INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-LBA110L-R07 1
LBA110L
Dual Single-Pole, Combination
OptoMOS® Relay
Part # Description
LBA110L 8-Pin DIP (50/Tube)
LBA110PL 8-Pin Flatpack (50/Tube)
LBA110PLTR 8-Pin Flatpack (1000/Reel)
LBA110LS 8-Pin Surface Mount (50/Tube)
LBA110LSTR 8-Pin Surface Mount (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 350 VP
Load Current ±120 mArms / mADC
On-Resistance (max) 35
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
• 3750Vrms Input/Output Isolation
• Normally Open Relay is a Current-Limiting Device
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Flammability Rating UL 94 V-0
• Surface Mount Tape & Reel Versions Available
LBA110L is a combination device comprising one
normally open (1-Form-A) and one normally closed
(1-Form-B) solid state relays. Both relays are
independent, 350V, 120mA, 35 devices designed to
provide an ideal solution where a complementary relay
pair (1-Form-A / 1-Form-B) is required.
The normally open (1-Form-A) relay is configured as a
current-limiting device.
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
1
2
3
4
8
7
6
5
+ Control - Normally Closed
– Control - Normally Closed
+ Control - Normally Open
– Control - Normally Open
Normally Closed Pole
Normally Open Pole
Switching Characteristics of
Normally Open
(Form A) Devices
Switching Characteristics of
Normally Closed
(Form B) Devices
Form-A
IF
ILOAD
10%
90%
ton toff
Form-B
IF
10% 90%
ILOAD
toff ton
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R07
LBA110L
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - ±120 mArms / mADC
Peak (1-Form-B Relay Only) t =10ms ILPK - - ±350 mAP
Load Current Limiting (1-Form-A Relay Only) - ICL ±130 ±170 ±210 mA
On-Resistance 2IL=120mA RON -2335
Off-State Leakage Current VL=350VPILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --3 ms
Turn-Off toff --3
Output Capacitance VL=50V, f=1MHz COUT -25- pF
Input Characteristics
Input Control Current to Activate IL=120mA IF--5 mA
Input Control Current to Deactivate - - 0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance VIO=0V, f=1MHz CIO -3- pF
1 If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value.
2 Measurement taken within one (1) second of on-time.
Parameter Ratings Units
Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / °C
2 Derate linearly 6.67 mW / °C
Absolute Maximum Ratings @ 25°C
Electrical Characteristics @ 25°C
INTEGRATED CIRCUITS DIVISION
LBA110L
www.ixysic.com 3
R07
Form-A
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
0.15 0.35 0.650.25 0.45
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
0.55
Form-A
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
0.03 0.13 0.230.180.08
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Form-A
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=120mADC)
35
30
25
20
15
10
5
0
15.8 16.4 17.0 17.616.1 16.7 17.3
On-Resistance (:)
Device Count (N)
Form-A
Typical IF for Switch Operation
(N=50, IL=120mADC)
0.5 0.9 1.30.7 1.1 1.5
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Form-A
Typical IF for Switch Dropout
(N=50, IL=120mADC)
25
20
15
10
5
0
0.45 1.05 1.650.15 0.75 1.35 1.95
LED Current (mA)
Device Count (N)
Form-A
Typical Blocking Voltage Distribution
(N=50)
35
30
25
20
15
10
5
0
376.8 379.8 382.8 385.8378.3 381.3 384.3
Blocking Voltage (VP)
Device Count (N)
Form-A RELAY PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical Leakage vs. Temperature
Measured Across Pins 5&6 or 7&8
Temperature (ºC)
Leakage (PA)
-40
0.030
0.025
0.020
0.015
0.010
0.005
0-20 0 20 40 60 80 100
Form-A/Form-B PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R07
LBA110L
FormA
Typical Turn-On Time
vs. LED Forward Current
(IL=120mADC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.40
0.35
0.30
0.25
0.20
0.15
0.10
50
Form-A
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.092
0.090
0.088
0.086
0.084
0.082
0.080
0.078
0.076
0.074
50
Form-A
Typical On-Resistance vs. Temperature
(IF=5mA, IL=120mADC)
Temperature (ºC)
On-Resistance (:)
-40
20
18
16
14
12
10
8
-20 0 20 40 60 80 100
Form-A
Typical Turn-On Time
vs. Temperature
(IL=120mADC)
Temperature (ºC)
Turn-On Time (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
-20 0 20 40 60 80 100
IF=20mA
IF=5mA
IF=10mA
Form-A
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=120mADC)
Temperature (ºC)
Turn-Off TIme (ms)
-40
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
-20 0 20 40 60 80 100
Form A
Maximum Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
I
F
=20mA
I
F
=10mA
I
F
=5mA
Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=120mADC)
Temperature (ºC)
LED Current (mA)
-40
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Form-A
Typical IF for Switch Dropout
vs. Temperature
(IL=120mADC)
Temperature (ºC)
LED Current (mA)
-40
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Form-A
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
400
395
390
385
380
375
370
365
360
355
-20 0 20 40 60 80 100
Form-A
Typical Load Current vs. Load Voltage
(IF=5mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-2.0 -1.5 -0.5-1.0 0 0.5 1.0 1.5 2.0
Form-A
Typical Current Limiting Characteristics
vs. Temperature
(IF=5mA)
Temperature (ºC)
Current Limit (mA)
-40
250
200
150
100
50
0
-20 0 20 40 60 80 100
Form-A PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
LBA110L
www.ixysic.com 5
R07
Form-B
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
0.10 0.18 0.260.14 0.22 0.30
Turn-On Time (ms)
Device Count (N)
30
25
20
15
10
5
0
Form-B
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
0.35 0.55 0.750.650.450.25
Turn-Off Time (ms)
Device Count (N)
30
25
20
15
10
5
0
Form-B
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=120mADC)
30
25
20
15
10
5
0
27.8 29.2 30.6 32.028.5 29.9 31.3
On-Resistance (:)
Device Count (N)
Form-B
Typical IF for Switch Operation
(N=50, IL=120mADC)
30
25
20
15
10
5
0
0.7 1.1 1.5 1.91.3
LED Current (mA)
Device Count (N)
Form-B
Typical IF for Switch Dropout
(N=50, IL=120mADC)
25
20
15
10
5
0
0.45 0.65 0.850.35 0.55 0.75 0.95
LED Current (mA)
Device Count (N)
Form-B
Typical Blocking Voltage Distribution
(N=50)
30
25
20
15
10
5
0
386.3 391.3 396.3 401.3388.8 393.8 398.8
Blocking Voltage (VP)
Device Count (N)
Form-B
Typical Turn-On Time
vs. LED Forward Current
(IL=120mADC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.25
0.20
0.15
0.10
0.05
50
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Form-B
Typical On-Resistance vs. Temperature
(IF=5mA, IL=120mADC)
Temperature (ºC)
On-Resistance (:)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
FormB
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=120mADC)
Temperature (ºC)
Turn-On Time (ms)
-40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100
Form-B
Typical Turn-Off Time
vs. Temperature
(IL=120mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
0.7
0.6
0.5
0.4
0.3
0.2
0.1
-20 0 20 40 60 80 100
IF=5mA
IF=10mA
IF=20mA
Form-B
Maximum Load Current vs. Temperature
(IF=5mA)
Temperature (ºC)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
Form-B PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R07
LBA110L
Form-B
Typical IF for Switch Operation
vs. Temperature
(IL=120mADC)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Form-B
Typical IF for Switch Dropout
vs. Temperature
(IL=120mADC)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Form-B
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
410
405
400
395
390
385
380
375
370
365
360 -20 0 20 40 60 80 100
Form-B
Typical Load Current vs. Load Voltage
(IF=5mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-4 -3 -1-2 0 1 2 3 4
Form-B
Energy Rating Curve
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
Form-B PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
LBA110L
www.ixysic.com 7
R07
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
LBA110L / LBA110LS / LBA110PL MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
LBA110L 250ºC 30 seconds 1
LBA110LS 250ºC 30 seconds 3
LBA110PL 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
8R07
LBA110L
MECHANICAL DIMENSIONS
LBA110L
LBA110LS
LBA110PL
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
9
LBA110L
Specification: DS-LBA110L-R07
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/25/2018
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
MECHANICAL DIMENSIONS
LBA110LSTR Tape & Reel
LBA110PLTR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P1=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P1 = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
