© 2011 IXYS CORPORATION, All Rights Reserved
Symbol Test Conditions Maximum Ratings
VDSS TJ= 25°C to 150°C 500 V
VDGR TJ= 25°C to 150°C, RGS = 1MΩ 500 V
VGSS Continuous ±30 V
VGSM Transient ±40 V
ID25 TC= 25°C 112 A
IDM TC= 25°C, Pulse Width Limited by TJM 330 A
IATC= 25°C 66A
EAS TC= 25°C3J
dv/dt IS IDM, VDD VDSS, TJ 150°C 35 V/ns
PDTC= 25°C 1500 W
TJ-55 ... +150 °C
TJM 150 °C
Tstg -55 ... +150 °C
VISOL 50/60 Hz, RMS, t = 1minute 2500 V~
IISOL 1mA, t = 1s 3000 V~
MdMounting Torque for Base Plate 1.5/13 Nm/lb.in.
Terminal Connection Torque 1.3/11.5 Nm/lb.in.
Weight 30 g
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
BVDSS VGS = 0V, ID = 3mA 500 V
VGS(th) VDS = VGS, ID = 8mA 3.0 5.0 V
IGSS VGS = ±30V, VDS = 0V ±200 nA
IDSS VDS = VDSS, VGS = 0V 50 μA
TJ = 125°C 6 mA
RDS(on) VGS = 10V, ID = 66A, Note 1 39 mΩ
IXFN132N50P3 VDSS = 500V
ID25 = 112A
RDS(on)
39mΩΩ
ΩΩ
Ω
trr
250ns
DS100316(03/11)
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Rectifier
Advance Technical Information
Polar3TM HiPerFETTM
Power MOSFET
miniBLOC
E153432
G
D
S
S
G = Gate D = Drain
S = Source
Either Source Terminal S can be used as
the Source Terminal or the Kelvin Source
(Gate Return) Terminal.
Features
zInternational Standard Package
zminiBLOC with Aluminum Nitride
Isolation
zAvalanche Rated
zLow Package Inductance
zFast Intrinsic Rectifier
zLow RDS(on) and QG
Advantages
zEasy to Mount
zSpace Savings
Applications
zDC-DC Converters
zBattery Chargers
zSwitch-Mode and Resonant-Mode
Power Supplies
zUninterrupted Power Supplies
zAC Motor Drives
zHigh Speed Power Switching
Applications
IXFN132N50P3
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
gfs VDS = 10V, ID = 66A, Note 1 68 115 S
Ciss 18.6 nF
Coss VGS = 0V, VDS = 25V, f = 1MHz 1750 pF
Crss 5.0 pF
RGi Gate Input Resistance 1.0 Ω
td(on) 44 ns
tr 9 ns
td(off) 72 ns
tf 8 ns
Qg(on) 250 nC
Qgs VGS = 10V, VDS = 0.5 • VDSS, ID = 66A 90 nC
Qgd 52 nC
RthJC 0.083 °C/W
RthCS 0.05 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
ISVGS = 0V 132 A
ISM Repetitive, Pulse Width Limited by TJM 530 A
VSD IF = 100A, VGS = 0V, Note 1 1.5 V
trr 250 ns
QRM 1.9 μC
IRM 16.4 A
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Note 1. Pulse test, t 300μs, duty cycle, d 2%.
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 66A
RG = 1Ω (External)
IF = 66A, -di/dt = 100A/μs
VR = 100V, VGS = 0V
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
(M4 screws (4x) supplied)
SOT-227B (IXFN) Outline
© 2011 IXYS CORPORATION, All Rights Reserved
IXFN132N50P3
Fi g. 1. Ou tp ut C h ar act er i st i cs @ T
J
= 25ºC
0
20
40
60
80
100
120
140
0123456
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
8V
5
V
6
V
7
V
Fi g. 2. Extended Ou tput C h ar a cter i sti cs @ T
J
= 25ºC
0
50
100
150
200
250
0 5 10 15 20 25
V
DS
- Vo lts
I
D
- Amperes
V
GS
= 10V
8V
6
V
5
V
7
V
Fi g . 3. Ou tpu t C h ar ac ter i sti cs @ T
J
= 125º C
0
20
40
60
80
100
120
140
02468101214
V
DS
- Volts
I
D
- A mperes
5
V
6V
4V
V
GS
= 10V
8V
7V
Fig. 4. R
DS(on)
No r mali z ed to I
D
= 66A Valu e vs.
Junction T emperature
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
-50 -25 0 25 50 75 100 125 150
T
J
- Deg re es Centigrade
R
DS(on)
- Normalized
V
GS
= 10V
I
D
= 132A
I
D
= 66A
Fig. 5. R
DS(on)
Normalized to I
D
= 66A Valu e vs.
Drain Current
0.6
1.0
1.4
1.8
2.2
2.6
3.0
0 50 100 150 200 250
I
D
- Amp e res
R
DS(on)
- Normalized
V
GS
= 10V T
J
= 125ºC
T
J
= 25ºC
Fig. 6. Maxi mum Drain Current vs.
Case Temper atu re
0
20
40
60
80
100
120
-50 -25 0 25 50 75 100 125 150
T
C
- Degrees Centigrade
I
D
- Am peres
IXFN132N50P3
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
Fig. 7. Input Adm ittance
0
20
40
60
80
100
120
140
160
180
200
3.54.04.55.05.56.06.57.07.5
V
GS
- Volt s
I
D
- Amperes
T
J
= 125ºC
2C
- 4C
Fig. 8. Transconductan ce
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 180 200 220
I
D
- Amp eres
g
f s
- Siemens
T
J
= - 40ºC
125ºC
25ºC
Fig. 9. Forward Voltage Drop of Intrinsic Diode
0
50
100
150
200
250
300
350
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
V
SD
- Volts
I
S
- Amperes
T
J
= 12 5ºC
T
J
= 25ºC
Fig. 10. Gate Charge
0
1
2
3
4
5
6
7
8
9
10
0 50 100 150 200 250
Q
G
- NanoCoulombs
V
GS
- Volt s
V
DS
= 25 0V
I
D
= 66A
I
G
= 10mA
Fig. 11. Capacitance
1
10
100
1,000
10,000
100,000
0 5 10 15 20 25 30 35 40
V
DS
- Volts
Capacitance - PicoFarads
f
= 1 MHz
Ciss
Crss
Coss
Fi g . 12. F o r war d -B i as Safe Op erati n g Area
1
10
100
1000
10 100 1,000
V
DS
- V olts
I
D
- Am pe res
T
J
= 150ºC
T
C
= 25ºC
Single Pulse
100µs
1ms
R
DS(on)
Limit
© 2011 IXYS CORPORATION, All Rights Reserved
IXFN132N50P3
IXYS REF: F_132N50P3(K9)03-17-11
Fig. 13. Maximum Transient Thermal Impedance
0.001
0.01
0.1
1
0.0001 0.001 0.01 0.1 1 10
Pulse Width - Seconds
Z
(th)JC
- ºC / W
Fig. 13. Maximum Transient Thermal Impedance
AAAAA
0.2