Semiconductor Group 1
PNP Silicon Switching Transistor PZT 3906
5.91
Maximum Ratings
Type Ordering Code
(tape and reel)
Marking Package1)
Pin Configuration
PZT 3906 Q62702-Z2030ZT 3906 SOT-223
1234
B C E C
Parameter Symbol Values Unit
Collector-emitter voltage VCE0 40 V
Collector-base voltage VCB0 40
Emitter-base voltage VEB0 5
Collector current IC200 mA
Total power dissipation, TS=80˚C P
tot 1.5 W
Junction temperature Tj150 ˚C
Storage temperature range Tstg 65 … + 150
Thermal Resistance
Junction - ambient2) Rth JA 117 K/W
Junction - soldering point Rth JS 47
1) For detailed information see chapter Package Outlines.
2) Package mounted on epoxy pcb 40 mm ×40 mm ×1.5 mm/6 cm2 Cu.
High DC current gain 0.1 mA to 100 mA
Low collector-emitter saturation voltage
Complementary type: PZT 3904 (NPN)
Semiconductor Group 2
PZT 3906
Electrical Characteristics
at TA = 25 ˚C, unless otherwise specified.
UnitValues
Parameter Symbol
min. typ. max.
DC characteristics
VCollector-emitter breakdown voltage
I
C = 1 mA, IB = 0 V(BR)CE0 40
Collector-base breakdown voltage
I
C = 10 µA, IB = 0 V(BR)CB0 40
Emitter-base breakdown voltage
I
E = 10 µA, IC = 0 V(BR)EB0 5––
nACollector-base cutoff current
VCB = 30 V, IE = 0 ICB0 ––50
Collector-emitter cutoff current
VCE = 30 V, + VBE = 0.5 V ICEV ––50
DC current gain1)
I
C = 0.1 mA, VCE = 1 V
I
C = 1 mA, VCE = 1 V
I
C = 10 mA, VCE = 1 V
I
C = 50 mA, VCE = 1 V
I
C = 100 mA, VCE = 1 V
hFE 60
80
100
60
30
300
VCollector-emitter saturation voltage1)
I
C = 10 mA, IB = 1 mA
I
C = 50 mA, IB = 5 mA
VCEsat
0.25
0.4
Base-emitter saturation voltage1)
I
C = 10 mA, IC = 1 mA
I
C = 50 mA, IC = 5 mA
VBEsat
0.85
0.95
Collector-base cutoff current
VCE = 30 V, + VBE = 0.5 V IBEV ––50
1) Pulse test conditions: t 300 µs, D = 2 %
Semiconductor Group 3
PZT 3906
Electrical Characteristics
at TA = 25 ˚C, unless otherwise specified.
MHzTransition frequency
I
C = 10 mA, VCE = 20 V, f = 100 MHz fT250
pFCollector-base capacitance
VCB = 5 V, f = 1 MHz Cobo 4.5
AC characteristics
UnitValuesParameter Symbol
min. typ. max.
Input capacitance
VEB = 0.5 V, f = 1 MHz Cibo ––10
dBNoise figure
I
C = 100 µA, VCE = 5 V, RS = 1 k,
f = 10 Hz to 15.7 kHz
F––4
kInput impedance
I
C = 1 mA, VCE = 10 V, f = 1 kHz h11e 2–12
10–4
Open-circuit reverse voltage transfer ratio
I
C = 1 mA, VCE = 10 V, f = 1 kHz h12e 0.1 10
Short-circuit forward current transfer ratio
I
C = 1 mA, VCE = 10 V, f = 1 kHz h21e 100 400
µSOpen-circuit output admittance
I
C = 1 mA, VCE = 10 V, f = 1 kHz h22e 3–60
ns
ns
ns
ns
VCC = 3 V, IC = 10 mA, IB1 = 1 mA
VBE(off) = 0.5 V
Delay time
Rise time
VCC = 3 V, IC = 10 mA, IB1 = IB2 = 1 mA
Storage time
Fall time
(see diagrams)
td
tr
tstg
tf
35
35
225
75
Semiconductor Group 4
PZT 3906
Switching Times
Turn-on time when switched from + VBEoff = 0.5 V to –VBEon = 10.6 V, – ICon = 10 mA;
–I
Bon = 1 mA
Input waveform; tr<1 ns; tp= 300 ns; Delay and rise time test circuit; total shunt
δ = 0.02. capacitance of test jig and connectors
CS<4 pF; scope impedance = 10 M.
Turn-off time ICon = 10 mA; IBon = – IBoff = 1 mA
Storage and fall time test circuit; total shunt
capacitance of test jig and connectors
CS<4 pF; scope impedance = 10 M.
Input waveform; tf<1 ns; 10 µs<tp500 µs;
δ = 0.02.
Semiconductor Group 5
PZT 3906
Total power dissipation Ptot =f(TA*; TS)
* Package mounted on epoxy
DC current gain hFE =f(IC)
VCE = 1 V, normalized
Saturation voltage IC=f(VBEsat,VCEsat)
hFE =10
Permissible pulse load Ptot max /Ptot DC =f(tp)