Tyco Electronics Corporation
300 Constitutional Drive
Menlo Park, CA 94025 USA
Specification
This Issue:
Date:
Replaces:
RT-1404
ISSUE 9
April 20, 2000
ISSUE 8
SolderSleeve Insulated Electrical Termination Devices
1.0 INTRODUCTION
1.1 Scope
This specification covers the design, performance and qualification requirements for Raychem SolderSleeve
electrical termination devices.
1.2 Description.
Raychem SolderSleeve termination devices covered by this specification consist primarily of heat-shrinkable
insulating sleeving and one or more solder preforms. These devices reduce to predetermined diameters upon
the proper application of heat, and form insulated, soldered connections between wire or cable conductors.
These devices are heat-shrinkable solder devices as described in ANSI-J-STD-001.
1.3 Classification.
SolderSleeve devices shall be as specified on the applicable Raychem Specification Control Drawing (SCD).
1.4 Temperature Rating
The maximum continuous operating temperature for SolderSleeve devices shall be as specified on the
applicable Raychem specification control drawing.
2.0 APPLICABLE DOCUMENTS
2.1 Issues of Documents
The latest issue of those specifications and standards referenced below or on the applicable Raychem
specification control drawing shall form part of this document to the extent specified.
2.2 SPECIFICATIONS
Military
MIL-H-5606
MIL-T-5624
MIL-L-7808
MIL-T-7928
MIL-A-8243
MIL-L-23699
MIL-C-25769
MIL-S-81824
MIL-S-83519
MIL-STD-202
MIL-STD-45662
Hydraulic Fluid, Petroleum Base, Aircraft, Missile and Ordnance
Turbine Fuel, Aviation, Grades JP-4 and JP-5
Lubricating Oil, Aircraft Turbine Engine, Synthetic Base
Terminals, Lug: Splices, Conductor, Crimp Style
Anti-Icing and Deicing/Defrosting Fluid
Lubricating Oil, Aircraft Turboprop and Turboshaft Engines, Synthetic Base
Cleaning Compound, Aircraft Surface, Alkaline, Water Base
Splices, Electric, Permanent, Crimp Style, Copper, Insulated, Environment Resistant
Shield Termination, Solder Style, Insulated, Heat- Shrinkable, Environment Resistant, General
Specification for
Test Methods for Electronic Component Parts
Calibration System Requirements
(Copies of Department of Defense documents may be obtained from the Standardization Document Order Desk,
700 Robbins Ave., Building 4, Section D, Philadelphia, PA 19111-5094.)
Other
ANSI-J-STD-001B
ANSI/ASQC Z1.4-1993
Requirements for Soldered Electrical and Electronic Assemblies
Sampling Procedures and Tables for Inspection by Attributes
SPECIFICATION RT-1404 ISSUE 9 Page 2
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3.0 REQUIREMENTS
3.1 Detail Requirements
Detail requirements or exceptions applicable to a particular style of SolderSleeve device shall be as specified
on the applicable Raychem specification control drawing. In the event of any conflict between requirements
of this specification and the specification control drawing, the latter shall take precedence.
3.2 Classification of Requirements
The requirements for SolderSleeve devices are classified herein as follows:
Requirement Paragraph
Qualification 3.3
Materials 3.4
Design and Construction 3.5
Performance 3.6
Product Identification 3.7
Workmanship 3.8
3.3 Qualification
SolderSleeve devices furnished under this specification shall be products which are qualified to this
specification by test or by similarity of design and materials.
3.4 Materials
The materials used in the manufacture of SolderSleeve devices shall be as specified on the applicable
specification control drawing and shall conform to the requirements specified herein.
3.4.1 Insulation Sleeve. Insulation sleeves shall consist of heat- shrinkable tubing of the type and color specified
on the applicable specification control drawing.
3.4.2 Solder Preform with Flux. Prefluxed solder preforms shall consist of the solder and flux types specified on
the applicable specification control drawing.
3.4.3 Meltable Inserts. Meltable inserts shall consist of thermoplastic material as defined on the applicable
specification control drawing.
3.4.4 Preinstalled Leads. Preinstalled leads shall be as defined on the applicable specification control drawing.
3.4.5 Thermal Indicator. Thermal indicating material shall provide a visual indication that sufficient heat has been
applied to cause soldering under normal circumstances. The thermal indicator, when present, shall be in
accordance with 3.4.5.1 or 3.4.5.2, as specified on the applicable specification control drawing.
3.4.5.1 Color Change Type. Color change type (thermochromic) thermal indicator material shall indicate sufficient
heating by loss of color.
3.4.5.2 Thermally Fusible Ring Type. Thermal indicator consisting of a ring of fusible material shall indicate
sufficient heating by melting and flowing.
3.5 Design and Construction.
SolderSleeve devices shall conform to the design, construction, and physical dimensions specified on the
applicable specification control drawing.
SPECIFICATION RT-1404 ISSUE 9 Page 3
3.6 Performance.
SolderSleeve devices shall conform to the requirements specified herein and on the applicable specification
control drawing. Unless otherwise specified, room temperature shall be 25°C ± 5°C. Values given as "after
conditioning" refer to requirements after any of the environmental exposures of Table I.
3.6.1 Voltage Drop. When installed shield terminations are tested as specified in 4.5.3.1, the voltage drop across
the shield termination shall not exceed that of an equivalent length of the ground lead by more than 1.0 milli-
volt (before conditioning) and 1.5 millivolts (after conditioning). When installed conductor splices are tested
in accordance with 4.5.3.3, the voltage drop shall not exceed that of an equivalent length of wire by more
than 2.0 millivolts (before conditioning) and 2.5 millivolts (after conditioning).
3.6.2 Tensile Strength. When installed SolderSleeve devices are tested in accordance with 4.5.4, the tensile
strength of the soldered connection shall be not less than that of the weakest soldered member or 110 pounds,
whichever is less.
3.6.3 Dielectric Withstanding Voltage (SolderSleeve Device). When installed SolderSleeve devices are tested in
accordance with 4.5.5, the insulation shall withstand the 2000 Vrms, 60 Hz potential for 60 seconds with no
evidence of arcing or breakdown. Leakage current shall be 2.5 milliamperes maximum.
3.6.4 Dielectric Withstanding Voltage (Cable). When shielded or coaxial cables terminated with SolderSleeve
devices are tested in accordance with 4.5.6, the cable primary insulation or dielectric shall withstand the
voltage specified for the cable used with no evidence of arcing or breakdown.
3.6.5 Salt Spray (Corrosion). When installed SolderSleeve devices are subjected to 48-hour salt spray testing in
accordance with 4.5.7, there shall be no evidence of corrosion, and the termination shall meet the voltage
drop and tensile strength requirements specified in 3.6.1 and 3.6.2.
3.6.6 Vibration. When installed SolderSleeve devices are subjected to 15 g peak sine vibration in accordance with
4.5.8, there shall be no evidence of cracking, breaking or loosening of the SolderSleeve termination, and the
termination shall meet the voltage drop and tensile strength requirements specified in 3.6.1 and 3.6.2.
3.6.7 Thermal Shock. When installed SolderSleeve devices are subjected to five thermal shock cycles between the
maximum rated temperature and minus 65°C in accordance with 4.5.9, there shall be no evidence of damage
to the SolderSleeve termination, and the termination shall meet the voltage drop and tensile strength
requirements specified in 3.6.1 and 3.6.2. Discoloration of the SolderSleeve device insulation shall not be
cause for rejection.
3.6.8 Heat Aging. When installed SolderSleeve devices are subjected to 96- hour heat aging at the maximum rated
temperature in accordance with 4.5.10, the SolderSleeve terminations shall meet the subsequent performance
requirements of Table I. Discoloration of the SolderSleeve device insulation shall not be cause for rejection.
3.6.9 Fluid Resistance. When installed SolderSleeve devices are exposed to any of the six test fluids in accordance
with 4.5.11, the SolderSleeve terminations shall meet the dielectric withstanding voltage requirements
specified in 3.6.3.
3.6.10 Flammability. (Applicable only to SolderSleeve devices having fluorocarbon-based insulation sleeves)
When installed, horizontally suspended SolderSleeve devices are exposed to flame for 20 seconds in
accordance with 4.5.12, the SolderSleeve insulation shall be self-extinguishing within 5 seconds after
removal from flame.
SPECIFICATION RT-1404 ISSUE 9 Page 4
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3.6.11 Altitude Immersion. (Applicable only to SolderSleeve devices identified as "Environment Resistant" on the
applicable Raychem specification control drawing) When installed SolderSleeve devices are subjected to
three altitude immersion cycles between sea level and 70,000-foot altitude in accordance with 4.5.13, the
insulation resistance shall be not less than 5000 megohms and the leakage current shall be not greater than
2.5 milliamperes.
3.6.12 Thermal Indicator Change. (Applicable only to SolderSleeve devices having thermal indicator) When
SolderSleeve devices are installed and tested in accordance with 4.5.14, the applicable thermal indication for
underheating shall be visible in underheated terminations, and the solder joint area shall be acceptable in
accordance with MIL-S-83519 in terminations in which the thermal indicator has undergone the applicable
transition to indicate completion of heating.
3.6.13 Copper Mirror Corrosion. When SolderSleeve devices are tested for 16 hours at 121°C in accordance with
4.5.15, copper removal shall not exceed 10 percent of the area of the mirror above the bottom 0.063 inch.
3.7 Product Identification.
Marking of SolderSleeve devices shall be in accordance with the applicable specification control drawing.
3.8 Workmanship.
SolderSleeve devices shall be uniform in quality and shall be free from defects detrimental to life,
serviceability, or performance.
4.0 QUALITY ASSURANCE PROVISIONS
4.1 Responsibility for Inspection. Unless otherwise specified in the contract or purchase order, the supplier is
responsible for performing the inspection tests specified herein. The supplier may utilize his own facilities or
any suitable testing facility. Inspection records of the tests shall be kept complete and available to the buyer
as specified in the contract or order.
4.1.1 Inspection Equipment and Facilities. Test and measuring equipment and inspection facilities of sufficient
accuracy, quality, and quantity to permit performance of the required inspection shall be established and
maintained by the supplier. A calibration system to control the accuracy of the measuring and test equipment
shall be maintained in accordance with MIL-STD-45662.
4..2 Classification of Inspections. The examination and testing of SolderSleeve devices covered by this
specification shall be classified as follows:
a. Qualification inspection (See Paragraph 4.3)
b. Quality conformance inspection (See Paragraph 4.4)
4.3 Qualification Inspection.
Qualification inspection shall consist of the tests in Table I in the order shown. All sample units shall be
subjected to the inspection of Group A. The samples shall then be divided into Groups B through J, as
shown in Table I, and subjected to the inspection for the particular groups.
4.3.1 Test Samples for Qualification Inspection. Test samples submitted for qualification inspection shall be
produced using equipment and procedures normally used in production. Test samples shall be of the types
listed in Table I.
SPECIFICATION RT-1404 ISSUE 9 Page 5
4.3.2 Failures. One or more failures of the tests listed in Table I shall be cause for failure of qualification of the
parts under test, with the exception of visual examination, where occurrence of one major defect or two
minor defects shall be cause for failure of qualification. Major and minor defects shall be as defined in
ANSI/ASQC Z1.4-1993.
4.3.3 Qualification Report. Qualification shall be documented in a report which shall be available to buyers.
4.3.4 Retention of Qualification. Qualification may remain in effect as long as the component design and
manufacturing procedures remain essentially unchanged, and components meet quality conformance
requirements.
4.3.4.1 Applicability of Routine Testing. Testing performed on production parts may be cited in support of continued
qualification.
4.3.4.2 Applicability of Usage Experience. In-service performance of components and documented testing
performed on components by users may be cited in support of continued qualification.
4.4 Quality Conformance Inspection.
4.4.1 Component Materials Inspection. Component materials inspection shall consist of verification that the
component materials are in accordance with applicable specifications and requirements.
4.4.2 Inspection of Product for Delivery. Inspection of product for delivery shall consist of visual and
dimensional examination in accordance with Paragraph 4.5.2. In-process examination may be used for
quality conformance inspection. Statistical process control (SPC) may be substituted for lot acceptance
inspection.
4.4.2.1 Inspection Lot. An inspection lot, as far as practicable, shall consist of all SolderSleeve devices of a single
class, size, and composition, manufactured under essentially the same conditions and offered for inspection at
one time.
4.4.2.2 Sampling Plan. Quality conformance sampling shall be in accordance with MIL-STD-105 for normal
inspection. The inspection level shall be level I, and the acceptable quality level (AQL) shall be 4.0 for all
defects.
4.4.2.3 Nonconforming Lots. Disposition of nonconforming lots shall be in accordance with ANSI/ASQC Z1.4-
1993.
SPECIFICATION RT-1404 ISSUE 9 Page 6
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TABLE I. QUALIFICATION INSPECTION
+---------------------------------------------------------------------+
REQUIREMENT METHOD
PARAGRAPH PARAGRAPH
Group A (30 or 363 uninstalled devices)
Visual and dimensional exam. as supplied 3.1, 3.4, 3.5,3.7, 3.8 4.5.2.1
Group B (3 uninstalled devices)
Dimensional exam. after unrestricted recovery 3.5 4.5.2.2
Group C (4 installed devices)
Voltage Drop 3.6.1 4.5.3
Thermal shock 3.6.7 4.5.9
Voltage Drop 3.6.1 4.5.3
Tensile Strength 3.6.2 4.5.4
Group D (4 installed devices)
Salt spray (corrosion) 3.6.5 4.5.7
Voltage Drop 3.6.1 4.5.3
Tensile Strength 3.6.2 4.5.4
Group E (4 installed devices)
Vibration 3.6.6 4.5.8
Voltage Drop 3.6.1 4.5.3
Tensile Strength 3.6.2 4.5.4
Group F (4 installed devices)
Altitude Immersion1 3.6.11 4.5.13
Dielectric Withstanding Voltage (Cable) 3.6.4 4.5.6
Heat Aging 3.6.8 4.5.10
Dielectric Withstanding Voltage (Device) 3.6.3 4.5.5
Voltage Drop 3.6.1 4.5.3
Tensile Strength 3.6.2 4.5.4
Group G (6 installed devices)
Fluid Resistance 3.6.9 4.5.11
Group H (3 installed devices)
Flammability2 3.6.10 4.5.12
Group J (2 uninstalled devices)
Copper mirror corrosion 3.6.13 4.5.15
Group K (6 uninstalled devices)3
Thermal Indicator Change 3.6.12 4.5.14
Notes to Table I:
1 Applicable only to immersion resistant devices.
2 Applicable only to devices with fluorocarbon-based insulation sleeves.
3 Applicable only to devices with thermal indicator
SPECIFICATION RT-1404 ISSUE 9 Page 7
4.5 Test Procedures.
4.5.1 Test Conditions. Unless otherwise specified herein, all inspection shall be made at ambient temperature,
pressure, and humidity as specified in general requirements of MIL-STD-202.
4.5.1.1 Specimen Assembly. When installed SolderSleeve devices are specified for testing, the devices shall be
installed in the mode of their primary function as specified on the applicable Raychem specification control
drawing (e.g: shield termination, coaxial cable termination, or primary conductor splice).
4.5.1.1.1 Shield Terminations. SolderSleeve shield terminators shall be installed using the specified assembly
procedure in the center, unless otherwise specified, of a 12-inch length of cable meeting the dimensional and
material requirements specified in the applicable Raychem specification control drawing. Ground leads shall
have the same plating and insulation as the cable and shall be at least 6 inches long.
4.5.1.1.2 Coaxial Cable Terminations. SolderSleeve coaxial cable terminators shall be installed using the specified
assembly technique on a coaxial cable meeting the dimensional and material requirements specified on the
applicable Raychem specification control drawing.
4.5.1.1.3 Conductor Splices. The test specimens shall be 1 to 1 in-line splices between wires of the same gauge size
and material, assembled in accordance with the specified assembly technique. Wires shall meet the
dimensional and material requirements of the applicable Raychem specification control drawing.
4.5.1.2 Temperature Stabilization. Voltage drop measurements shall be made after the temperature of the wire has
stabilized. All tests performed after exposure to high or low temperature shall be conducted after assemblies
have been conditioned for at least 1 hour at the inspection conditions specified in 4.5.1.
4.5.2 Visual and Dimensional Examination.
4.5.2.1 Visual and Dimensional Examination As Supplied (see 3.1, 3.4, 3.5, 3.7, 3.8). Devices shall be visually
examined, and the as-supplied dimensions shall be measured in accordance with the applicable Raychem
specification control drawing.
4.5.2.2 Dimensional Examination After Unrestricted Shrinkage (see 3.5). Devices shall be heated to cause
unrestricted shrinkage in accordance with MIL-S-83519, and the after-shrinkage dimensions shall be
measured in accordance with the applicable Raychem specification control drawing. Longitudinal change
after shrinkage shall be calculated in accordance with MIL-S-83519.
4.5.3 Voltage Drop (see 3.6.1).
4.5.3.1 Voltage Drop of Shield Terminator. The voltage drop of the SolderSleeve termination shall be measured at a
test current of 1 ampere dc, from a point on the ground lead immediately adjacent to the insulation sleeve to a
point on the cable shield immediately adjacent to the opposite end of the insulation sleeve. The voltage drop
shall then be measured across a length of ground lead equal to the distance between the points of
measurement across the SolderSleeve terminator. The difference between the two measurements shall be
recorded as the voltage drop result.
4.5.3.2 Voltage Drop of Coaxial Cable Terminators. The voltage drop across the shield termination of coaxial cable
terminators shall be measured as described in 4.5.3.1. The voltage drop across the center conductor
termination of coaxial cable terminators shall be measured as described in 4.5.3.3, except that the point of
measurement on the cable shall be approximately 1/4 inch from the end of the coaxial cable terminator.
SPECIFICATION RT-1404 ISSUE 9 Page 8
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4.5.3.3 Voltage Drop of Conductor Splices. The voltage drop across the SolderSleeve splice shall be measured
between points l/16 inch outside the ends of the insulation sleeve at both ends of the splice. The distance
between the two points shall be noted. Test current shall be in accordance with Table I of MIL-S-81824.
The voltage drop shall then be measured across a length of conductor equal to the distance between the points
of measurement across the SolderSleeve splice. The difference between the two measurements shall be
recorded as the voltage drop result.
4.5.4 Tensile Strength (see 3.6.2). The specimen shall be placed in a standard tensile testing machine with separate
members of the connection gripped by jaws at opposite ends of the SolderSleeve device. Sufficient force
shall be applied to cause tensile failure. The travel speed of the head shall be 1 inch per minute. The
clamping surfaces of the jaws may be serrated to provide sufficient gripping force.
4.5.5 Dielectric Withstanding Voltage (SolderSleeve Device) (see 3.6.3). A piece of metallic foil between l/8 and
1/4 inch narrower than the length of the installed SolderSleeve device shall be wrapped tightly around the
middle of the SolderSleeve device. One lead from the high voltage test set shall be attached to the foil, and
one lead shall be attached to the conductor being spliced or terminated. A 60 Hz test voltage shall be applied
and increased at a rate of 500 volts per second until a value of 2000 Vrms is attained. This voltage shall be
applied for 1 minute.
4.5.6 Dielectric Withstanding Voltage (Cable) (see 3.6.4). (Applicable only to shielded wire and coaxial cable
terminations) A test voltage equal to that specified for the cable shall be applied for 1 minute between the
primary conductor and the ground lead. The rate of voltage application shall be 500 volts per second.
4.5.7 Salt Spray (Corrosion) (see 3.6.5). Installed SolderSleeve devices shall be conditioned in accordance with
MIL-STD-202, Method 101, test condition A. After conditioning, the voltage drop and tensile strength shall
be measured in accordance with 4.5.3 and 4.5.4.
4.5.8 Vibration (see 3.6.6). Specimens with installed SolderSleeve devices shall have terminal lugs conforming to
MIL-T-7928 attached to all conductors. The conductors leading from one end of the SolderSleeve device
shall be rigidly mounted to a test fixture 1 inch in height and securely fastened to the vibrating platform. The
conductors leading from the opposite end of the devices shall be secured to a stationary support so that the
center of the specimen is 6 inches from the vibrating platform and the tension on the wire allows between l/8
and l/4 inch of movement perpendicular to the axis of the specimen. The specimens shall be vibrated in
accordance with MIL-STD-202, Method 204, test condition B. One axis shall be parallel to the specimen
axis. After conditioning, the voltage drop and tensile strength shall be measured in accordance with 4.5.3
and 4.5.4 respectively.
4.5.9 Thermal Shock (see 3.6.7). Installed SolderSleeve devices shall be conditioned in accordance with MIL-
STD-202, Method 107, test condition F, except that the maximum temperature extreme shall be the
maximum continuous operating temperature of the SolderSleeve device or wire, whichever is lower. After
conditioning, the voltage drop and tensile strength shall be measured in accordance with 4.5.3 and 4.5.4.
4.5.10 Heat Aging (see 3.6.8). Installed SolderSleeve devices shall be conditioned in an oven at the maximum
operating temperature of the SolderSleeve device or wire, whichever is lower. The duration of the test shall
be 96 hours. Specimens shall be placed in the oven horizontally. After conditioning, voltage drop, dielectric
withstanding voltage, and tensile strength tests shall be performed in accordance with 4.5.3, 4.5.5, and 4.5.4.
4.5.11 Fluid Resistance (see 3.6.9). Installed SolderSleeve devices shall be immersed in test fluids as specified in
Table II. A separate specimen shall be immersed in each fluid. After the fluid immersion, dielectric
withstanding voltage testing shall be performed in accordance with 4.5.5.
SPECIFICATION RT-1404 ISSUE 9 Page 9
4.5.12 Flammability (see 3.6.10). Installed devices shall be suspended horizontally in a draft-free enclosure. A
Bunsen Burner with a 3/8 inch bore, 1/4 inch inlet and 4 inch length shall be connected to a natural gas
source and adjusted to produce a 2 inch high flame with a 3/4 inch inner cone. The top of this inner cone
shall be applied to the center of the SolderSleeve device under test. After 20 seconds, the flame shall be
removed, and the length of time required for the flame to extinguish shall be recorded.
4.5.13 Altitude Immersion (see 3.6.11). Installed devices shall be immersed in a water bath containing 0.5 percent
of an anionic wetting agent so that the free ends of the leads are a minimum of 2 inches above the top surface
of the water. After immersion for at least 30 minutes, insulation resistance shall be measured between the
conductor and the water bath in accordance with MIL-STD- 202, Method 302, test condition A, with 1
minute electrification time.
Following the insulation resistance measurement, the immersed specimens shall be placed in a vacuum
chamber. The vacuum chamber shall be evacuated to a pressure of 1 inch of mercury, maintained at this
pressure for 30 minutes, and returned to ambient pressure. This shall constitute one cycle. A total of three
cycles shall be performed. After the third cycle and while the specimen is still immersed, insulation
resistance shall be measured as described above, and the immersed specimen shall be subjected to dielectric
withstanding voltage testing in accordance with 4.5.5, using the water bath as the outer electrode.
TABLE II. FLUID IMMERSION
SPECIMEN
NUMBER
TEST FLUID
SPECIFICATION
TEST CONDITION
1
2
MIL-L-7808
MIL-L-23699
a) Immerse for 5 minutes at 120 ± 3°C or at the maximum
operating
temperature of the SolderSleeve device or wire,
whichever is lower.
(b) Remove and allow to drain for 1 hour at 23 ± 5°C
(c) Place in oven at rated temperature of device or
wire, whichever is lower, for 22 hours,
(d) Repeat a, b, and c for 7 cycles
3 MIL-H-5606 Same as MIL-L-7808, except 85 ± 3°C for step (a) and
104 ± 3°C for step (c).
4 MIL-A-8243 Same as MIL-L-7808, except 65 ± 3°C for step (a).
5 MIL-C-25769
pH 10-12
6 MIL-T-5624 (a) Immerse at 23 ± 5°C for 20 hours.
(b) Remove and allow to drain for 4 hours at 23 ± 5°C
4.5.14 Thermal Indicator Change (see 3.6.12).
4.5.14.1 Color-Change Type. SolderSleeve devices containing color-change type thermal indicator shall be
installed on the maximum size cable with a convection heat source in accordance with the following
procedure:
a. Carefully observe the solder preform during the heating operation, and remove the assembly from the
heat after the solder preform has collapsed but before it has melted, so that the solder termination has the
characteristics of a "Reject - Insufficient Heat" termination as defined in MIL-S-83519.
SPECIFICATION RT-1404 ISSUE 9 Page 10
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b. Examine the solder joint area for clearly visible amounts of the thermal indicator indicative of
insufficient heating. (Solder joint area for round wires includes the visible area of conductor in the
overlapped portion of the termination. Solder joint area for braid includes the half of the braid
circumference to which the ground lead is soldered, in the overlapped portion of the termination.)
c. Reheat the specimen until the thermal indicator color change is complete in the solder joint area. Do
not continue heating after the color change is complete.
d. Examine the solder joint area for evidence that the termination is acceptable in accordance with MIL-
S-83519.
4.5.14.2 Thermally Fusible Ring Type. SolderSleeve devices containing thermally fusible ring type thermal
indicator shall be installed on the maximum size cable with a convection heat source in accordance with
the following procedure:
a. Carefully observe the solder preform during the heating operation, and remove the assembly from the
heat after the solder preform has collapsed but before it has melted, so that the solder termination has the
characteristics of a "Reject - Insufficient Heat" termination as defined in MIL-S-83519.
b. Examine the solder joint area for the clearly visible presence of the thermally fusible ring indicative of
insufficient heating. (Solder joint area for round wires includes the visible area of conductor in the
overlapped portion of the termination. Solder joint area for braid includes the half of the braid
circumference to which the ground lead is soldered, in the overlapped portion of the termination.)
c. Reheat the specimen until the thermally fusible ring loses all appearance of a preform shape. Do not
continue heating after the change is complete.
d. Examine the solder joint area for evidence that the termination is acceptable in accordance with MIL-
MIL-S-83519.
4.5.15 Copper Mirror Corrosion (see 3.6.13). SolderSleeve devices shall be tested in accordance with MIL-S-
83519.
5.0 PREPARATION FOR DELIVERY
5.1 Packaging and Packing. SolderSleeve devices shall be packaged and packed in accordance with standard
commercial practice.
5.2 Marking. Unless otherwise specified in the procurement document, marking shall be in accordance with
commercial practice.
6.0 NOTES
6.1 Intended Use. The SolderSleeve devices described in this specification are intended for use in making
soldered connections between cable shields and ground leads, between cable shields and primary
conductors, or between two primary conductors, depending on the type of device provided that the cable
shields and conductors are solderable. The solderability of the cable shields and conductors are the
responsibility of the users. They are suitable for usage within the limitations set forth in this document and
in the applicable Raychem specification control drawing.
The application in which any SolderSleeve device is used should conform with the Raychem Selection
Guide, and the installation should be in accordance with the applicable installation procedures.
SPECIFICATION RT-1404 ISSUE 9 Page 11
6.2 Ordering Data.
Procurement documents should specify the following:
(a) Raychem part number;
(b) Quantity;
(c) Any special marking or packaging requirements.
6.3 Design Modification.
Raychem reserves the right to make minor design modifications (which do not affect the form, fit or
primary function of the product) without notification.
6.4 Storage Recommendations.
Raychem SolderSleeve devices may be stored up to 5 years after the date of manufacture indicated on the
label, provided that the following conditions are satisfied:
• o The products are kept unopened in their original packages.
• o The storage temperature does not exceed +50°C or fall below +5°C, and the relative humidity does not
exceed 80 percent.
If storage exceeds 5 years, or storage conditions are not as described above, the user should carry out tests
on installed products to ensure that solder joints have acceptable mechanical and electrical characteristics.
Devices containing metallic components in addition to solder (such as ground leads or other conductors)
shall be stored in unopened containers in order to preserve solderability.
