. To use at temperature above TA=25C reduce 4.7mW/C. Mounted on a FR4 glass epoxy PCB 70mmx70mmx1.6mm (Copper foil area less than 3%). The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. (Note 7) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Electrical Characteristics BU7265G, BU7265SGUnless otherwise specified VDD=+3V, VSS=0V, TA=25C Limit Temperature Parameter Symbol Range Min Typ Max Unit Conditions Input Offset Voltage (Note 8) VIO 25C - 1 8.5 mV Input Offset Current (Note 8) IIO 25C - 1 - pA - Input Bias Current (Note 8) IB 25C - 1 - pA - Supply Current (Note 9) IDD Maximum Output Voltage (High) 25C - 0.35 0.9 Full range - - 1.3 VOH 25C VDD-0.1 - Maximum Output Voltage (Low) VOL 25C - Large Signal Voltage Gain AV 25C VICM Common-mode Rejection Ratio VDD=1.8V to 5.5V A RL=, AV=0dB IN+ =1.5V - V RL=10k - VSS+0.1 V RL=10k 60 95 - dB RL=10k 25C 0 - 3 V VSS to VDD CMRR 25C 45 60 - dB - Power Supply Rejection Ratio PSRR 25C 60 80 - dB - Output Source Current (Note 10) ISOURCE 25C 1 2.4 - mA OUT=VDD-0.4V Output Sink Current (Note 10) ISINK 25C 2 4 - mA OUT=VSS+0.4V Slew Rate SR 25C - 2.4 - V/ms CL=25pF Unity Gain Frequency fT 25C - 4 - kHz CL=25pF, AV=40dB Phase Margin 25C - 60 - deg CL=25pF, AV=40dB Input Common-mode Voltage Range (Note 8) Absolute value (Note 9) Full range BU7265: TA=-40C to +85C BU7265S: TA=-40C to +105C (Note 10) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Electrical Characteristics - continued BU7266xxx, BU7266SxxxUnless otherwise specified VDD=+3V, VSS=0V, TA=25C Limit Temperature Parameter Symbol Unit Range Min Typ Max Conditions Input Offset Voltage (Note 11) VIO 25C - 1 8.5 mV Input Offset Current (Note 11) IIO 25C - 1 - pA - Input Bias Current (Note 11) IB 25C - 1 - pA - Supply Current (Note 12) IDD 25C - 0.7 1.55 Full range - - 2.1 Maximum Output Voltage (High) VOH 25C VDD-0.1 - Maximum Output Voltage (Low) VOL 25C - Large Signal Voltage Gain AV 25C VICM Common-mode Rejection Ratio VDD=1.8V to 5.5V A RL=, All Op-Amps AV=0dB, IN+=1.5V - V RL=10k - VSS+0.1 V RL=10k 60 95 - dB RL=10k 25C 0 - 3 V VSS to VDD CMRR 25C 45 60 - dB - Power Supply Rejection Ratio PSRR 25C 60 80 - dB - Output Source Current (Note 13) ISOURCE 25C 1 2.4 - mA OUT=VDD-0.4V Output Sink Current (Note 13) ISINK 25C 2 4 - mA OUT=VSS+0.4V Slew Rate SR 25C - 2.4 - V/ms CL=25pF Unity Gain Frequency fT 25C - 4 - kHz CL=25pF, AV=40dB Phase Margin 25C - 60 - deg CL=25pF, AV=40dB CS 25 - 100 - dB AV=40dB, OUT=1Vrms Input Common-mode Voltage Range Channel Separation (Note 11) Absolute value (Note 12) Full range BU7266: TA=-40C to +85C BU7266S: TA=-40C to +105C (Note 13) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx BU7266Sxxx Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer's document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25 (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. (5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (6) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) (7) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (8) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) (9) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) (10) Output Source Current/ Output Sink Current (ISOURCE / ISINK) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (11) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) Unity Gain Frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. (13) Phase Margin () Indicates the margin of phase from 180 degree phase lag at unity gain frequency. (14) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves 0.8 0.8 0.6 0.6 Power Dissipation [W] . Power Dissipation [W] BU7265G, BU7265SG BU7265G 0.4 0.2 0 0 25 BU7265SG 0.4 0.2 0.0 85 50 75 100 Ambient Temperature [C] 125 105 0 25 50 75 100 Ambient Temperature [] 125 Figure 3. Power Dissipation vs Ambient Temperature (Derating Curve) Figure 2. Power Dissipation vs Ambient Temperature (Derating Curve) 0.8 0.8 5.5V 105 0.6 85 Supply Current [A] Supply Current [A] 0.6 0.4 25 -40 0.2 3.0V 0.4 1.8V 0.2 0 1 2 3 4 Supply Voltage [V] 5 0 6 -50 -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 5. Supply Current vs Ambient Temperature Figure 4. Supply Current vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7265G: -40C to +85C BU7265SG: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued BU7265G, BU7265SG 6 Maximum Output Voltage (High) [V] Maximum Output Voltage (High) [V] 6 5 4 105 85 25 3 -40 2 1 4 3.0V 3 1.8V 2 1 0 0 1 2 3 4 Supply Voltage [V] 5 -50 6 Figure 6. Maximum Output Voltage (High) vs Supply Voltage (RL=10k) -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 7. Maximum Output Voltage (High) vs Ambient Temperature (RL=10k) 20 Maximum Output Voltage (Low) [mV] 20 Maximum Output Voltage (Low) [mV] 5.5V 5 105 85 15 10 25 -40 5 15 10 0 1 2 3 4 Supply Voltage [V] 5 5.5V 3.0V 1.8V 5 0 -50 6 Figure 8. Maximum Output Voltage (Low) vs Supply Voltage (RL=10k) -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 9. Maximum Output Voltage (Low) vs Ambient Temperature (RL=10k) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7265G: -40C to +85C BU7265SG: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued BU7265G, BU7265SG 10 10 -40 Output Source Current [mA] Output Source Current [mA] 8 25 6 85 105 4 8 6 5.5V 4 3.0V 2 2 1.8V 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 Figure 10. Output Source Current vs Output Voltage (VDD=3 V) -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 11. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) 20 20 15 Output Sink Current [mA] Output Sink Current [mA] -40 25 85 10 105 5 15 10 5.5V 3.0V 5 1.8V 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 Figure 12. Output Sink Current vs Output Voltage (VDD=3V) -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 13. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7265G: -40C to +85C BU7265SG: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued BU7265G, BU7265SG 7.5 7.5 5.0 5.0 Input Offset Voltage [mV] 10.0 Input Offset Voltage [mV] 10.0 2.5 -40 25 0.0 85 105 -2.5 -5.0 -7.5 2.5 5.5V 0.0 3.0V 1.8V -2.5 -5.0 -7.5 -10.0 -10.0 1 2 3 4 Supply Voltage [V] 5 6 -50 -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 15. Input Offset Voltage vs Ambient Temperature (VICM=VDD, EK=-VDD/2) Figure 14. Input Offset Voltage vs Supply Voltage (VICM=VDD, EK=-VDD/2) 10.0 160 Large Signal Voltage Gain [dB] Input Offset Voltage [mV] 7.5 5.0 2.5 25 -40 0.0 105 85 -2.5 -5.0 105 140 85 120 25 -40 100 80 -7.5 -10.0 -1 0 1 2 Input Voltage [V] 3 4 60 1 Figure 16. Input Offset Voltage vs Input Voltage (VDD=3V) 2 3 4 Supply Voltage [V] 5 6 Figure 17. Large Signal Voltage Gain vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7265G: -40C to +85C BU7265SG: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued BU7265G, BU7265SG 120 Common Mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 160 140 5.5V 120 3.0V 100 1.8V 80 -25 0 25 50 75 Ambient Temperature [C] 100 -40 105 80 85 60 40 20 60 -50 25 100 0 125 1 Figure 18. Large Signal Voltage Gain vs Ambient Temperature 2 3 4 Supply Voltage [V] 5 6 Figure 19. Common Mode Rejection Ratio vs Supply Voltage 120 140 Power Supply Rejection Ratio [dB] Common Mode Rejection Ratio [dB] 5.5V 100 3.0V 80 1.8V 60 40 20 120 100 80 60 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [C] 100 0 -50 125 -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 21. Power Supply Rejection Ratio vs Ambient Temperature Figure 20. Common Mode Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7265G: -40C to +85C BU7265SG: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued 5 5 4 4 3 Slew Rate H-L [V/ms] Slew Rate L-H [V/ms] BU7265G, BU7265SG 5.5V 3.0V 2 1.8V 3 5.5V 2 3.0V 1.8V 1 1 0 0 -50 -25 0 25 50 75 Ambient Temperature [C] 100 125 -50 0 25 50 75 Ambient Temperature [C] 100 125 Figure 23. Slew Rate H-L vs Ambient Temperature Figure 22. Slew Rate L-H vs Ambient Temperature 100 -25 200 Phase 80 60 100 Gain 40 Phase [deg] Voltage Gain[dB] 150 50 20 0 0 2 3 4 5 6 1 10 10 10 10 10 10 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 Frequency [Hz] Figure 24. Voltage GainPhase vs Frequency (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7265G: -40C to +85C BU7265SG: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued BU7266xxx, BU7266Sxxx 0.8 0.8 0.6 BU7266F Power Dissipation [W] Power Dissipation [W] 0.6 BU7266FV 0.4 BU7266FVM BU7266SF BU7266SFV 0.4 BU7266SFVM 0.2 0.2 0.0 0.0 85 0 25 50 75 100 Ambient Temperature [C] 105 0 125 Figure 25. Power Dissipation vs Ambient Temperature (Derating Curve) 25 50 75 100 Ambient Temperature [C] 125 Figure 26. Power Dissipation vs Ambient Temperature (Derating Curve) 1.2 1.2 105 1.0 1.0 5.5V Supply Current [A] Supply Current [A] 85 0.8 0.6 25 0.4 -40 0.8 3.0V 0.6 1.8V 0.4 0.2 0.2 0.0 0.0 0 1 2 3 4 Supply Voltage [V] 5 -50 6 Figure 27. Supply Current vs Supply Voltage -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 28. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued BU7266xxx, BU7266Sxxx 6 Maximum Output Voltage (High) [V] Maximum Output Voltage (High) [V] 6 5 4 105 85 25 3 -40 2 1 4 3.0V 3 1.8V 2 1 0 0 1 2 3 4 Supply Voltage [V] 5 6 -50 Figure 29. Maximum Output Voltage (High) vs Supply Voltage (RL=10k) 30 30 25 25 20 105 85 15 10 25 2 3 4 Supply Voltage [V] 100 125 5.5V 15 3.0V 10 1.8V 5 0 -50 0 1 0 25 50 75 Ambient Temperature [C] 20 -40 5 -25 Figure 30. Maximum Output Voltage High vs Ambient Temperature (RL=10k) Output Voltage Low [mV] Maximum Output Voltage (Low) [mV] 5.5V 5 5 6 Figure 31. Maximum Output Voltage (Low) vs Supply Voltage (RL=10k) -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 32. Maximum Output Voltage (Low) vs Ambient Temperature (RL=10k) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued BU7266xxx, BU7266Sxxx 10 10 8 25 8 Output Source Current [mA] Output Source Current [mA] -40 6 85 105 4 6 5.5V 4 3.0V 2 2 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 1.8V -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 34. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) Figure 33. Output Source Current vs Output Voltage (VDD=3 V) 20 20 -40 Output Sink Current [mA] Output Sink Current [mA] 15 25 10 85 105 5 15 10 5.5V 3.0V 5 1.8V 0 0.0 0.5 1.0 1.5 2.0 Output Voltage[V] 2.5 0 -50 3.0 Figure 35. Output Sink Current vs Output Voltage (VDD=3V) -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 36. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued 10.0 10.0 7.5 7.5 5.0 5.0 Input Offset Voltage [mV] Input Offset Voltage [mV] BU7266xxx, BU7266Sxxx 2.5 -40 0.0 25 -2.5 105 85 -5.0 5.5V 2.5 3.0V 0.0 1.8V -2.5 -5.0 -7.5 -7.5 -10.0 -10.0 1 2 3 4 Supply Voltage [V] 5 -50 6 Figure 37. Input Offset Voltage vs Supply Voltage (VICM=VDD, EK=-VDD/2) -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 38. Input Offset Voltage vs Ambient Temperature (VICM=VDD, EK=-VDD/2) 10.0 140 7.5 Large Signal Voltage Gain [dB] Input Offset Voltage [mV] 120 5.0 2.5 105 0.0 85 25 -2.5 -40 -5.0 100 105 85 80 40 25 60 40 -7.5 -10.0 20 -1 0 1 2 Input Voltage [V] 3 1 4 Figure 39. Input Offset Voltage vs Input Voltage (VDD=3V) 2 3 4 Supply Voltage [V] 5 6 Figure 40. Large Signal Voltage Gain vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued BU7266xxx, BU7266Sxxx 120 Common Mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 140 120 100 5.5V 80 1.8V 3.0V 60 40 100 85 80 25 60 -40 40 20 20 0 -50 -25 0 25 50 75 Ambient Temperature [C] 100 125 1 Figure 41. Large Signal Voltage Gain vs Ambient Temperature 2 3 4 Supply Voltage [V] 5 6 Figure 42. Common Mode Rejection Ratio vs Supply Voltage (VDD=3V) 140 120 100 Power Supply Rejection Ratio [dB] Common Mode Rejection Ratio [dB] 105 5.5V 80 1.8V 60 3.0V 40 20 120 100 80 60 40 20 0 -50 0 -50 -25 0 25 50 75 Ambient Temperature [C] 100 125 -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 44. Power Supply Rejection Ratio vs Ambient Temperature Figure 43. Common Mode Rejection Ratio vs Ambient Temperature (VDD=3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Typical Performance Curves - continued 8 8 6 6 4 Slew Rate H-L [V/ms] Slew Rate L-H [V/ms] BU7266xxx, BU7266Sxxx 5.5V 2 1.8V 3.0V 0 4 2 -2 -4 -4 -25 0 25 50 75 Ambient Temperature [C] 100 -50 125 Figure 45. Slew Rate L-H vs Ambient Temperature 100 1.8V 3.0V 0 -2 -50 5.5V -25 0 25 50 75 Ambient Temperature [C] 100 125 Figure 46. Slew Rate H-L vs Ambient Temperature 200 Phase 80 60 100 40 Gain Phase [deg] Voltage Gain[dB] 150 50 20 0 0 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 103 104 105 1.E+06 106 1 10 102 Frequency [Hz] Figure 47. Voltage GainPhase vs Frequency (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Application Information NULL method condition for Test circuit1 VDD, VSS, EK, VICM Unit:V Parameter Input Offset Voltage VF S1 S2 S3 VDD VSS EK VICM Calculation VF1 ON ON OFF 3 0 -1.5 3 1 ON ON ON 3 0 1.5 2 ON ON OFF 3 0 -1.5 ON ON OFF 0 -0.9 VF2 Large Signal Voltage Gain VF3 VF4 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF5 VF6 Power Supply Rejection Ratio VF7 1.8 5.5 -0.5 -2.5 0 3 0 3 4 - Calculation |VF1| 1. Input Offset Voltage (VIO) VIO = 2. Large Signal Voltage Gain (AV) Av = 20Log 3. Common-mode Rejection Ratio (CMRR) CMRR= 20Log VICM x (1+RF/RS) |VF4 - VF5| [dB] PSRR = 20Log VDD x (1+ RF/RS) |VF6 - VF7| [dB] 4. Power Supply Rejection Ratio (PSRR) [V] 1+RF/RS EK x (1+RF/RS) |VF2-VF3| [dB] 0.1F RF=50k SW1 RS=50 500k VDD 15V EK RI=1M 0.01F Vo 500k 0.015F 0.015F DUT SW3 RS=50 1000pF RI=1M NULL RL VICM 50k SW2 V VF VRL -15V VSS Figure 48. Test Circuit 1 (One Channel Only) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Application Information - continued Switch Condition for Test circuit2 SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW No. Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Unity Gain Frequency ON ON OFF OFF OFF OFF OFF ON ON ON ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF ON SW3 R2 100k SW4 VDD=3V SW1 SW2 SW5 SW6 SW7 SW8 SW9 RL CL SW10 SW11 SW12 R1 1k VSS IN- IN+ Vo Figure 49. Test Circuit 2 Output Voltage Input Voltage SR = V / t 3.0 V 3.0 V V 3.0 V P-P 0V 0V t t t Input Wave Output Wave Figure 50. Slew Rate Input and Output Wave R2=100k R2=100k VDD VDD R1=1k R1=1k OUT1 VIN OUT2 R1//R2 R1//R2 VSS VSS CS=20Log 100xOUT1 OUT2 Figure 51. Test circuit 3 (Channel Separation) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Examples of Circuit Voltage Follower Voltage gain is 0dB. VDD Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input impedance and low output impedance. Computation for output voltage (OUT) is shown below. OUT IN OUT=IN VSS Figure 52. Voltage Follower Circuit Inverting Amplifier R2 For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression VDD R1 IN OUT OUT=-(R2/R1)IN This circuit has input impedance equal to R1. VSS Figure 53. Inverting Amplifier Circuit Non-inverting Amplifier R1 R2 For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase with the input voltage (IN) and is shown in the next expression. VDD OUT=(1 + R2/R1)IN OUT Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. IN VSS Figure 54. Non-inverting Amplifier Circuit www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol JAC/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 55 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (JA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). JA = (TJmaxTA) / PD C/W The derating curve in Figure 55 (b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (JA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 55(c) to 55(f) shows an example of the derating curve for BU7265G, BU7265SG, BU7266xxx, BU7266Sxxx. Power dissipation of LSI [W] PDmax Power Dissipation of IC JA=(TJmax-TA)/ PD C/W Ambient Temperature TA [ C ] P2 JA2 < JA1 P1 JA2 TJmax JA1 Chip Surface Temperature TJ [ C ] 0 25 50 75 100 125 Ambient Temperature TA[C] (a) Thermal Resistance 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] (b) Derating Curve BU7265G(Note 14) 0.4 0.2 0.0 25 50 75 100 Ambient Temperature [C] 125 0.2 105 0 (c)BU7265G www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0.4 0.0 85 0 BU7265SG(Note 14) 25 50 75 100 Ambient Temperature [C] 125 (d)BU7265SG 22/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] BU7266SF(Note 15) BU7266F(Note 15) BU7266FV(Note 16) 0.4 BU7266FVM(Note 17) 0.2 0.0 0.4 BU7266SFVM(Note 17) 0.2 0.0 85 0 BU7266SFV(Note 16) 25 50 75 100 Ambient Temperature [C] 105 0 125 25 50 75 100 Ambient Temperature [C] (e)BU7266F/FV/FVM 125 (f)BU7266SF/SFV/SFVM (Note 14) (Note 15) (Note 16) (Note 17) Unit 5.4 5.5 5.0 4.7 mW/ When using the unit above TA=25C, subtract the value above per Celsius degree. Power dissipation is the value when FR4 glass epoxy board 70mmx70mmx1.6mm (copper foil area less than 3%) is mounted. Figure 55. Thermal Resistance and Derating Curve www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Operational Notes - continued 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Unused circuits When there are unused op-amps, it is recommended that they are connected as in Figure 58, setting the non-inverting input terminal to a Keep this potential potential within the in-phase input voltage range (VICM). in VICM 14. Input Voltage Applying VDD+0.3V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. VDD VICM VSS Figure 58. Example of Application Circuit for Unused Op-amp 15. Power supply(single/dual) The operational amplifier operates when the voltage supplied is between VDD and VSS. Therefore, the single supply operational amplifiers can be used as dual supply operational amplifiers as well. 16. Output capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1uF between output pin and VSS pin. 17. Oscillation by output capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 18. Latch Up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. 19. Crossorver distortion Inverting amplifier generates crossover distortion when feedback resistance value is small. To suppress the crosover distortion, connect a resistor between the output terminal and VSS. Feedback Resistor VDD Pull-down Resistor VSS Figure 56. To Suppress the Crosover Distortion www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 25/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Marking Diagram SSOP5(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number 1PIN MARK LOT Number SSOP-B8(TOP VIEW) MSOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Package Type Product Name BU7265 BU7265S G F BU7266 FV FVM F BU7266S FV FVM www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 SSOP5 Marking D3 FA SOP8 7266 SSOP-B8 266 MSOP8 SOP8 7266 7266S SSOP-B8 266S MSOP8 7266S 26/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx BU7266Sxxx Datasheet Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 SSOP5 27/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Physical Dimension, Tape and Reel Information - continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 28/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Physical Dimension, Tape and Reel Information - continued Package Name SSOP-B8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 29/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Physical Dimension, Tape and Reel Information - continued Package Name MSOP8 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Order quantity needs to be multiple of the minimum quantity. 30/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Physical Dimension, Tape and Reel Information - continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 31/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Physical Dimension, Tape and Reel Information - continued Package Name SSOP-B14 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 32/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 BU7265G BU7265SG BU7266xxx Datasheet BU7266Sxxx Land Pattern Data All dimensions in mm Land length Land width 2 b2 Land pitch e Land space MIE SSOP5 0.95 2.4 1.0 0.6 SOP8 1.27 4.60 1.10 0.76 SSOP-B8 0.65 4.60 1.20 0.35 MSOP8 0.65 2.62 0.99 0.35 PKG SSOP5 e SOP8, SSOP-B8, MSOP8 e 2 e MIE MIE b2 b2 2 Revision History Date Revision 12.Sep.2013 001 www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Changes New Release 33/33 TSZ02201-0RAR1G200270-1-2 12.Sep.2013 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bu7266sfv - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bu7266sfv SSOP-B8 2500 2500 Taping inquiry Yes