EC1500SJTS-66.000M EC15 00 SJ TS -66.000M Series 3.3V Plastic J-Lead SMD CMOS Oscillator Nominal Frequency 66.000MHz Frequency Tolerance/Stability 100ppm Maximum Package Operating Temperature Range 0C to +70C Output Control Function Tri-State (High Impedance) Duty Cycle 50 10(%) ELECTRICAL SPECIFICATIONS Nominal Frequency 66.000MHz Frequency Tolerance/Stability 100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration) Aging at 25C 5ppm/year Maximum Operating Temperature Range 0C to +70C Supply Voltage 3.3Vdc 10% Input Current 35mA Maximum Output Voltage Logic High (Voh) Vdd-0.4Vdc Minimum , IOH = -8mA Output Voltage Logic Low (Vol) 0.4Vdc Maximum, IOL = +8mA Rise/Fall Time 5nSec Maximum (Measured over 10% to 90% of waveform) Duty Cycle 50 10(%) (Measured at 50% of waveform) Load Drive Capability 15pF HCMOS Load Maximum Output Logic Type HCMOS Output Control Function Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) +2.0Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to enable output. Absolute Clock Jitter 100pSec Maximum One Sigma Clock Period Jitter 25pSec Maximum Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-202, Method 213, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision Q 08/18/2006 | Page 1 of 3 EC1500SJTS-66.000M MECHANICAL DIMENSIONS (all dimensions in millimeters) 5.080 0.203 0.25 MIN 3 4 9.8 MAX 7.620 0.203 4.7 MAX 0.510 0.203 MARKING ORIENTATION 1 2 14.0 MAX PIN CONNECTION 1 Tri-State 2 Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 66.000M 3 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of Year ZZ=Week of Year Suggested Solder Pad Layout All Dimensions in Millimeters 1.27 (X4) 3.0 (X4) Solder Land (X4) 5.8 3.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision Q 08/18/2006 | Page 2 of 3 EC1500SJTS-66.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 2 Times / 230C Maximum 1 Time 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Revision Q 08/18/2006 | Page 3 of 3