A Y
Copyright © 2016,
Texas Instruments Incorporated
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN5407
,
SN5417
,
SN7407
,
SN7417
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
SNx407 and SNx417 Hex Buffers and Drivers With Open-Collector High-Voltage Outputs
1
1 Features
1• Convert TTL Voltage Levels to MOS Levels
• High Sink-Current Capability Design
• Open-Collector Driver for Indicator Lamps
• Inputs Fully Compatible With Most TTL Circuits
• On Products Compliant to MIL-PRF-38535,
All Parameters Are Tested Unless Otherwise
Noted. On All Other Products, Production
Processing Does Not Necessarily Include Testing
of All Parameters.
2 Applications
• Audio Docks: Portable
• Blu-ray Disc®Players and Home Theaters
• MP3 Players or Recorders
• Personal Digital Assistants (PDAs)
• Power: Telecom and Server AC or DC Supply:
Single Controllers: Analog and Digital
• Solid-State Drive (SSD): Client and Enterprise
• TV: LCD, Digital, and High-Definition (HDTV)
• Tablets: Enterprise
• Video Analytics: Servers
• Wireless Headsets, Keyboards, and Mice
3 Description
These TTL hex buffers and drivers feature high-
voltage open-collector outputs for interfacing with
high-level circuits (such as MOS) or for driving high-
current loads (such as lamps or relays), and also are
characterized for use as buffers for driving TTL
inputs. The SN5407 and SN7407 devices have
minimum breakdown voltages of 30 V, and the
SN5417 and SN7417 devices have minimum
breakdown voltages of 15 V. The maximum sink
current is 30 mA for the SN5407 and SN5417 devices
and 40 mA for the SN7407 and SN7417 devices.
These devices perform the Boolean function Y = A in
positive logic.
These circuits are completely compatible with most
TTL families. Inputs are diode clamped to minimize
transmission-line effects, which simplifies design.
Typical power dissipation is 145 mW, and average
propagation delay time is 14 ns.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SNx407J,
SNx417J CDIP (14) 19.56 mm × 6.92 mm
SN74x7D SOIC (14) 8.65 mm × 3.91 mm
SN74x7N PDIP (14) 19.30 mm × 6.35 mm
SNJ5407FK LCCC (20) 8.89 mm × 8.89 mm
SNJ5407W CFP (14) 9.21 mm × 5.97 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram, Each Buffer and Driver (Positive Logic)
2
SN5407
,
SN5417
,
SN7407
,
SN7417
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
www.ti.com
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation Feedback Copyright © 1983–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 5
6.7 Typical Characteristics.............................................. 6
7 Parameter Measurement Information .................. 7
8 Detailed Description.............................................. 8
8.1 Overview................................................................... 8
8.2 Functional Block Diagram......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 8
9 Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application.................................................... 9
10 Power Supply Recommendations ..................... 10
11 Layout................................................................... 10
11.1 Layout Guidelines ................................................. 10
11.2 Layout Example .................................................... 10
12 Device and Documentation Support................. 11
12.1 Documentation Support ........................................ 11
12.2 Related Links ........................................................ 11
12.3 Receiving Notification of Documentation Updates 11
12.4 Community Resources.......................................... 11
12.5 Trademarks........................................................... 11
12.6 Electrostatic Discharge Caution............................ 11
12.7 Glossary................................................................ 11
13 Mechanical, Packaging, and Orderable
Information........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (May 2004) to Revision H Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
• Deleted Ordering Information table; see POA at the end of the data sheet........................................................................... 1
• Added Military Disclaimer to Features.................................................................................................................................... 1
• Changed RθJA values for SN7404: D (SOIC) from 86 to 86.8, N (PDIP) from 80 to 52.1, and NS (SO) from 76 to 85.9...... 5
42A
5NC
62Y
7NC
83A
93Y
10GND
11NC
124Y
134A
14 5Y
15 NC
16 5A
17 NC
18 6Y
19 6A
20 VCC
1 NC
2 1A
3 1Y
Not to scale
11A 14 VCC
21Y 13 6A
32A 12 6Y
42Y 11 5A
53A 10 5Y
63Y 9 4A
7GND 8 4Y
Not to scale
3
SN5407
,
SN5417
,
SN7407
,
SN7417
www.ti.com
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation FeedbackCopyright © 1983–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
D, N, NS, J, or W Package
14-Pin SOIC, PDIP, CDIP, or CFP
Top View
FK Package
20-Pin LCCC
Top View
NC – No internal connection
Pin Functions
PIN I/O DESCRIPTION
NAME SOIC, PDIP,
CDIP, CFP LCCC
1A 1 2 I Input 1
1Y 2 3 O Output 1
2A 3 4 I Input 2
2Y 4 6 O Output 2
3A 5 8 I Input 3
3Y 6 9 O Output 3
4A 9 13 I Input 4
4Y 8 12 O Output 4
5A 11 16 I Input 5
5Y 10 14 O Output 5
6A 13 19 I Input 6
6Y 12 18 O Output 6
GND 7 10 — Ground Pin
NC — 1, 5, 7, 11, 15,
17 — No Connect
VCC 14 20 — Power Pin
4
SN5407
,
SN5417
,
SN7407
,
SN7417
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
www.ti.com
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation Feedback Copyright © 1983–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) This is the maximum voltage that can safely be applied to any output when it is in the OFF state.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 7 V
VIInput voltage(2) 5.5 V
VOOutput voltage(2)(3) SN5407, SN7407 30 V
SN5417, SN7417 15
TJJunction temperature 150 ºC
Tstg Storage temperature –65 150 ºC
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
SN7407 AND SN7417
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
SN5407 AND SN5417
V(ESD) Electrostatic discharge Human-body model (HBM) ±2000 V
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating
CMOS Inputs,.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VCC Supply voltage SN5407, SN5417 4.5 5 5.5 V
SN7407, SN7417 4.75 5 5.25
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VOH High-level output voltage SN5407, SN7407 30 V
SN5417, SN7417 15
IOL Low-level output current SN5407, SN5417 30 mA
SN7407, SN7417 40
TAOperating free-air temperature SN5407, SN5417 –55 125 °C
SN7407, SN7417 0 70
5
SN5407
,
SN5417
,
SN7407
,
SN7417
www.ti.com
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation FeedbackCopyright © 1983–2016, Texas Instruments Incorporated
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
6.4 Thermal Information
THERMAL METRIC(1) SN7407 SN7417
UNITD (SOIC) N (PDIP) NS (SO) D (SOIC) N (PDIP)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance(2) 86.8 52.1 85.9 88.8 52.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.1 39.4 43.9 50.4 39.4 °C/W
RθJB Junction-to-board thermal resistance 41 32 44.7 43 32 °C/W
ψJT Junction-to-top characterization parameter 15.6 24.2 14.6 16.5 24.2 °C/W
ψJB Junction-to-board characterization parameter 40.8 31.8 44.4 42.8 31.8 °C/W
(1) All typical values are at VCC = 5 V, TA= 25°C.
(2) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIK Input clamp voltage VCC = MIN, II= –12 mA –1.5 V
VOL Low-level output voltage VCC = MIN,
VIL = 0.8 V
IOL = 16 mA 0.4 VIOL = 30 mA, SN5407, SN5417 0.7
IOL = 40 mA, SN7407, SN7417 0.7
IOH High-level output current VCC = MIN,
VIH = 2 V VOH = 30 V, SN5407, SN7407 0.25 mA
VOH = 15 V, SN5417, SN7417 0.25
IIInput current VCC = MAX, VI= 5.5 V 1 mA
IIH High-level input current VCC = MAX, VIH = 2.4 V 40 µA
IIL Low-level input current VCC = MAX, VIL = 0.4 V –1.6 mA
ICCH High-level supply current VCC = MAX 29 41 mA
ICCL Low-level supply current VCC = MAX 21 30 mA
6.6 Switching Characteristics
VCC = 5 V, TA= 25°C (see Figure 2)
PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT
tPLH A Y RL= 110 Ω, CL= 15 pF 6 10 ns
tPHL 20 30
tPLH A Y RL= 150 Ω, CL= 50 pF 15 ns
tPHL 26
0
3
6
9
12
15
0 5 10 15 20 25 30
tpd (ns)
Vout (V)
C001
6
SN5407
,
SN5417
,
SN7407
,
SN7417
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
www.ti.com
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation Feedback Copyright © 1983–2016, Texas Instruments Incorporated
6.7 Typical Characteristics
Figure 1. Time Low to High vs VOUT
From Output
Under Test
CL
(see Note A)
RL
Test Point
VCC
LOAD CIRCUIT
1.5 V 1.5 V
High-Level
Pulse
1.5 V 1.5 V
tw
Low-Level
Pulse
VOLTAGE WAVEFORMS
PULSE WIDTHS
1.5 V 1.5 V
Input
tPLH
In-Phase
Output
3 V
0 V
1.5 V 1.5 V
VOH
VOL
tPHL
1.5 V 1.5 V
VOH
VOL
tPHL tPLH
Out-of-Phase
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
7
SN5407
,
SN5417
,
SN7407
,
SN7417
www.ti.com
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation FeedbackCopyright © 1983–2016, Texas Instruments Incorporated
7 Parameter Measurement Information
A. CLincludes probe and jig capacitance.
B. In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤1 MHz, ZO= 50 Ω, tr≤7 ns,
tf≤7 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
Figure 2. Load Circuit and Voltage Waveforms
6 kΩ
Input A
Output Y
GND
VCC
3.4 kΩ1.6 kΩ
100 Ω
1 kΩ
Copyright © 2016, Texas Instruments Incorporated
8
SN5407
,
SN5417
,
SN7407
,
SN7417
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
www.ti.com
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation Feedback Copyright © 1983–2016, Texas Instruments Incorporated
8 Detailed Description
8.1 Overview
The SN74x7 is a high sink current capable open-collector buffer. This device is high-voltage tolerant on the
output of up to 30 V on the SNx407 model and 15 V on the SNx417 model. The SN74x7 is also useful for
converting TTL voltage levels to MOS levels.
8.2 Functional Block Diagram
Resister values shown are nominal.
Figure 3. Schematic
8.3 Feature Description
The SNx407 and SNx417 devices are ideal for high voltage outputs. The SNx407 device has a maximum output
voltage 30 V and the SNx417 device has a maximum output voltage 15 V.
The high sink current is up to 40 mA for the SN74x7.
8.4 Device Functional Modes
Table 1 lists the functions of the devices.
Table 1. Function Table
INPUT
AOUTPUT
Y
H High-Z
L L
9
SN5407
,
SN5417
,
SN7407
,
SN7417
www.ti.com
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation FeedbackCopyright © 1983–2016, Texas Instruments Incorporated
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SN74x7 device is a high-drive, open-collector device that is used for multiple buffer-type functions. The
device produces 30 mA of drive current. Therefore, this device is ideal for driving multiple inputs and for high-
speed applications up to 100 MHz. The outputs are high voltage tolerant up to 30 V for the SNx407.
9.2 Typical Application
Figure 4. Typical Application Diagram
9.2.1 Design Requirements
Avoid bus contention because it can drive currents that would exceed maximum limits. The high drive also
creates fast edges into light loads; therefore, routing and load conditions must be considered to prevent ringing.
9.2.2 Detailed Design Procedure
1. Recommended Input Conditions
– Rise time and fall time specs: See tPHL and tPLH in Switching Characteristics.
– Specified high and low levels: See VIH and VIL in Recommended Operating Conditions.
2. Recommend Output Conditions
– Load currents must not exceed 30 mA.
– Outputs must not be pulled above 30 V for the SNx407 device.
Vcc
Unused Input
Input
Output
Input
Unused Input Output
15
20
25
30
35
40
0.4 0.5 0.6 0.7
IOL (mA)
VOL(V)
C002
10
SN5407
,
SN5417
,
SN7407
,
SN7417
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
www.ti.com
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation Feedback Copyright © 1983–2016, Texas Instruments Incorporated
Typical Application (continued)
9.2.3 Application Curve
Figure 5. VOL vs IOL
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating (see
Recommended Operating Conditions).
Each VCC pin must have a good bypass capacitor to prevent power disturbance. TI recommends 0.1 µF for
devices with a single supply. If there are multiple VCC pins, then TI recommends 0.01 µF or 0.022 µF for each
power pin. It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise. A 0.1 µF
and a 1 µF are commonly used in parallel. The bypass capacitor must be installed as close to the power pin as
possible for best results.
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices inputs must never float.
In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two
inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins must not be
left unconnected because the undefined voltages at the outside connections result in undefined operational
states. Figure 6 specifies the rules that must be observed under all circumstances. All unused inputs of digital
logic devices must be connected to a high or low bias to prevent them from floating. The logic level that must be
applied to any particular unused input depends on the function of the device. Generally they are tied to GND or
VCC, whichever makes more sense or is more convenient. It is generally acceptable to float outputs, unless the
part is a transceiver.
11.2 Layout Example
Figure 6. Layout Diagram
11
SN5407
,
SN5417
,
SN7407
,
SN7417
www.ti.com
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation FeedbackCopyright © 1983–2016, Texas Instruments Incorporated
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
Implications of Slow or Floating CMOS Inputs, (SCBA004)
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
SN5407 Click here Click here Click here Click here Click here
SN5417 Click here Click here Click here Click here Click here
SN7407 Click here Click here Click here Click here Click here
SN7417 Click here Click here Click here Click here Click here
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert meto register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
Blu-ray Disc is a registered trademark of Blue-ray Disc Association.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.7 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12
SN5407
,
SN5417
,
SN7407
,
SN7417
SDLS032H –DECEMBER 1983–REVISED SEPTEMBER 2016
www.ti.com
Product Folder Links: SN5407 SN5417 SN7407 SN7417
Submit Documentation Feedback Copyright © 1983–2016, Texas Instruments Incorporated
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
JM38510/00803BCA ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
00803BCA
JM38510/00803BDA ACTIVE CFP W 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
00803BDA
M38510/00803BCA ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
00803BCA
M38510/00803BDA ACTIVE CFP W 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
00803BDA
SN5407J ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN5407J
SN5417J ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SN5417J
SN7407D ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7407
SN7407DE4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7407
SN7407DG4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7407
SN7407DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7407
SN7407DRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7407
SN7407DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7407
SN7407N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN7407N
SN7407NE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN7407N
SN7407NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 SN7407
SN7407NSRG4 ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 SN7407
SN7417D ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7417
SN7417DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7417
SN7417N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN7417N
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ5407FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 SNJ5407FK
SNJ5407J ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ5407J
SNJ5407W ACTIVE CFP W 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ5407W
SNJ5417J ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 SNJ5417J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN5407, SN5417, SN7407, SN7417 :
•Catalog: SN7407, SN7417
•Military: SN5407, SN5417
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN7407DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN7407DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN7407NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN7417DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN7407DR SOIC D 14 2500 333.2 345.9 28.6
SN7407DR SOIC D 14 2500 853.0 449.0 35.0
SN7407NSR SO NS 14 2000 853.0 449.0 35.0
SN7417DR SOIC D 14 2500 853.0 449.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
14X .008-.014
[0.2-0.36]
TYP
-15
0
AT GAGE PLANE
-.314.308 -7.977.83[ ]
14X -.026.014 -0.660.36[ ]
14X -.065.045 -1.651.15[ ]
.2 MAX TYP
[5.08] .13 MIN TYP
[3.3]
TYP-.060.015 -1.520.38[ ]
4X .005 MIN
[0.13]
12X .100
[2.54]
.015 GAGE PLANE
[0.38]
A
-.785.754 -19.9419.15[ ]
B -.283.245 -7.196.22[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
78
14
1
PIN 1 ID
(OPTIONAL)
SCALE 0.900
SEATING PLANE
.010 [0.25] C A B
www.ti.com
EXAMPLE BOARD LAYOUT
ALL AROUND
[0.05] MAX.002
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
METAL
(.063)
[1.6]
(R.002 ) TYP
[0.05]
14X ( .039)
[1]
( .063)
[1.6]
12X (.100 )
[2.54]
(.300 ) TYP
[7.62]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
SEE DETAIL A SEE DETAIL B
SYMM
SYMM
1
78
14
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
DETAIL B
13X, SCALE: 15X
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,
costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated
