SEMICONDUCTOR GENERAL CATALOG
Optical Semiconductor Devices
Visibl e LEDs
Photosensors
Photocouplers and Photorelays
Fiber-Optic Device s (TOSLINKTM)
Image Sensors
12010/8 SCE0004J
Visible LEDs
Dual-C olor LED Lamps Optical Characteristics (Ta = 25°C)
Intensity (mcd)
IF = 20 mA Typical Emitting
Wavelength
Part Number Source Color
Min Typ.
Viewing Angle
2θ1/2 (°) λd (nm)
λp (nm)
Lens Color
Absolute Maximum DC
Forwa rd Curr en t Rating
IF (mA)
@Ta = 25°C
Typical Applications
Red 476 1100 626 636
TLRMHGH48T(F) Green 272 500
30/35 571 574 Transparent
(Lens diameter: φ5 mm)
50 (Total)
Red 272 450 626 636
TLRMHGH48M(F) Green 153 220
45/50 571 574
Milky white diffused
(Lens diameter: φ5 mm)
50 (Total) Message boards
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
22010/8 SCE0004J
High-Brightness LED Lamps ( φ5 ) Optical Characteristics (Ta = 25°C)
Intensity (mcd)
I
F = 20 mA Typical Emitting
Wavelength
Part Number Source Color
Min Typ.
Viewing Angle
2•1/2 (°) λd (nm)
λp (nm)
Lens Color
Absolute Maximum
DC Forward Current
Rating
IF (mA)
@Ta = 25°C
Typical Applications
TLRME20CP(F)
4760 12000 626 636 Red transparent 50
TLSH20TP(F) 4760 11000 613 623 Transparent 50
TLRMH20TP(F)
2720 9000 626 636 Transparent 50
TLSE20TP(F) 2720 9000 613 623 Transparent 50
TLRME20TP(F)
2720 8000 626 636 Transparent 50
TLRE20TP(F) 2720 7000
7
630 644 Transparent 50
TLSH38TP(F) 2720 6500 613 623 Transparent 50
TLRMH38TP(F)
1530 4800 12 626 636 Transparent 50
TLSH17TP(F) 1530 4500 613 623 Transparent 50
TLRMH17TP(F)
850 3200 626 636 Transparent 50
TLRH17TP(F) 850 2000 630 644 Transparent 50
TLSE17TP(F) 850 3000 613 623 Transparent 50
TLRME17TP(F)
850 2400 626 636 Transparent 50
TLRE17TP(F) 476 1500
20
630 644 Transparent 50
TLRMK37TP(F)
* 1530 5600 23 626 636 Transparent 50
Pilot lamps
(narrow range)
TLSH16TP(F) 850 1900 613 623 Transparent 50
TLSH16CP(F) 476 1500 613 623 Red transparent 50
TLRMH16TP(F)
476 1500 626 636 Transparent 50
TLRMH16CP(F)
476 1300 626 636 Red transparent 50
TLSE16TP(F) 476 1500 613 623 Transparent 50
TLSE16CP(F) 476 1000 613 623 Red transparent 50
TLRME16TP(F)
272 1200 626 636 Transparent 50
TLRE16TP(F) 272 800 630 644 Transparent 50
TLRME16CP(F)
272 800 626 636 Red transparent 50
TLRE16CP(F) 153 600 630 644 Red transparent 50
TLRME17DP(F)
153 500
25
626 636 Red diffused 50
TLRMK16TAP(F)
* 1530 5400 30 626 636 Transparent 50
TLSE30TP(F) 272 1000 613 623 Transparent 50
TLRE30TP(F) 153 600 30 630 644 Transparent 50
TLSH30TP(F) 476 1300 613 623 Transparent 50
TLRMH30TP(F)
476 950 626 636 Transparent 50
TLRH30TP(F) 272 680 33 630 644 Transparent 50
TLRMH30MP(F)
272 600 40 626 636 Milky white diffused
50
Message boards
Backlighting
TLRE25TP(F) 47.6 150 75 630 644 Transparent 50
TLRE11TP(F)
Red
8.5 20 130 630 644 Transparent 50 Backlighting
(wide range)
TLOH20TP(F) 4760 15000 605 612 Transparent 50
TLOE20TP(F) 4760 10000 7 605 612 Transparent 50
TLOH38TP(F) 2720 7500 12 605 612 Transparent 50
TLOH17TP(F) 1530 5000 605 612 Transparent 50
TLOE17TP(F) 1530 4500 605 612 Transparent 50
TLOE17CP(F) 1530 3500 20 605 612 Orange transparent
50
Pilot lamps
(narrow range)
TLOH16TP(F) 850 2300 605 612 Transparent 50
TLOH16CP(F) 850 2100 605 612 Orange transparent
50
TLOE16TP(F) 850 2000 605 612 Transparent 50
TLOE16CP(F) 476 1600
25
605 612 Orange transparent
50
TLOE30TP(F) 476 1400 30 605 612 Transparent 50
TLOH30TP(F) 476 1600 33 605 612 Transparent 50
Message boards
Backlighting
TLOE25TP(F) 153 350 75 605 612 Transparent 50
TLOE11TP(F)
Orange
27.2 65 130 605 612 Transparent 50 Backlighting
(wide range)
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components. *: New product
32010/8 SCE0004J
High-Brightness LED Lamps ( φ5 ) (Continued) Optical Characteristics (Ta = 25°C)
Intensity (mcd)
I
F = 20 mA Typical Emitting
Wavelength
Part Number Source Color
Min Typ.
Viewing Angle
2•1/2 (°) λd (nm)
λp (nm)
Lens Color
Absolute Maximum DC
Forward Cu
rrent Rating
IF (mA)
@Ta = 25°C
Typical Applications
TLYH20TP(F) 4760 13000 587 590 Transparent 50
TLYE20TP(F) 2720 9500 7 587 590 Transparent 50
TLYH38TP(F) 2720 7000 12 587 590 Transparent 50
TLYH17TP(F) 1530 4800 587 590 Transparent 50
TLYE17TP(F) 850 3000 587 590 Transparent 50
TLYE17CP(F) 850 3000 20 587 590 Yellow transparent
50
TLYK37TP(F) * 2720 6800 23 590 594 Transparent 50
Pilot lamps
(narrow ra nge)
TLYH16TP(F) 850 2200 587 590 Transparent 50
TLYH16CP(F) 850 2000 587 590 Yellow transparent
50
TLYE16TP(F) 476 1500 587 590 Transparent 50
TLYE16CP(F) 476 1200
25
587 590 Yellow transparent
50
TLYE30TP(F) 476 1300 30 587 590 Transparent 50
TLYK16TAP(F)
* 2720 5900 30 590 594 Transparent 50
TLYH30TP(F) 476 1350 33 587 590 Transparent 50
Message boards
Backlighting
TLYE25TP(F) 85 300 75 587 590 Transparent 50
TLYE11TP(F)
Yellow
15.3 45 130 587 590 Transparent 50 Backlighting
(wide range)
TLPYE23TP(F)
2720 8000 5 580 583 Transparent 50
TLPYE19TP(F)
476 2000 18 580 583 Transparent 50 Pilot lamps
(narrow ra nge)
TLPYE18TP(F)
Pure yellow 272 750 30 580 583 Transparent 50 Message boards
Backlighting
TLGE23TP(F) 2720 7000 571 574 Transparent 50
TLGU23TP(F) 1530 4000 5 571 574 Transparent 30
TLGE19TP(F) 476 1300 571 574 Transparent 50
TLGE19CP(F) 476 1100 18 571 574 Green transparent
50
Pilot lamps
(narrow ra nge)
TLGE18TP(F) 272 700 571 574 Transparent 50
TLGE18CP(F) 153 500 571 574 Green transparent
50
TLGU18TP(F) 85 200 571 574 Transparent 30
TLGU18CP(F) 47.6 180
30
571 574 Green transparent
30
TLGU13CP(F) 47.6 120 45 571 574 Green transparent
30
TLGU13DP(F) 27.2 70 55 571 574 Green diffused 30
Message boards
Backlighting
TLGE25TP(F) 27.2 90 75 571 574 Transparent 50
TLGE11TP(F)
Green
8.5 20 130 571 574 Transparent 50 Backlighting
(wide range)
TLFGE23TP(F)
1530 5000 5 565 568 Transparent 50
TLFGE19TP(F)
272 800 565 568 Transparent 50
TLFGE19CP(F)
272 800 18 565 568 Green transparent
50
Pilot lamps
(narrow ra nge)
TLFGE18TP(F)
Fresh green
85 300 30 565 568 Transparent 50 Message boards
Backlighting
TLPGE23TP(F)
850 3000 558 562 Transparent 50
TLPGU23TP(F)
476 1600 5 558 562 Transparent 30
TLPGE19TP(F)
153 500 18 558 562 Transparent 50
Pilot lamps
(narrow ra nge)
TLPGE18TP(F)
85 200 558 562 Transparent 50
TLPGU18TP(F)
27.2 90 30 558 562 Transparent 30
TLPGU13CP(F)
27.2 80 45 558 562 Green transparent
30
TLPGU13DP(F)
15.3 35 55 558 562 Green diffused 30
Message boards
Backlighting
TLPGE11TP(F)
Pure green
2.72 8 130 558 562 Transparent 50 Backlighting
(wide range)
TLGTC16TP(F)
1530 6000 18 505 503 Transparent 30 Pilot lamps
(narrow ra nge)
TLGTC30TP(F)
850 3200 25 505 503 Transparent 30
TLGTC32TP(F)
Bluish green
850 2500 33 505 503 Transparent 30 Message boards
Backlighting
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components. *: New product
42010/8 SCE0004J
High-Brightness LED Lamps ( φ3 ) Optical Characteristics (Ta = 25°C)
Intensity (mcd) IF = 20 mA
Typical Emitting Wavelength
Part Number Source Color Min Typ.
Viewing Angle
2•1/2 (°) λd (nm) λp (nm) Lens Color
Absolute Maximum DC
Forward Current Rating
IF (mA) @Ta = 25°C)
Typical Applications
TLSH50T(F) 2720 4700 613 623 Transparent 50
TLRH50T(F) 850 2000 630 644 Transparent 50
TLSE50T(F) 1530 3500 613 623 Transparent 50
TLRME50C(F)
1530 3500 626 636 Red transparent 50
TLRME50T(F)
850 2500 626 636 Transparent 50
TLRE50T(F) 850 2200
16
630 644 Transparent 50
TLSE53T(F) 272 800 613 623 Transparent 50
TLRME53T(F)
272 600 626 636 Transparent 50
TLRE53T(F) 153 400 45 630 644 Transparent 50
Pilot lamps
TLRME68TG(F)
∆
85 330 626 636 Transparent 50
TLRME68CG(F)
∆
85 260 626 636 Red transparent 50
TLSE62T(F) 85 200 613 623 Transparent 50
TLRH62T(F) 47.6 180 630 644 Transparent 50
TLRME62T(F)
47.6 180 626 636 Transparent 50
TLRE62T(F) 47.6 120
80
630 644 Transparent 50
TLRME68DG(F)
∆
47.6 140 100 626 636 Red transparent 50
TLRE60T(F)
Red
15.3 45 120 630 644 Transparent 50
Backlighting
(wide range)
TLOE50C(F) 2720 7000 605 612 Orange transparent
50
TLOH50T(F) 1530 5800 605 612 Transparent 50
TLOE50T(F) 1530 4500 16 605 612 Transparent 50
TLOE53T(F) 272 1000 45 605 612 Transparent 50
Pilot lamps
TLOH62T(F) 153 550 605 612 Transparent 50
TLOE62T(F) 153 350 80 605 612 Transparent 50
TLOE60T(F)
Orange
27.2 100 120 605 612 Transparent 50
Backlighting
(wide range)
TLYH50T(F) 1530 4400 587 590 Transparent 50
TLYE50T(F) 1530 3500 587 590 Transparent 50
TLYE50C(F) 1530 3500 16 587 590 Yellow transparent
50
TLYE53T(F) 272 800 45 587 590 Transparent 50
Pilot lamps
TLYH68TG(F)
272 520 587 590 Transparent 50
TLYH62T(F) 153 400 587 590 Transparent 50
TLYE68TG(F)
∆
85 340 587 590 Transparent 50
TLYE68CG(F)
∆
85 300 587 590 Yellow transparent
50
TLYE62T(F) 85 250
80
587 590 Transparent 50
TLYE68DG(F)
∆
47.6 150 100 587 590 Yellow diffused 50
TLYE60T(F)
Yellow
27.2 85 120 587 590 Transparent 50
Backlighting
(wide range)
TLPYE50T(F) 850 2500 16 580 583 Transparent 50
TLPYE53T(F) 153 450 45 580 583 Transparent 50 Pilot lamps
TLPYE62T(F) Pure yellow 47.6 150 80 580 583 Transparent 50 Backlighting
(wide range)
TLGU50T(F) 476 1200 10 571 574 Transparent 30
TLGE50T(F) 476 1500 16 571 574 Transparent 50
TLGU53T(F) 47.6 170 571 574 Transparent 30
TLGU53C(F) 47.6 150 40 571 574 Green transparent
30
TLGE53T(F) 153 400 45 571 574 Transparent 50
Pilot lamps
TLGU53D(F) 27.2 80 50 571 574 Green diffused 30
TLGU62T(F) 27.2 70 571 574 Transparent 30
TLGE68TG(F)
∆
47.6 155 571 574 Transparent 50
TLGE68CG(F)
∆
47.6 110 571 574 Green transparent
50
TLGE62T(F) 47.6 110
80
571 574 Transparent 50
TLGE68DG(F)
∆
15.3 45 100 571 574 Green diffused 50
TLGE60T(F)
Green
15.3 50 120 571 574 Transparent 50
Backlighting
(wide range)
TLFGE50T(F) 272 1000 565 568 Transparent 50
TLFGE50C(F)
272 1000 16 565 568 Green transparent
50
TLFGE53T(F) 85 200 45 565 568 Transparent 50 Pilot lamps
TLFGE68CG(F)
∆
27.2 70 565 568 Green transparent
50
TLFGE62T(F) 27.2 70 80 565 568 Transparent 50
TLFGE68DG(F)
∆
Fresh green
15.3 30 100 565 568 Green diffused 50
Backlighting
(wide range)
TLPGU50T(F)
153 450 10 558 562 Transparent 30
TLPGE50T(F) 153 600 16 558 562 Transparent 50
TLPGU53T(F)
27.2 80 558 562 Transparent 30
TLPGU53C(F)
27.2 70 40 558 562 Green transparent
30
TLPGE53T(F) 47.6 130 45 558 562 Transparent 50
Pilot lamps
TLPGU53D(F)
15.3 40 50 558 562 Green diffused 30
TLPGE62T(F) 15.3 45 558 562 Transparent 50
TLPGU62T(F)
Pure green
8.5 25 80 558 562 Transparent 30
Backlighting
(wide range)
∆ : Mount flu sh wi th PCB
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
52010/8 SCE0004J
High-Brightness LED Lamps (Other) Optical Characteristics (Ta = 25°C)
Intensity (mcd)
I
F = 20 mA Typical Emitting
Wavelength
Part Number Source Color
Package
Size
(mm) Min Typ.
Viewing Angle
2•1/2 (°) λd (nm)
λp (nm)
Lens Color
Absolute Maximum DC
Forward Current Rating
IF (mA)
@Ta = 25°C
Typical Applications
TLSE27C(F) 272 750 30/50 613 623 Red transparent
50
TLRH27T(F) 153 450 40/70 630 644 Transparent 50
TLRME27C(F)
153 400 626 636 Red transparent
50
TLRE27C(F)
Red
85 300 30/50 630 644 Red transparent
50
TLOE27C(F) Orange 272 800 30/50 605 612 Orange transparent
50
TLYH27T(F) 272 900 40/70 587 590 Transparent 50
TLYE27C(F) Yellow 272 650 30/50 587 590 Yellow transparent
50
TLGE27C(F) Green
Oval
5 x 5.8
85 250 30/50 571 574 Green transparent
50
TLRE28C(F) 85 200 630 644 Red transparent
50
TLRME28C(F)
85 200 626 636 Red transparent
50
TLSE28C(F) Red 85 300 80/50 613 623 Red transparent
50
TLYH28C(F) 272 750 70/50 587 590 Yellow transparent
50
TLYE28C(F) Yellow 153 350 587 590 Yellow transparent
50
TLOE28C(F) Orange 153 500
80/50 605 612 Orange transparent
50
TLGH28C(F) 47.6 170 70/50 571 574 Green transparent
50
TLGE28C(F) Green
Oval
4. 3 x 5
47.6 150 80/50 571 574 Green transparent
50
Message boards
TLOE33CP(F) Orange 1530 4000 605 612 Orange transparent
50
TLYE33CP(F) Yellow 1530 3500 587 590 Yellow transparent
50
TLPYE33CP(F) Pure yellow
476 1400 580 583 Yellow transparent
50
TLFGE33CP(F) F resh green
153 400 565 568 Green transparent
50
TLGE33CP(F) 272 800 571 574 Green transparent
50
TLGE33TP(F) Green
Arched
5 x 2.5
476 1300
10
571 574 Transparent 50
Backlighting
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
62010/8 SCE0004J
Surf ace-Mount LED Lamps (1608) Optical Characteristics (Ta = 25°C)
Intensity IV (mcd) Typical Emitting
Wavelength
Part Number Source Color Package Size (mm)
Min Typ. λd (nm)
λp (nm)
Viewing Angle
2•1/2 (°) IF
(mA) Packaging Specification
TLRE1008A(T04)/(T05)
☆
Red 27.2 70 630 644
TLSE1008A(T04)/(T05)
☆
Red 47.6 135 613 623
TLOE1008A(T04)/(T05)
☆
Orange 47.6 150 605 612
TLYE1008A(T04)/(T05)
☆
Yellow 27.2 105 587 590
TLPYE1008A(T04)/(T05)
☆
Pure yellow 27.2 70 580 583
TLGE1008A(T04)/(T05)
☆
Green 27.2 70 571 574
TLFGE1008A(T04)/(T05)
☆
Fresh green 8.5 30 565 568
TLPGE1008A(T04)/(T05)
☆
Pure green 4.76 18 558 562
130 to 135
TLSU1008A(T04)/(T05)
☆
Red 27.2 60 623 636
TLOU1008A(T04)/(T05)
☆
Orange 27.2 78 605 612
TLAU1008A(T04)/(T05)
☆
Amber 8.5 30 592 596
TLYU1008A(T04)/(T05)
☆
Yellow 8.5 30 587 590
TLGU1008A(T04)/(T05)
☆
Green 8.5 30 571 574
TLPGU1008A(T04)/(T05)
☆
Pure green
1.6(L) x 0.8(W) x 0.6(H)
(PC B type)
1.53 6 558 562
100 to 110
20
Embossed tape
Tape No.: T04
4-mm pitch
4000 pcs/reel
Tape No.: T05
2-m m pitch
8000 pcs/reel
TLRV1022(T14,F)/(T15 ,F)
☆
Red 4.76 15 630 644
TLRMV1022(T14,F)/(T15, F)
☆
Red 4.76 20 626 636
TLSV1022(T14,F)/(T15,F)
☆
Red 8.5 30 613 623
TLOV1022(T14,F)/(T 15,F)
☆
Orange 8.5 38 605 612
TLAV1022(T14,F)/(T15,F)
☆
Amber 8.5 25 592 596
TLYV1022(T14,F)/(T15,F)
☆
Yellow 8.5 25 587 590
TLGV1022(T14,F)/(T 15,F)
☆
Green 4.76 14 571 574
TLPGV1022(T14,F)/(T15 ,F)
☆
Pure green 1.53 3.5 561 558
5
TLRH1032(T14,F)/(T 15,F)
☆
Red 25 56 630 644
TLRMH1032(T14,F) /(T15,F)
☆
Red 40 85 626 636
TLSH1032(T14,F)/(T15 ,F)
☆
Red 63 160 613 623
TLOH1032(T14,F)/( T15,F)
☆
Orange 100 200 605 612
TLYH1032(T14,F)/(T15 ,F)
☆
Yellow 40 100 587 590
TLGH1032(T14,F)/( T15,F)
☆
Green 25 60 571 574
TLFGH1032(T14,F)/(T15, F)
☆
Fr esh green
1.6(L) x 0.8(W) x 0.45(H)
(ESC typ e)
10 25 565 568
135 to 140
20
Embossed tape
Tape No.: T14
4-m m pitch
4000 pcs/reel
Tape No.: T15
2-m m pitch
8000 pcs/reel
☆
: Dry-packed
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
Surf ace-Mount LED Lamps (2125) Optical Characteristics (Ta = 25°C)
Intensity IV (m cd) Typical Emitting
Wavelength
Part Number Source Color Package Size (mm)
Min Typ. λd (nm)
λp (nm)
Viewing Angle
2•1/2 (°) IF
(mA) Packaging Specification
TLRE1002A(T02)
☆ Red 27.2 70 630 644
TLSE1002A(T02)
☆ Red 47.6 135 613 623
TLOE1002A(T02)
☆ Orange 47.6 150 605 612
TLYE1002A(T02)
☆ Yellow 27.2 105 587 590
TLPYE1002A(T02)
☆ Pure yellow 27.2 70 580 583
TLGE1002A(T02)
☆ Green 27.2 70 571 574
TLFGE1002A(T02)
☆ Fresh green 8.5 25 565 568
TLPGE1002A(T02)
☆ Pure green 4.76 18 558 562
130 to 140
TLRU1002A(T02)
☆ Red 4.76 45 630 644
TLSU1002A(T02)
☆ Red 27.2 60 623 636
TLOU1002A(T02)
☆ Orange 27.2 78 605 612
TLAU1002A(T02)
☆ Amber 8.5 30 592 596
TLYU1002A(T02)
☆ Yellow 8.5 30 587 590
TLGU1002A(T02)
☆ Green 8.5 30 571 574
TLPGU1002A(T02)
☆ Pure green
2.0(L) x 1.25(W) x 1.1(H)
1.53 6 558 562
120 to 130
20
Em bossed tape
Tape No.: T02
4-mm pitch
3000 pcs/reel
☆
: Dry-packed
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
72010/8 SCE0004J
Surf ace-Mount LED Lamps (φ3.6 Lens-Top) Optical Characteristics (Ta = 25°C)
Intensity IV (m cd) Typical Emitting
Wavelength
Part Number Source Color Package Size (mm)
Min Typ. λd (nm)
λp (nm)
Viewing Angle
2•1/2 (°) IF
(mA) Packaging Specification
TLRM1050(T20) *
☆ Red 630 1800 630 644
TLRMM1050(T20)
*
☆ Red 1000 2000 626 636
TLSM1050(T20) *
☆ Red 1600 2800 613 623
TLOM1050(T20) *
☆ Orange 1600 3500 605 612
TLYM1050(T20) *
☆ Yellow
5.2(L) x 5.2(W) x 4.0(H)
with φ3.6 lens
1600 3000 590 592
35
TLRM1052(T20) *
☆ Red 630 1200 630 644
TLRMM1052(T20)
*
☆ Red 630 1300 626 636
TLSM1052(T20) *
☆ Red 1000 1900 613 623
TLOM1052(T20) *
☆ Orange 1000 2200 605 612
TLYM1052(T20) *
☆ Yellow
5.2(L) x 5.2(W) x 4.0(H)
with 3.6 x 4.4 Oval lens
1000 1900 590 592
30/85
20
TLRMH1050(T20)
☆ Red 272 700 626 636
TLSH1050(T20)
☆ Red 476 1400 613 623
TLOH1050(T20)
☆ Orange 476 1500 605 612
TLYH1050(T20)
☆ Yellow 476 1000 587 590
TLGH1050(T20)
☆ Green 272 600 571 574
TLFGH1050(T20)
☆ Fresh green 85 250 565 568
30
TLEGD1050(T20)
☆ Green 476 1300 528 518
TLBD1050(T20)
☆ Blue
5.2(L) x 5.2(W) x 4.0(H)
with φ3.6 lens
153 400 470 468 40
20
TLRMH1052(T20)
☆ Red 153 450 626 636
TLSH1052(T20)
☆ Red 272 900 613 623
TLOH1052(T20)
☆ Orange 476 1000 605 612
TLYH1052(T20)
☆ Yellow 272 750 587 590
TLGH1052(T20)
☆ Green 153 400 571 574
TLFGH1052(T20)
☆ Fresh green 85 190 565 568
30/85
TLEGD1052(T20)
☆ Green 272 850 528 518
TLBD1052(T20)
☆ Blue
5.2(L) x 5.2(W) x 4.0(H)
with 3.6 x 4.4 Oval lens
85 300 470 468 30/75
20
TLRMF1050(T20)
☆ Red 250 700 626 636
TLSF1050(T20)
☆ Red 630 1400 613 623
TLOF1050(T20)
☆ Orange 630 1500 605 612
TLYF1050(T20)
☆ Yellow 630 1000 587 590
TLGF1050(T20)
☆ Green 400 900 571 574
TLFGF1050(T20)
☆ Fresh green 160 370 565 568
TLPGF1050(T20)
☆ Pure green
5.2(L) x 5.2(W) x 4.0(H)
with φ3.6 lens
100 180 558 562
30 20
TLRMF1052(T20)
☆ Red 160 450 626 636
TLSF1052(T20)
☆ Red 400 900 613 623
TLOF1052(T20)
☆ Orange 400 1000 605 612
TLYF1052(T20)
☆ Yellow 250 750 587 590
TLGF1052(T20)
☆ Green 250 600 571 574
TLFGF1052(T20)
☆ Fresh green 100 280 565 568
TLPGF1052(T20)
☆ Pure green
5.2(L) x 5.2(W) x 4.0(H)
with 3.6 x 4.4 Oval lens
63 140 558 562
30/85 20
Em bossed tape
Tape No.: T20
8-mm pitch
400 pcs/reel
☆
: Dry-packed *: New product
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
Mini P LCC LED Lamps (Flat-Top) Optical Characteristics (Ta = 25°C)
Intensity IV (mcd) Typical Emitting
Wavelength
Part Number Source Color Package Size (mm)
Min Typ. λd (nm)
λp (nm)
Viewing Angle
2•1/2 (°) IF
(mA) Packaging Specification
TLRF1060(T18)
☆ Red 40 100 630 644
TLSF1060(T18)
☆ Red 100 200 613 623
TLOF1060(T18)
☆ Orange 100 220 605 612
TLYF1060(T18)
☆ Yellow 63 180 587 590
TLPYF1060(T18)
☆ Pure yellow 40 100 580 583
TLGF1060(T18)
☆ Green 40 80 571 574
TLFGF1060(T18)
☆ Fresh green 25 50 565 568
TLPGF1060(T18)
☆ Pure green 10 20 558 562
TLEGD1060(T18)
☆ Green 63 150 528 523
TLBD1060(T18)
☆ Blue 25 60 470 468
100 20
TLCBD1060(T18)
☆ Ice blue 40 100
♠
0.2/0.3
TLWD1060(T18)
☆ White
2.2(L) x 1.4(W) x 1.3(H)
40 100
♠
0.32/0.31 100 10
Em bossed tape
Tape No.: T18
4-mm pitch
3000 pcs/reel
☆
: Dry-packed
♠: CIE1931 (chromaticity coordinate) (typ.)
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
82010/8 SCE0004J
PLCC SMD LED Lamps (Flat-Top) Optical Characteristics (Ta = 25°C)
Intensity IV (mcd) Typical Emitting
Wavelength
Part Number Source Color Package Size (mm)
Min Typ. λd (nm)
λp (nm)
Viewing Angle
2•1/2 (°) IF
(mA)
Packaging
Specification
TLRK1100C(T11)
☆ Red 100 300 630 644
TLRMK1100C(T11)
☆ Red 160 400 626 636
TLSK1100C(T11)
☆ Red 250 500 613 623
TLOK1100C(T11)
☆ Orange 250 500 605 612
TLYK1100C(T11)
☆ Yellow 160 400 590 592
TLRH1100B(T11)
☆ Red 63 150 630 644
TLRMH1100B(T11)
☆ Red 63 150 626 636
TLSH1100B(T11)
☆ Red 160 260 613 623
TLOH1100B(T11)
☆ Orange 160 270 605 612
TLYH1100B(T11)
☆ Yellow 100 220 587 590
TLGH1100B(T11)
☆ Green 63 150 571 574
TLFGH1100B(T11)
☆ Green 40 70 565 568
TLPGH1100B(T11)
☆ Green 16 35 558 562
TLRE1100B(T11)
☆ Red 40 100 630 644
TLSE1100B(T11)
☆ Red 63 180 613 623
TLOE1100B(T11)
☆ Orange 63 180 605 612
TLYE1100B(T11)
☆ Yellow 63 150 587 590
TLGE1100B(T11)
☆ Green 40 100 571 574
TLFGE1100B(T11)
☆ Fresh green 25 45 565 568
TLPGE1100B(T11)
☆ Fresh green 10 25 558 562
TLEGE1100B(T11)
☆ Green 100 350 528 523
TLGTE1100B(T11)
☆ Bluish green 160 300 505 496
TLBE1100B(T11)
☆ Blue 63 100 470 468
TLEGD1100B(T11)
☆ Green 100 200 528 518
TLBD1100B(T11)
☆ Blue 40 70 470 468
20
TLBA1100B(T11)
☆ Blue 4 7 465 428
TLCBD1100B(T11)
*
☆ Ice blue 32 90
♠
0.2/0.3 10
TLWD1100B(T11)
☆ White
3.5(L) x 2.8(W) x 1.9(H)
63 180
♠
0.32/0.31
TLCBK1100B(T11)
*
☆ Ice blue 1000 1500
♠
0.2/0.3
TLEGF1100C(T11)
*
☆ Green 400 700 528 518
TLBF1100C(T11) *
☆ Blue 200 300 470 468
TLWF1100C(T11) *
☆ White (Color temperature: 6500 K) 1000 1600
♠
0.31/0.30
TLWNF1100C(T11)
*
☆ White (Color temperature: 5000 K) 1000 1600
♠
0.345/0.35
TLWLF1100C(T11)
*
☆ White (Color temperature: 3000 K) 800 1160
♠
0.44/0.40
TLWK1100C(T11)
☆ White (Color temperature: 6500 K) 1250 1700
♠
0.31/0.30
TLWLK1100B(T11)
*
☆ White (Color temperature: 3000 K) 1000 1500
♠
0.44/0.40
TLWWK1100B(T11)
*
☆ White (Color temperature: 3500 K)
3.5(L) x 2.9(W) x 1.9(H)
1000 1500
♠
0.40/0.39
20
TLRH1106(T11)
☆ Red 160 380 630 644
TLRMH1106(T11)
☆ Red 160 380 626 636
TLSH1106(T11)
☆ Red 250 500 613 623
TLOH1106(T11)
☆ Orange 250 600 605 612
TLYH1106(T11)
☆ Yellow 250 450 587 590
TLGH1106(T11)
☆ Green
3.5(L) x 2.8(W) x 1.9(H)
100 200 571 574
50
TLRM1108(T11) *
☆ Red 630 1300 630 644
TLRMM1108(T11) *
☆ Red 630 1600 626 636
TLSM1108(T11) *
☆ Red 1000 2400 613 623
TLOM1108(T11) *
☆ Orange 1000 2500 605 612
TLYM1108(T11) *
☆ Yellow
3. 5(L) x 2.9(W) x 1.9(H)
1000 2200 590 592
50
TLWK1109(T11) *
☆ White (Color temperature: 6500 K) 2000 3200
♠
0.31/0.3
TLWNK1109(T11) *
☆ White (Color temperature: 5000 K) 2000 3200
♠
0.345/0.35
TLWLK1109(T11) *
☆ White (Color temperature: 3000 K) 3.5(L) x 2.9(W) x 1.9(H) 1600 2500
♠
0.44/0.4
120
40
Em bossed tape
Tape No.: T11
4-mm pitch
2000 pcs/reel
☆
: Dry-packed *: New product
♠: CIE1931 (chromaticity coordinate) (typ.)
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
92010/8 SCE0004J
High Luminous Flux LED Lamps Optical Characteristics (Ta = 25°C)
Luminous Flux
F (Im)
♠
Typical
Chromaticity Forward Voltage
VF (V)
Part Number Source Color Package Size (mm)
Min Typ.
Cx Cy Typ.
Max
Viewing Angle
2•1/2 (°) IF
(mA)
Packaging Specification
TL19W01-D(T32)
**
☆
White
(Color temperature: 6500 K)
90 (Note1)
110 0.32 0.31 3.3 3.8 (Note2)
TL19W01-N(T32)
**
☆
White
(Color temperature: 5000 K)
100 (Note1)
120 0.345 0.35 3.3 3.8 (Note2)
TL19W01-L(T32) **
☆
White
(Color temperature: 3000 K)
3.8(L)×3.1(W)×0.55(H)
70 (Note1)
95 0.44 0.4 3.3 3.8 (Note2)
135 300
Em bossed tape
Tape No.: T32
8-mm pitch
500 pcs/reel
TL12W03-D(T30)
☆
White
(Color temperature: 6500 K)
67.3
(Note3) 90 0.32 0.31 3.3 3.9
(Note2)
TL12W03-N(T30)
☆
White
(Color temperature: 5000 K)
67.3
(Note3) 100 0.345 0.35 3.3 3.9
(Note2)
TL12W03-L(T30)
☆
White
(Color temperature: 3000 K)
47.6
(Note3) 75 0.44 0.4 3.3 3.9
(Note2)
350
TL12W02-D(T30)
☆
White
(Color temperature: 6500 K)
40 90 0.32 0.31 6.8 7.9
TL12W02-N(T30)
☆
White
(Color temperature: 5000 K)
40 90 0.345 0.35 6.8 7.9
TL12W02-L(T30)
☆
White
(Color temperature: 3000 K)
28 60 0.44 0.40 6.8 7.9
TL12W01-D(T30)
☆
White
(Color temperature: 6500 K)
20 40 0.32 0.31 3.4 4.0
TL12W01-L(T30)
☆
White
(Color temperature: 3000 K)
14 30 0.44 0.40 3.4 4.0
120
TL12B01(T30)
☆
Blue
10. 5(L) x 5.0(W) x 2.1(H)
3.5 6
※•d(nm) = Typ.
460 nm 3.4 4.0 100
250
Em bossed tape
Tape No.: T30
8-mm pitch
500 pcs/reel
☆
: Dry-packed **: Under development
♠: CIE1931 (chromaticity coordinate)
Note 1: Min/max tolerance ±10 %
Note 2: Min/max tolerance ±0.1 V
Note 3: Min/max tolerance ±20 %
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
Middle Luminous Flux LED Lam ps Optical Characteristics (Ta = 25°C)
Luminous Flux
F (Im)
♠
Typical
Chromaticity Forward Voltage
VF (V)
Part Number Source Color
Package Size (mm)
Min Typ. Cx Cy Typ. Max
Viewing Angle
2•1/2 (°) IF
(mA) Packaging Specification
TL30W01-D(T36)
☆
White 4.5(L) x 2.0(W) x 0.8 (H)
15.1 (Note1)
19 0.32 0.31 3.2 3.8(Note2)
120 150
Em bossed tape
Tape No.: T36
4-mm pitch
1000 pcs/reel
☆
: Dry-packed
♠: CIE1931 (chromaticity coordinate)
Note 1: Min/max tolerance ±10 %
Note 2: Min/max tolerance ±0.05 V
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
10 2010/8 SCE0004J
Photosensors
Inf rared LEDs and Visible LEDs for Sensor Light Sources Electrical/Optical Characteristics (Ta = 25°C)
Radiant Intensity Radiant Power
Part Number Part Number
with Rank
Package Min
(mW/sr)
Max
(mW/sr)
IF (mA)
Min
(mW) Max
(mW) IF (mA)
Peak
Emission
Wavelength
(nm)
Half-Value
Angle
( ° )
Applications
TLN108(F) ⎯ TO-18CAN with lens 10 ⎯ 50 ⎯ ⎯ ⎯ 940 ±8 Optoelectronic switches
TLN105B(F)
⎯ φ5 12 ⎯ 50 ⎯ ⎯ ⎯ 950 ±23.5 Remote controls
TLN110(F) ⎯ φ5 15 ⎯ 50 ⎯ ⎯ ⎯ 940 ±8 Optoelectronic switches
⎯ 15 ⎯
TLN115A(F)
TLN115A(B,F)
φ5 19 ⎯ 50 ⎯ ⎯ ⎯ 950 ±21 Remote controls
TLN231(F) ⎯ φ5 35 ⎯ 50 ⎯ ⎯ ⎯ 870 ±16
TLN233(F) ⎯ φ5 46 ⎯ 50 ⎯ ⎯ ⎯ 870 ±13 F iberless optical transmissions,
optoelectronic switches
TLN227(F) ⎯ φ5 ⎯ ⎯ ⎯ 14 ⎯ 50 870 ±5
TLN225(F) ⎯ φ4.9 ⎯ ⎯ ⎯ 14 ⎯ 50 870 ±21
TLN226(F) ⎯ φ4.9 ⎯ ⎯ ⎯ 14 ⎯ 50 870 ±13 Fiberless optical transmissions
⎯ 2.5 10
TLN119(F) TLN119(B,F)
φ3 4.2 10 20 ⎯ ⎯ ⎯ 945 ±30 Optoelectronic switches
TLN238(F) ⎯ φ3 40 ⎯ 50 ⎯ ⎯ ⎯ 870 ±18 F iberless optical transmissions,
optoelectronic switches
⎯ 2 ⎯
TLN117(B,F)
2 7.5
TLN117(F) TLN117(C,F)
Small side-view package 5 18.7
20 ⎯ ⎯ ⎯ 940 ±15 Optoelectronic switches
TLOH9204
☆
⎯ 6-pin SMD 15◆ ⎯ 20 ⎯ ⎯ ⎯ 612 ±4
Specifically designed for digital still
cameras
TLN241 *
☆
▲
⎯ 1. 6(L) x 0.95 (W) x 0.6(H)
(PCB-mounted) ⎯ ⎯ ⎯ 11 ⎯ 30 850 ±78/87 Infrared lighting
☆
: Dry-packed *: New product
◆: Luminous intensity (cd)
▲: Sample available
Note: IF = fo rward curre nt
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
Phototransistors (for Opt ical Sensors) Electrical/Optical Characteristics (Ta = 25°C)
Light Current Dark Current
Part Number Part Number
with Rank Package Min
(µA) Max
(µA) E (mW/cm2)
Max
(µA) VCE (V)
Peak
Sensitive
Wavelength
(nm)
Half-Value
Angle
( ° )
Impermeable
to Visible Light
Applications
⎯ 100 ⎯
TPS601A(A,F) 100 300
TPS601A(B,F) 200 600
TPS601A(F)
TPS601A(C,F)
TO-18CAN with lens
400 1200
0.1 0.2 30 800 ±10 ⎯
TPS610(F) ⎯ φ5 100 ⎯ 0.1 0.1 24 800 ±8 ⎯
TPS611(F) ⎯ φ5 30 ⎯ 0.1 0.1 24 900 ±8 ●
⎯ 20 150
TPS615(B,F) 34 85
TPS615(C,F) 60 150
TPS615(F)
TPS615(BC,F)
φ3
34 150
0.1 0.1 24 800 ±30 ⎯
⎯ 10 75
TPS616(B,F) 17 42.5
TPS616(C,F) 30 75
TPS616(F)
TPS616(BC,F)
φ3
17 75
0.1 0.1 24 900 ±30 ●
⎯ 27 ⎯
TPS622(A,F) 27 80
TPS622(F)
TPS622(B,F)
Small side-view package
55 165
0.1 0.1 24 870 ±15 ●
Optoelectronic
switches
Note: E = radiant incidence; VCE = collector-emitter v oltage
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
11 2010/8 SCE0004J
Photodiodes Electrical/Optical Characteristics (Ta = 25°C)
Short-Circuit Current Dark Current
Part Number Package Min
(µA) E (mW/cm2)
Max
(nA) VR (V)
Peak Sensitive
Wavelength
(nm)
Half-Value
Angle
( ° )
Impermeable to
Visible Light
Applications
TPS703(F) 0.9 0.1 30 10 960 ±65 ●
TPS704(F) Side-view package 0.5 0.1 30 10 1000 ±65 ● Remote controls
Note: E = radiant incidence; VR = reverse voltage
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
Photo-ICs (Analog Output) Electrical/Optical Characteristics (Ta = 25°C)
Light Current Dark Current
Part Number Package Part Number
with Rank Min
(µA) Max
(µA) Ev (Ix) VCC (V)
Max
(µA) VCC (V)
Peak
Sensitive
Wavelength
(nm)
Half-Value
Angle
( ° )
Impermea
ble to
Visible
Light
Applications
TPS820(B,F)
Side-view
package ⎯ 1500 6000 E = 0.1 mW/cm2
5 0.5 5 870 ±15 ● Optoelectronic
switches
⎯ 37 74
TPS851(E
☆
TPS851(E,A 37 62
100 3 0.17 3.3 600 ±55 ⎯
⎯ 27 54 TPS852(T)/
TPS852(K)
☆
TPS852(A,T)/TPS852(A,K) 30 50 100 3 0.1 3.3 600 ±55 ⎯
⎯ 37 74
TPS853(E
☆
TPS853(E,A 42 70
100 3 0.1 3.3 600 ±55 ⎯
40 80
TPS856(T)/
TPS856(K)
☆
TPS856(A,T)/TPS856(A,K) 44.1 73.7 100 3 0.1 3 550 ±55 ⎯
⎯ 160 320
TPS859(T)/
TPS859(K)
☆
Chip type
TPS859(A,T)/TPS859(A,K) 180 300 100 3 0.2 3 550 ±55 ⎯
Ambient l ight
sensor
☆
: Dry-packed
Note 1: V CC = power supply voltage; EV: Illuminance; E = radiant incidence
Note 2: (T) = For world wide except japan, (K) = For japan
• The products shown in italic are manufactured by Toshiba semiconductor (Thailand) Co.,Ltd.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
12 2010/8 SCE0004J
Photointerrupters (Phototransistor Output)
Electrical Characteristics (Ta = 25°C) Absolute
Maximum Ratings
(Ta = 25°C)
Current Transfer Ratio
Part Number
Part Number
with Rank
Package Gap
(mm) Slit Widt h
(mm) Min
(%) Max
(%) IF (mA) VCE (V) Collector-Emitter
Voltage (V)
Applications
TLP832(F)
⎯ 5 0.5 5 100 10 2 35
TLP833(F)
⎯ 5 0.5 5 100 10 2 35
TLP831(F)
⎯ 4.2 0.5 (Note 1)
5 100 10 2 35
TLP830(F)
⎯
PWB direct mounting
2 0.15 3 20 10 2 35
Printers,
fax machines,
copiers,
image scanners,
vending machines
⎯ 1.2 0.3 3 24 5 2 15
TLP848(E)
☆
TLP848(R) Surface-mount,
ultra-compact package 1.2 0.3 4 20 5 2 15 Cameras,
cellular phones
☆
: Dry-packed
Note: PWB = printed wiring board; IF = forward current; VCE = collector-emitter voltage
Note 1: Horizontal slit
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
Photointerrupters (with Connector) Electrical Characteristics (Ta = 25°C)
Output Type
Part Number Package Gap
(mm) Slit Width
(mm) Operating Supply
Voltage (V) With
Resistor Open-Collector
Connector Manufacturer Applications
TLP1243(C8) Snap-in mounting 5 0.7 VCE ≤ 35 V ⎯ Phototransistor output
Tyco Electronics AMP K.K.
Printers,
copiers,
fax machines,
vending machines,
FA equipment,
amusement equipment
Note: VCE: collector-emitter voltage
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
13 2010/8 SCE0004J
Photocou pler s and Photorelays
Tr ansistor Output CTR Safety Standards (1)
Part Number Pin Configuration Features Rank
Min
(%) Max
(%) @IF / VCE
(mA) (V)
VCEO
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
⎯ 100
TLP124
1
4
6
3
Mini-flat
MFSOP6
Low input drive current BV 200
1200 1/0.5 ○ ○
TLP126
1
4
6
3
Mini-flat
MFSOP6
AC input
Low input drive current
⎯ 100 1200 ±1/0.5
80
○ ○
⎯ 50
TLP130
13
456
Mini-flat
MFSOP6
AC input
Internal base connection GB 100
600 ±5/5 80 ○ ○
⎯ 50
TLP131
Mini-flat
MFSOP6
General-purpose
Internal base connection GB 100 600 5/5 ○ ○
⎯ 100
TLP137 13
456
Mini-flat
MFSOP6
Low input drive current
Internal base connection BV 200
1200 1/0.5
80
○ ○
⎯ 50 600
Y 50 150
GR 100 300
BL 200
TLP180 (4)
1
4
6
3
Mini-flat
MFSOP6
AC input
SEMKO-approved
TST part recommended GB 100 600
±5/5 ○ ○ ○(2) △(2)
◎ △
⎯ 50
GB 100 600
Y 50 150
GR 100 300
BL 200 600
YH 75 150
GRL 100 200
TLP181 (4)
1
4
6
3
Mini-flat
MFSOP6
General-purpose
High CTR
SEMKO-approved
TST part recommended
GRH 150 300
5/5
80
3750
○ ○ △(2)
○(2)
◎ △
⎯ 50 600
Y 50 150
GR 100 300
BL 200
TLP280 (4)
1
3
4
2
SOP4
Lead pitch: 1.27 mm
AC input
SEMKO-approved
TST part recommended GB 100 600
⎯ 50
TLP280-4
312 87654
1416 15 910111213
SOP16
4-channel version of the TLP280
Lead pitch: 1.27 mm
AC input
SEMKO-approved GB 100
600
±5/5 80 2500 ○ ○ △(2) ○(2) ◎ △
⎯ 50
GB 100 600
Y 50 150
GR 100 300
BL 200 600
YH 75 150
GRL 100 200
GRH 150 300
TLP281 (4)
1
3
4
2
SOP4
Lead pitch: 1.27 mm
General-purpose
SEMKO-approved
TST part recommended
BLL 200 400
⎯ 50
TLP281-4
312 87654
1416 15 910111213
SOP16
4-channel version of the TLP281
Lead pitch: 1.27 mm
SEMKO-approved GB 100
600
5/5 80 2500
○ ○ △(2) ○(2) ◎ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
Note (3): The products with the ranks Y and BL are limited in production. For details, please contact your nearest Toshiba sales representative.
Note (4): Product manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. [TST] is recommended. See page 169 to 171 for detail. Japan product is non-promotional item.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
14 2010/8 SCE0004J
CTR Safety Standards
(1)
Part Number Pin Configuration Features Rank
Min
(%) Max
(%) @IF / VCE
(mA) (V)
VCEO
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
⎯ 50 600
Y 50 150
GR 100 300
BL 200
TLP284 (4)
1
3
4
2
SOP4
Lead pitch: 1.27 mm
AC input
General-purpose･High BVs
Creepage distance:
5.0 mm (min)
TST part recommended GB 100
600
○ ○ △(2) ○(2) ○ △
⎯ 50 600
TLP284-4
312 87654
1416 15 910111213
SOP16
4-channel version of the TLP284
Lead pitch: 1.27 mm
AC input
General-purpose･High BVs
Creepage distance:
5.0 mm (min)
GB 100 600
±5/5 80 3750
○ ○
⎯ 50
GB 100
600
Y 50 150
GR 100 300
BL 200 600
YH 75 150
GRL 100 200
GRH 150 300
TLP285 (4)
1
3
4
2
SOP4
Lead pitch: 1.27 mm
General-purpose･High BVs
Creepage distance:
5.0 mm (min)
TST part recommended
BLL 200 400
○ ○ ○(2) ○(2) ◎ △
⎯ 50 600
TLP285-4
312 87654
1416 15 910111213
SOP16
4-channel version of the TLP285
Lead pitch: 1.27 mm
General-purpose･High BVs
Creepage distance:
5.0 mm (min)
GB 100 600
5/5 80 3750
○ ○
TLP320
1
3
4
2
DIP4
High input current
AC input
IF = 150 mA
⎯
TLP320-2
1
7 8
2
3
5 6
4
DIP8
Dual channel version of the
TLP320
⎯
TLP320-4
312 87654
1416 15 910111213
DIP16
4-channel version of the TLP320
⎯
20 80 ±100/1 55 5000 ○ ○ △ △ ◎ △
TLP330
13
456
2
DIP6
High input current
AC input
IF = 150 mA
⎯ 20 80 ±100/1 55 5000 ○ ○
⎯ 100
TLP331
13
456
2
DIP6
Low input drive current
Internal base connection BV 200
⎯ 100
TLP332
13
456
2
DIP6
Low input drive current
No internal base connection BV 200
1200 1/0.5 55 5000 ○ ○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
Note (3): The products with the ranks Y and BL are limited in production. For details, please contact your nearest Toshiba sales representative.
Note (4): Product manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. [TST] is recommended. See page 169 to 171 for detail. Japan product is non-promotional item.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
15 2010/8 SCE0004J
Tr ansistor O utput (Continued) CTR Safety Standards
(1)
Part Number Pin Configuration Features Rank Min
(%) Max
(%) @IF / VCE
(mA) (V)
VCEO
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
⎯ 50
TLP504A
1
7 8
2
3
5 6
4
DIP6
General-purpose GB 100
600 5/5 55 2500
○
⎯ 50 600
GB 100 600
Y 50 150
GR 100 300
TLP521-1
(4)
1
3
4
2
DIP4
General-purpose
TST part recommended
BL 200 600
⎯ 50
TLP521-2
(4)
1
7 8
2
3
5 6
4
DIP8
Dual -channel version of
the TLP521-1
TST part recommended GB 100
600
⎯ 50
TLP521-4
3 1 2 8 7 6 5 4
14 16 15 9 10 11 12 13
DIP16
4-channel version of the
TLP521-1 GB 100
600
5/5 55 2500
○ ○
⎯ 50
GB 100
BL 200 600
GR 100 300
TLP531 (3)
13
456
2
DIP6
General-purpose
Internal base connection
Y 50 150
⎯ 50
GB 100
BL 200 600
GR 100 300
TLP532 (3)
13
456
2
DIP6
General-purpose
High EMI immunity
No internal base
connection Y 50 150
5/5 55 2500
○ ○
TLP620 (4) ⎯ 50
TLP620F
1
3
4
2
DIP4
AC input
SEMKO-approv ed
TST part recommended GB 100
⎯ 50
TLP620-2
(4)
1
7
8
2
3
5
6
4
DIP8
Dual channel version of
the TLP620
SEMKO-approv ed
TST part recommended GB 100
⎯ 50
TLP620-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP620 GB 100
600 ±5/5 55 5000 ○ ○ △ ○ ◎ △
⎯ 50 600
TLP621 (4) GB 100 600
TLP621F Y 50 150
GR 100 300
1
3
4
2
DIP4
High isolation voltage
UL-approved (double
protection)
SEMKO-approv ed
TST part recommended BL 200 600
⎯ 50
TLP621-2
(4)
1
7 8
2
3
5 6
4
DIP8
Dual channel version of
the TLP621
SEMKO-approv ed
TST part recommended GB 100
600
⎯ 50
GB 100
TLP621-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP621 BV 200
600
5/5 55 5000
○ ○ △ ○ ◎ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (3): The products with the ranks Y and BL are limited in production. For details , please contact your nearest Toshiba sales representative.
Note (4): Product manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. [TST] is recommended. See page 169 to 171 for detail. Japan product is non-promotional item.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
16 2010/8 SCE0004J
CTR Safety Standards
(1)
Part Number Pin Configuration Features Rank Min
(%) Max
(%) @IF / VCE
(mA) (V)
VCEO
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
⎯ 100
TLP624
1
3
4
2
DIP4
Low i nput driv e cu rrent BV 200
⎯ 100
TLP624-2
1
7 8
2 3
5 6
4
DIP8
Dual channel version of
the TLP624 BV 200
⎯ 100
TLP624-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP624 BV 200
1200 1/0.5 55 5000 ○ △ △ ◎ △
⎯ 100
TLP626
1
3
4
2
DIP4
Low i nput driv e cu rrent
AC input BV 200
1200 ±1/0.5 55 5000 ○ △ △ ◎ △
⎯ 100
TLP626-2
1
7
8
23
5
6
4
DIP8
Dual channel version of
the TLP626 BV 200
⎯ 100
TLP626-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP626 BV 200
1200 ±1/0.5 55 5000 ○ △ △ ◎ △
⎯ 50
TLP628
1
3
4
2
DIP4
High VCEO
VCEO = 350 V GB 100
⎯ 50
TLP628-2
1
7
8
2
3
5
6
4
DIP8
Dual channel version of
the TLP628 GB 100
⎯ 50
TLP628-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP628 GB 100
600 5/5 350 5000
○ △ △ △ △
TLP629
1
3
4
2
DIP4
High input current
I
F
= 150 mA (max)
DC input
TLP629-2
1
7
8
2
3
5
6
4
DIP8
Dual channel version of
the TLP629
TLP629-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP629
⎯ 20 80 100/1 55 5000
○ △ △ △ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
17 2010/8 SCE0004J
Tr ansistor O utput (Continued)
CTR Safety Standards
(1)
Part Number Pin Configuration Features Rank Min
(%) Max
(%) @IF / VCE
(mA) (V)
VCEO
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
⎯ 50
TLP630
13
456
2
DIP6
AC input
High isolation voltage GB 100
600 ±5/5 55 5000 ○
⎯ 50
GB 100 600
TLP631
13
456
2
DIP6
General-purpose
Internal base connection GR 100 300
⎯ 50
GB 100 600
TLP632
13
456
2
DIP6
General-purpose
High EMI immunity
No internal base
connection GR 100 300
5/5 55 5000
○ ○
⎯ 50
GB 100 600
TLP731
13
456
2
DIP6
SEMKO-approv ed
Internal base connection GR 100 300
⎯ 50
GB 100 600
TLP732
13
456
2
DIP6
SEMKO-approv ed
No internal base
connection GR 100 300
5/5 55 4000
○ △ ○ ◎ △
⎯ 50
TLP733
TLP733F
GB 100 600
13
456
2
DIP6
SEMKO-approv ed
Internal base connection GR 100 300
⎯ 50
TLP734
TLP734F
GB 100 600
13
456
2
DIP6
SEMKO-approv ed
No internal base
connection GR 100 300
5/5 55 4000
○ △ ○ ◎ △
⎯ 50 600
Y 50 150
GR 100 300
TLP781 (5) BL 200
TLP781F
(5) GB 100 600
YH 75 150
GRL 100 200
GRH 150 300
1
3
4
2
DIP4
High isolation voltage
UL-approved (double
protection)
SEMKO-approved
BLL 200 400
5/5 80 5000
○ ○ △ ○ ◎ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (5): For details of the TLP781 and TLP781F, please contact your nearest Toshiba sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
18 2010/8 SCE0004J
Darlin gton Transistor O utput
CTR VCE(sat) Safety Standards
(1)
Part Number Pin Configuration Features Min
(%) @IF / VCE
(mA) (V)
Max
(V) @IC / IF
(mA)
VCEO
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP127
13
4
6
Mini-flat
MFSOP6
High V CEO 1000 1/1 1.2 100/10 300 2500
○ ○ ○(2) △(2) ◎ △
TLP371
13
4
5
6
2
DIP6
High V CEO
SEMKO-approved
TLP372
13
4
5
6
2
DIP6
High V CEO
No internal base
connection
1000 1/1 1.2 100/10 300 5000
○ ○
TLP373
12 3
46
DIP6
High V
CEO
Long emitter-collector
distance
1000 1/1 1.2 100/10 300 5000
○ ○
TLP523
12
3
4
DIP4
General-purpose
TLP523-2
12
7
8
34
5
6
DIP8
Dual channel version of the
TLP523
TLP523-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP523
500 1/1 1.0 50/10 55 2500
○ ○
TLP570
456
132
DIP6
General-purpose
High EMI immunity
TLP571
456
132
DIP6
General-purpose
Internal base connection
1000 1/1 1.2 100/10 35 2500
○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
19 2010/8 SCE0004J
Darlin gton Transistor Output (Continued)
CTR VCE(sat) Safety Standards
(1)
Part Number Pin Configuration Features Min
(%) @IF / VCE
(mA) (V)
Max
(V) @IC / IF
(mA)
VCEO
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP572
13
4
5
6
2
DIP6
General-purpose
Built-in RBE 1000 1/1.2 1.2 100/10 55 2500 ○
TLP627 (4)
12
3
4
DIP4
High V CEO
SEMKO-approved
TST part recommended
TLP627-2
(4)
12
7
8
34
5
6
DIP8
Dual channel version of the
TLP627
SEMKO-approved
TST part recommended
TLP627-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP627
1000 1/1 1.2 100/10 300 5000
○ ○ △ ○ ◎ △
Note (1): Legend in the Safety Standards column:
BSI and IEC
：○
: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI
：
EN 60065 / EN 60950
、
IEC
：
IEC 60065 / IEC 60950
TÜV and VDE
：○
: Approved
△
: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (4): Product manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. [TST] is recommended. See page 169 to 171 for detail. J apan product is non-promotional item.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
20 2010/8 SCE0004J
Thyrist or Output Trigger
LED
Current,
IFT
Peak On-State
Voltage, VTM Safety Standards (1)
Part Number Pin Configuration Features
Max (mA)
Max (V)
@ITM (mA)
Off-State
Output
Terminal
Voltage
VDRM (V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP148G
1
6
3
5
4
Mini-flat
MFSOP6
General-purpose 10 1.45 100 400 ○ ○
TLP548J
12
6
3
5
4
DIP6
General-purpose
Low trigger current 7 1.45 100 600 ○ △
TLP549J
12
7
34
5
6
DIP8
Long anode-cathode distance
(SCR) 7 1.45 100 600
2500
○ △
TLP748J
TLP748JF
12
6
3
54
DIP6
SEMKO-approve d 10 1.45 100 600 4000 ○ △ ○ ◎
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
21 2010/8 SCE0004J
Triac Output Trigger LED Current,
IFT Peak On-State
Voltage, VTM Safety Standards (1)
Part Number Pin Configuration Features Rank Max (mA)
Max (V)
@ITM (mA)
Off-State
Output
Terminal
Voltage
VDRM (V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP160G ⎯
IFT7
IFT5
10
7
5
400 ○ ○ △(2) ○(2)
TLP165J
TLP160J 1
4
6
3
Mini-flat
MFSOP6
Non-zero cross ⎯
IFT7
10
7
2.8 70
600
2500
○ ○ △(2) ○(2)
⎯ 10
IFT7 7 400 ○ ○ △(2) ○(2)
TLP161G IFT5 5
TLP166J ⎯ 10
TLP161J
Mini-flat
MFSOP6
Zero cross
IFT7 7
70
○ ○ △(2) ○(2)
TLP163J
Mini-flat
MFSOP6
Zero cross
High impulse noise immunity
VN = 2000 V (typ.)
⎯ 10 100 ○ ○ △(2) △(2)
TLP168J
1
4
6
3
Z
C
Mini-flat
MFSOP6
Zero cross
⎯ 3
2.8
70
600
2500
○ ○
TLP260J
1
4
6
3
Mini-flat
MFSOP6
Non-zero cross
⎯ 10 2.8 70 600 3000
○
△(2) ○(2)
TLP261J
1
4
6
3
ZC
Mini-flat
MFSOP6
Zero cross
⎯ 10 2.8 70 600 3000
○ △(2) ○(2)
TLP360J ⎯ 10
TLP360JF
1
3
4
2
DIP4
Non-zero cross IFT7 7
3.0 100 600 5000
○ ○ ○ △
TLP361J ⎯ 10
TLP361JF DIP4
Zero cross IFT7 7
TLP363J
TLP363JF
1
3
4
2
Z
C
DIP4
Zero cross
High impulse noise immunity
VN = 2000 V (typ.)
⎯ 10
3.0 100 600 5000
○ ○ ○ △
TLP525G
1
3
4
2
DIP4 ⎯ 10
TLP525G-2
1
7
8
2
3
5
6
4
DIP8
Dual channel version of the
TLP525G
⎯ 10
TLP525G-4
312 87654
1416 15 910111213
DIP16
4-channel version of the
TLP525G
⎯ 10
3.0 100 400 2500
○ ○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
22 2010/8 SCE0004J
Trigger LED Current, IFT
Peak On -
State Voltage,
VTM Safety Standards (1)
Part Number Pin Configuration Features Rank Max (mA)
Max (V) @ITM (mA)
Off-State Output
Terminal Voltage
VDRM (V)
BVs
1 Minute
(Vrms)
UL
c-UL
TÜV
VDE
BSI
IEC
⎯ 10
IFT7 7 400
TLP560G IFT5 5 3.0 100
⎯ 10
TLP560J 13
46
2
DIP6
General-purpose
Non zero cross
IFT7 7 600
○
⎯ 10
IFT7 7 400
TLP561G IFT5 5 3.0 100
⎯ 10
TLP561J 13
46
2
ZC
DIP6
General-purpose
Zero cross
IFT7 7 600
2500
○
TLP3022(S)
TLP3022F(S)
⎯ 10
TLP3023(S)
TLP3023F(S)
DIP6
SEMKO-approved
Non- ze r o cross ⎯ 5 400
TLP3052(S)
TLP3052F(S)
13
46
2
DIP6
High VDRM
SEMKO-approved
Non- ze r o cross
⎯ 10
3.0 100
600
5000
○
○
△
○
◎
△
TLP3042(S)
TLP3042F(S)
⎯ 10
TLP3043(S)
TLP3043F(S)
DIP6
SEMKO-approved
Zero cross ⎯ 5 400
TLP3062(S)
TLP3062F(S)
⎯ 10
TLP3063(S)
TLP3063F(S)
DIP6
SEMKO-approved
High VDRM
Zero cross ⎯ 5
TLP3064(S)
TLP3064F(S)
DIP6
SEMKO-approved
Zero cross ⎯ 3
600
TLP3082(S)
TLP3082F(S)
DIP6
Zero cross ⎯ 10 800
TLP3762(S)
TLP3762F(S)
DIP6
Zero cross
High impulse noise
immunity
VN = 2000 V (typ.)
⎯ 10 600
○
△
○
◎
△
TLP3782(S)
TLP3782F(S)
⎯ 10
TLP3783(S)
TLP3783F(S)
13
46
2
ZC
DIP6
High impulse noise
immunity
VN = 1500 V (typ.) ⎯ 5
3.0 100
800
5000
○
△
○
TLP762J
TLP762JF
13
46
2
DIP6
SEMKO-approved
Non zero cross
⎯ 10 3.0 100 600 4000
○ △ ○ ◎ △
TLP763J
TLP763JF
13
46
2
ZC
DIP6
SEMKO-approved
Zero cross
⎯ 10 3.0 100 600 4000
○ △ ○ ◎ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
23 2010/8 SCE0004J
IC Output
Safety Standards (1)
Part Number Pin Configuration Features Data Rate
(Typ. @NRZ)
Output/CTR @IF(IN)
(mA)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
6N135 7% min
6N136 1
7
8
23
5
6
4
DIP8
JEDEC-compliant 1M bi t /s
19% min
16 ○
6N137
1
7
8
23
5
6
4
Vcc
GND
DIP8
JEDEC-compliant
High-speed 10M bit/s 700% typ. 5 ○
6N138 300% min 1.6
6N139
12
7
8
34
5
6
DIP8
JEDEC-compliant
High CTR 300k bit/s
400% min 0.5
2500
○
TLP104
1 3
4 6
5
SO6 (reinforced insulation)
Topr (max) 125°C
Propagation
delay time
550 ns (max)
Open-collector output
(Inverter logic)
IFHL = 5
(max) ○ ○ ○(2)
TLP105
1 3
4 6
5
SHIELD
GND
Vcc
Mini-flat
MFSOP6 5M bit/s Totempole output
(Buffer logic) IFLH = 1.6
(max) ○ ○ ○(2) △(2)
TLP109 1M bit/s 20% min 16 ○ ○ △(2) ○(2)
TLP109(IGM)
1 3
4 6
5
SHIELD
SO6 (reinforced insulation)
Creepage/clearance ≥ 5 mm
Inter mal isorati o n thickne ss ≥
0.4 mm
Propagation
delay time
0.8 µs
(max)
25% min 10
3750
○ ○ △ ○(2)
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
24 2010/8 SCE0004J
Safety Standards (1)
Part Number Pin Configuration Features Data Rate
(Typ. @NRZ)
Output/CTR @IF(IN)
(mA)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP116A
1 3
4 6 5
SHIELD
GND
Vcc
SO6 (reinforced insulation)
Ul t ra-high-speed (20M Bd) 20M Bd ○ ○ △(2) ○(2)
TLP117
1 3
4 6 5
SHIELD
GND
Vcc
Mini-flat
MFSOP6
Ul t ra-high-speed (50M Bd) 50M Bd
Totempole output
(Inverter logic) IFHL = 5
(max)
○ ○ ○(2) ○(2)
TLP118
1 3
4
6
5
SHIELD
Vcc
GND
SO6 (reinforced insulation)
Topr (max) 125°C
Ultra-high-speed 20M Bd Open-collector output
(Inverter logic) IFHL = 5
(max) ○ ○ ○(2)
TLP151
1 3
4
6
5
SO6 (reinforced insulation)
Topr (max) 125°C
Direct drive of a small power
IGBT/MOSFET
Propagation
delay time
0.7 µs
(max)
Outp u t cu r rent:
±0.6 A (max) IFHL = 5
(max) ○ ○ ○(2)
TLP350
TLP350F
DIP8
Direct drive of a medium-
power IG B T/MOSFET
Low power dissipation
Propagation
delay time
0.5 µs
(max)
Peak output current:
±2.5 A (max) IFLH = 5
(max) ○ ○ ○ ○
TLP350H
TLP350HF
3 4
5
6
1 2
7
8
DIP8
Direct drive of a medium-
power IG B T/MOSFET
Low power dissipation
Topr (max) 125°C
Propagation
delay time
0.5 µs
(max)
Peak output current:
±2.5 A (max) IFLH = 5
(max)
△ △ ○
TLP351
TLP351F
DIP8
Direct drive of a small power
IGBT/MOSFET
Low power dissipation
Propagation
delay time
0.7 µs
(max)
Peak output current:
±0.6 A (max) I
FLH = 5
(max)
○ ○ ○ ○
TLP351H
TLP351HF
3 4
5
6
1 2
7
8
DIP8
Direct drive of a small power
IGBT/MOSFET
Low power dissipation
Topr (max) 125°C
Propagation
delay time
0.7 µs
(max)
Peak output current:
±0.6 A (max) IFLH = 5
(max) △
△ ○
TLP358
TLP358F
DIP8
Direct drive of a medium-
power IG B T/MOSFET
Low power dissipation
Propagation
delay time
0.5 µs
(max)
Peak output current:
±6 A (max) IFLH = 5
(max) △ △ ○ ○
TLP358H
TLP358HF
3 4
5
6
1
2
7
8
DIP8
Direct drive of a medium-
power IG B T/MOSFET
Low power dissipation
Topr (max) 125°C
Propagation
delay time
0.5 µs
(max)
Peak output current:
±6 A (max) IFLH = 5
(max)
3750
△ △ ○ ○
Note (1): Legend in the Safety Standards column:
BSI and IEC：
○
: Approved (supplementary or basic insulation)
◎
: Approved (reinforced insulation)
△
: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
25 2010/8 SCE0004J
IC Output (Continued)
Safety Standards (1)
Part Number Pin Configuration Features Data Rate
(Typ. @NRZ)
Output/CTR @IF(IN)
(mA)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP512
13
46
5
2
DIP6
6-pin package version of the
TLP550 1M bit/s 20% min 16
TLP513
13
46
5
Vcc
GND
2
DIP6
6-pin package version of the
TLP552 10M bit/s Open-collector output
(Inverter logic) I
FHL
= 5
(max)
○
TLP550
12
7
8
34
5
6
DIP8
No internal base connection
High CMR 1M bi t/s 16 ○
TLP551
12
7
8
34
5
6
DIP8
Internal base connection 1M bit /s
10% min
(19% (min) for rank O)
16
○
○
TLP552
Vcc
GND
12
7
8
34
5
6
DIP8
High-speed 10M bit/s Open-collector output
(Inverter logic) IFHL = 5
(max) ○
TLP553
12
7
8
34
5
6
DIP8
Low input drive current 300k bit/s 400% min 0.5 ○
TLP554
Vcc
GND
1 2
7
8
3 4
5
6
SHIELD
DIP8
High-speed
High CMR ver sion of the
TLP552
10M bit/s Open-collector
(Inverter logic) IFHL = 5
(max) ○ ○
TLP555
Vcc
GND
1 2
7
8
3 4
5
6
SHIELD
DIP8
Low input current
High V CC operation 5M bit/s 3-state output
(Buffer logic) IFLH = 1.6
(max) ○ ○
TLP557
12
7
8
34
5
6
DIP8
Direct drive of a power
transistor
Propagation
delay time
5 µs
(max)
Constant current output:
0.25 A IFLH = 5
(max) ○ ○
TLP558
Vcc
GND
1 2
7
8
3 4
5
6
SHIELD
DIP8
Inverted logic version of the
TLP555 5M bit/s 3-state output
(Inverter logic) IFHL = 1.6
(max)
2500
○ ○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
26 2010/8 SCE0004J
Safety Standards (1)
Part Number Pin Configuration Features Data Rate
(Typ. @NRZ)
Output/CTR @IF(IN)
(mA)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP559 1M bit/s 20% mi n 16
TLP559(IGM)
1 2
7
8
3 4
5
6
SHIELD
DIP8
High CMR version of the
TLP550
No internal base connection
Propagation
delay time
0.8 µs
(max)
25% min 10
2500 ○ ○
TLP651
12
7
8
34
5
6
DIP8
High isolation voltage
Internal base connection 1M bit/ s 10% min
(19% (min) for rank O) 16 ○ ○
TLP700
TLP700F
SDIP6
Direct drive of a medium-
power IGBT /MOSFE T
Low power dissipation
SDIP version of the TLP350
Propagation
delay time
0.5 µs
(max)
Output current:
±2.0 A (max) IFLH = 5
(max) ○ ○ ○ ○
TLP700H
TLP700HF
6
5
4
1
2
3
SDIP6
Direct drive of a medium-
power IGBT /MOSFE T
Low power dissipation
Topr (max) 125°C
SDIP version of the TLP350
Propagation
delay time
0.5 µs
(max)
Peak output current:
±2.0 A (max) IFLH = 5
(max)
○
○
△
TLP701
TLP701F
SDIP6
Direct drive of a small-power
IGBT/MOSFET
Low power dissipation
SDIP version of the TLP351
Propagation
delay time
0.7 µs
(max)
Output current:
±0.6 A (max) IFLH = 5
(max) ○ ○ ○ ○
TLP701E **
SDIP6
Direct drive of a small-power
IGBT/MOSFET
Low power dissipation
Propagation
delay time
0.7 µs
(max)
Peak output current:
±0.6 A (max) IFHL=5
(max) △ △ △
TLP701H
TLP701HF
6
5
4
1
2
3
SDIP6
Direct drive of a small-power
IGBT/MOSFET
Low power dissipation
Topr (max) 125°C
SDIP version of the TLP351
Propagation
delay time
0.7 µs
(max)
Peak output current:
±0.6 A (max) IFLH = 5
(max) ○ ○ △
TLP705
TLP705F
6
5
4
1
2
3
SDIP6
Direct drive of a small-power
IGBT/MOSFET
High speed
Low power dissipation
Propagation
delay time
0.2 µs
(max)
Output current:
±0.45 A (max) IFLH = 8
(max) ○ ○ ○ ○
TLP708
1 3
4
6 5
SHIELD
Vcc
GND
2
SDIP6
Topr (max) 125°C
High speed
SDIP version of the TLP118
20 MBd Open-collector output
(Inverter logic) IFHL = 5
(max) ○ ○ △
TLP714 **
TLP714F **
1 3
4 6
5
2
SDIP6
SDIP version of the TLP104
Propagation
delay time
550 ns
(max)
Open-collector output
(Inverter logic) IFHL=5
(max) △ △ △
TLP715
TLP715F
2
1 3
4 6
5
SHIELD
GND
Vcc
SDIP6
Direct drive of an IPM
High CMR
Propagation
delay time
250 ns
(max)
Totempole output
(Buffer logic) IFLH = 3
(max)
5000
○ ○ ○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
** Under development: Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
27 2010/8 SCE0004J
IC Output (Continued)
Safety Standards (1)
Part Number Pin Configuration Features Data Rate
(Typ. @NRZ)
Output/CTR @IF(IN)
(mA)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP716
TLP716F
1 3
4 6 5
SHIELD
GND
Vcc
2
SDIP6
High-speed
SDIP version of the TLP116
15 MBd Totempole o utput
(Inverter logic) IFHL = 6.5
(max) ○ ○ ○ ○
TLP718
TLP718F
2
1 3
4 6 5
SHIELD
GND
Vcc
SDIP6
Direct drive of an IPM
High CMR
Propagation
delay time
250 ns
(max)
Totempole out put
(Inverter logic) IFHL = 3
(max) ○ ○ ○ ○
TLP719
TLP719F
1 3
4 6
5
SHIELD
2
SDIP6
High CMR 1M bit/s 20% min 16 ○ ○ ○ ○
TLP750
TLP750F
12
7
8
34
5
6
DIP8
High isolation voltage
High CMR
SEMKO-approved
1M bit/s 10% min
(19% (min) for rank O) 16 ○ ○ △ ○ ◎ △
TLP751
TLP751F
12
7
8
34
5
6
DIP8
High isolation voltage
Internal base connection
SEMKO-approved
1M bit/s 10% min 16 ○ ○ △ ○ ◎ △
TLP754 **
1 2
7
8
3 4
5
6
DIP8
DIP8 version of the TLP104
Propagation
delay time
450 ns
(max)
Open-collector output
(Inverter logic) IFHL = 5
(max) △ △ △
TLP759
TLP759F 1M bit/s 20% min 16
TLP759(IGM)
TLP759F(IGM)
1 2
7
8
3 4
5
6
SHIELD
DIP8
IEC950 design standard
ve rsion of the TLP559
SEMKO-approved
Propagation
delay time
0.8 µs
(max)
25% min 10
5000
○ ○ ○ ○ ◎ △
TLP2066
1 3
4 6
5
SHIELD
GND
Vcc
Mini-flat
MFSOP6
3.3-V power supply 20 MBd Totempole output
(Inverter logic) I
FHL
= 5
(max) ○ ○ ○(2) ○(2)
TLP2095
1 3
4 6
5
SHIELD
GND
Vcc
Mini-flat
MFSOP6
VCC = 3.0 to 20 V 5 Mbit/s Totempole output
(Buffer logic) IFLH = 3
(max) ○ ○ ○(2)
TLP2098
1 3
4 6
5
SHIELD
GND
Vcc
Mini-flat
MFSOP6
VCC = 3.0 to 20 V 5 Mbit /s Totempole output
(Inverter logic) IFHL = 3
(max)
3750
○ ○ ○(2)
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
** Under development: Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
28 2010/8 SCE0004J
Safety Standards
(1)
Part Number Pin Configuration Features Data Rate
(Typ. @NRZ)
Output/CTR @IF(IN)
(mA)
BVs
1 Minute
(Vrms)
UL c-UL
TÜV
VDE
BSI
IEC
TLP2105
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
SO8
Dual channel version of the TLP105 5 MBd T ot em pole out put
(Buffer logic) IFLH = 1.6
(max)
○
○
△(2)
○(2)
TLP2108 SO8
Dual channel version of the TLP108 5 MBd T ot em pole out put
(I nvert er logic) IFHL = 1. 6
(max)
○
○
△(2)
○(2)
TLP2116
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
SO8
Dual channel version equivalent for the
TLP116 15 MBd Totempole output
(I nvert er logic) IFHL = 5
(max)
○
○
○(2)
○(2)
TLP2118 SO8
Dual channel version equivalent for the
TLP118 15 MBd Open-collector output
(I nvert er logic) IFHL = 5
(max) ○ ○ ○(2)
TLP2118E
**
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
SO8
Dual channel version equivalent for the
TLP118 15 MBd Open-collector output
(I nvert er logic) IFHL=5
(max) △ △ △(2)
TLP2166A
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
SO8
3.3-V power supply
Dual channel version equivalent for the
TLP2066
15 MBd T ot em pole out put
(I nvert er logic) I
FHL = 3
(max)
○
○
△(2)
○(2)
TLP2200
Vcc
GND
1 2
7
8
3 4
5
6
SHIELD
DIP8
Low input current
High-speed
High VCC operation
5M bit/s 3-state output
(Buffer logic) IFLH = 1.6
(max)
2500
○ ○
TLP2360
1 3
4 6 5
SHIELD
GND
Vcc
SO6(thin pac kage)
Reinforced insulation type complies
with international safety standards.
3.3-V power supply
SO6 version of the TLP2066
20 MBd T ot em pole out put
(I nvert er logic) IFHL = 5
(max) ○ ○ ○(2)
TLP2403
12
7
8
34
5
6
SO8
Low input current
SO8 version of the TLP553 300k bit/s 400% min 0.5 ○ ○ △(2)
TLP2404
1 2
7
8
3 4
5
6
SHIELD
SO8
Topr (max) 125°C
SO8 version of the TLP104
Propagation
delay time
450 ns
(max)
Open-collector output
(I nvert er logic) IFHL = 5
(max) ○ ○ △(2)
TLP2405
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
SO8
Low input current
SO8 version of the TLP105 5M bit/s T ot em pole out put
(Buffer logic) IFLH = 1.6
(max) ○ ○ △(2)
TLP2408
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
SO8
Low input current
SO8 version of the TLP108 5M bit/s T ot em pole out put
(I nvert er logic) IFHL = 1. 6
(max) ○ ○ △(2)
TLP2409
1 2
7
8
3 4
5
6
SHIELD
SO8
Topr (max) 125°C
SO8 version of the TLP109 1M bit/s 20% min 16 ○ ○ △
(2)
TLP2418
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
SO8
Topr (max) 125°C
High-speed
SO8 version of the TLP118
20 MBd Open-collector output
(I nvert er logic) IFHL = 5
(max)
3750
○ ○ △(2)
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
** Under development: Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
29 2010/8 SCE0004J
IC Output (Continued)
Safety Standards (1)
Part Number Pin Configuration Features Data Rate
(Typ. @NRZ)
Output/CTR @IF(IN)
(mA)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP2451
3 4
5
6
1 2
7
8
SO8
Direct drive of a small- power
IGBT/MOSFET
Low power dissipation
Topr (max) 125°C
SO8 version of t he TLP351
Propagation
delay time
0.7µs
(max)
Peak output current:
±0.6 A (max) IFLH = 5
(max) 3750 ○ ○
△(2)
TLP2530
DIP8
Dual channel version of the
6N135 and the TLP550 1M bit/s 7% min 16 ○ ○
TLP2531
1 2
7
8
3 4
5
6
DIP8
Dual channel version of the
6N136 and the TLP550 1M bi t/s 19% mi n 16 ○ ○
TLP2601
Vcc
GND
1 2
7
8
3 4
5
6
SHIELD
DIP8
High CMR
High-speed 10M bit/s Open-collector output
(Inverter logic) IFHL = 5
(max) ○ ○
TLP2630
Vcc
GND
12
7
8
34
5
6
DIP8
Dual channel version of the
6N137 and the TLP552 10M bit/s Open-collector output
(Inverter logic) IFHL = 5
(max) ○ ○
TLP2631
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
DIP8
High CMR
Dual channel version of the
TLP554
10M bit/s Open-collector output
(Inverter logic) IFHL = 5
(max)
2500
○ ○
TLP2168
**
SO8
3.3-V/5-V power supply
Topr (max) 125°C
Open-collector output
(Inverter logic) IFHL = 5
(max) 3750 △ △ △(2)
TLP2468
**
SO8
3.3-V/5-V power supply
Topr (max) 125°C
Open-collector output
(Inverter logic) IFHL = 5
(max) 3750 △ △
△(2)
TLP2768
**
SDIP6
3.3-V/5-V power supply
Topr (max) 125°C
20M bit/s
Open-collector output
(Inverter logic) IFHL = 5
(max) 5000 △ △ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
** Under development: Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
Vcc
GND
SHIELD
1 2
7
8
3 4
5
6
1 3
4
6
5
SHIELD
Vcc
GND
2
30 2010/8 SCE0004J
Photovoltaic Output
Short-Circuit Current (µA) Open Voltage
Voc (V) Safety Standards (1)
Part Number Pin Configuration Features Rank Min @IF (mA)
Min @IF (mA)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
⎯ 12
TLP190B
1 3
4
6
Mini-flat
MFSOP6 C20 20
10 7 10 ○ ○
TLP191B
1 3
4
6
Mini-flat
MFSOP6
Built-in shunt regulator
⎯ 24 20 7 20 ○ ○
⎯ 12
TLP590B
13
46
2
DIP6
General-purpose C20 20
10 7 10 ○
⎯ 24
TLP591B
13
46
2
DIP6
Built-in shunt regulator C40 40
20 7 20 ○
TLP3902
1 3
4
6
Mini-flat
MFSOP6
General-purpose
⎯ 5 10 7 10
2500
○ ○
TLP3904
SSOP4
General-purpose ⎯ 5 ○
TLP3914
SSOP4
High output ⎯ 20 7
○
TLP3924
1 2
3
4
SSOP4
High open-circ uit
voltage
⎯ 4
10
30
10 1500
○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
31 2010/8 SCE0004J
Photorelays ( M OSFET Output, 1-Form-A)
RON Safety Standards
(1)
Part Number Pin Con figur ation Features
Trigger LED
Current, IFT
Max
(mA) Max
(Ω) @IF
(mA)
ION
Max
(A) VOFF (V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP170A
2.54SOP4
Lead pitch: 2.54 mm
Low trigger current
General-purpose
2 ±0.4
60 ○ ○
TLP170D
2.54SOP4
Lead pitch: 2.54 mm
Low trigger current
General-purpose
8 ±0.2
200 ○ ○
TLP170G
2.54SOP4
Lead pitch: 2.54 mm
Low trigger current
General-purpose
50 ±0.1
350 ○ ○
TLP170J
2.54SOP4
Lead pitch: 2.54 mm
Low trigger current
General-purpose
1
60
2
±0.09
600 ○ ○
TLP172A
2.54SOP4
Lead pitch: 2.54 mm
High output current
General-purpose
2 ±0.4
60 ○ ○
TLP172G 2.54SOP4
Lead pitch: 2.54 mm
General-purpose
3
35
5
±0.11
350
1500
○ ○
TLP173A MFSOP6
General-purpose 2 50 3 ±0.0.7
60 3750
○ ○
TLP174G 350 ○ ○
TLP174GA
2.54SOP4
Lead pitch: 2.54 mm
Current-limiting function
Limit current:
150 to 300 mA
35 ±0.12
400 ○ ○
TLP176A 2.54SOP4
Lead pitch: 2.54 mm
High output current 2 ±0.4
60 ○ ○ △(2) ○(2)
TLP176D 2.54SOP4
Lead pitch: 2.54 mm
Low On-resistance 8 ±0.2
200 ○ ○ △(2) ○(2)
TLP176G
2.54SOP4
Lead pitch: 2.54 mm
General-purpose
SEMKO-approv ed
350 ○ ○ △(2)
○(2)
○ △
TLP176GA 2.54SOP4
Lead pitch: 2.54 mm
General-purpose
35 ±0.12
400 ○ ○ ○ △
TLP179D
1
2
3
4
2.54SOP4
Lead pitch: 2.54 mm
COFF 15 pF (typ. )
3
50
5
±0.05
200
1500
○ ○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
32 2010/8 SCE0004J
RON Safety Standards
(1)
Part Number Pin Con figur ation Features
Trigger LED
Current, IFT
Max
(mA) Max
(Ω)
@IF
(mA)
ION
Max
(A)
VOFF (V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP192A 2.54SOP6
Lead pitch: 2.54 mm
High output current 2 ±0.4
60 ○ ○
TLP192G 2.54SOP6
Lead pitch: 2.54 mm 35 ±0.11
350 ○ ○
TLP197A 2.54SOP6
Lead pitch: 2.54 mm
High output current 2 ±0.4
60 ○ ○
TLP197D 2.54SOP6
Lead pitch: 2.54 mm
Low On-resistance 8 ±0.2
200 ○ ○
TLP197G 2.54SOP6
Lead pitch: 2.54 mm
SEMKO-approved 350 ○ ○ △(2) ○(2) ○ △
TLP197GA 2.54SOP6
Lead pitch: 2.54 mm
35 ±0.12
400 ○ ○ △
TLP199D
13
4
5
6
2
2.54SOP6
Lead pitch: 2.54 mm
COFF 15 pF (typ. ) 50
5
±0.05
200 ○ ○
TLP200D
2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the
TLP176D
8 ±0.2
200 ○
TLP202A 2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the TLP172A
2 ±0.4
60 ○
TLP202G
2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the
TLP172G
50 ±0.11
350 ○
TLP206A 2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the TLP176A
2 ±0.4
60 ○
TLP206G
2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the
TLP176G
350 ○
△(2) ○(2) ○ △
TLP206GA
2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the
TLP176GA
35 ±0.12
400 ○ ○ △
TLP209D
12
7
8
34
5
6
2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the
TLP179D
3
50
5
±0.05
200
1500
○
TLP220A **
DIP4
General-purpose
Reinforced insulation 2 5 ±0.5
60 △ △ △ △
TLP220D **
DIP4
General-purpose
Reinforced insulation 8 5 ±0.25
200 △ △ △ △
TLP220G **
DIP4
General-purpose
Reinforced insulation 50 5 ±0.1
350 △ △ △ △
TLP220GA **
DIP4
General-purpose
Reinforced insulation 35 5 ±0.12
400 △ △ △ △
TLP220J **
DIP4
General-purpose
Reinforced insulation 60 5 ±0.09
600 △ △ △ △
TLP221A **
1
2
3
4
DIP4
General-purpose
Reinforced insulation
2
0.2 5 ±1.5
60
5000
△
△
△
△
Note (1): Legend in the Safety Standards column:
BSI and IEC
：○
: Approved (supplementary or basic insulation)
◎
: Approved (reinforced insulation)
△
: Design which meets safety standard/approval pending as of April 2010
BSI
：
EN 60065 / EN 60950
、
IEC
：
IEC 60065 / IEC 60950
TÜV and VDE
：○
: Approved
△
: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
** Under development: Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
33 2010/8 SCE0004J
Photorelays (MOSF E T Out put, 1-Form-A ) (Continued)
RON Safety Standards
(1)
Part Number Pin Configuration Features
Trigge r LED
Current, IFT
Max
(mA) Max
(Ω)
@IF
(mA)
ION
Max
(A) VOFF (V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP222A
1
2
3
4
DIP4
High output current
General-purpose
○ ○
TLP222A-2
12
7
8
34
5
6
DIP8
Dual channel version of
the TLP222A
2 5 ±0.5
60
○ ○
TLP222G
1
2
3
4
DIP4
General-purpose
SEMKO-approved
○ ○ ○ △
TLP222G-2
12
7
8
34
5
6
DIP8
Dual channel version of
the TLP222G
SEMKO-approved
50 5 ±0.12
350
○ ○ ○ △
TLP224G
1
2
3
4
DIP4
Current-limiting function
Limit current:
150 to 300 mA
SEMKO-approved
○ ○ △ △
TLP224G-2
12
7
8
34
5
6
DIP8
Dual channel version of
the TLP224G
SEMKO-approved
35 5 ±0.12
350
○ ○ ○ △
TLP224GA
1
2
3
4
DIP4
For modems
Current-limiting function
Limit current:
150 to 300 mA
○
TLP224GA-2
12
7
8
34
5
6
DIP8
Dual channel version of
the TLP224GA
Current-limiting function
Limit current:
150 to 300 mA
3
35 5 ±0.12
400
○
TLP225A
1
2
3
4
DIP4
For DC use only 5 1.1 10 0.5 60 ○ ○
TLP227A
1
2
3
4
DIP4
General-purpose
SEMKO-approved
○ ○
TLP227A-2
12
7
8
34
5
6
DIP8
Dual channel version of
the TLP227A
SEMKO-approved
3 2 5 ±0.5
60
2500
○ ○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
34 2010/8 SCE0004J
RON Safety Standards
(1)
Part Number Pin Configuration Features
Trigger LED
Current, IFT
Max
(mA) Max
(Ω)
@IF
(mA)
ION
Max
(A) VOFF (V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP227G
1
2
3
4
DIP4
General-purpose
SEMKO-approved
○ ○ △ ○ ○ △
TLP227G-2
12
7
8
34
5
6
DIP8
Dual channel version of
the TLP227G
SEMKO-approved
3 35 5 ±0.12
350
○ ○ △ ○ ○ △
TLP227GA
1
2
3
4
DIP4
General-purpose
SEMKO-approved
○
TLP227GA-2
12
7
8
34
5
6
DIP8
Dual channel version of
the TLP227GA
SEMKO-approved
3 35 5 ±0.12
400
○
TLP592A DIP6
High output current 2 ±0.5
60 ○
TLP592G 13
4
5
6
2
DIP6
General-purpose
3
50
5
±0.12
350 ○
TLP597A DIP6
High output current
SEMKO-approved 2 ±0.5
60
○
TLP597G DIP6
General-purpose
SEMKO-approved 350 ○ ○ △ ◎ △
TLP597GA DIP6
General-purpose
SEMKO-approved
3
35 ±0.12
400 ○
TLP598AA DIP6
High output current 2 ±0.5
60 ○
TLP598GA DIP6
Low On-resistance
3 12 ±0.15
400
2500
○
TLP797GA
TLP797GAF DIP6
High isolation voltage 3
5
±0.12
400 ○ △ △ △ △
TLP797J ○ ○ △ △ △ △
TLP797JF
DIP6
High isolation voltage
35
10 ±0.1
600
○ ○ △ △ △ △
TLP798GA
13
4
5
6
2
DIP6
Low On-resistance
5
12 5 ±0.15
400
5000
○ △ △ △ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
35 2010/8 SCE0004J
Photorelays (MOSF E T Out put, 1-Form-A ) (Continued)
RON Safety Standards
(1)
Part Number Pin Con figur ation Features
Trigger LED
Current, IFT
Max
(mA) Max
(Ω)
@IF
(mA)
ION
Max
(A)
VOFF
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP3100
2.54SOP6
Lead pitch: 2.54 mm
Low On-resistance
High output current:
ION = 2.5 A (max) @Ta: up to 50°C
For measuring instruments and power
supply lines
0.05 ±2.5
20 ○ ○
TLP3102 **
2.54SOP6
General-purpose
High output current:
ION = 2.5 A (max) @Ta: up to 50°C
C-connection: ION(DC)=5.0A(Max)
0.06 ±2.5
40 △ △
TLP3103 **
2.54SOP6
General-purpose
High output current:
ION = 2.3A (Max) @Ta: up to 50°C
C-connection: ION(DC)=4.6A(Max)
0.07 ±2.3
60 △ △
TLP3105 **
13
4
5
6
2
2.54SOP6
General-purpose
High output current:
ION = 1.4A (Max) @Ta: up to 50°C
C-connection: ION(DC)=2.8A(Max)
3
0.2
5
±1.4
100
△ △
TLP3110
Lead pitch: 2.54 mm
Low CR
COFF: 100 pF (typ.)
For measuring instruments
1.2 ±0.35
60 ○
TLP3111
1
2
3
4
2.54SOP4
Lead pitch: 2.54 mm
Low CR
COFF: 11 pF (typ.)
For measuring instruments
4
20
5
±0.1
80 ○
TLP3113
2.54SOP4
Lead pitch: 2.54 mm
Ultra-low CR: 15 pF · Ω
COFF: 0.6 pF (typ.)
For measuring instruments
35 ±0.08
○
TLP3114
2.54SOP4
Lead pitch: 2.54 mm
Ultra-low CR: 10 pF · Ω
COFF: 5 pF (typ.)
For measuring instruments
3 ±0.25
○
TLP3115
2.54SOP4
Lead pitch: 2.54 mm
Ultra-low CR: 10 pF · Ω
COFF: 10 pF (typ.)
For measuring instruments
1.5 ±0.3
○
TLP3116
2.54SOP4
Lead pitch: 2.54 mm
Ultra-low CR: 10 pF · Ω
COFF: 1 pF (typ.)
For measuring instruments
15 ○
TLP3116A
1
2
3
4
2.54SOP4
Lead pitch: 2.54 mm
Ultra-low CR: 10 pF · Ω
C
OFF
1.65 pF (typ.)
3.0 pF (max)
For measuring instruments
4
9.5
5
±0.12
40
1500
○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
** Under development: Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
36 2010/8 SCE0004J
RON Safety Standards
(1)
Part Number Pin Configuration Features
Trigger LED
Current, IFT
Max
(mA) Max
(Ω)
@IF
(mA)
ION
Max
(A)
VOFF
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP3118
2.54SOP4
Lead pitch: 2.54 mm
Low CR: 40 pF · Ω
COFF: 2.5 pF (typ.)
3.5 pF (max)
For measuring instruments
25 ±0.04
80 ○
TLP3119
Lead pitch: 2.54 mm
Low CR: 30 pF · Ω
COFF: 6.5 pF (typ.)
11 pF (Max)
For measuring instruments
3
8
5
±0.2 80 ○
TLP3120
13
4
5
6
2
2.54SOP6
Lead pitch: 2.54 mm
High output current
ION: 1.25 A (max)
For measuri ng instruments and
power supply lines
5 0.15
5 ±1.25
80 ○ ○
TLP3121
2.54SOP4
Lead pitch: 2.54 mm
Low CR: 30 pF · Ω
For measuring instruments
4 1.2 ±0.35
80 ○ ○
TLP3122
2.54SOP4
Lead pitch: 2.54 mm
High output current
ION: 1 A (max)
@Ta: up to 50°C
For measuri ng instruments and
power supply lines
0.7 ±1 60 ○ ○
TLP3123
1
2
3
4
2.54SOP4
Lead pitch: 2.54 mm
High output current
I
ON
: 1 A (max)
@Ta: up to 50°C
For measuri ng instruments and
power supply lines
3
0.13
5
±1 40 ○ ○
TLP3125
8
765
1234
2.54SOP8
Lead pitch: 2.54 mm
Low On-resistance
For measuring instruments
3 4 5 ±0.2 400 ○ ○
TLP3130
2.54SOP4
Lead pitch: 2.54 mm
Ultra-low CR: 5 pF · Ω
C
OFF: 1 pF ( typ.)
For measuring instruments
8 ±0.16
○
TLP3131
1 2
3
4
2.54SOP4
Lead pitch: 2.54 mm
Ultra-low CR: 5 pF · Ω
COFF: 5 pF ( typ.)
For measuring instruments
4
1.2
5
±0.3
20
○
TLP3203
SSOP4
Ultra-low On-resistance
R 0.18 Ω (typ.)
High output current
ION: 0.9 A (max)
3 0.22
±0.9 20 ○
TLP3212
SSOP4
Low CR: 20 pF · Ω
COFF: 20 pF (typ.)
For measuring instruments
5 1.5
5
±0.4 60
1500
○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
1
2
3
4
1 2
3
4
37 2010/8 SCE0004J
Photorelays (MOSF E T Out put, 1-Form-A ) (Continued)
RON Safety Standards
(1)
Part Number Pin Configuration Features
Trigger LED
Current, IFT
Max
(mA) Max
(Ω)
@IF
(mA)
ION
Max
(A)
VOFF
(V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP3213
SSOP4
Ultra-low CR: 15 pF · Ω
COFF: 0.6 pF (typ.)
For measuring instruments
35 ±0.08
○
TLP3214
SSOP4
Ultra-low CR: 10 pF · Ω
COFF: 5 pF (typ.)
For measuring instruments
3 ±0.25
○
TLP3215
SSOP4
Ultra-low CR: 10 pF · Ω
COFF: 10 pF (typ.)
For measuring instruments
1.5 ±0.3
○
TLP3216
SSOP4
Ultra-low CR: 10 pF · Ω
COFF: 1 pF (typ.)
For measuring instruments
15 ○
TLP3216A
SSOP4
Ultra-low CR: 10 pF · Ω
COFF 1 .65 pF (t yp.)
3.0 pF (max)
For measuring instruments
4
9.5
40
○
TLP3217
SSOP4
Low CR
COFF: 5 pF (typ.)
For measuring instruments
5 12
±0.12
80 ○
TLP3218
SSOP4
Low CR: 40 pF･Ω
COFF 2.5 pF (typ.)
3.5 pF (max)
For measuring instruments
25 ±0.04
△
TLP3219
SSOP4
Low CR: 30 pF･Ω
COFF 6.5 pF (typ.)
11 pF (max)
For measuring instruments
3
8
5
±0.2
80
△
TLP3220
SSOP4
Peak off-state voltage: 100 V
For measuring instruments 5 14 10 ±0.08
100
○
TLP3230
SSOP4
Ultra-low CR: 5 pF · Ω
COFF: 1 pF (typ.)
For measuring instruments
8 ±0.16
○
TLP3231
SSOP4
Ultra-low CR: 5 pF · Ω
COFF: 5 pF (typ.)
For measuring instruments
4
1.2 ±0.45
20
○
TLP3240
SSOP4
Ultra-low CR: 5 pF · Ω
COFF: 0.45 pF (typ.)
For measuring instruments
14 ±0.12
○
TLP3241
1 2
3
4
SSOP4
Ultra-low CR: 5 pF · Ω
COFF: 0.7 pF (typ.)
For measuring instruments
3
10
5
±0.14
40
1500
○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: App roved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
38 2010/8 SCE0004J
RON Safety Standards
(1)
Part Number Pin Configuration Featur es
Trigger LED
Current, IFT
Max
(mA) Max
(Ω)
@IF
(mA)
ION
Max
(A) VOFF (V)
BVs
1 Minute
(Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP3250
SSOP4
Ultra-low CR: 2.5 pF · Ω
COFF: 0.8 pF (typ.)
For measuring instruments
5 ±0.2
20 1500
○
TLP3312
**
USOP4
COFF 20 pF (typ.) 1 ±0.4
60 △ △
TLP3375
**
USOP4
COFF 12 pF (typ.) 1.5 ±0.3
50
500
△ △
TLP3275
**
SSOP4
COFF 12 pF (typ.) 1.5
5
±0.3
50 1500 △ △
TLP3542
1
3
4
5
6
2
DIP6
Low On-resistance
High output current:
ION = 2.5 A (max)
For m
easuring instruments
and power supply lines
3
0.1 10 ±2.5
60 2500
○ ○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
** Under development: Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
1 2
3
4
39 2010/8 SCE0004J
Photorelays ( M OSFET Output, 1-Form-B) RON Safety Standards
(1)
Part Number Pin Configuration Features
Trigger LED
Current, IFT
Max(mA)
Max
(Ω)
@IF
(mA)
ION
Max
(A)
VOFF
(V)
BVs
1 Minute
(Vrms)
UL c-UL
TÜV
VDE
BSI
IEC
TLP4006G DIP8
General-purpose
1-Form-A/1-Form-B 25 ±0.12
○
TLP4007G
1 2
7
8
3 4
5
6
1-form-b 1-form-a
DIP8
General-purpose
1-Form-A/1-Form-B
3
50
1-Form-A
5
1-Form-B
0 ±0.1
350
2500
○
TLP4026G
2.54SOP8
Lead pitch: 2.54 mm
General-purpose
1-Form-A/1-Form-B
25 ±0.12
○
TLP4027G
1
2
7
8
3 4
5
6
1-form-b 1-form-a
2.54SOP8
Lead pitch: 2.54 mm
General-purpose
1-Form-A/1-Form-B
3
50
1-Form-A
5
1-Form-B
0 ±0.09
350
○
TLP4172G
2.54SOP4
Lead pitch: 2.54 mm
General-purpose
1-Form-B
50 ±0.09
○
TLP4176G
1
2
3
4
2.54SOP4
Lead pitch: 2.54 mm
General-purpose
1-Form-B
3
25
0
±0.12
350
○
TLP4192G
2.54SOP6
Lead pitch: 2.54 mm
General-purpose
1-Form-B
50 ±0.09
○
TLP4197G
1 3
4
5
6
2
2.54SOP6
Lead pitch: 2.54 mm
General-purpose
1-Form-B
3
25
0
±0.12
350
○
TLP4202G
2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the TLP4172G
2-Form-B
50 ±0.09
○
TLP4206G
1 2
7
8
3 4
5
6
2.54SOP8
Lead pitch: 2.54 mm
Dual channel version of the TLP4176G
2-Form-B
3
25
0
±0.12
350
1500
○
TLP4222G
1 2
3
4
DIP4
General-purpose
1-Form-B
○
TLP4222G-2
1 2
7
8
3 4
5
6
DIP8
Dual channel version of the TLP4222G
2-Form-B
3 50 0 ±0.1
350
○
TLP4227G
1
2
3
4
DIP4
General-purpose
1-Form-B
SEMKO-approved
○
TLP4227G-2
1
2
7
8
3
4
5
6
DIP8
Dual channel version of the TLP4227G
SEMKO-approved
2-Form-B
3 25 0 ±0.15
350
○
TLP4592G DIP6
General-purpose
1-Form-B 50 ±0.1
○
TLP4597G
1 3
4
5
6
2
DIP6
General-purpose
1-Form-B
SEMKO-approved
3
25
0
±0.15
350
2500
○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety standard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
40 2010/8 SCE0004J
Produ cts Manufa c tured by Toshiba Semiconductor Thailand Co., Ltd. (Tran sist or Output )
Part Number Pin Configuration Features VCEO (V) Safety Standards (1)
BVs 1 Minute (Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP180(T)
1
4
6
3
Mini-flat
MFSOP6
AC input
SEMKO-approved
80 3750
○ ○ ○(2)
△(2) ◎ △
TLP181(T)
1
4
6
3
Mini-flat
MFSOP6
Transistor output
General-purpose
80 3750
○ ○ △(2) ○(2) ◎ △
TLP280(T)
1
3
4
2
SOP4
Lead pitch: 1.27 mm
AC input
SEMKO-approved
80 2500
○ ○ △(2) ○(2) △ △
TLP281(T)
1
3
4
2
SOP4
Lead pitch: 1.27 mm
General-purpose 80 2500
○ ○ △(2) ○(2) ◎ △
TLP284(T)
1
3
4
2
SOP4
Lead pitch: 1.27 mm
AC input
General-purpose･High BVs
Creepage distance: 5.0 mm (min)
80 ○ ○ △(2) ○(2) ◎ △
TLP285(T)
1
3
4
2
SOP4
Lead pitch: 1.27 mm
General-purpose･High BVs
Creepage distance: 5.0 mm (min)
80
3750
○ ○ ○(2) ○(2) ◎ △
TLP521-1(T)
1
3
4
2
DIP4
Transistor output
AC input
○ ○
TLP521-2(T)
1
78
2
3
56
4
DIP8
Dual channel version of the TLP521-1(T)
55 2500
○ ○
TLP620(T)
TLP620F(T)
1
3
4
2
DIP4
Transistor output
AC input
SEMKO-approved
TLP620-2(T)
1
78
2
3
56
4
DIP8
Dual channel version of the TLP620(T)
SEMKO-approved
55 5000
○ △ ○ ◎ △
TLP621(T)
TLP621F(T)
1
3
4
2
DIP4
Transistor output
High isolation voltage
SEMKO-approved
TLP621-2(T)
1
78
2
3
56
4
DIP8
Dual channel version of the TLP621(T)
SEMKO-approved
55 5000
○ △ ○ ◎ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Although the photocouplers manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. are generally sold outside of Japan, some of them are also available in Japan. For details, contact your nearest Toshiba
sales representative.
Note (2): The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales
representative for more details.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
41 2010/8 SCE0004J
Produ cts Manufa c tured by Toshiba Semiconductor Thailand Co., Ltd. (Darlingt on Transistor Output)
Part Number Pin Configuration Features VCEO (V) Safety Standards (1)
BVs 1 Minute (Vrms) UL c-UL
TÜV
VDE
BSI
IEC
TLP627(T)
12
3
4
DIP4
Dar lington Tran sistor Out put
High V CEO
SEMKO-approved
TLP627-2(T)
2
8
3
5
6
7
14
DIP8
Dual channel version of the TLP627(T)
SEMKO-approved
300 5000
○ △ ○ ◎ △
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Although the photocouplers manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. are generally sold outside of Japan, some of them are also available in Japan. For details, contact your nearest Toshiba
sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
42 2010/8 SCE0004J
Produ cts Manufa c tured by Toshiba Semiconductor Thailand Co., Ltd. (Triac Output)
Trigger LED Current,
IFT Peak On-State
Voltage, VTM Safety Standards (1)
Part Number Pin Configuration Features Rank Max (mA)
Max (V)
@ITM
(mA)
Off-
State
Output
Terminal
Voltage
VDRM (V)
BVs
1 Minute
(Vrms)
UL
c-UL
TÜV
VDE
BSI
IEC
TLP360J(T) ⎯ 10
TLP360JF(T)
1
3
4
2
DIP4
Non- ze r o cross IFT7 7
3.0 100 600 ○ △ △ ○
⎯ 10
TLP361J(T)
TLP361JF(T) DIP4
Zero cross IFT7 7
TLP363J(T)
TLP363JF(T)
1
3
4
2
ZC
DIP4
Zero cross
Hig h im pul s e no is e i mm uni t y
V
N
= 2000 V (typ.)
⎯ 10
3.0 100 600
5000
○
△
△
○
⎯ 10
IFT7 7
TLP560G(T)
IFT5 5
400
⎯ 10
TLP560J(T)
13
46
2
DIP6
General-purpose
Non- ze r o cross
IFT7 7
3.0 100
600
○
⎯ 10
IFT7 7
TLP561G(T)
IFT5 5
400
⎯ 10
TLP561J(T) 13
46
2
ZC
DIP6
General-purpose
Zero cross
IFT7 7
3.0 100
600
2500
○
TLP3022(S,T)
TLP3022F(S,T) ⎯ 10
TLP3023(S,T)
TLP3023F(S,T)
DIP6
SEMKO-approved
Non-zero cross ⎯ 5 400
TLP3052(S,T)
TLP3052F(S,T) 13
46
2
DIP6
High V
DRM
SEMKO-approved
Non-zero cross
⎯ 10
3.0 100
600
5000
○
○
△
○
◎
△
TLP3042(S,T) ⎯ 10
TLP3043(S,T)
DIP6
SEMKO-approved
Zero cross ⎯ 5 400
TLP3062(S,T)
TLP3062F(S,T) ⎯ 10
TLP3063(S,T)
TLP3063F(S,T)
DIP6
SEMKO-approved
High V
DRM
Zero cross ⎯ 5
TLP3064(S,T) DIP6
SEMKO-approved
Zero cross ⎯ 3
600
TLP3082(S,T) DIP6
Zero cross ⎯ 10 800
○
△
○
◎
△
TLP3782(S,T)
TLP3782F(S,T) ⎯ 10
TLP3783(S,T)
TLP3783F(S,T)
13
46
2
ZC
DIP6
High impulse noise immunity
VN = 1500 V (typ.) ⎯ 5
3.0 100
800
5000
○
△
○
Note (1): Legend in the Safety Standards column:
BSI and IEC：○: Approved (supplementary or basic insulation) ◎: Approved (reinforced insulation) △: Design which meets safety standard/approval pending as of April 2010
BSI：EN 60065 / EN 60950、IEC：IEC 60065 / IEC 60950
TÜV and VDE：○: Approved △: Design which meets safety s t andard/approval pending as of April 2010
EN 60747-5-2-approved with optionV4 or D4
Although the photocouplers manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. are generally sold outside of Japan, some of them are also available in Japan. For details, contact your nearest Toshiba
sales representative.
• The pin configuration diagrams only show the general configurations of the circuits.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
43 2010/8 SCE0004J
Fiber-Optic Devices (TOSLINKTM)
Simplex Optical Modules (General-Purpose Optical Modules)
Transmitting Modu le
Receiving Module
Data Rate
(NRZ, Mb/s)
Emission
Wavelength
(nm)
Transmission
Distance
(m) (1)
Pulse Width
Distortion
(ns) (1)
Supply
Voltage
(V)
Operating
Temperature
(°C)
Compatible
Optical
Connector
Compatible Optical
Fiber
(µm)
Compatible Optical Fiber
with Fiber-Optic Connectors (7)
TOTX1950(F) ** (2)
TORX1950(F) **
DC to 10 650 Up to 50 ± 30 5 ± 0.25
−40 to 85 JIS F05 APF (980/1000)
NA = 0.5 LUCT1-TC1000-xxM (3)
TOCP100-xxMBT (4)
TOTX1951(F) ** (2)
TORX1951(F) **
DC to 6 650 Up to 40 ± 55 5 ± 0.25
−40 to 70 JIS F05 APF (980/1000)
NA = 0.5 LUCT1-TC1000-xxM (3)
TOCP100-xxMBT (4)
TOTX1952(F) ** TORX1952(F) **
DC to 10 650 Up to 10 ± 30 5 ± 0.25
−40 to 85 JIS F05 APF (980/1000)
NA = 0.5 LUCT1-TC1000-xxM (3)
TOCP100-xxMBT (4))
TOTX1960(F) * * (2)
TORX1950(F) **
DC to 10 770 Up to 1000 ± 30 5 ± 0.25
−40 to 85 JIS F05 PCF (200/230) CF-1071 (HC-20/70) Series(5)
OPC202HV Series (6)
• TOSLINKTM is a registered trademark of Toshiba Corporation in Japan and other countries. **: Under development
Note (1) All values at Ta = 25°C
(2) The external resistor value must be chosed, based on the transmission distance.
(3) Manufactured by Asahi Kasei EMD Corporation.
(4) Manufactured by Toray Industries, Inc.
(5) Manufactured by Sumitomo Electric Industries (SEI), Ltd.
(6) Manufactured by Oki Electric Cable Co., Ltd.
(7) For details on optical fiber cables with connectors, contact the respective manufactures.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
(Hi gh-Speed Optical Modules)
Transmitting Module
Receiving
Module Data Rate
(NRZ, Mb/s)
Emission
Wavelength
(nm)
Transmission
Distance
(m) (1)
Supply Voltage
(V)
Operating
Temperature
(°C)
Compatible
Optical
Connector
Compatible Optical
Fiber
(µm)
Compatible Optical Fiber
with Fiber-Optic Connectors (7)
TOTX1400(F) TORX1400(F)
20 to 125 65 0 Up to 50 3.3 ± 0.3 −10 to 70 SMA APF (980/1000)
NA = 0. 3 ⎯
Up to 20 (APF) APF (980/1000)
NA = 0. 5 LUCT1-TC1000-xxM (3)
TOCP100-xxMBT (4)
TOTX1701(F) TORX1701(F)
20 to 125 65 0 Up to 1 0 0 (GI-PCF)
3.3 ± 0.3 −10 to 70 JIS F05 GI-PCF (200/230) CF-1071 (HC-20/80) Series (5)
Note (1) All values at Ta = 25°C
(3) Manufactured by Asahi Kasei EMD Corporation.
(4) Manufactured by Toray Industries, Inc.
(5) Manufactured by Sumitomo Electric Industries (SEI), Ltd.
(7) For details on optical fiber cables with connectors, contact the respective manufactures.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
44 2010/8 SCE0004J
(Di gital Audio Transm i tting Modules )
Transmitting Modu le (12) Data Rate
(NRZ, Mb/s)
Emission
Wavelength
(nm)
Fiber output power
(dBm) (1)
Pulse Width
Distortion
(ns) (1)
Supply Voltage
(V)
Operating
Temperature
(°C)
Compatible Optical
Connector
Compatible Optical
Fiber
(µm)
Compatible
Opt ic a l Fiber
with Fiber-Optic
Connectors (7)
TOTX147A(F,T) **
(9)
TOTX147A(F,TJ)
**
(9) DC to 15 650 -21 to -15 ± 15 2.7 to 3.6 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0.5 RFA4011-xxx (8)
TOTX147AL(F,T)
**
(9) (10)
TOTX147AL(F,TJ)
** (9) (10) DC to 15 650 -21 to -15 ± 15 2.7 to 3.6 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0.5 RFA4011-xxx (8)
TOTX147APL(F,T)
** (10) (11)
TOTX147APL(F,TJ)
** (10) (11)
DC to 15 650 -21 to -15 ± 15 2.7 to 3.6 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0.5 RFA4011-xxx (8)
TOTX177A(F,T) ** (9)
TOTX177A(F,TJ)
** (9) DC to 15 650 -21 to -15 ± 15 5 ± 0.25 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0.5 RFA4011-xxx (8)
TOTX177AL(F,T)
** (9) (10)
TOTX177AL(F,TJ)
** (9) (10) DC to 15 650 -21 to -15 ± 15 5 ± 0.25 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0.5 RFA4011-xxx (8)
TOTX177APL(F,T)
** (10) (11)
TOTX177APL(F,TJ) ** (10) (11)
DC to 15 650 -21 to -15 ± 15 5 ± 0.25 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0.5 RFA4011-xxx (8)
Note (1) All values at Ta = 25°C **: Under development
(7) For details on optical fiber cables with connectors, contact the respective manufactures.
(8) Manufactured by Mitsubishi Rayon Co., Ltd.
(9) Panel-mount type
(10) Shutter-equipped
(11) Mini-package type (fixed to printed circuit board)
(12) Optical modules with the (F,T) suffix are manufactured by Toshiba Semiconductor Thailand Co., Ltd. The ordering codes for these optical modules have the (F, TJ) suffix in Japan. For details, contact the your
local Toshiba distributor.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
(Di gital Audio Receiving Modu l es)
Receiving Modu le (12) Data Rate
(NRZ, Mb/s)
Maximum Receivable
Power
(dBm) (1)
Pulse Width
Distortion
(ns) (1)
Supply Voltage
(V)
Operating
Temperature
(°C)
Compatible
Optical
Connector
Compatible Optical
Fiber
(µm)
Compatible Optical Fiber
with Fiber-Optic
Connectors (7)
TORX147(F,T) (9)
TORX147(F,TJ) (9) 0.1 to 15 -24 Max ± 15 2.7 to 3.6 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0. 5 RFA4011-xxx (8)
TORX147L(F,T) (9) (10)
TORX147L(F,TJ) (9) (10) 0.1 to 15 -24 Max ± 15 2.7 to 3.6 −20 to 7 0 JEITA
RC-5720C Square
APF (980/1000)
NA = 0. 5 RFA4011-xxx (8)
TORX147PL(F,T) (1 0) (11)
TORX147PL(F,TJ)
(10) (11) 0.1 to 15 -24 Max ± 15 2.7 to 3.6 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0. 5 RFA4011-xxx (8)
TORX177(F,T) (9)
TORX177(F,TJ) (9) 0.1 to 15 -24 Max ± 15 5 ± 0.25 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0. 5 RFA4011-xxx (8)
TORX177L(F,T) (9) (10)
TORX177L(F,TJ) (9) (10) 0.1 to 15 -24 Max ± 15 5 ± 0.25 −20 to 7 0 JEITA
RC-5720C Square
APF (980/1000)
NA = 0. 5 RFA4011-xxx (8)
TORX177PL(F,T) (1 0) (11)
TORX177PL(F,TJ)
(10) (11) 0.1 to 15 -24 Max ± 15 5 ± 0.25 −20 to 70 JEITA
RC-5720C Square
APF (980/1000)
NA = 0. 5 RFA4011-xxx (8)
Note (1) All values at Ta = 25°C
(7) For details on optical fiber cables with connectors, contact the respective manufactures.
(8) Manufactured by Mitsubishi Rayon Co., Ltd.
(9) Panel-mount type
(10) Shutter-equipped
(11) Mini-package type (fixed to printed circuit board)
(12) Optical modules with the (F,T) suffix are manufactured by Toshiba Semiconductor Thailand Co., Ltd. The ordering codes for these optical modules have the (F, TJ) suffix in Japan. For details, contact the your
local Toshiba distributor.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
45 2010/8 SCE0004J
Duplex Modules (General-Purpose Optical Modules)
Transceiving Module Data Rate
(NRZ, Mb/s)
Emission
Wavelength
(nm)
Transmission
Distance
(m) (1)
Pulse Width
Distortion
(ns) (1)
Supply Voltage
(V)
Operating
Temperature
(°C)
Compatible
Optical
Connector
Compatible Optical
Fiber
(µm)
Compatible Optical Fiber
with Fiber-Optic Connectors (7)
TODX2950(F) ** (2) DC to 10 650 Up to 50 ± 30 5 ± 0.25 −40 to 85 JIS F07 APF (980/1000)
NA = 0.5 LUCT2-TC1000W-xxM (3)
TOCP200-xxMBT (4)
TODX2951(F) ** (2) DC to 6 650 Up to 40 ± 55 5 ± 0.25 −40 to 85 JIS F07 APF (980/1000)
NA = 0.5 LUCT2-TC1000W-xxM (3)
TOCP200-xxMBT (4)
TODX2952(F) ** DC to 10 650 Up to 10 ± 30 5 ± 0.25 −40 to 85 JIS F07 APF (980/1000)
NA = 0.5 LUCT2-TC1000W-xxM (3)
TOCP200-xxMBT (4))
TODX2960(F) * * (2) DC to 10 770 Up to 1000 ± 30 5 ± 0.25 −40 to 85 JIS F07 PCF (200/230) CF-2071 (HC-20/70) Series (5)
OPC202HV Series (6)
Note (1) All values at Ta = 25°C **: Under development
(2) The external resistor value must be chosed, based on the transmission distance.
(3) Manufactured by Asahi Kasei EMD Corporation.
(4) Manufactured by Toray Industries, Inc.
(5) Manufactured by Sumitomo Electric Industries (SEI), Ltd.
(6) Manufactured by Oki Electric Cable Co., Ltd.
(7) For details on optical fiber cables with connectors, contact the respective manufactures.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
(Hi gh-Speed Optical Modules)
Transceiving Module Data Rate
(NRZ, Mb/s)
Emission
Wavelength
(nm)
Transmission
Distance
(m) (1)
Supply
Voltage
(V)
Operating
Temperature
(°C)
Compatible
Optical
Connector
Compatible Optical
Fiber
(µm)
Compatible Optical Fiber
with Fiber-Optic Connectors (7)
TODX2402(F) 20 to 250 6 50 Up to 50 (125M)
Up to 20 (250M) 3.3 ± 0.3 −10 to 70 (125M)
0 to 60 (250M) SMI APF (980/1000)
NA = 0.3 LPG-Z0005P Series (13)
Up to 20 (APF) APF (980/1000)
NA = 0.5 LUCT2-TC1000W-xxM (3)
TOCP20 0-xxMBT (4)
TODX2701(F) 20 to 125 6 50
Up to 1 0 0 (GI-PCF )
3.3 ± 0.3 −10 to 70 PN
GI-PCF (200/230) CF-2071 (HC-20/80) Series (5)
Note (1) All values at Ta = 25°C
(3) Manufactured by Asahi Kasei EMD Corporation.
(4) Manufactured by Toray Industries, Inc.
(5) Manufactured by Sumitomo Electric Industries (SEI), Ltd.
(7) For details on optical fiber cables with connectors, contact the respective manufactures.
(13) Manufa ctured by Honda Tsushin Kogyo Co., Ltd.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
46 2010/8 SCE0004J
Image Sensor s
CCD Linear Image Sensors Photosenstitive Pixels (Picture Elements)
Part Number Style Type/Lamp
Effective Pixels
Size (µm) Sensitivity (Typ.)
(V/lx · s) Data Rate (Max)
(MHz) Other Features
TCD1103GFG
☆
1500 5.5 x 64 79 2
TCD1254GFG
☆
2500 5.25 x 64 103 2 Digital shutter
Sample-and-hold
TCD1706DG 7400 15 25 x 4
TCD1710DG 7500 x 2 Line 15 15 x 2
TCD1711DG
B/W
7450 4. 7 x 4.7 15 30 x 2
TCD2563BFG 5340 x 4 Line 5.25 x 8.4 R:22.6, G:28.0, B:17.0 Color:25, B/W:25 x 2 TDI
TCD2564DG 5400 x 3 Line 7 x 7 R:9.6, G:8.9, B:3.8 30 x 2
TCD2565BFG 7500 x 4 Line 5.25 x 5.25 R:10.2, G:9.2, B:4.0, B/W:14.7 Color:35, B/W:35 x 2 2-line distance (color)
TCD2709DG 7450 x 3 Line 4.7 x 4.7 R:5.7, G:5.2, B:2.2 25 x 2
TCD2710DG 7500 x 3 Line 9.325 x 9.325 R:9.3, G:14.5, B:4.8 30 x 2
TCD2712DG 7500 x 3 Line 9.325 x 9.325 R:14.1, G:22.2, B:9.1 30 x 4
TCD2713DG 7500 x 4 Line 9.325 x 9.325 R:13.1, G:18.4, B:7.6, B/W:23.8 Color:35 x 2, B/W:35 x 4 2-line distance (color)
TCD2715DG 7450 x 3 Line 4.7 x 4.7 R:5.7, G:5.2, B:2.2 30
TCD2716DG 7450 x 3 Line 4.7 x 4.7 R:9.1, G:8.5, B:3.8 30 x 2
TCD2717BFG 7500 x 4 Line 4.7 x 4.7 R:8.0, G:7.2, B:3.1 Color:35, B/W:35 x 2 2-line distance (color)
TCD2915BFG 10680 x 3 Line R:5.6, G:7.0, B:4.3 20
TCD2916BFG 10680 x 4 Line 2.625 x 8.4 R:6.7, G:7.0, B:4.3, B/W-H:17.4, B/W-H:11.3
Col or:25, B/W:25 x 2
TCD2964BFG
Lens
reduction type
Color
21360 x 6 Line 2 x 4 R:1.3, G:1.5, B:0.7 10 Overflow drain
☆
: Dry-packed *: New product
• The products shown in bold are also manufactured in offshore fabs.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
Area I mage Sensors (DynastronTM) Features
Part Number Package Optical Format
(Inches) Total Pixel Count
(PIX) Color/Mono Digital Signal Processor
TCM9001MD Camera module 1/10 648 (H) x 492 (V)
(VGA) Color (RGB) Yes
TCM9200MD Camera module 1/4 1648 (H) x 1216 (V)
(2.0M) Color (RGB) Yes
• Dynastron is a trademark of Toshiba Corporation.
• Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
47 2010/8 SCE0004J
Package Resolution
(DPI) Applications Remarks
16PIN G L CC ⎯ Barcode readers
22PIN Cerdip A3 600 Photocopiers, scanners
22PIN CL CC
22PIN Cerdip
22PIN CL CC A4 600 ES: OK
22PIN Cerdip
68PIN Cerdip
22PIN Cerdip
32PIN CL CC
A3 600
22PIN CL CC A4 12 0 0
Photocopiers, color scanners
32PIN CL CC A4 48 0 0 Color s canners
48 2010/8 SCE0004J
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