4-90
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
IRFR9220, IRFU9220 UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDSS -200 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR -200 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS ±20 V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 3.6
Refer to Peak Current Curve A
Single Pulse Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAS Refer to UIS Curve
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
0.33 W
W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ,T
STG -55 to 150 oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 300
260
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ= 25oC to 125oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V -200 - - V
Gate to Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA -2.0 - -4.0 V
Zero Gate Voltage Drain Current IDSS VDS = Rated BVDSS, VGS = 0V - - -25 µA
VDS = 0.8 x Rated BVDSS, VGS = 0V, TC = 150oC - - -250 µA
Gate to Source Leakage Current IGSS VGS = ±20V - - ±100 nA
Drain to Source On Resistance (Note 2) rDS(ON) ID = 2.2A, VGS = -10V (Figure 9) - - 1.500 W
Turn-On Time tON VDD = -100V, ID = 3.9A,
RL = 24Ω, VGS = -10V,
RGS = 18Ω
(Figures 13, 16, 17)
- - 50 ns
Turn-On Delay Time td(ON) - 8.8 - ns
Rise Time tr-27- ns
Turn-Off Delay Time td(OFF) - 7.3 - ns
Fall Time tf-19- ns
Turn-Off Time tOFF - - 50 ns
Total Gate Charge Qg(TOT) VGS = 0 to -10V VDD = -160V,
ID = 3.9A,
RL = 41Ω
IG(REF) = 1.45mA
-20- nC
Gate to Drain Charge Qgd -11 - nC
Gate to Source Charge Qgs - 3.3 - nC
Input Capacitance CISS VDS = -25V, VGS = 0V, f = 1MHz
(Figure 12) - 550 - pF
Output Capacitance COSS - 110 - pF
Reverse Transfer Capacitance CRSS -33- pF
Thermal Resistance Junction to Case RθJC - - 3.00 oC/W
Thermal Resistance Junction to Ambient RθJA - - 100 oC/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage (Note 2) VSD ISD = -3.6A - - -6.3 V
Diode Reverse Recovery Time trr ISD = -3.6A, dISD/dt = -100A/µs - 150 300 ns
Reverse Recovery Charge QRR 0.97 2.0 µC
NOTES:
2. Pulse test: pulse width ≤300µs, duty cycle ≤2%.
3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3).
IRFR9220, IRFU9220