2SD1899-L(AZ) - RENESAS TECHNOLOGY

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TSZ22111･14･001

Datashee

t

Operational Amplifiers

Ultra Low Power

CMOS Operational Amplifiers

BU7265G BU7265SG BU7266xxx BU7266Sxxx

General Description

The BU7265G/BU7266xxx ar e ultra low supply current

input output full swing CMOS operational amplifiers.

The BU7265SG/BU7266Sxxx have an extended

operating temperature range. T hey have low operating

supply voltage and low input bias current. There are

suitable for portable equipment and sensor amplifiers.

Features

 Ultra Low Supply Current

 Low Operating Supply Voltage

 Wide operating temperature R ange

(BU7265SG/BU7266Sxxx)

 Low Input Bias Current

Applications

 Battery-powered Equipment

 Portable Equipment

 Consumer Equipment

 Sensor Amplifiers

Key Specifications

 Supply Voltage Range(single supply):

+1.8V to +5.5V

 Supply Current:

BU7265/BU7265SG 0.35μA(Typ)

BU7266xxx/BU7266Sxxx t0.7μA(Typ)

 Temperature Range:

BU7265G/BU7466xxx ttt-40°C to +85°C

BU7265SG/BU7266Sxxx -40°C to +105°C

 Input Offset Current: 1pA (Typ)

Input Bias Current: 1pA (Typ)

Packages jW(Typ) x D(Typ) x H(Max)

SSOP5 M-B2.90mm x 2.80mm x 1.25mm

SOP8 jMS-jj5.00mm x 6.20mm x 1.71mm

SSOP-B8 5M3.00mm x 6.40mm x 1.35mm

MSOP8 -5SB2.90mm x 4.00mm x 0.90mm

Simplified Schematic

Figure 1. Simplified Schematic

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

IN+

OUT

IN-

VDD

VSS

Vbias

Class

A

B control

Vbias

Datasheet

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TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Pin Configuration

BU7265G, BU7265SG: SSOP5

Pin No. Pin Name

1 IN+

2 VSS

3 IN-

4 OUT

5 VDD

BU7266F, BU7266SF: SOP8

BU7266FV, BU7266SFV: SSOP-B8

BU7266FVM, BU7266SFVM: MSOP8

Pin No. Pin Name

1 OUT1

2 IN1-

3 IN1+

4 VSS

5 IN2+

6 IN2-

7 OUT2

8 VDD

Package

SSOP5 SOP8 SSOP-B8 MSOP8

BU7265G

BU7265SG BU7266F

BU7266SF BU7266FV

BU7266SFV BU7266FVM

BU7266SFVM

Ordering Information

B U 7 2 6 x x x x x - x x

Part Number

BU7265G

BU7265SG

BU7266xxx

BU7266Sxxx

Package

G : SSOP5

F : SOP8

FV : SSOP-B8

FVM : MSOP8

Packaging and forming specific ation

E2: Embossed tape and reel

(SOP8/SSOP-B8)

TR: Embossed tape and reel

(SSOP5/MSOP8)

Line-up

Topr Channels Package Orderable Part Number

-40°C to +85°C

1ch SSOP5 Reel of 3000 BU7265G-TR

2ch SOP8 Reel of 2500 BU7266F-E2

SSOP-B8 Reel of 2500 BU7266FV-E2

MSOP8 Reel of 3000 BU7266FVM-TR

-40°C to +105°C

1ch SSOP5 Reel of 3000 BU7265SG-TR

2ch SOP8 Reel of 2500 BU7266SF-E2

SSOP-B8 Reel of 2500 BU7266SFV-E2

MSOP8 Reel of 3000 BU7266SFVM-T R

34

2

15

+

-

OU

T

IN+

IN-

VSS

VDD

-+

+ -

CH1

CH2

81

2

3

45

6

7

OUT1

-IN1

+IN1

VEE

VCC

OUT2

-IN2

+IN2

VDD

OU

T2

IN2-

IN2+

OU

T1

IN1-

IN1+

V

SS

Datasheet

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TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Absolute Maximum Ratings (TA=25℃)

Parameter Symbol Rating Unit

BU7265G BU7266xxx BU7265SG BU7266Sxxx

Supply Voltage VDD-VSS +7 V

Power Dissip ati on PD

SSOP5 0.54

(Note 1,5) - 0.54

(Note 1,5) -

W

SOP8 - 0.55

(Note 2,5) - 0.55

(Note 2,5)

SSOP-B8 - 0.50

(Note 3,5) - 0.50

(Note 3,5)

MSOP8 - 0.47

(Note 4,5) - 0.47

(Note 4,5)

Differential Input

Voltage(Note 6) VID VDD - VSS V

Input Common-mode

Voltage Range VICM (VSS - 0.3) to VDD + 0.3 V

Input Current (Note 7) I

I ±10 mA

Operating Supply Voltage Vopr +1.8 to +5.5 V

Operating Temperature Topr -40 to +85 -40 to +105 °C

S torage Temperature Tstg -55 to +125 °C

Maximum

Junction Temperature TJmax +125 °C

(Note 1) To use at te m peratur e above TA=25C reduce 5.4mW/°C.

(Note 2) To use at te m peratur e above TA=25C reduce 5.5mW/°C.

(Note 3) To use at te m peratur e above TA=25C reduce 5.0mW/°C.

(Note 4) To use at te m peratur e above TA=25C reduce 4.7mW/°C.

(Note 5) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).

(Note 6) The voltage difference between inverting input and non-inverting input is the differential input voltage.

Then input pin voltage is set to more than VSS.

(Note 7) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied.

The input cu rrent can be set to less than the rated current by adding a limiting resistor.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open

circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case

the IC is operated over the absolute maximum ratings.

Datasheet

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TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Electrical Characteristics

○BU7265G, BU7265SG（Unless otherwise specified VDD=+3V, VSS=0V, TA=25°C）

Parameter Symbol

Temperature

Range

Limit Unit Conditions

Min Typ Max

Input Offset Voltage (Note 8) V

IO 25°C - 1 8.5 mV VDD=1.8V to 5.5V

Input Offset Current (Note 8) I

IO 25°C - 1 - pA -

Input Bias Current (Note 8) I

B 25°C - 1 - pA -

Supply Current (Note 9) I

DD 25°C - 0.35 0.9

μA RL=∞, AV=0dB

IN+ =1.5V

Full range - - 1.3

Maximum Output Voltage (High) VOH 25°C VDD-0.1 - - V RL=10kΩ

Maximum Output Voltage (Low) VOL 25°C - - VSS+0.1 V RL=10kΩ

Large Signal Voltage Gain AV 25°C 60 95 - dB RL=10kΩ

Input Common-mode

Voltage Range VICM 25°C 0 - 3 V VSS to VDD

Common-mode Rejection Ra tio CMRR 25°C 45 60 - dB -

Power Supply Rejection Ratio PSRR 25°C 60 80 - dB -

Output Source Current (Note 10) I

SOURCE 25°C 1 2.4 - mA OUT=VDD-0.4V

Output Sink Current (Note 10) I

SINK 25°C 2 4 - mA OUT=VSS+0.4V

Slew Rate SR 25°C - 2.4 - V/ms CL=25pF

Unity Gain Frequency fT 25°C - 4 - kHz CL=25pF, AV=40dB

Phase Margin θ 25°C - 60 - deg CL=25pF, AV=40dB

(Note 8) Absolute value

(Note 9) Full range BU7265: TA=-40C to +85C BU7265S: TA=-40C to +105C

(Note 10) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.

When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.

Datasheet

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TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Electrical Characteristics - continued

○BU7266xxx, BU7266Sxxx（Unless ot herwise specified VDD=+3V, VSS=0V, TA=25°C）

Parameter Symbol

Temperature

Range

Limit Unit Conditions

Min Typ Max

Input Offset Voltage (Note 11) VIO 25°C - 1 8.5

mV VDD=1.8V to 5.5V

Input Offset Current (Note 11) IIO 25°C - 1 -

pA -

Input Bias Current (Note 11) IB 25°C - 1 -

pA -

Supply Current (Note 12) IDD 25°C - 0.7 1.55

μA RL=∞, All Op-Amp s

AV=0dB, IN+=1.5V

Full range - - 2.1

Maximum Output Voltage (High) VOH 25°C

VDD-0.1 - -

V RL=10kΩ

Maximum Output Voltage (Low) VOL 25°C - - VSS+0.1 V RL=10kΩ

Large Signal Voltage Gain AV 25°C 60 95 - dB RL=10kΩ

Input Common-mode

Voltage Range VICM 25°C 0 - 3

V VSS to VDD

Common-mode Rejection Ra tio CMRR 25°C 45 60 - dB -

Power Supply Rejection R atio PSRR 25°C 60 80 - dB -

Output Source Current (Note 13) ISOURCE 25°C 1 2.4 -

mA OUT=VDD-0.4V

Output Sink Current (Note 13) ISINK 25°C 2 4 -

mA OUT=VSS+0.4V

Slew Rate SR 25°C - 2.4 -

V/ms CL=25pF

Unity Gain Frequency fT 25°C - 4 -

kHz CL=25pF, AV=40dB

Phase Margin θ 25°C - 60 -

deg CL=25pF, AV=40dB

Channel Separation CS 25℃ - 100 -

dB AV=40dB,

OUT=1Vrms

(Note 11) Absolute value

(Note 12) Full range BU7266: TA=-40C to +85C BU7266S: TA=-40C to +105C

(Note 13) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.

When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.

Datasheet

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TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Description of Electrical Characteristics

Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also

shown. Note that item name and symbol and their meaning may differ from those on another manufacturer ’s document or

general document.

1. Absolute maximum ratings

Absolute maximum rating ite ms indicate the condition which must not be exceeded. Application of voltage in excess of absolute

maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.

(1) Supply Voltage (VDD/VSS)

Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without

deterioration or destruction of characteristics of internal circuit.

(2) Differential Input Voltage (VID)

Indicates the maximum voltage that can be applied bet ween non-inverting and inverting terminals without damaging

the IC.

(3) Input Common-mode Voltage Range (VICM)

Indicates the maximum voltage that can be appl ied to the non-inverting and inverting ter minals without deterioration

or destruction of electrical char acteristics. In put common-mode v oltage range of the ma ximum ratings does n ot assure

normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.

(4) Power Dissipation (PD)

Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃

(normal temper ature). A s for p a c k a ge p r od uct, P D is determi ned by the temperature t hat can be permitted by the IC in

the package (maximum junction temperature) and the ther mal resistance of the package.

2. Electrical characteristics

(1) Input Offset Voltage (VIO)

Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the

input voltage difference required for setting the output voltage at 0 V.

(2) Input Offset Current (IIO)

Indicates the difference of input bias current between the non-invertin g and inverting terminals.

(3) Input Bias Current (IB)

Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at

the non-inverting and inverting terminals.

(4) Supply Current (IDD)

Indicates the current that flows within the IC under specified no-load conditi ons.

(5) Maximum Output Voltage(High) / Maximum Output Voltage(Lo w) (VOH/VOL)

Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output

voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output

voltage low indicates the lower limit.

(6) Large Signal Voltage Gain (AV)

Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal

and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.

Av = (Output voltage) / (Differential Input voltage)

(7) Input Common-mode Voltage Range (VICM)

Indicates the input voltage range where IC normally operates.

(8) Common-mode Rejection Ratio (CMRR)

Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is

normally the fluctuation of DC.

CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)

(9) Power Supply Rejection Ratio (PSRR)

Indicate s the rati o of fluc tua tion of inpu t offset voltage when su pply volt a ge is changed .

It is normally the fluctuation of DC.

PSRR= (Change of power supply voltage)/(Input offset fluctuation)

(10) Output Source Current/ Output Sink Current (ISOURCE / ISINK)

The maximum current that can be output from the IC under specific output conditions. The output source current

indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.

(11) Slew Rate (SR)

Indicates the ratio of the change in output voltage with time when a step input signal is applied.

(12) Unity Gain Frequency (fT)

Indicates a frequency where the voltage ga in of operational amplifier is 1.

(13) Phase Margin (θ)

Indicates the margin of phase from 180 degre e phase lag at unity gain frequency.

(14) Channel Separation (CS)

Indicates the fluctuation in the output voltage of the drive n channel with refer ence to the change of output voltage of

the channel which is not drive n.

Datasheet

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TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Typical Performance Curves

○BU7265G, BU7265SG

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7265G: -40C to +85C BU7265SG: -40C to +105C

Figure 2.

Power Dissipation vs Ambient Temperature

(Derating Curve)

Figure 3.

Power Dissipation vs Ambient Temperature

(Derating Curve)

Figure 4.

Supply Current vs Supply Voltage Figure 5.

Supply Current vs Ambient Temperature

0

0.2

0.4

0.6

0.8

123456

Supply Voltage [V]

Supply Current [μA]

-40℃ 25℃

85℃

105℃

0

0.2

0.4

0.6

0.8

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Supply Current [μA]

1.8V

5.5V

3.0V

0

0.2

0.4

0.6

0.8

0 25 50 75 100 125

Ambient Temperature [°C]

Power Dissipati on [W ]

BU7265G

85

BU7265SG

105

0.0

0.2

0.4

0.6

0.8

0 255075100125

A mbi ent Temperature [℃]

P ower Dissip ation [W] .

Datasheet

www.rohm.com TSZ02201-0RAR1G200270-1-2

TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Typical Performance Curves - continued

○BU7265G, BU7265SG

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7265G: -40C to +85C BU7265SG: -40C to +105C

0

1

2

3

4

5

6

123456

Supply Voltage [V]

Maximum Output Voltage (High) [V]

0

5

10

15

20

123456

Supply Voltage [V]

Maximum Output Voltage (Low) [mV]

0

1

2

3

4

5

6

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Maximum Output Voltage (High) [V]

0

5

10

15

20

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Maximum Output Voltage (Low) [mV]

Figure 8.

Maximum Output Voltage (Low) vs Supply Voltage

(RL=10kΩ)

Figure 6.

Maximum Output Voltage (High) vs Supply Voltage

(RL=10kΩ)

Figure 7.

Maximum Output Voltage (High) vs Ambient Temperature

(RL=10kΩ)

Figure 9.

Maximum Output Voltage (Low) vs Ambie nt Temperature

(RL=10kΩ)

-40℃

25℃

85℃

105℃

1.8V

5.5V

3.0V

-40℃

25℃

85℃

105℃

1.8V

5.5V

3.0V

Datasheet

www.rohm.com TSZ02201-0RAR1G200270-1-2

TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Figure 11.

Output Source Current vs Ambient Temperature

(OUT=VDD-0.4V)

Typical Performance Curves - continued

○BU7265G, BU7265SG

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7265G: -40C to +85C BU7265SG: -40C to +105C

0

2

4

6

8

10

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Output Source Current [mA]

0

2

4

6

8

10

0.0 0.5 1.0 1.5 2.0 2.5 3.0

Output Voltage [V]

Output Source Current [mA]

0

5

10

15

20

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Output Sink Current [mA]

0

5

10

15

20

0.00.51.01.52.02.53.0

Output Voltage [V]

Output Sink Current [mA]

Figure 13.

Output Sink Current vs Ambient Temperature

(OUT=VSS+0.4V)

Figure 12.

Output Sink Current vs Output Voltage

(VDD=3V)

Figure 10.

Output Source Current vs Output Voltage

(VDD=3 V)

-40℃

1.8V

5.5V

3.0V

-40℃

25℃

85℃

105℃ 5.5V

1.8V

3.0V

25℃

85℃

105℃

Datasheet

www.rohm.com TSZ02201-0RAR1G200270-1-2

TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Typical Performance Curves - continued

○BU7265G, BU7265SG

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7265G: -40C to +85C BU7265SG: -40C to +105C

-10.0

-7.5

-5.0

-2.5

0.0

2.5

5.0

7.5

10.0

123456

S upply Volt age [V]

Input Offset Voltage [mV]

-10.0

-7.5

-5.0

-2.5

0.0

2.5

5.0

7.5

10.0

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Input Offset Voltage [mV]

-10.0

-7.5

-5.0

-2.5

0.0

2.5

5.0

7.5

10.0

-101234

Input Voltage [V]

Input Offset Voltage [mV]

60

80

100

120

140

160

123456

S uppl y Vol ta ge [V]

Large Signal Voltage Gain [dB]

Figure 14.

Input Offset Voltage vs Supply Voltage

(VICM=VDD, EK=-VDD/2)

Figure 15.

Input Offset Voltage vs Ambient Temperature

(VICM=VDD, EK=-VDD/2)

Figure 16.

Input Offset Voltage vs Input Voltage

(VDD=3V)

Figure 17.

Large Signal Voltage Gain vs Supply Voltage

-40℃ 25℃

85℃

105℃

5.5V

1.8V

3.0V

-40℃

25℃

85℃

105℃

-40℃

85℃ 105℃

Datasheet

www.rohm.com TSZ02201-0RAR1G200270-1-2

TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Typical Performance Curves - continued

○BU7265G, BU7265SG

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7265G: -40C to +85C BU7265SG: -40C to +105C

60

80

100

120

140

160

-50 -25 0 25 50 75 100 125

A mbient Temperature [°C]

Large Signal Voltage Gain [dB]

0

20

40

60

80

100

120

123456

Supply Voltage [V]

Common Mode Rejection Ratio [dB]

0

20

40

60

80

100

120

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Common Mode Rejection Ratio [dB]

0

20

40

60

80

100

120

140

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Power Supply Re jection Ra tio [dB]

Figure 18.

Large Signal Voltage Gain vs Ambient Temperature Figure 19.

Common Mode Rejection R atio vs Supply Voltage

Figure 20.

Common Mode Rejection Ratio vs Ambient Temperature

Figure 21.

Power Supply Rejecti on Ratio vs Ambient Temperature

5.5V

1.8V

3.0V

-40℃

25℃

85℃

105℃

5.5V

1.8V

3.0V

Datasheet

www.rohm.com TSZ02201-0RAR1G200270-1-2

TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Typical Performance Curves - continued

○BU7265G, BU7265SG

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7265G: -40C to +85C BU7265SG: -40C to +105C

0

1

2

3

4

5

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Slew Rate L-H [V/ms]

0

1

2

3

4

5

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Slew Rate H-L [V/ms]

0

20

40

60

80

100

1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06

Frequency [Hz]

Voltage Gain[dB]

0

50

100

150

200

Phase [deg]

Figure 22.

Slew Rate L-H vs Ambient Temperature Figure 23.

Slew Rate H-L vs Ambient Temperature

Figure 24.

Voltage Gain・Phase vs F r equency

5.5V

1.8V

3.0V 5.5V

1.8V 3.0V

Phase

Gain

1 10 10

2 10

3 10

4 10

5 10

6

Datasheet

www.rohm.com TSZ02201-0RAR1G200270-1-2

TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Typical Performance Curves - continued

○BU7266xxx, BU7266Sxxx

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C

0.0

0.2

0.4

0.6

0.8

0 25 50 75 100 125

Ambient Temperature [°C]

Power Dissipation [W]

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0123456

Supply Voltage [V]

Supply Current [μA]

0.0

0.2

0.4

0.6

0.8

1.0

1.2

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Supply Current [μA]

Figure 25.

Power Dissipation vs Ambient Temperature

(Derating Curve)

Figure 26.

Power Dissipation vs Ambient Temperature

(Derating Curve)

Figure 27.

Supply Current vs Supply Voltage Figure 28.

Supply Current vs Ambient Temperature

BU7266F

BU7266FV

BU7266FVM

0.0

0.2

0.4

0.6

0.8

0255075100125

Ambient Temperature [°C]

Power Dissipati on [W]

BU7266SF

BU7266SFV

BU7266SFVM

-40℃

25℃

85℃

105℃

1.8V

5.5V

3.0V

85 105

Datasheet

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TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Typical Performance Curves - continued

○BU7266xxx, BU7266Sxxx

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C

0

1

2

3

4

5

6

123456

Supply Voltage [V]

Maximum Output Voltage (High) [V]

0

1

2

3

4

5

6

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Maximum Output Voltage (High) [V]

0

5

10

15

20

25

30

123456

Supply Voltage [V]

Maximum Output Voltage (Low) [mV]

0

5

10

15

20

25

30

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Output Voltage Low [mV]

Figure 29.

Maximum Output Voltage (High) vs Supply Voltage

(RL=10kΩ)

Figure 30.

Maximum Output Voltage High vs Ambient Temperature

(RL=10kΩ)

Figure 31.

Maximum Output Voltage (Low) vs Supply Voltage

(RL=10kΩ)

Figure 32.

Maximum Output Voltage (Low) vs Ambient Temperature

(RL=10kΩ)

-40℃

25℃

85℃

105℃

1.8V

5.5V

3.0V

-40℃

25℃

85℃

105℃

1.8V

5.5V

3.0V

Datasheet

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TSZ22111･15･001

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Figure 34.

Output Source Current vs Ambient Temperature

(OUT=VDD-0.4V)

Typical Performance Curves - continued

○BU7266xxx, BU7266Sxxx

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C

0

2

4

6

8

10

0.0 0.5 1.0 1.5 2.0 2.5 3.0

Output Voltage [V]

Output Source Current [mA]

0

2

4

6

8

10

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Output Source Current [mA]

0

5

10

15

20

0.0 0.5 1.0 1.5 2.0 2.5 3.0

Output Voltage[V]

Output Sink Current [ m A]

0

5

10

15

20

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Output Sink Current [mA]

Figure 33.

Output Source Current vs Output Voltage

(VDD=3 V)

Figure 35.

Output Sink Current vs Output Voltage

(VDD=3V)

Figure 36.

Output Sink Current vs Ambient Temperature

(OUT=VSS+0.4V)

-40℃

25℃

85℃

105℃

1.8V

5.5V

3.0V

-40℃

25℃

85℃

105℃

5.5V

1.8V

3.0V

Datasheet

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Typical Performance Curves - continued

○BU7266xxx, BU7266Sxxx

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C

-10.0

-7.5

-5.0

-2.5

0.0

2.5

5.0

7.5

10.0

123456

Supply Voltage [V]

Input Offset Voltage [mV]

-10.0

-7.5

-5.0

-2.5

0.0

2.5

5.0

7.5

10.0

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Input Offset Voltage [mV]

-10.0

-7.5

-5.0

-2.5

0.0

2.5

5.0

7.5

10.0

-101234

Input Voltage [V]

Input Offset Voltage [mV]

20

40

60

80

100

120

140

123456

Supply Voltage [V]

Large Signal Voltage Gain [dB]

Figure 37.

Input Offset Voltage vs Supply Voltage

(VICM=VDD, EK=-VDD/2)

Figure 38.

Input Offset Voltage vs Ambient Temperature

(VICM=VDD, EK=-VDD/2)

Figure 39.

Input Offset Voltage vs Input Voltage

(VDD=3V)

Figure 40.

Large Signal Voltage Gain vs Supply Voltage

-40℃

25℃

85℃

105℃

5.5V

1.8V

3.0V

-40℃

25℃

85℃

105℃

40℃ 25℃

85℃

105℃

Datasheet

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Typical Performance Curves - continued

○BU7266xxx, BU7266Sxxx

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C

20

40

60

80

100

120

140

-50 -25 0 25 50 75 100 125

Ambient Temperature [° C]

Large Signal Voltage Gain [dB]

0

20

40

60

80

100

120

123456

Supply Voltage [V]

Common Mode Rejection Ratio [dB]

0

20

40

60

80

100

120

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Common Mode Rejection Ratio [dB]

0

20

40

60

80

100

120

140

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Power Supply Rejection Ratio [dB]

Figure 41.

Large Signal Voltage Gain vs Ambient Temperature Figure 42.

Common Mode Rejection Ratio vs Supply Voltage

(VDD=3V)

Figure 43.

Common Mode Rejection Ra tio vs Ambient Temperature

(VDD=3V)

Figure 44.

Power Supply Rejection Rat io vs Ambient Temperature

5.5V

1.8V 3.0V

-40℃

25℃

85℃ 105℃

5.5V

1.8V 3.0V

Datasheet

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Typical Performance Curves - continued

○ BU7266xxx, BU7266Sxxx

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7266xxx: -40C to +85C BU7266Sxxx: -40C to +105C

0

20

40

60

80

100

1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06

Frequency [Hz]

Voltage Gain[dB]

0

50

100

150

200

Phase [deg]

-4

-2

0

2

4

6

8

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Slew Rate L-H [V/ms]

Figure 45.

Slew Rate L-H vs Ambient Temperature

-4

-2

0

2

4

6

8

-50 -25 0 25 50 75 100 125

Ambient Temperature [°C]

Slew Rate H-L [V/ms]

Figure 46.

Slew Rate H-L vs Ambient Temperature

Figure 47.

Voltage Gain・Phase vs F r equency

5.5V

1.8V 3.0V

5.5V

1.8V 3.0V

Phase

Gain

1 10 10

2 10

3 10

4 10

5 106

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Application Information

NULL method condition for Test circuit1

VDD, VSS, EK, VICM Unit:V

Parameter V

F S1 S2 S3 VDD VSS EK V

ICM

Calculation

Input Offset Voltage VF1 ON ON OFF 3 0 -1.5 3 1

Large Signal Voltage Gain VF2 ON ON ON 3 0

-0.5 1.5 2

VF3 -2.5

Common-mode Rejection Ratio

(Input Common-mode Voltage Range) VF4 ON ON OFF 3 0 -1.5

0 3

VF5 3

Power Supply Rejecti on Ratio VF6 ON ON OFF 1.8 0 -0.9 0 4

VF7 5.5

- Calculation -

1. Input Offset Voltage (VIO)

2. Large Signal Voltage Gain (AV)

3. Common-mode Rejecti on Ratio (CMRR)

4. Power Supply Rejection Ratio (PSRR)

VIO |VF1|

=1+RF/RS[V]

A

v|VF2-VF3|

=ΔEK × (1+RF/RS) [dB]

20Log

CMRR |VF4 - VF5|

=ΔVICM ×

(

1+RF

/

RS

)

[dB]

20Log

PSRR |VF6 - VF7|

=ΔVDD × (1+ RF/RS)[dB]

20Log

Figure 48. Test Circuit 1 (One Channel Only)

VICM

RS=50Ω

RF=50kΩ

RI=1MΩ

0.015μF0.015μF

SW1

SW2 50kΩ

SW3

RL

VRL

0.1μF

EK

500kΩ

1000pF

VF

0.01μF

15V

-15V

VDD

VSS

Vo

V

NULL

DUT

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Application Information - continued

Switch Condition for Test circuit2

SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12

Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF

Maximum Output V olt age OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF

Output Current OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF

Slew Rate OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON

Unity Gain Frequency ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON

Figure 49. Test Circuit 2

Figure 50. Slew Rate I nput and Output Wave

Figure 51. Test circuit 3 (Channel Se paration)

SW3

●

SW1 SW2

－

＋SW9 SW10 SW11SW8

SW5 SW6 SW7

CL

SW12

SW4

R1

1kΩ

R2 100kΩ

RL

VSS

VDD=3V

Vo

IN- IN+

t

3.0 V P-P

3.0 V

0 V

SR=

Δ

V

/

Δ

t

Δ

tt

3.0 V

0 V

Δ

V

Input Voltage Output Voltage

Input Wave Output Wave

R2=100kΩ

R1=1kΩ VDD

VSS

OUT1

VIN R1//R2 OUT2

R2=100kΩ

R1=1kΩ VDD

VSS

R1//R2

CS=20Log 100×OUT1

OUT2

Datasheet

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Examples of Circuit

○Voltage Follower

○Inverting Amplifier

○Non-inverting Amplifier

Figure 53. Inverting Amplifier Circuit

Figure 54. Non-invertin g Amplifier Circuit

Figure 52. Voltage Follower Circuit

Voltage gain is 0dB.

Using this circuit, t he output voltage (OUT) is configure d

to be equal to the input voltage (IN). This circuit also

stabilizes the output voltage (OUT) due to high input

impedance and low output impedance. Computation for

output voltage (OUT) is shown below.

OUT=IN

For inverting amplifier, input voltage (IN) is amplified b y

a voltage gain and dep ends on the ratio of R1 and R2 .

The out-of-phase output voltage is shown in the next

expression

OUT=-(R2/R1)・IN

This circuit has input impedance equal to R1.

For non-inverting amplifier, input voltage (IN ) is amplified

by a voltage gain, which depends on the ratio of R1 and

R2. The output voltage (OUT) is in-phase with the input

voltage (IN) and is shown in the next expression.

OUT=(1 + R2/R1)・IN

Effectively, this circuit has high input imped ance since its

input side is the same as that of the operational

amplifier.

VSS

OUT

IN

VDD

R 2

R 1

VSS

IN OUT

VDD

VSS

R2

VDD

IN

OUT

R1

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Power Dissipation

Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC

consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable

temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and

consumable power.

Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the

thermal resistance of the package us ed (heat dissipation c apability). Maximum junct ion temperat ure is typical ly equal t o the

maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold

resin or lead frame of t he package. Thermal resistance, represent ed by the symbol θJA°C/ W, indicates t his heat dissipation

capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.

Figure 55 (a) sho ws the model of t he thermal resistance of a package. The equation below shows ho w to compute fo r the

Thermal resistance (θJA), given the ambient temperature (T A), maximum junctio n temperat ure (TJmax), and power dissipation

(PD).

θJA = (TJmax－TA) / PD °C/W

The derating curve in Figure 55 (b) indicates the power that the IC can consume with reference to ambient temperature.

Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal

resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,

wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a

reference value measured at a specified condition. Figure 55(c) to 55(f) shows an example of the derating curve for

BU7265G, BU7265SG, BU7266xxx, BU726 6Sxxx.

(c)BU7265G (d)BU7265SG

0.0

0.2

0.4

0.6

0.8

0 25 50 75 100 125

Ambient Temperature [°C]

Power Dissipation [W]

0.0

0.2

0.4

0.6

0.8

0 25 50 75 100 125

Ambient Temperature [°C]

Power Dissipation [W]

BU7265G(Note 14)

BU7265SG(Note 14)

85 105

θJA=(TJmax-TA)/ PD °C/W

A

mbient Temperature T

A

[ °C ]

Chip Surface Temperature TJ [ °C ]

(a) Thermal Resistance 0

A

mbient Temperature TA[C]

P1

25 125

75 100 50

Power dissipation of LS I [W]

PDma

x

TJma

x

θJA2

θJA1

θJA2 < θJA1

(b) Derating Curve

P2

Power Dissipation of IC

Datasheet

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(Note 14) (Note 15) (Note 16) (Not e 17) Unit

5.4 5.5 5.0 4.7 mW/℃

When using the unit above TA=25C, subtract the value a bove per Celsius degree. Power dissipation is the value

when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted.

Figure 55. Thermal Resistance and Derating Curve

(e)BU7266F/FV/FVM (f)BU7266SF/SFV/SFVM

0.0

0.2

0.4

0.6

0.8

0 25 50 75 100 125

Ambient Temperature [°C]

Power Dissipation [W]

0.0

0.2

0.4

0.6

0.8

0 25 50 75 100 125

Ambient Temperature [°C]

Power Dissipation [W]

BU7266F(Note 15)

BU7266FV(Note 16)

BU7266FVM(Note 17)

BU7266SF(Note 15)

BU7266SFV(Note 16)

BU7266SFVM(Note 17)

85 105

Datasheet

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent nois e in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground t races, t he two ground traces should be rout ed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large c urrents. Also ensure that the ground t races of external components do not cause variat ions

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of t he properties of the chip. The absolute maximum rating of the PD stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exc eeding the PD rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected charact erist ics of t he IC can be approxim atel y obtained.

The electrical c haracteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the interna l powering sequence and dela ys, especially if th e IC has more than one power

supply. Theref ore, give s peci al cons ider at io n to po wer couplin g capacitance, po wer wiring, width of ground wiring, and

routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent dam age from static discharge, ground t he IC during assembly and u se similar precautions durin g

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. I ncorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reason s such as metal particles, water dropl ets (in very humid environment) and

unintentional solder bridge deposited in between pins during assemb ly to name a few.

11. Unused Input Pins

Input pins of an IC are often conn ected to the gate of a MO S transistor. The gate has extremel y high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

12. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The

operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical

damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an

input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when

no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that t he input pins

have voltages within the values specified in the electrical characteristics of this IC.

13. Unused circuits

When there are unused op-amps, it is recommended that they are

connected as in Figure 58, setting the non-inverting input terminal to a

potential within the in-phase input voltage range (VICM).

14. Input Voltage

Applying VDD+0.3V to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, regardless

of the supply voltage. However, this does not ensure normal circuit

operation. Please note that the circuit operates normally only when the

input voltage is within the common mode input voltage range of the

electric characteristics.

15. Power supply(single/dual)

The operational amplifi er operates when the voltage supp lied is bet ween VDD an d VSS. T herefore, the single sup ply

operational am plifiers can be used as dual supply operational amplifiers as well.

16. Output capacitor

If a large capacitor is connected bet ween the output pi n a nd VSS pi n, curr ent from the c harge d capacitor will flo w into

the output pin and ma y destroy the IC when the VDD pin is short ed to ground or pulled down to 0V. Use a capacitor

smaller than 0.1uF between output pin and V SS pin.

17. Oscillation by output capacitor

Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop

circuit with these ICs.

18. Latch Up

Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and

protect the IC fr om abnormaly noise.

19. Crossorver distortion

Inverting amplifier generates crossover distortion when feedback resistance value is small.

To suppress the crosover distortion, connect a resistor between the output terminal and VSS.

Figure 58. Example of Application Circuit

for Unused Op-amp

VDD

VSS

Feedback Resistor

Figure 56. To Suppress the Crosover Distortion

Keep this potential

in VICM

VSS

VDD

VICM

Pull-down Resistor

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Marking Diagram

Product Name Package Type Marking

BU7265 G SSOP5 D3

BU7265S FA

BU7266 F SOP8 7266

FV SSOP-B8 266

FVM MSOP8 7266

BU7266S F SOP8 7266S

FV SSOP-B8 266S

FVM MSOP8 7266S

SOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SSOP-B8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

MSOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Part Number Marking

SSOP5(TOP VIEW)

LOT Number

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Physical Dimension, Tape and Reel Information

Package Name SSOP5

Datasheet

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Physical Dimension, Tape and Reel Information - continued

Package Name SOP8

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(UNIT : mm)

PKG : SOP8

Drawing No. : EX112-5001-1

(Max 5.35 (include.BURR))

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Physical Dimension, Tape and Reel Information - continued

Package Name SSOP-B8

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

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Physical Dimension, Tape and Reel Information - continued

Package Name MSOP8

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

TR

()

1pin

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Physical Dimension, Tape and Reel Information – continued

Package Name SOP14

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(UNIT : mm)

PKG : SOP14

Drawing No. : EX113-5001

(Max 9.05 (include.BURR))

Datasheet

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TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

Physical Dimension, Tape and Reel Information – continued

Package Name SSOP-B14

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

Datasheet

www.rohm.com TSZ02201-0RAR1G200270-1-2

TSZ22111･15･001

BU7265G BU7265SG BU7266xxx BU7266Sxxx

e

MIE

ℓ2

b2

e

Land Pattern Data All dimensions in mm

PKG Land pitch

e Land space

MIE Land length

≧ℓ 2 Land width

b2

SSOP5 0.95 2.4 1.0 0.6

SOP8 1.27 4.60 1.10 0.76

SSOP-B8 0.65 4.60 1.20 0.35

MSOP8 0.65 2.62 0.99 0.35

Revision History

Date Revision Changes

12.Sep.2013 001 New Release

SSOP5 SOP8, SSOP-B8, MSOP8

MIE

ℓ2

b 2 e

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.

Datasheet

Part Number bu7266sfv

Package SSOP-B8

Unit Quantity 2500

Minimum Package Quantity 2500

Packing Type Taping

Constitution Materials List inquiry

RoHS Yes

bu7266sfv - Web Page

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