SEMiX604GB12Vs
© by SEMIKRON Rev. 2 16.02.2011 1
SEMiX® 4s
GB
SEMiX604GB12Vs
Features
Homogeneous Si
•V
CE(sat) with positive temperature
coefficient
High short circuit capability
UL recognised file no. E63532
Typical Applications*
•AC inverter drives
•UPS
Electronic Welding
Remarks
Case temperature limited to TC=125°C
max.
Product reliability results are valid for
Tj=150°C
Dynamic values apply to the
following combination of resistors:
RGon,main = 1,0
RGoff,main = 1,0
RG,X = 2,2
RE,X = 0,5
Absolute Maximum Ratings
Symbol Conditions Values Unit
IGBT
VCES 1200 V
ICTj= 175 °C Tc=2C 880 A
Tc=8C 670 A
ICnom 600 A
ICRM ICRM = 3xICnom 1800 A
VGES -20 ... 20 V
tpsc
VCC = 600 V
VGE 15 V
VCES 1200 V
Tj=12C 10 µs
Tj-40 ... 175 °C
Inverse diode
IFTj= 175 °C Tc=2C 707 A
Tc=8C 529 A
IFnom 600 A
IFRM IFRM = 3xIFnom 1800 A
IFSM tp= 10 ms, sin 180°, Tj=2C 3240 A
Tj-40 ... 175 °C
Module
It(RMS) Tterminal =8C 600 A
Tstg -40 ... 125 °C
Visol AC sinus 50Hz, t = 1 min 4000 V
Characteristics
Symbol Conditions min. typ. max. Unit
IGBT
VCE(sat) IC=600A
VGE =15V
chiplevel
Tj=2C 1.75 2.2 V
Tj=15C 2.2 2.5 V
VCE0 Tj=2C 0.94 1.04 V
Tj=15C 0.88 0.98 V
rCE VGE =15V Tj=2C 1.4 1.9 m
Tj=15C 2.2 2.5 m
VGE(th) VGE=VCE, IC= 24 mA 5.5 6 6.5 V
ICES VGE =0V
VCE = 1200 V
Tj=2C 0.1 0.3 mA
Tj=15C mA
Cies VCE =25V
VGE =0V
f=1MHz 36.0 nF
Coes f=1MHz 3.55 nF
Cres f=1MHz 3.54 nF
QGVGE = - 8 V...+ 15 V 6600 nC
RGint Tj=2C 1.25
td(on) VCC = 600 V
IC=600A
VGE 15V
RG on =1.7
RG off =1.7
di/dton = 6300 A/µs
di/dtoff =5400A/µs
du/dtoff = 6800 V/
µs
Tj=15C 517 ns
trTj=15C 94 ns
Eon Tj=15C 58.7 mJ
td(off) Tj=15C 788 ns
tfTj=15C 102 ns
Eoff Tj=15C 78.5 mJ
Rth(j-c) per IGBT 0.051 K/W
SEMiX604GB12Vs
2 Rev. 2 16.02.2011 © by SEMIKRON
Characteristics
Symbol Conditions min. typ. max. Unit
Inverse diode
VF = VEC IF= 600 A
VGE =0V
chip
Tj=2C 2.1 2.46 V
Tj=15C 2.1 2.4 V
VF0 Tj=2C 1.1 1.3 1.5 V
Tj=15C 0.7 0.9 1.1 V
rFTj=2C 1.1 1.4 1.6 m
Tj=15C 1.8 1.9 2.1 m
IRRM IF= 600 A
di/dtoff =6200A/µs
VGE =-15V
VCC = 600 V
Tj=15C 463 A
Qrr Tj=15C 110 µC
Err Tj=15C 49.5 mJ
Rth(j-c) per diode 0.086 K/W
Module
LCE 22 nH
RCC'+EE' res., terminal-chip TC=2C 0.7 m
TC=12C 1m
Rth(c-s) per module 0.03 K/W
Msto heat sink (M5) 3 5 Nm
Mtto terminals (M6) 2.5 5 Nm
Nm
w400 g
Temperatur Sensor
R100 Tc=100°C (R25=5 k) 493 ± 5%
B100/125 R(T)=R100exp[B100/125(1/T-1/T100)]; T[K]; 3550
±2% K
SEMiX® 4s
GB
SEMiX604GB12Vs
Features
Homogeneous Si
•V
CE(sat) with positive temperature
coefficient
High short circuit capability
UL recognised file no. E63532
Typical Applications*
•AC inverter drives
•UPS
Electronic Welding
Remarks
Case temperature limited to TC=125°C
max.
Product reliability results are valid for
Tj=150°C
Dynamic values apply to the
following combination of resistors:
RGon,main = 1,0
RGoff,main = 1,0
RG,X = 2,2
RE,X = 0,5
SEMiX604GB12Vs
© by SEMIKRON Rev. 2 16.02.2011 3
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic
SEMiX604GB12Vs
4 Rev. 2 16.02.2011 © by SEMIKRON
Fig. 7: Typ. switching times vs. ICFig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Typ. transient thermal impedance Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE'
Fig. 11: Typ. CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode recovery charge
SEMiX604GB12Vs
© by SEMIKRON Rev. 2 16.02.2011 5
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
SEMiX 4s
spring configuration