INTEGRATED CIRCUITS DATA SHEET TDA1519C 22 W BTL or 2 x 11 W stereo power amplifier Product specification Supersedes data of 2001 Aug 24 2004 Jan 28 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C FEATURES GENERAL DESCRIPTION * Requires very few external components for Bridge-Tied Load (BTL) operation The TDA1519C is an integrated class-B dual output amplifier in a 9-lead plastic single in-line power package or 20-lead heatsink small outline package. * Stereo or BTL application * High output power For the TDA1519CTH (SOT418-3), the heatsink is positioned on top of the package, which allows an external heatsink to be mounted on top. The heatsink of the TDA1519CTD (SOT397-1) is facing the PCB, allowing the heatsink to be soldered onto the copper area of the PCB. * Low offset voltage at output (important for BTL applications) * Fixed gain * Good ripple rejection * Mute/standby switch * Load dump protection * AC and DC short-circuit safe to ground and VP * Thermally protected * Reverse polarity safe * Capability to handle high energy on outputs (VP = 0 V) * No switch-on/switch-off plops * Protected against electrostatic discharge * Low thermal resistance * Identical inputs (inverting and non-inverting) * Pin compatible with TDA1519B (TDA1519C and TDA1519CSP). ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1519C SIL9P DESCRIPTION VERSION plastic single in-line power package; 9 leads SOT131-2 TDA1519CSP SMS9P plastic surface mounted single in-line power package; 9 leads SOT354-1 TDA1519CTD HSOP20 plastic, heatsink small outline package; 20 leads SOT397-1 TDA1519CTH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 2004 Jan 28 2 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage operating 6.0 14.4 17.5 V non-operating - - 30 V load dump protected - - 45 V IORM repetitive peak output current - - 4 A Iq(tot) total quiescent current - 40 80 mA Istb standby current - 0.1 100 A Isw(on) switch-on current - - 40 A BTL 25 - - k stereo 50 - - k RL = 4 - 6 - W RL = 2 Inputs Zi input impedance Stereo application Po output power THD = 10 % - 11 - W cs channel separation 40 - - dB Vn(o)(rms) noise output voltage (RMS value) - 150 - V - 22 - W fi = 100 Hz 34 - - dB fi = 1 to 10 kHz 48 - - dB BTL application Po output power THD = 10 %; RL = 4 SVRR supply voltage ripple rejection RS = 0 VOO DC output offset voltage - - 250 mV Tj junction temperature - - 150 C 2004 Jan 28 3 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C BLOCK DIAGRAM handbook, full pagewidth NINV mute switch 1 Cm 60 k VA 4 OUT1 183 power stage 18.1 k VP 8 + standby switch - M/SS standby reference voltage VA 15 k + + - x1 RR 3 15 k mute reference voltage mute switch TDA1519C TDA1519CSP 18.1 k power stage 183 6 VA INV OUT2 9 Cm 60 k input reference voltage mute switch power ground (substrate) signal ground 2 7 GND1 VP 5 MGL491 GND2 The pin numbers refer to the TDA1519C and TDA1519CSP only, for TDA1519CTD and TDA1519CTH see Figs 3 and 4. Fig.1 Block diagram. 2004 Jan 28 4 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C PINNING PIN SYMBOL DESCRIPTION TDA1519C; TDA1519CSP TDA1519CTD TDA1519CTH NINV 1 19 19 GND1 2 20 20 ground 1 (signal) RR 3 1 1 supply voltage ripple rejection OUT1 4 3 3 output 1 GND2 5 5 5 ground 2 (substrate) OUT2 6 8 8 output 2 VP 7 10 10 positive supply voltage M/SS 8 11 11 mute/standby switch input INV 9 12 12 inverting input n.c. - non-inverting input 2, 4, 6, 7, 9 and 13 to 18 2, 4, 6, 7, 9 and 13 to 18 not connected fpage halfpage NINV 1 RR 1 20 GND1 GND1 2 n.c. 2 19 NINV GND1 20 1 RR NINV 19 2 n.c. n.c. 18 3 OUT1 RR 3 OUT1 3 18 n.c. OUT1 4 n.c. 4 17 n.c. n.c. 17 4 n.c. 16 n.c. n.c. 16 5 GND2 6 n.c. n.c. 14 7 n.c. n.c. 13 8 OUT2 INV 12 9 n.c. TDA1519C GND2 5 TDA1519CSP GND2 5 n.c. 15 TDA1519CTD OUT2 6 n.c. 6 15 n.c. VP 7 n.c. 7 14 n.c. M/SS 8 OUT2 8 13 n.c. INV 9 n.c. 9 12 INV VP 10 11 M/SS MGR561 TDA1519CTH M/SS 11 10 VP 001aaa348 MGL937 Fig.2 Pin configuration TDA1519C and TDA1519CSP. 2004 Jan 28 Fig.3 Pin configuration TDA1519CTD. 5 Fig.4 Pin configuration TDA1519CTH. Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C * Low standby current (<100 A) FUNCTIONAL DESCRIPTION * Low mute/standby switching current (allows for low-cost supply switch) The TDA1519C contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/standby switch which has the following features: * Mute condition. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER CONDITIONS supply voltage MIN. - operating MAX. 17.5 UNIT V non-operating - 30 V load dump protected; during 50 ms; tr 2.5 ms - 45 V - 17.5 V - 6 V - 200 mJ - 6 A - 4 A - 25 W Vsc AC and DC short-circuit-safe voltage Vrp reverse polarity voltage Eo energy handling capability at outputs IOSM non-repetitive peak output current IORM repetitive peak output current Ptot total power dissipation Tj junction temperature - 150 C Tstg storage temperature -55 +150 C VP = 0 V see Fig.5 MGL492 30 handbook, halfpage Ptot (W) (1) 20 (2) 10 (3) 0 -25 0 50 100 150 Tamb (C) (1) Infinite heatsink. (2) Rth(c-a) = 5 K/W. (3) Rth(c-a) = 13 K/W. Fig.5 Power derating curve for TDA1519C. 2004 Jan 28 6 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient; in free air TDA1519C, TDA1519CTH and TDA1519CTD 40 K/W Rth(j-c) thermal resistance from junction to case; TDA1519C, TDA1519CTH and TDA1519CTD 3 K/W DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measured in circuit of Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage Iq(tot) total quiescent current VO DC output voltage VOO DC output offset voltage note 1 note 2 6.0 14.4 17.5 V - 40 80 mA - 6.95 - V - - 250 mV Mute/standby switch Vsw(on) switch-on voltage level 8.5 - - V Vmute mute voltage level 3.3 - 6.4 V Vstb standby voltage level 0 - 2 V - - 20 mV Mute/standby condition Vo output voltage mute mode; Vi = 1 V (maximum); fi = 20 Hz to 15 kHz VOO DC output offset voltage mute mode - - 250 mV Istb standby current standby mode - - 100 A Isw(on) switch-on current - 12 40 A Notes 1. The circuit is DC adjusted at VP = 6 to 17.5 V and AC operating at VP = 8.5 to 17.5 V. 2. At VP = 17.5 to 30 V, the DC output voltage is 0.5VP. 2004 Jan 28 7 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Stereo application (see Fig.6) Po output power note 1 THD = 0.5 % 4 5 - W THD = 10 % 5.5 6.0 - W 7.5 8.5 - W RL = 2 ; note 1 THD = 0.5 % 10 11 - W THD total harmonic distortion Po = 1 W - 0.1 - % fro(l) low frequency roll-off -3 dB; note 2 - 45 - Hz fro(h) high frequency roll-off -1 dB 20 - - kHz Gv(cl) closed-loop voltage gain 39 40 41 dB SVRR supply voltage ripple rejection 40 - - dB on; notes 3 and 5 45 - - dB mute; notes 3 and 6 45 - - dB standby; notes 3 and 6 80 - - dB 50 60 75 k on; RS = 0 - 150 - V on; RS = 10 k - 250 500 V mute; note 8 - 120 - V 40 - - dB - 0.1 1 dB THD = 0.5 % 15 17 - W THD = 10 % 20 22 - W THD = 0.5 % - 13 - W THD = 10 % - 17.5 - W THD = 10 % Zi input impedance Vn(o)(rms) noise output voltage (RMS value) cs channel separation Gv(ub) channel unbalance on; notes 3 and 4 note 7 RS = 10 k BTL application (see Fig.7) Po output power note 1 VP = 13.2 V; note 1 THD total harmonic distortion Po = 1 W - 0.1 - % Bp power bandwidth THD = 0.5 %; Po = -1 dB; with respect to 15 W - 35 to 15000 - Hz fro(l) low frequency roll-off -1 dB; note 2 - 45 - Hz fro(h) high frequency roll-off -1 dB 20 - - kHz Gv(cl) closed-loop voltage gain 45 46 47 dB 2004 Jan 28 8 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier SYMBOL SVRR TDA1519C PARAMETER supply voltage ripple rejection Zi input impedance Vn(o)(rms) noise output voltage (RMS value) CONDITIONS MIN. TYP. MAX. UNIT 34 - - dB on; notes 3 and 5 48 - - dB mute; notes 3 and 6 48 - - dB standby; notes 3 and 6 80 - - dB 25 30 38 k on; RS = 0 - 200 - V on; RS = 10 k - 350 700 V mute; note 8 - 180 - V on; notes 3 and 4 note 7 Notes 1. Output power is measured directly at the output pins of the device. 2. Frequency response externally fixed. 3. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V). 4. Frequency f = 100 Hz. 5. Frequency between 1 and 10 kHz. 6. Frequency between 100 Hz and 10 kHz. 7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 8. Noise output voltage independent of RS (Vi = 0 V). 2004 Jan 28 9 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C APPLICATION INFORMATION handbook, full pagewidth standby switch 100 F VP 3 input reference voltage 220 nF non-inverting input + 40 dB 2 5 60 k 40 dB + 1 7 2200 F internal 1/2 VP TDA1519C - 60 k 8 100 nF - 4 220 nF 9 inverting input 6 MGL493 signal ground power ground 1000 F Fig.6 Stereo application diagram (TDA1519C). standby switch handbook, full pagewidth VP 3 input reference voltage - 60 k 220 nF non-inverting input to pin 9 TDA1519C + 40 dB + 5 7 internal 1/2 VP 40 dB 1 2 8 100 nF - 4 60 k 9 to pin 1 6 MGL494 signal ground power ground RL = 4 Fig.7 BTL application diagram (TDA1519C). 2004 Jan 28 10 2200 F Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C MGR539 60 handbook, halfpage Iq(tot) (mA) 50 40 30 0 4 8 12 16 20 VP (V) Fig.8 Total quiescent current as a function of the supply voltage. MGR540 30 handbook, halfpage Po (W) 20 THD = 10% 10 0.5% 0 0 4 8 12 16 20 VP (V) BTL application. RL = 4 . fi = 1 kHz. Fig.9 Output power as a function of the supply voltage. 2004 Jan 28 11 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C MGR541 12 handbook, halfpage THD (%) 8 4 0 10-1 1 10 Po (W) 102 BTL application. RL = 4 . fi = 1 kHz. Fig.10 Total harmonic distortion as a function of the output power. MGU377 0.6 handbook, halfpage THD (%) 0.4 0.2 0 10 102 103 fi (Hz) 104 BTL application. RL = 4 . Po = 1 W. Fig.11 Total harmonic distortion as a function of the operating frequency. 2004 Jan 28 12 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads SOT131-2 non-concave Dh x D Eh view B: mounting base side d A2 seating plane B E j A1 b L c 1 9 e Z Q w M bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A1 max. A2 b max. bp c D (1) d Dh E (1) e Eh j L Q w x Z (1) mm 2 4.6 4.4 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 6 3.4 3.1 17.2 16.5 2.1 1.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 99-12-17 03-03-12 SOT131-2 2004 Jan 28 EUROPEAN PROJECTION 13 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C SMS9P: plastic surface mounted single in-line power package; 9 leads SOT354-1 D y d non-concave heatsink A2 Dh x heatsink Eh j E Q A1 L Lp c 9 1 e Z w M bp (A3) A 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 A2 A3 bp c mm 4.9 4.2 0.35 0.05 4.6 4.4 0.25 0.75 0.60 0.48 0.38 D(1) d 24.0 20.0 23.6 19.6 Dh E(1) 10 12.2 2.54 11.8 e Eh j L Lp Q w x y Z(1) 6 3.4 3.1 7.4 6.6 3.4 2.8 2.1 1.9 0.25 0.03 0.15 2.00 1.45 3 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 99-12-17 03-03-12 SOT354-1 2004 Jan 28 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C HSOP20: plastic, heatsink small outline package; 20 leads SOT397-1 E D A E2 X HE v M A c y D1 D2 11 20 Q A2 E1 A (A3) A1 A4 pin 1 index Lp detail X 1 10 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A1 max. A2 A3 A4 0.3 0.1 3.3 3.0 0.35 0.1 0 3.6 D1 D2 E(1) E1 E2 e HE Lp Q 0.53 0.32 16.0 13.0 0.40 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 1.27 14.5 13.9 1.1 0.8 1.5 1.4 bp c D(1) v w 0.25 0.25 y Z 0.1 2.5 2.0 8 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 03-02-18 03-07-23 SOT397-1 2004 Jan 28 EUROPEAN PROJECTION 15 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 E D A x X c E2 y HE v M A D1 D2 10 1 pin 1 index Q A A2 E1 (A3) A4 Lp detail X 20 11 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) D1 D2 E(2) E1 E2 e HE Lp Q +0.08 0.53 0.32 16.0 13.0 -0.04 0.40 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 1.27 14.5 13.9 1.1 0.8 1.7 1.5 bp c D(2) v w x y 0.25 0.25 0.03 0.07 Z 2.5 2.0 8 0 Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 02-02-12 03-07-23 SOT418-3 2004 Jan 28 EUROPEAN PROJECTION 16 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C SOLDERING cooling) vary between 100 and 200 seconds depending on heating method. Introduction Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). * below 225 C (SnPb process) or below 245 C (Pb-free process) There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. - for all the BGA, HTSSON..T and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. The total contact time of successive solder waves must not exceed 5 seconds. To overcome these problems the double-wave soldering method was specifically developed. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. MANUAL SOLDERING * For packages with leads on two sides and a pitch (e): Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Surface mount packages The footprint must incorporate solder thieves at the downstream end. REFLOW SOLDERING * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and 2004 Jan 28 17 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD PACKAGE(1) MOUNTING WAVE Through-hole mount CPGA, HCPGA REFLOW(2) DIPPING suitable - suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable(3) - - Through-holesurface mount PMFP(4) not suitable not suitable - Surface mount BGA, HTSSON..T(5), LBGA, LFBGA, SQFP, SSOP-T(5), TFBGA, USON, VFBGA not suitable suitable - DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(6) suitable - PLCC(7), SO, SOJ suitable suitable - not recommended(7)(8) suitable - SSOP, TSSOP, VSO, VSSOP not recommended(9) suitable - CWQCCN..L(11), PMFP(10), WQCCN32L(11) not suitable not suitable - LQFP, QFP, TQFP Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. Hot bar soldering or manual soldering is suitable for PMFP packages. 5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 7. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 2004 Jan 28 18 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C 8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 10. Hot bar or manual soldering is suitable for PMFP packages. 11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 2004 Jan 28 19 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo power amplifier TDA1519C DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Jan 28 20 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA76 (c) Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R32/04/pp21 Date of release: 2004 Jan 28 Document order number: 9397 750 12599