samsung.com/semi/dram 9
DRAM
1H 2012 Mobile & Graphics DRAM Components
GRAPHICS DRAM COMPONENTS
Type Density Organization Part Number Package VDD/VDDQ Speed Bin (MHz) Production
GDDR5
2Gb 64Mx32
K4G20325FD-FC(04/03/28) 170-FBGA 1.5V/1.5V 1250/1500/1750 Now
K4G20325FD-FC(04/03) 170-FBGA 1.35V/1.35V 900/1050 Now
K4G20325FC-HC(05/04/03) 170-FBGA 1.5V/1.5V 1000/1250/1500 Now
K4G20325FC-HC04 170-FBGA 1.35V/1.35V 900 Now
1Gb 32Mx32
K4G10325FG-HC03 170-FBGA 1.5/1.5V (1.6V/1.6V) 1500 Now
K4G10325FG-HC(05/04) 170-FBGA 1.5V/1.5V 1000/1250 Now
K4G10325FG-HC(04/03) 170-FBGA 1.35V/1.35V 900/1050 Now
GDDR3 1Gb 32Mx32 K4J10324KG-HC(14/1A) 136-FBGA 1.8V/1.8V 700/1000 Now
512Mb 16Mx32 K4J52324KI-HC(1) 136-FBGA 1.8/1.8V 700/800/1000 Now
gDDR3
4Gb 256Mx16 K4W4G1646B-HC(12/11/1A) 96-FBGA 1.5V/1.5V 800/933/1066 Now
2Gb 128Mx16 K4W2G1646C-HC(15/12/11/1A) 96-FBGA 1.5V/1.5V 667/800/900/1000 Now
1Gb 64Mx16 K4W1G1646G-BC(15/12/11/1A/08) 96-FBGA 1.5V/1.5V 667/800/933/1066/1200 Now
gDDR2 1Gb 64Mx16 K4N1G164QF-BC(1) 84-FBGA 1.8/1.8V 400/500
NOTES: Package
H: FBGA (Halogen Free & Lead Free)
B: FBGA (Halogen Free & Lead Free)
(1) Speeds (clock cycle - speed bin)
03: 0.3ns (3000MHz)
04: 0.4ns (2500MHz)
05: 0.5ns (2000MHz)
5C: 0.555 (1800MHz)
08: 0.83ns (1200MHz)
1A: 1ns (1000MHz GDDR3)
1A: 1ns (1066MHz gDDR3)
11: 1.1ns (933MHz)
12: 1.25ns (800MHz)
14: 1.429ns (700MHz)
20: 2.0ns (500MHz)
25: 2.5ns (400MHz)
MOBILE DRAM COMPONENTS
Type Density Organization Part Number Package Power Production
MDDR
512Mb 32Mx16 K4X51163PK-FG(1) 60-FBGA 1.8V Now
16Mx32 K4X51323PK-8G(1) 90-FBGA 1.8V Now
1Gb 32Mx32 K4X1G323PF-8G(1) 90-FBGA 1.8V Now
2Gb 64Mx32 K4X2G323PC-8G(1) 90-FBGA 1.8V Now
64Mx32 K4X2G323PD-8G(1) 90-FBGA 1.8V ES Q1'12, CS in Q2'12
4Gb x32 (2CS, 2CKE) K4X4G303PC-AG(1) 168-FBGA, 12x12 PoP, DDP 1.8V Now
x32 (2CS, 2CKE) K4X4G303PC-7G(1) 240-FBGA, 14x14 PoP, DDP 1.8V Now
LPDDR2
2Gb 1CH x32 K4P2G324EC-AG(1) 168-FBGA, 12x12 PoP, MONO, 1.2V EOL by end of 2012. (LBO '12 June, LTS Dec)
1CH x32 K4P2G324ED-AG(1) 168-FBGA, 12x12 PoP, MONO, 1.2V Now
4Gb
1CH x32 K4P4G304EC-AG(1) 168-FBGA, 12x12 PoP, DDP, 64Mx32*2 1.2V EOL by end of 2012. (LBO '12 June, LTS Dec)
1CH x32 K4P4G304EC-FG(1) 134-FBGA, 11x11.5 PoP, DDP, 128x16*2 1.2V Now
1CH x32 K4P4G324EB-AG(1,2) 168-FBGA, 12x12 PoP, MONO, 128Mx32 1.2V Now
2CH x32/ch K3PE4E400M-XG(1) 216-FBGA, 12x12 PoP, DDP, 64Mx32*2 1.2V EOL by end of 2012. (LBO '12 June, LTS Dec)
2CH x32/ch K3PE4E400A-XG(1) 240-FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V EOL by end of 2012. (LBO '12 June, LTS Dec)
2CH x32/ch K3PE4E400P-XG(2) 216FBGA,12x12 PoP, DDP, 64Mx32*2 1.2V Now
2CH x32/ch K3PE4E400D-XGC(2) 220FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V CS
2CH x32/ch K3PE4E400K-XG(2) 240-FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V Now
6Gb 2CH x32/ch K3PE8E400C-XG(2) 240FBGA, 14x14 PoP, TDP 1.2V Now
2CH x32/ch K3PE4E700A-XG(2) 220FBGA, 14x14 PoP, DDP 1.2V Now
8Gb
1CH x32 K4P8G304EB-FG(1,2) 134-FBGA, 11x11.5 PoP, DDP, 128x16*4 1.2V Now
1CH x32 K4P8G304EB-AG(1) 168-FBGA, 12x12 PoP, DDP, 128x16*4 1.2V Now
1CH x32 K4P8G304EB-GG(2) 216FBGA, 12x12 PoP, DDP, 128x16*4 1.2V ES
2CH x32/ch K3PE7E700M-XG(2) 216-FBGA, 12x12 PoP, DDP, 128Mx32*2 1.2V Now
2CH x32/ch K3PE7E700D-XG(2) 220-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V Now
16Gb
1CH x32 K4PAG304EB-FG(2) 134-FBGA, 11x11.5 PoP, QDP 1.2V Now
2CH x32/ch K3PE0E000M-XG(2) 216-FBGA, 12x12 PoP, QDP, 128Mx32*4 1.2V Now
2CH x32/ch K3PE0E000A-XG(2) 220-FBGA, 14x14 PoP, QDP, 128Mx32*4 1.2V Now
2CH x32/ch K3PE0E000B-XG(2) 240-FBGA, 14x14 PoP, QDP, 128Mx32*4 1.2V Now
NOTES: (1,2) Speed: Mobile DDR (1) 60: 166MHz, CL3 (1) 75: 133MHz, CL3 (1) D8: 200MHz, CL3 LPDDR2
(2) C1: 800Mbps All products offered at Extended, Low, i-TCSR & PASR & DS (Temp, Power) (2) C2: 1066Mbps All products offered at Extended, Low, i-TCSR & PASR & DS (Temp, Power)