TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
Small Signal Diode
Designed for mounting on small surface.
Moisture sensitivity level 1
Protects one birectional I/O line
Working Voltage : 5V, 12V, 24V
Case : 0503 standard package, molded plastic Min Max Min Max
1.15 1.35 0.045 0.053
0.65 0.85 0.026 0.034
0.60. 0.75 0.024 0.030
Notebooks, Desktops, and Servers
Keypads, Side Keys, USB 2.0, LCD Displays
Portable Instrumentation
Touch panel
Part No. Package codePackage Packing Marking
TESDE5V0 RZG 0503 4K / 7" Reel E05
TESDE12V RZG 0503 4K / 7" Reel E12
TESDE24V RZG 0503 4K / 7" Reel E24
Maximum Ratings and Electrical Characteristics
Maximum Ratings
TESDE12V
TESDE24V
W25
47
TESDE5V0
0503
Applications Pin Configutation
Cell Phone Handsets and Accessories
C
Terminal: Gold plated,solder
per MIL-STD-750, Method 2026 guaranteed
Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
Marking Code : E05, E12, E24
Mounting position: Any
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
Value
.-55 to + 150.Junction and Storage Temperature Range TJ, TSTG
PPP
Peak Pulse Power (tp=8/20μs
waveform)
KV
Type Number
Rating at 25°C ambient temperature unless otherwise specified.
EWeight :2 mg (approximately)
Ordering Information
Symbol
±15
±8
VESD
Features
Mechanical Data
Pb free version, RoHS compliant, and Halogen free
High temperature soldering guaranteed: 260°C/10s
Unit (mm)
°C
Unit (inch)
Dimensions
D
A
0.55(Typ.)
Units
Suggested PAD Layout
75
0.022(Typ.)
B
0.40(Typ.) 0.016(Typ.)
0.85
0.033
0.012
0.55
0.022
0.055
1.40 mm
inch
Unit :
Version : C11
TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
Small Signal Diode
Electrical Characteristics
TESDE5V0
TESDE12V
TESDE24V
TESDE5V0
TESDE12V
TESDE24V
TESDE5V0 5V
TESDE12V 12V
TESDE24V 24V
1A
5A
1A
5A
1A
5A
TESDE5V0
TESDE12V
TESDE24V
V
IPP=
TESDE5V0
VR=
Reverse Leakage Current IR
IPP=Vc
VR=
VR=
Vc -
-
-
Clamping Voltage
V
Clamping Voltage IPP=Vc
Clamping Voltage IPP=
VR=0V, f=1.0MHzJunction Capacitance
IPP=-33
TESDE12V
TESDE24V
CJ
V
IPP=-51
Type Number Symbol Min Max Units
-
VVRWM
5
V(BR) V
5.1 -
Reverse Breakdown Voltage
Reverse Stand-Off Voltage
13 -
25 -
IR= 1mA
12
24
2
15 (Typ.)
-47
25
9.8
-15
12 (Typ.)
10 (Typ.)
uA
pF
Version : C11
TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
Small Signal Diode
Rating and Sharacteristic Curves
Ambient Tempeatature (oC) Reverse Voltage (V)
FIG 4 Typical Junction Capacitance
0
5
10
15
0 5 10 15 20 25
Normalized Capacitance
0
10
20
30
40
50
60
012345
Clamping Voltage (V)
FIG 5 Clamping Voltage vs. Peak Pulse Current)
Peak Pulse Current (A)
Waveform Parameters
tr = 8
μ
s
,
td = 20
μ
s
TESDE5V0
TESDE12V
TESDE24V
TESDE5V0
TESDE12V
TESDE24V
0.01
0.1
1
10
0.1 1 10 100 100
0
Peak Pulse Power Ppp (KW)
FIG 1 Non-Repetitive Peak Pulse Power vs. Pulse Time FIG 2 Pulse Waveform
0
10
20
30
40
50
60
70
80
90
100
110
0 5 10 15 20 25 30
Percent of IPP
td=Ipp/2
Time (us)
Waveform Parameters:
tr = 8μs, td = 20μs
FIG 3 Admissible Power Dissipation Curve
0
20
40
60
80
100
120
0 20 40 60 80 100 120 140 160 180
Power Rating (%)
f = 1.0MHz
Version : C11
TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
Small Signal Diode
Applications Information
Designed to protect sensitive electronics from damage or latch-up due to ESD
Designed to replace multilayer varistors (MLVs) in portable applications
Features large crosssectional area junctions for conducting high transient currents
Offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs
Circuit Board Layout Recommendations
Tape & Reel specification
Reel width W1 13.5 Max
Overall tape thickness T 0.23 ± 0.05
Tape width W 8.00 ±0.20
Sprocket hole pitch P0 4.00 ±0.10
Embossment center P1 2.00 ±0.05
Punch hole position F 3.50 ±0.05
Punch hole pitch P 4.00 ±0.10
Feed hole width D2 13.0 ± 0.20
Sprocket hole position E 1.75 ±0.10
Reel outside diameter D 178 ± 1
Reel inner diameter D1 60.0 Min
Carrier depth C 0.80 ± 0.10
Sprocket hole d 1.55 ± 0.05
Carrier width A 0.90 ± 0.10
Carrier length B 1.46 ± 0.10
Minimize the path length between the ESD Protection Diode and the protected line.
Minimize all conductive loops including power and ground loops.
The ESD transient return path to ground should be kept as short as possible.
Designed to protect one data, I/O, or power supply line.
The combination of small size and high ESD surge capability makes them ideal for use in portable applications.
Good circuit board layout is critical for the suppression of ESD induced transients.
Place the ESD Protection Diode near the input terminals or connectors to restrict transient coupling.
Item Symbol Dimension
(mm)
Never run critical signals near board edges.
Use ground planes whenever possible.
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
TSC label
W1
D1D2
D
T
C
dP1
P0
A
B
FW
E
Direction of Feed
Version : C11
