OPA376
OPA2376
OPA4376
VoltageNoise(nV/ )ÖHz
1 10
100
10
1
Frequency(Hz)
100k100 1k 10k
INPUTVOLTAGENOISESPECTRALDENSITY
Population
2.5
-2.5
5.0
-5.0
7.5
-7.5
10.0
-10.0
12.5
-12.5
15.0
-15.0
17.5
-17.5
20.0
-20.0
22.5
-22.5
25.0
-25.0
OffsetVoltage( V)m
0
OFFSETVOLTAGEPRODUCTIONDISTRIBUTION
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406D –JUNE 2007–REVISED AUGUST 2010
Low-Noise, Low Quiescent Current,
Precision Operational Amplifier
e-trim™ Series
Check for Samples: OPA376,OPA2376,OPA4376
1FEATURES DESCRIPTION
23• LOW NOISE: 7.5nV/√Hz at 1kHz The OPA376 family represent a new generation of
low-noise operational amplifiers with e-trim, offering
• 0.1Hz TO 10Hz NOISE: 0.8mVPP outstanding dc precision and ac performance.
• QUIESCENT CURRENT: 760mV (typ) Rail-to-rail output, low offset (25mV max), low noise
• LOW OFFSET VOLTAGE: 5mV (typ) (7.5nV/√Hz), quiescent current of 950mA max, and a
• GAIN BANDWIDTH PRODUCT: 5.5MHz 5.5MHz bandwidth make this part very attractive for a
variety of precision and portable applications. In
• RAIL-TO-RAIL OUTPUT addition, this device has a reasonably wide supply
• SINGLE-SUPPLY OPERATION range with excellent PSRR, making it attractive for
• SUPPLY VOLTAGE: 2.2V to 5.5V applications that run directly from batteries without
regulation.
• SPACE-SAVING PACKAGES:
– SC-70, SOT23, WCSP, MSOP, TSSOP The OPA376 (single version) is available in
MicroSIZE SC70-5, SOT23-5, and SO-8 packages.
The OPA2376 (dual) is offered in the WCSP-8,
APPLICATIONS MSOP-8, and SO-8 packages. The OPA4376 (quad)
• ADC BUFFER is offered in a TSSOP-14 package. All versions are
• AUDIO EQUIPMENT specified for operation from –40°C to +125°C.
• MEDICAL INSTRUMENTATION
• HANDHELD TEST EQUIPMENT
• ACTIVE FILTERING
• SENSOR SIGNAL CONDITIONING
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2e-trim, NanoStar, NanoFree are trademarks of Texas Instruments Incorporated.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2007–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
OPA376
OPA2376
OPA4376
SBOS406D –JUNE 2007–REVISED AUGUST 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATING(1)
over operating free-air temperature range (unless otherwise noted) OPA376, OPA2376, OPA4376 UNIT
Supply Voltage VS= (V+) – (V–) +7 V
Voltage(2) (V–) – 0.5 to (V+) + 0.5 V
Signal Input Terminals Current(2) ±10 mA
Output Short-Circuit(3) Continuous
Operating Temperature TA–40 to +150 °C
Storage Temperature TA–65 to +150 °C
Junction Temperature TJ+150 °C
Human Body Model 4000 V
ESD Rating Charged Device Model 1000 V
Machine Model 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
PACKAGE INFORMATION(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
SC70-5 DCK BUR
OPA376 SOT23-5 DBV BUQ
SO-8 D OPA376
SO-8 D OPA2376
OPA2376 MSOP-8 DGK OBBI
OPA2376 Lead- (Pb-) Free WCSP-8 YZD OPA2376
OPA4376 TSSOP-14 PW OPA4376
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
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OPA4376
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SBOS406D –JUNE 2007–REVISED AUGUST 2010
ELECTRICAL CHARACTERISTICS: VS= +2.2V to +5.5V
Boldface limits apply over the specified temperature range: TA= –40°C to +125°C.
At TA= +25°C, RL= 10kΩconnected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
OPA376, OPA2376, OPA4376
PARAMETERS CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
Input Offset Voltage VOS 5 25 mV
vs Temperature dVOS/dT –40°C to +85°C 0.26 1 mV/°C
–40°C to +125°C 0.32 2 mV/°C
vs Power Supply PSRR VS= +2.2V to +5.5V, VCM < (V+) – 1.3V 5 20 mV/V
Over Temperature VS= +2.2V to +5.5V, VCM < (V+) – 1.3V 5 mV/V
Channel Separation, dc (dual, quad) 0.5 mV/V
INPUT BIAS CURRENT
Input Bias Current IB0.2 10 pA
Over Temperature See Typical Characteristics pA
Input Offset Current IOS 0.2 10 pA
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz 0.8 mVPP
Input Voltage Noise Density, f = 1kHz en7.5 nV/√Hz
Input Current Noise, f = 1kHz in2 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range VCM (V–) – 0.1 (V+) + 0.1 V
Common-Mode Rejection Ratio CMRR (V–) < VCM < (V+) – 1.3 V 76 90 dB
INPUT CAPACITANCE
Differential 6.5 pF
Common-Mode 13 pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain AOL 50mV < VO< (V+) – 50mV, RL= 10kΩ120 134 dB
100mV < VO< (V+) – 100mV, RL= 2kΩ120 126 dB
FREQUENCY RESPONSE CL= 100pF, VS= 5.5V
Gain-Bandwidth Product GBW 5.5 MHz
Slew Rate SR G = +1 2 V/ms
Settling Time 0.1% tS2V Step , G = +1 1.6 ms
Settling Time 0.01% tS2V Step , G = +1 2 ms
Overload Recovery Time VIN × Gain > VS0.33 ms
THD + Noise THD+N VO= 1VRMS, G = +1, f = 1kHz, RL= 10kΩ0.00027 %
OUTPUT
Voltage Output Swing from Rail RL= 10kΩ(1) 10 20 mV
RL= 10kΩ(2) 20 30 mV
Over Temperature RL= 10kΩ40 mV
Voltage Output Swing from Rail RL= 2kΩ(1) 40 50 mV
RL= 2kΩ(2) 50 60 mV
Over Temperature RL= 2kΩ80 mV
Short-Circuit Current ISC +30/–50 mA
Capacitive Load Drive CLOAD See Typical Characteristics
Open-Loop Output Impedance RO150 Ω
(1) SC70-5, SOT23-5, SO-8, MSOP-8, and TSSOP-14 packages only.
(2) Wafer chip-scale package only.
Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): OPA376 OPA2376 OPA4376
OPA376
OPA2376
OPA4376
SBOS406D –JUNE 2007–REVISED AUGUST 2010
www.ti.com
ELECTRICAL CHARACTERISTICS: VS= +2.2V to +5.5V (continued)
Boldface limits apply over the specified temperature range: TA= –40°C to +125°C.
At TA= +25°C, RL= 10kΩconnected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
OPA376, OPA2376, OPA4376
PARAMETERS CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
Specified Voltage Range VS2.2 5.5 V
Operating Voltage Range 2 to 5.5 V
Quiescent Current per amplifier IQIO= 0, VS= +5.5V, VCM < (V+) – 1.3V 760 950 mA
Over Temperature 1 mA
TEMPERATURE RANGE
Specified Range –40 +125 °C
Operating Range –40 +150 °C
Thermal Resistance qJA °C/W
SC70 250 °C/W
SOT23 200 °C/W
SO-8, TSSOP-14, MSOP-8 150 °C/W
WCSP-8 250 °C/W
4Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA376 OPA2376 OPA4376
1
2
3
5
4
V+
-IN
OUT
V-
+IN
1
2
3
4
8
7
6
5
V+
OUTB
-INB
+INB
OUTA
-INA
+INA
V-
1
2
3
5
4
V+
OUT
+IN
V-
-IN
D2
C2
B2
A2
D1
C1
B1
A1
+INB
-INB
OUTB
V+
V-
+INA
-IN A
OUTA
1,15mm
1,00mm
2,188mm
2,038mm
(BumpSideDown)
1
2
3
4
8
7
6
5
NC(1)
V+
OUT
NC(1)
NC(1)
-IN
+IN
V-
-
+
1
2
3
4
5
6
7
14
13
12
11
10
9
8
OUTD
-IND
+IND
V-
+INC
-INC
OUTC
OUTA
-INA
+INA
V+
+INB
-INB
OUTB
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406D –JUNE 2007–REVISED AUGUST 2010
PIN CONFIGURATIONS
OPA376 OPA2376
SOT23-5 SO-8, MSOP-8
(TOP VIEW) (TOP VIEW)
OPA376
SC70-5 OPA2376
(TOP VIEW) WCSP-8
(TOP VIEW)
OPA376
SO-8
(TOP VIEW)
OPA4376
TSSOP-14
(TOP VIEW)
NOTE: (1) NC denotes no internal connection.
Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): OPA376 OPA2376 OPA4376
Open-LoopGain(dB)
0.1
160
140
120
100
80
60
40
20
0
-20
PhaseMargin( )°
0
-20
-40
-60
-80
-100
-120
-140
-160
-180
Frequency(Hz)
10M1 100k10 100 1k 10k 1M
Gain
Phase
500nV/div
1s/div
Open-LoopGainandPSRR(dB)
-50 -25
160
140
120
100
80
Temperature( C)°
15050 100
0 25 75 125
Open-LoopGain(R =2 )kW
L
Power-SupplyRejectionRatio
(V =2.1Vto5.5V)
S
VoltageNoise(nV/ )ÖHz
1 10
100
10
1
Frequency(Hz)
100k
100 1k 10k
TotalHarmonicDistortion+Noise(%)
10 100
1
0.1
0.01
0.001
0.0001
Frequency(Hz)
100k
1k 10k
V =5V,V =2V,V =1V
S CM OUT RMS
Gain=10V/V
Gain=1V/V
OPA376
OPA2376
OPA4376
SBOS406D –JUNE 2007–REVISED AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS
At TA= +25°C, VS= +5V, RL= 10kΩconnected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
POWER-SUPPLY AND COMMON-MODE
OPEN-LOOP GAIN/PHASE vs FREQUENCY REJECTION RATIO vs FREQUENCY
Figure 1. Figure 2.
OPEN-LOOP GAIN AND POWER-SUPPLY 0.1Hz to 10Hz
REJECTION RATIO vs TEMPERATURE INPUT VOLTAGE NOISE
Figure 3. Figure 4.
TOTAL HARMONIC DISTORTION + NOISE
INPUT VOLTAGE NOISE SPECTRAL DENSITY vs FREQUENCY
Figure 5. Figure 6.
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QuiescentCurrent( A)m
-50 -25
1000
900
800
700
600
500
Temperature( C)°
15050 1000 25 75 125
Short-CircuitCurrent(mA)
-50 -25
75
50
25
0
-25
-50
-75
-100
Temperature( C)°
15050 1000 25 75 125
V = 2.75V
S±
ISC+
ISC-
QuiescentCurrent( A)m
2.0 2.5
1000
900
800
700
600
500
Short-CircuitCurrent(mA)
50
40
30
20
10
0
SupplyVoltage(V)
5.53.0 3.5 4.0 4.5 5.0
ISC+
IQ
OutputVoltage(V)
0
3
2
1
0
-1
-2
-3
OutputCurrent(mA)
8010 60
20 30 40 50 70
+150 C°+125 C°+25 C° - °40 C
V = 2.75
S±
Input Bias Current (pA)
-50 -25
Temperature ( C)°
15050 1000 25 75 125
1000
900
800
700
600
500
400
300
200
100
0
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406D –JUNE 2007–REVISED AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
At TA= +25°C, VS= +5V, RL= 10kΩconnected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
COMMON-MODE REJECTION RATIO QUIESCENT CURRENT
vs TEMPERATURE vs TEMPERATURE
Figure 7. Figure 8.
QUIESCENT AND SHORT-CIRCUIT CURRENT SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE vs TEMPERATURE
Figure 9. Figure 10.
INPUT BIAS CURRENT vs TEMPERATURE OUTPUT VOLTAGE vs OUTPUT CURRENT
Figure 11. Figure 12.
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Product Folder Link(s): OPA376 OPA2376 OPA4376
Population
1.1
0.9
1.2
0.8
1.3
0.7
1.4
0.6
1.5
0.5
1.6
0.4
1.7
0.3
1.8
0.2
1.9
0.1
2.0
0
½ °½OffsetVoltageDrift ( V/ C)m
1.0
Population
2.5
-2.5
5.0
-5.0
7.5
-7.5
10.0
-10.0
12.5
-12.5
15.0
-15.0
17.5
-17.5
20.0
-20.0
22.5
-22.5
25.0
-25.0
OffsetVoltage( V)m
0
OutputVoltage(V )
PP
1k
6
5
4
3
2
1
0
Frequency(Hz)
10M100k
10k 1M
V =5.5V
S
V =5V
S
V =2.5V
S
Small-SignalOvershoot(%)
10
50
40
30
20
10
0
LoadCapacitance(pF)
1k100
G=+1V/V
50mV/div
Time(400ns/div)
G=+1
R =10k
C
W
=50pF
L
L
1V/div
Time(2 s/div)m
G=+1
R =2kW
C =50pF
L
L
OPA376
OPA2376
OPA4376
SBOS406D –JUNE 2007–REVISED AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA= +25°C, VS= +5V, RL= 10kΩconnected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
OFFSET VOLTAGE DRIFT
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
PRODUCTION DISTRIBUTION (–40°C to +125°C)
Figure 13. Figure 14.
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
Figure 15. Figure 16.
SMALL-SIGNAL PULSE RESPONSE LARGE-SIGNAL PULSE RESPONSE
Figure 17. Figure 18.
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ChannelSeparation(dB)
10
140
120
100
80
60
40
0
Frequency(Hz)
100M1k100 10M
10k 100k 1M
20
SettlingTime( s)m
1
100
10
1
0.1
Closed-LoopGain(V/V)
10010
0.01%
0.1%
Open-LoopOutputResistance( )W
10
1k
100
10
1
0.1
Frequency(Hz)
10M1k100 10k 100k 1M
400 ALoadm
2mALoad
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406D –JUNE 2007–REVISED AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
At TA= +25°C, VS= +5V, RL= 10kΩconnected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted.
SETTLING TIME vs CLOSED-LOOP GAIN CHANNEL SEPARATION vs FREQUENCY
Figure 19. Figure 20.
OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY
Figure 21.
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Product Folder Link(s): OPA376 OPA2376 OPA4376
C1
100nF
R2
10kW
R1
1kW
+5V
VOUT
VIN
V =2.5V
CM
OPA376
InputOffsetVoltage(mV)
-0.5
3
2
1
0
-1
-2
-3
InputCommon-ModeVoltage(V)
6.00 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
+V
-V
OPA376
OPA2376
OPA4376
SBOS406D –JUNE 2007–REVISED AUGUST 2010
www.ti.com
APPLICATION INFORMATION
The OPA376 family of operational amplifiers is built
using e-trim, a proprietary technique in which offset
voltage is adjusted during the final steps of
manufacturing. This technique compensates for
performance shifts that can occur during the molding
process. Through e-trim, the OPA376 family delivers
excellent offset voltage (5mV, typ). Additionally, the
amplifier boasts a fast slew rate, low drift, low noise,
and excellent PSRR and AOL. These 5.5MHz CMOS
op amps operate on 760mA (typ) quiescent current.
OPERATING CHARACTERISTICS
The OPA376 family of amplifiers has parameters that
are fully specified from 2.2V to 5.5V (±1.1V to
±2.75V). Many of the specifications apply from –40°C
to +125°C. Parameters that can exhibit significant
variance with regard to operating voltage or
temperature are presented in the Typical
Characteristics.
GENERAL LAYOUT GUIDELINES Figure 22. Basic Single-Supply Connection
For best operational performance of the device, good
printed circuit board (PCB) layout practices are
required. Low-loss, 0.1mF bypass capacitors must be
connected between each supply pin and ground, COMMON-MODE VOLTAGE RANGE
placed as close to the device as possible. A single The input common-mode voltage range of the
bypass capacitor from V+ to ground is applicable to OPA376 series extends 100mV beyond the supply
single-supply applications. rails. The offset voltage of the amplifier is very low,
from approximately (V–) to (V+) – 1V, as shown in
BASIC AMPLIFIER CONFIGURATIONS Figure 23. The offset voltage increases as
common-mode voltage exceeds (V+) –1V.
The OPA376 family is unity-gain stable. It does not Common-mode rejection is specified from (V–) to
exhibit output phase inversion when the input is (V+) – 1.3V.
overdriven. A typical single-supply connection is
shown in Figure 22. The OPA376 is configured as a
basic inverting amplifier with a gain of –10V/V. This
single-supply connection has an output centered on
the common-mode voltage, VCM. For the circuit
shown, this voltage is 2.5V, but may be any value
within the common-mode input voltage range.
Figure 23. Offset and Common-Mode Voltage
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Product Folder Link(s): OPA376 OPA2376 OPA4376
10 toW
20W
V+
VIN
VOUT
RS
RLCL
OPA376
5kW
OPA376
10mAmax
V+
VIN
VOUT
IOVERLOAD
C1
1nF
C
150pF
2
R3
5.49kW
R1
5.49kW
R2
12.4kW
V+
VOUT
VIN
OPA376
(V+)/2
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406D –JUNE 2007–REVISED AUGUST 2010
INPUT AND ESD PROTECTION load, a voltage divider is created, introducing a gain
error at the output and slightly reducing the output
The OPA376 family incorporates internal electrostatic swing. The error introduced is proportional to the ratio
discharge (ESD) protection circuits on all pins. In the RS/RL, and is generally negligible at low output
case of input and output pins, this protection primarily current levels.
consists of current steering diodes connected
between the input and power-supply pins. These ESD
protection diodes also provide in-circuit, input
overdrive protection, as long as the current is limited
to 10mA as stated in the Absolute Maximum Ratings.
Figure 24 shows how a series input resistor may be
added to the driven input to limit the input current.
The added resistor contributes thermal noise at the
amplifier input and its value should be kept to a
minimum in noise-sensitive applications.
Figure 25. Improving Capacitive Load Drive
ACTIVE FILTERING
The OPA376 series is well-suited for filter
applications requiring a wide bandwidth, fast slew
rate, low-noise, single-supply operational amplifier.
Figure 26 shows a 50kHz, 2nd-order, low-pass filter.
The components have been selected to provide a
Figure 24. Input Current Protection maximally-flat Butterworth response. Beyond the
cutoff frequency, roll-off is –40dB/dec. The
Butterworth response is ideal for applications
CAPACITIVE LOAD AND STABILITY requiring predictable gain characteristics such as the
The OPA376 series of amplifiers may be used in anti-aliasing filter used ahead of an analog-to-digital
applications where driving a capacitive load is converter (ADC).
required. As with all op amps, there may be specific
instances where the OPAx376 can become unstable,
leading to oscillation. The particular op amp circuit
configuration, layout, gain, and output loading are
some of the factors to consider when establishing
whether an amplifier will be stable in operation. An op
amp in the unity-gain (+1V/V) buffer configuration and
driving a capacitive load exhibits a greater tendency
to be unstable than an amplifier operated at a higher
noise gain. The capacitive load, in conjunction with
the op amp output resistance, creates a pole within
the feedback loop that degrades the phase margin.
The degradation of the phase margin increases as
the capacitive loading increases.
The OPAx376 in a unity-gain configuration can
directly drive up to 250pF pure capacitive load.
Increasing the gain enhances the ability of the
amplifier to drive greater capacitive loads; see the
typical characteristic plot, Small-Signal Overshoot vs
Capacitive Load. In unity-gain configurations, Figure 26. Second-Order Butterworth 50kHz
capacitive load drive can be improved by inserting a Low-Pass Filter
small (10Ωto 20Ω) resistor, RS, in series with the
output, as shown in Figure 25. This resistor
significantly reduces ringing while maintaining dc
performance for purely capacitive loads. However, if
there is a resistive load in parallel with the capacitive
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OPA2376YZD
TopView
(bumpsidedown)
NottoScale
WCSP-8
D2
C2
B2
A2
D1
C1
B1
A1
+INB
-INB
OUTB
V+
V-
+INA
-IN A
OUTA
C1
0.1 Fm
R
100W
1
(1)
+5V
VIN
ADS8327
LowPower
16-Bit
500kSPS
C3
(1)
1.2nF
C4
100nF
+5V
REFIN
-IN
+IN
REF5040
4.096V
+5V
OPA376
OPA2376YZD
WCSP-8EnlargedImage
TopView
(bumpsidedown)
YMDCGLS
PackageMarkingCode:
YMD=year/month/day
CGL=indicatesOPA2376YZD
S=forengineeringpurposesonly
ActualSize:
ExactSize:
1.150mmx2.188mm
OPA376
OPA2376
OPA4376
SBOS406D –JUNE 2007–REVISED AUGUST 2010
www.ti.com
OPA2376 WCSP PACKAGE should be expected. Fluorescent lighting may
introduce noise or hum because of the time-varying
The OPA2376YZD is a lead- (PB-) free, die-level, light output. Best layout practices include end-product
wafer chip-scale package (WCSP). Unlike devices packaging that provides shielding from possible light
that are in plastic packages, these devices have no sources during operation.
molding compound, lead frame, wire bonds, or leads.
Using standard surface-mount assembly procedures, DRIVING AN ANALOG-TO-DIGITAL
the WCSP can be mounted to a PCB without CONVERTER
additional underfill. Figure 27 and Figure 28 detail the
pinout and package marking. See the NanoStar™ The low noise and wide gain bandwidth of the
and NanoFree™ 300mm Solder Bump WCSP OPA376 family make it an ideal driver for ADCs.
Application Note (SBVA017) for more detailed Figure 29 illustrates the OPA376 driving an
information on package characteristics and PCB ADS8327, 16-bit, 250kSPS converter. The amplifier is
design. connected as a unity-gain, noninverting buffer.
Figure 27. Pin Description
NOTE: (1) Suggested value; may require adjustment based on
specific application.
Figure 29. Driving an ADS8327
PHANTOM-POWERED MICROPHONE
The circuit shown in Figure 30 depicts how a remote
microphone amplifier can be powered by a phantom
source on the output side of the signal cable. The
cable serves double duty, carrying both the
Figure 28. Top View Package Marking differential output signal from and dc power to the
microphone amplifier stage.
An OPA2376 serves as a single-ended input to a
PHOTOSENSITIVITY differential output amplifier with a 6dB gain.
Although the OPA2376YZD package has a protective Common-mode bias for the two op amps is provided
backside coating that reduces the amount of light by the dc voltage developed across the electret
exposure on the die, unless fully shielded, ambient microphone element. A 48V phantom supply is
light can reach the active region of the device. Input reduced to 5.1V by the series 6.8kΩresistors on the
bias current for the package is specified in the output side of the cable, and the 4.7kΩand zener
absence of light. Depending on the amount of light diode on the input side of the cable. AC coupling
exposure in a given application, an increase in bias blocks the different dc voltage levels from each other
current, and possible increases in offset voltage on each end of the cable.
12 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA376 OPA2376 OPA4376
+
++
+
+
+
100W
R6
100W
1kW
1kW
1/2
OPA2376
1/2
OPA2376
10mF
10mF
C2
33 Fm
10 Fm
10kW
+
R1
2.7kW
R9
4.7kW
R8
4.7kW
33 FmD1
5.1V
2
R7
100W
C3
33 Fm
3
2
3
11
RG
R10
6.8kW
R11
6.8kW
3.3kW3.3kW
PhantomPower
(Providespowersourceformicrophone)
48V
1 Fm
INA163
-15V
+15V
Microphone
Typicalmicrophoneinputcircuitusedinmixingconsoles.
Low-leveldifferentialaudiosignal
istransmitteddifferentiallyonthe
samecableaspowertothemicrophone.
Panasonic
WM-034CY
C3
33pF
V+
GND
3
18
4
5
6
7
-IN
+IN
2
C2
DCLOCK
Serial
Interface
1000pF
R1
1.5kW
R4
20kW
R5
20kW
R6
100kW
R8
150kW
R9
510kW
R7
51kW
DOUT
VREF
V+=+2.7Vto5V
CS/SHDN
C1
1000pF
Electret
Microphone(1)
G=100
Passband300Hzto3kHz
R3
1MW
R2
1MW
ADS7822
12-BitA/D
1/2
OPA2376
1/2
OPA2376
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406D –JUNE 2007–REVISED AUGUST 2010
An INA163 instrumentation amplifier provides The INA163 gain may be set from 0dB to 80dB by
differential inputs and receives the balanced audio selecting the RGvalue. The INA163 circuit is typical
signals from the cable. of the input circuitry used in mixing consoles.
Figure 30. Phantom-Powered Electret Microphone
NOTE: (1) Electret microphone powered by R1.
Figure 31. OPA2376 as a Speech Bandpass Filtered Data Acquisition System
Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): OPA376 OPA2376 OPA4376
OPA376
OPA2376
OPA4376
SBOS406D –JUNE 2007–REVISED AUGUST 2010
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (October, 2008) to Revision D Page
• Updated format of Electrical Characteristics table ................................................................................................................ 3
• Updated Figure 11 ................................................................................................................................................................ 7
14 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA376 OPA2376 OPA4376
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA2376AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2376AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2376AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2376AIDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2376AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2376AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2376AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2376AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2376AIYZDR ACTIVE DSBGA YZD 8 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
OPA2376AIYZDT ACTIVE DSBGA YZD 8 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
OPA376AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA376AIDCKT ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA376AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4376AIPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4376AIPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4376AIPWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4376AIPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA376 :
•Automotive: OPA376-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA2376AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2376AIDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2376AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA2376AIYZDR DSBGA YZD 8 3000 180.0 8.4 1.24 2.29 0.81 4.0 8.0 Q1
OPA2376AIYZDR DSBGA YZD 8 3000 180.0 8.4 1.24 2.29 0.81 4.0 8.0 Q1
OPA2376AIYZDT DSBGA YZD 8 250 180.0 8.4 1.24 2.29 0.81 4.0 8.0 Q1
OPA2376AIYZDT DSBGA YZD 8 250 180.0 8.4 1.24 2.29 0.81 4.0 8.0 Q1
OPA376AIDBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA376AIDBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
OPA376AIDBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
OPA376AIDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA376AIDCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
OPA376AIDCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
OPA376AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA4376AIPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2376AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
OPA2376AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0
OPA2376AIDR SOIC D 8 2500 367.0 367.0 35.0
OPA2376AIYZDR DSBGA YZD 8 3000 220.0 220.0 34.0
OPA2376AIYZDR DSBGA YZD 8 3000 210.0 185.0 35.0
OPA2376AIYZDT DSBGA YZD 8 250 220.0 220.0 34.0
OPA2376AIYZDT DSBGA YZD 8 250 210.0 185.0 35.0
OPA376AIDBVR SOT-23 DBV 5 3000 195.0 200.0 45.0
OPA376AIDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0
OPA376AIDBVT SOT-23 DBV 5 250 202.0 201.0 28.0
OPA376AIDBVT SOT-23 DBV 5 250 195.0 200.0 45.0
OPA376AIDCKR SC70 DCK 5 3000 195.0 200.0 45.0
OPA376AIDCKT SC70 DCK 5 250 195.0 200.0 45.0
OPA376AIDR SOIC D 8 2500 367.0 367.0 35.0
OPA4376AIPWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
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