MCA1206ME1100BP1 - Vishay Presicion Group

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

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Revision: 21-Jan-13 1Document Number: 28785

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Precision Thin Film Chip Resistors

Automotive-grade MC AT precision thin film chip resistors

are the perfect choice for most fields of modern precision

electronics where reliability and stability is of major concern.

Typical applications include automotive, industrial,

telecommunication, medical equipment, precision test and

measuring equipment.

FEATURES

• Rated dissipation P70 up to 0.4 W for size 1206

• AEC-Q200 qualified

• Approved to EN 140401-801

• Superior temperature cycling robustness

• Waste gas resistance verified by ASTM B 809

• Superior temperature cycling robustness

• Lead (Pb)-free solder contacts

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• Automotive

• Telecommunication

• Medical equipment

• Industrial equipment

Notes

(1) The AEC-Q200 qualification of the extended ranges ( > 100 k; > 47 k for 0402) is pending.

(2) Please refer to APPLICATION INFORMATION next page.

TECHNICAL SPECIFICATIONS

MCS 0402 AT MCT 0603 AT MCU 0805 AT MCA 1206 AT

Imperial size 0402 0603 0805 1206

Metric size code RR1005M RR1608M RR2012M RR3216M

Resistance range (1) 47  to 221 k47  to 511 k47  to 1 M47  to 1 M

Resistance tolerance ± 0.1 %

Temperature coefficient ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K

Rated dissipation P70 (2) 0.100 W 0.125 W 0.200 W 0.400 W

Operating voltage, Umax. AC/DC 50 V 75 V 150 V 200 V

Permissible film temperature,



F max. (2) 155 °C

Operating temperature range - 55 °C to 155 °C

Insulation voltage

1 min; Uins 75 V 100 V 200 V 300 V

Continuous 75 V 75 V 75 V 75 V

Failure rate: FITobserved  0.1 x 10-9/h

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

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APPLICATION INFORMATION

The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow

support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is

not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder

joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly.

These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift

increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a

functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and

temperature limits in order to maintain a desired stability.

MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION

Operation mode Standard Power

Rated dissipation P70 P70

MCS 0402 AT 0.063 W 0.100 W

MCT 0603 AT 0.100 W 0.125 W

MCU 0805 AT 0.125 W 0.200 W

MCA 1206 AT 0.250 W 0.400 W

Applied maximum film temperature,



F max. 125 °C 155 °C

Max. resistance change at rated dissipation for

resistance range:

MCS 0402 AT 47  to 221 k47  to 221 k

MCT 0603 AT 47  to 511 k47  to 511 k

MCU 0805 AT 47  to 1 M47  to 1 M

MCA 1206 AT 47  to 1 M47  to 1 M

|R/R| max., after:

1000 h  0.1 %  0.2 %

8000 h  0.2 %  0.4 %

225 000 h  0.6 % -

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

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Note

• Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION.

Note

• Resistance values are available from the E24 and E192 series.

PART NUMBER AND PRODUCT DESCRIPTION

Part Number: MCT0603MD4641BPW00

TYPE/SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING

MCS0402

MCT0603

MCU0805

MCA1206

M = AT

(Automotive)

F = ± 10 ppm/K

E = ± 15 ppm/K

D = ± 25 ppm/K

3 digit value

1 digit

multiplier

MULTIPLIER

9 = *10-1

0 = *100

1 = *101

2 = *102

3 = *103

4 = *104

B = ± 0.1 % E1

Product Description: MCT 0603-25 0.1 % AT PW 4K64

MCT 0603 -25 0.1 % AT PW 4K64

TYPE SIZE TCR TOLERANCE VERSION PACKAGING RESISTANCE

MCS

MCT

MCU

MCA

0402

0603

0805

1206

± 10 ppm/K

± 15 ppm/K

± 25 ppm/K

± 0.1 % AT =

Automotive

4K64 = 4.64 k

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE

DESCRIPTION RESISTANCE RANGE

TCR TOLERANCE MCS 0402 AT MCT 0603 AT MCU 0805 AT MCA 1206 AT

± 25 ppm/K

± 0.1 %

47 to 221 k47 to 511 k47 to 1 M47 to 1 M

± 15 ppm/K 47 to 100 k47 to 221 k47 to 332 k47 to 511 k

± 10 ppm/K 47 to 10 k47 to 22.1 k47 to 33.2 k47 to 43.2 k

PACKAGING

TYPE CODE QUANTITY PACKAGING

STYLE WIDTH PITCH REEL

DIAMETER

MCS 0402 AT E1 1000

Tape and reel

cardboard tape

acc. IEC 60286-3

Type I

8 mm 2 mm 180 mm/7"

E0 10 000 330 mm/13"

MCT 0603 AT

P1 1000

8 mm 4 mm 180 mm/7"

P5 5000

PW 20 000 330 mm/13"

MCU 0805 AT

P1 1000

8 mm 4 mm 180 mm/7"

P5 5000

PW 20 000 330 mm/13"

MCA 1206 AT P1 1000 8 mm 4 mm 180 mm/7"

P5 5000

CT0603MD4M41BPW006

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DIMENSIONS

SOLDER PAD DIMENSIONS

Note

• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of

power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain

the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depends on

board materials and design.

The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or

in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many

other parameters.

Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation

mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and

adjacent conductor areas.

The terminations design withstands extended temperature cycling on the PCB. The robustness has been verified with appropriate solder

paste material through extensive testing.

DIMENSIONS AND MASS

TYPE H

(mm)

MASS

(mg)

MCS 0402 AT 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 0.6

MCT 0603 AT 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9

MCU 0805 AT 0.52 ± 0.1 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6

MCA 1206 AT 0.55 ± 0.1 3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE

WAVE SOLDERING REFLOW SOLDERING

(mm)

MCS 0402 AT - - - - 0.35 0.55 0.55 1.45

MCT 0603 AT 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05

MCU 0805 AT 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70

MCA 1206 AT 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80

W WT

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

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DESCRIPTION

Production is strictly controlled and follows an extensive

set of instructions established for reproducibility. A

homogeneous film of special metal alloy is deposited on a

high grade (Al2O3) ceramic substrate and conditioned to

achieve the desired temperature coefficient. Specially

designed inner contacts are deposited on both sides. A

special laser is used to achieve the target value by smoothly

cutting a meander groove in the resistive layer without

damaging the ceramics. The resistor elements are covered

by a unique protective coating designed for electrical,

mechanical and climatic protection. The terminations

receive a final pure tin on nickel plating.

The result of the determined production is verified by an

extensive testing procedure and optical inspection

performed on 100 % of the individual chip resistors. This

includes full screening for the elimination of products with

potential risk of early field failures (feasible for R  10 ).

Only accepted products are laid directly into the paper tape

in accordance with IEC 60286-3 (3).

ASSEMBLY

The resistors are suitable for processing on automatic SMD

assembly systems. They are suitable for automatic

soldering using wave, reflow or vapour phase as shown in

IEC 61760-1 (3). The encapsulation is resistant to all

cleaning solvents commonly used in the electronics

industry, including alcohols, esters and aqueous solutions.

The suitability of conformal coatings, if applied, shall be

qualified by appropriate means to ensure the long-term

stability of the whole system.

The resistors are RoHS compliant; the pure tin plating

provides compatibility with lead (Pb)-free and

lead-containing soldering processes. Solderability is

specified for 2 years after production or requalification. The

permitted storage time is 20 years. The immunity of the

plating against tin whisker growth has been proven under

extensive testing.

All products comply with the GADSL (1) and the

CEFIC-EECA-EICTA (2) list of legal restrictions on

hazardous substances. This includes full compliance with

the following directives:

• 2000/53/EC End of Vehicle life Directive (ELV) and

Annex II (ELV II)

• 2011/65/EU Restriction of the use of Hazardous

Substances directive (RoHS)

• 2002/96/EC Waste Electrical and Electronic Equipment

Directive (WEEE)

APPROVALS

The resistors are approved within the IECQ-CECC Quality

Assessment System for Electronic Components to the detail

specification EN 140401-801 which refers to EN 60115-1,

EN 140400 and the variety of environmental test procedures

of the IEC 60068 (3) series. The detail specification refers to

the climatic categories 55/125/56, which relates to the

“standard operation mode” of this datasheet.

Conformity is attested by the use of the CECC logo ( ) as

the mark of conformity on the package label.

The resistors are qualified according to AEC-Q200.

Qualification of the extended ranges is pending.

Vishay BEYSCHLAG has achieved “Approval of

Manufacturer” in accordance with IECQ 03-1. The release

certificate for “Technology Approval Schedule” in

accordance with CECC 240001 based on IECQ 03-3 is

granted for the Vishay BEYSCHLAG manufacturing

process.

RELATED PRODUCTS

For more information about products with higher operation

temperature please refer to the professional datasheet

(www.vishay.com/doc?28760).

Chip resistor arrays may be used in sensing applications or

precision amplifiers where close matching between multiple

resistors is necessary. Please refer to the ACAS AT -

Precision datasheet (www.vishay.com/doc?28770).

MC AT Precision is also available with gold termination for

conductive gluing. Please refer to the datasheet

(www.vishay.com/doc?28877).

Notes

(1) Global Automotive Declarable Substance List, see www.gadsl.org.

(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade

organisation representing the information and communications technology and consumer electronics), see

www.eicta.org/index.php?id=995  issues  environment policy  chemicals  chemicals for electronics.

(3) The quoted IEC standards are also released as EN standards with the same number and identical contents.

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

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FUNCTIONAL PERFORMANCE

TESTS AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

EN 60115-1, generic specification

EN 140400, sectional specification

EN 140401-801, detail specification

The components are approved in accordance with the

IECQ-CECC-system, where applicable. The following table

contains only the most important tests. For the full test

schedule refer to the documents listed above. The testing

also covers most of the requirements specified by

EIA/IS-703 and JIS-C-5202.

The tests are carried out in accordance with IEC 60068 and

under standard atmospheric conditions in accordance with

IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated

temperature range: Lower category temperature, upper

category temperature; damp heat, long term, 56 days) is

valid (LCT = - 55 °C/UCT = 125 °C).

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

The components are mounted for testing on boards in

accordance with EN 140400, 2.3.3 unless otherwise

specified.

The requirements stated in the Test Procedures and

Requirements table are based on the required tests and

permitted limits of EN 140401-801. However, some

additional tests and a number of improvements against

those minimum requirements have been included.

Derating

For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER, above

100

100- 55

Ambient Temperature in °C

180

Standard Mode

Power Mode

155

125050

Rated Power in %

Resistance Value

Current Noise

0.01

1 M

0.1

µV/V

100 k

10 k

1 k

MCS 0402 AT

MCT 0603 AT

MCU 0805 AT

MCA 1206 AT

100

Current noise A1 in accordance with IEC 60195

Current Noise

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TEST PROCEDURES AND REQUIREMENTS

EN 60115-1

CLAUSE

IEC 60068-2

TEST

METHOD

TEST PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

STABILITY CLASS 0.25 OR BETTER (1)

Stability for product types:

MCS 0402 AT 47 to 221 k

MCT 0603 AT 47 to 511 k

MCU 0805 AT 47 to 1 M

MCA 1206 AT 47 to 1 M

4.5 - Resistance ± 0.1 % R

4.8.4.2 - Temperature

coefficient

At (20/- 55/20) °C and

(20/155/20) °C ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K

4.25.1 -

Endurance at 70 °C:

Standard operation mode

U= or U = Umax.;

whichever is the less severe;

1.5 h on; 0.5 h off;

70 °C; 1000 h

70 °C; 8000 h

± (0.1 % R+0.02)

± (0.2 % R+0.02)

Endurance at 70 °C:

Power operation mode

U= or U = Umax.;

whichever is the less severe;

1.5 h on; 0.5 h off;

70 °C; 1000 h

70 °C; 8000 h

± (0.2 % R+0.02)

± (0.4 % R+0.05)

4.25.3 -

Endurance at

upper category

temperature

125 °C; 1000 h

155 °C; 1000 h

± (0.15 % R+ 0.02 )

± (0.3 % R+ 0.02 )

4.24 78 (Cab) Damp heat,

steady state

(40 ± 2) °C; 56 days;

(93 ± 3) % RH ± (0.1 % R+0.02)

4.39 67 (Cy)

Damp heat,

steady state,

accelerated:

Standard operation mode

(85 ± 2) °C

(85 ± 5) % RH

U= ;

U  0.3 x Umax.; 1000 h

± (0.5 % R+0.05)

4.23 Climatic sequence:

Standard operation mode:

± (0.25 % R+0.02)

4.23.2 2 (Ba) Dry heat 125 °C; 16 h

4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h; > 90 % RH;

1 cycle

4.23.4 1 (Aa) Cold - 55 °C; 2 h

4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C

4.23.6 30 (Db) Damp heat, cyclic 55 °C; 24 h; > 90 % RH;

5 cycles

4.23.7 - DC load U=  Umax.; 1 min

-1 (Aa)

Storage at low

temperature - 55 °C; 2 h ± (0.05 % R+0.01)

4.19 14 (Na) Rapid change of

temperature

30 min at - 55 °C and

30 min at 125 °C;

1000 cycles

± (0.25 % R+0.02)

4.13 - Short time overload:

Standard operation mode

U= 2.5 x or

U = 2 × Umax.;

whichever is the less severe;

5 s

± (0.05 % R+0.01)

4.27 -

Single pulse high

voltage overload:

Standard operation mode

Severity no. 4:

U= 10 x or

U = 2 x Umax.;

whichever is the less severe;

10 pulses 10 μs/700 μs

± (0.25 % R+0.05)

P70 x R

0.1 x P70 x R

P70 x R

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Note

(1) According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their

respective test conditions.

4.37 -

Periodic electric

overload:

Standard operation mode

U= or

U = 2 x Umax.

whichever is the less severe;

0.1 s on; 2.5 s off;

1000 cycles

± (0.5 % R+0.05)

4.40 - Electro Static Discharge

(Human Body Model)

IEC 61340-3-1;

3 pos. + 3 neg.

(equivalent to MIL-STD-883,

method 3015)

MCS 0402 AT: 500 V

MCT 0603 AT: 1000 V

MCU 0805 AT: 1500 V

MCA 1206 AT: 2000 V

± (0.5 % R+0.05)

4.22 6 (Fc) Vibration

Endurance by sweeping;

10 Hz to 2000 Hz;

no resonance;

amplitude  1.5 mm or

200 m/s2; 7.5 h

± (0.05 % R+0.01)

no visible damage

4.17.2 58 (Td) Solderability

Solder bath method;

SnPb40; non-activated flux

(215 ± 3) °C; (3 ± 0.3) s

Good tinning ( 95 % covered);

no visible damage

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux;

(235 ± 3) °C; (2 ± 0.2) s

Good tinning (95 % covered);

no visible damage

4.18.2 58 (Td) Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

± (0.05 % R+0.01)

no visible damage

4.29 45 (XA) Component solvent

resistance

Isopropyl alcohol + 50 °C;

method 2 No visible damage

4.32 21 (Ue3) Shear (adhesion) RR1005M and RR1608M; 9 N No visible damage

RR2012M and RR3216M; 45 N

4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times

± (0.05 % R+0.01)

no visible damage;

no open circuit in bent position

4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown

4.35 - Flammability Needle flame test; 10 s No burning after 30 s

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1

CLAUSE

IEC 60068-2

TEST

METHOD

TEST PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

STABILITY CLASS 0.25 OR BETTER (1)

Stability for product types:

MCS 0402 AT 47 to 221 k

MCT 0603 AT 47 to 511 k

MCU 0805 AT 47 to 1 M

MCA 1206 AT 47 to 1 M

15 x P70 x R

Legal Disclaimer Notice

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Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE

RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,

“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or

the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,

consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular

purpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical

requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements

about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular

product with the properties described in the product specification is suitable for use in a particular application. Parameters

provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All

operating parameters, including typical parameters, must be validated for each customer application by the customer’s

technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,

including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

applications or for any other application in which the failure of the Vishay product could result in personal injury or death.

Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please

contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by

any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Material Category Policy

Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the

definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council

of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment

(EEE) - recast, unless otherwise specified as non-compliant.

Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that

all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.

Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free

requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference

to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21

conform to JEDEC JS709A standards.