BAV102; BAV103 Single general-purpose switching diodes Rev. 03 -- 16 August 2007 Product data sheet 1. Product profile 1.1 General description Single general-purpose switching diodes, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages. Table 1. Product overview Type number BAV102 Package Configuration NXP JEITA SOD80C - single BAV103 1.2 Features n High switching speed: trr 50 ns n Low leakage current n Low capacitance: Cd 5 pF n Small hermetically sealed glass SMD package 1.3 Applications n High-speed switching n General-purpose switching n Voltage clamping n Reverse polarity protection 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter IF forward current VR reverse voltage Conditions [1][2] BAV102 BAV103 [3] Min Typ Max Unit - - 250 mA - - 150 V - - 200 V - - 50 ns trr reverse recovery time [1] Pulse test: tp 300 s; 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] When switched from IF = 30 mA to IR = 30 mA; RL = 100 ; measured at IR = 3 mA. BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes 2. Pinning information Table 3. Pinning Pin Description 1 cathode 2 anode Simplified outline Symbol [1] k a 2 1 006aab040 [1] The marking band indicates the cathode. 3. Ordering information Table 4. Ordering information Type number BAV102 Package Name Description Version - hermetically sealed glass surface-mounted package; 2 connectors SOD80C BAV103 4. Marking Table 5. Marking codes Type number Marking code[1] BAV102 marking band BAV103 [1] green: made in Philippines 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VRRM repetitive peak reverse voltage VR Conditions Min Max Unit BAV102 - 200 V BAV103 - 250 V - 150 V - 200 V - 250 mA - 625 mA reverse voltage BAV102 BAV103 IF forward current IFRM repetitive peak forward current BAV102_BAV103_3 Product data sheet [1][2] (c) NXP B.V. 2007. All rights reserved. Rev. 03 -- 16 August 2007 2 of 10 BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes Table 6. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol IFSM Parameter Conditions non-repetitive peak forward current square wave Min Max Unit - 9 A [3] tp = 1 s tp = 100 s - 3 A tp = 1 s - 1 A - 400 mW Tamb 25 C [2] Ptot total power dissipation Tj junction temperature - 175 C Tamb ambient temperature -65 +175 C Tstg storage temperature -65 +175 C [1] Pulse test: tp 300 s; 0.02. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Tj = 25 C prior to surge. 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient Rth(j-t) thermal resistance from junction to tie-point [1] in free air [1] Min Typ Max Unit - - 375 K/W - - 300 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter VF forward voltage IR Conditions Min Typ Max Unit IF = 100 mA - - 1.0 V IF = 200 mA - - 1.25 V VR = 150 V - - 100 nA VR = 150 V; Tj = 150 C - - 100 A VR = 200 V - - 100 nA [1] reverse current BAV102 BAV103 VR = 200 V; Tj = 150 C - - 100 A f = 1 MHz; VR = 0 V - - 5 pF - - 50 ns Cd diode capacitance trr reverse recovery time [1] Pulse test: tp 300 s; 0.02. [2] When switched from IF = 30 mA to IR = 30 mA; RL = 100 ; measured at IR = 3 mA. BAV102_BAV103_3 Product data sheet [2] (c) NXP B.V. 2007. All rights reserved. Rev. 03 -- 16 August 2007 3 of 10 BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes mbg459 600 IF (mA) mbg703 102 IFSM (A) 10 400 (1) (2) (3) 1 200 10-1 0 0 1 VF (V) 1 2 10 102 103 104 tp (s) (1) Tamb = 150 C; typical values Based on square wave currents. (2) Tamb = 25 C; typical values Tj = 25 C; prior to surge (3) Tamb = 25 C; maximum values Fig 1. Forward current as a function of forward voltage mgd009 103 IR (A) Fig 2. Non-repetitive peak forward current as a function of pulse duration; maximum values mgd005 1.6 Cd (pF) 102 1.4 10 1.2 1 1.0 10-1 10-2 0.8 0 100 Tj (C) 200 0 10 VR (V) 20 f = 1 MHz; Tamb = 25 C VR = VRmax Solid line: maximum values Dotted line: typical values Fig 3. Reverse current as a function of junction temperature Fig 4. Diode capacitance as a function of reverse voltage; typical values BAV102_BAV103_3 Product data sheet (c) NXP B.V. 2007. All rights reserved. Rev. 03 -- 16 August 2007 4 of 10 BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes mbh278 300 mgl588 300 VR (V) IF (mA) (1) 200 200 (2) 100 100 0 0 0 100 Tamb (C) 200 0 FR4 PCB, standard footprint 100 200 Tamb (C) FR4 PCB, standard footprint (1) BAV103 (2) BAV102 Fig 5. Forward current as a function of ambient temperature; derating curve Fig 6. Reverse voltage as a function of ambient temperature; derating curve 8. Test information tr t D.U.T. RS = 50 V = VR + IF x RS tp 10 % + IF IF SAMPLING OSCILLOSCOPE trr t Ri = 50 VR (1) 90 % mga881 input signal output signal (1) IR = 1 mA Fig 7. Reverse recovery time test circuit and waveforms BAV102_BAV103_3 Product data sheet (c) NXP B.V. 2007. All rights reserved. Rev. 03 -- 16 August 2007 5 of 10 BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes 9. Package outline 3.7 3.3 0.3 1.60 1.45 0.3 Dimensions in mm 06-03-16 Fig 8. Package outline SOD80C 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAV102 Package SOD80C Description 4 mm pitch, 8 mm tape and reel Packing quantity 2500 10000 -115 -135 BAV103 [1] For further information and the availability of packing methods, see Section 14. BAV102_BAV103_3 Product data sheet (c) NXP B.V. 2007. All rights reserved. Rev. 03 -- 16 August 2007 6 of 10 BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes 11. Soldering 4.55 4.30 2.30 solder lands solder paste 2.25 1.70 1.60 solder resist occupied area Dimensions in mm 0.90 (2x) sod080c Fig 9. Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 solder lands solder resist occupied area 2.90 1.70 tracks Dimensions in mm sod080c Fig 10. Wave soldering footprint SOD80C BAV102_BAV103_3 Product data sheet (c) NXP B.V. 2007. All rights reserved. Rev. 03 -- 16 August 2007 7 of 10 BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BAV102_BAV103_3 20070816 Product data sheet - BAV100_2 Modifications: * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. * * * * * * * * * * * Legal texts have been adapted to the new company name where appropriate. Type numbers BAV100 and BAV101 have been removed Section 1.1 "General description": amended Table 1 "Product overview": added Table 2 "Quick reference data": added Section 3 "Ordering information": added Figure 7: figure title amended Figure 8: superseded by minimized package outline drawing Section 10 "Packing information": added Section 11 "Soldering": added Section 13 "Legal information": updated BAV100_2 19960917 Product specification - BAV100_1 BAV100_1 19960423 Product specification - - BAV102_BAV103_3 Product data sheet (c) NXP B.V. 2007. All rights reserved. Rev. 03 -- 16 August 2007 8 of 10 BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com BAV102_BAV103_3 Product data sheet (c) NXP B.V. 2007. All rights reserved. Rev. 03 -- 16 August 2007 9 of 10 BAV102; BAV103 NXP Semiconductors Single general-purpose switching diodes 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 August 2007 Document identifier: BAV102_BAV103_3