© Semiconductor Components Industries, LLC, 2013
September, 2013 − Rev. 2
1Publication Order Number:
NE5532/D
NE5532, SA5532, SE5532,
NE5532A, SE5532A
Internally Compensated
Dual Low Noise
Operational Amplifier
The 5532 is a dual high-performance low noise operational
amplifier. Compared to most of the standard operational amplifiers,
such as the 1458, it shows better noise performance, improved output
drive capability and considerably higher small-signal and power
bandwidths.
This makes the device especially suitable for application in
high-quality and professional audio equipment, instrumentation and
control circuits, and telephone channel amplifiers. The op amp is
internally compensated for gains equal to one. If very low noise is of
prime importance, it is recommended that the 5532A version be used
because it has guaranteed noise voltage specifications.
Features
•Small-Signal Bandwidth: 10 MHz
•Output Drive Capability: 600 W, 10 VRMS
•Input Noise Voltage: 5.0 nVńHz
Ǹ (Typical)
•DC Voltage Gain: 50000
•AC Voltage Gain: 2200 at 10 kHz
•Power Bandwidth: 140 kHz
•Slew Rate: 9.0 V/ms
•Large Supply Voltage Range: "3.0 to "20 V
•Compensated for Unity Gain
•Pb−Free Packages are Available
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
PIN CONNECTIONS
SOIC−8
D SUFFIX
CASE 751
PDIP−8
N SUFFIX
CASE 626
1
8
1
8
16
1
SOIC−16 WB
D SUFFIX
CASE 751G
N, D8 Packages
D Package*
*SOL and non-standard pinout.
7
6
54
3
2
1
B
A
V+
OUTB
−INB
+INB
OUTA
−INA
+INA
V-
Top View
−INA
+INA
NC
V−
NC
NC
+INB
−INB
NC
NC
NC
OUTA
1
2
3
4
5
6
7
89
10
11
12
13
14
16
15
V+
OUTB
NC
NC
Top View
8
See general marking information in the device marking
section on page 6 of this data sheet.
DEVICE MARKING INFORMATION
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
2
Figure 1. Equivalent Schematic (Each Amplifier)
+
_
MAXIMUM RATINGS
Rating Symbol Value Unit
Supply Voltage VS"22 V
Input Voltage VIN "VSUPPLY V
Differential Input Voltage (Note 1) VDIFF "0.5 V
Operating Temperature Range
NE5532/A
SA5532
SE5532/A
Tamb 0 to 70
−40 to +85
−55 to +125
°C
Storage Temperature Tstg −65 to +150 °C
Junction Temperature Tj150 °C
Maximum Power Dissipation, Tamb = 25°C (Still-Air)
8 D8 Package
8 N Package
16 D Packagee
PD780
1200
1200
mW
Thermal Resistance, Junction−to−Ambient
8 D8 Package
8 N Package
16 D Packagee
RqJA 182
130
140
°C/W
Lead Soldering Temperature (10 sec max) Tsld 230 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input
voltage exceeds 0.6 V. Maximum current should be limited to "10 mA.
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
3
DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) (Notes 2, 3 and 4)
Characteristic Symbol Test Conditions
SE5532/A NE5532/A, SA5532
Unit
Min Typ Max Min Typ Max
Offset Voltage VOS − − 0.5 2.0 −0.5 4.0 mV
−Overtemperature − − 3.0 − − 5.0 mV
DVOS/DT− − 5.0 − − 5.0 −mV/°C
Offset Current IOS − − − 100 −10 150 nA
−Overtemperature − − 200 − − 200 nA
DIOS/DT− − 200 − − 200 −pA/°C
Input Current IB− − 300 500 −300 800 nA
−Overtemperature − − 700 − − 1000 nA
DIB/DT− − 5.0 − − 5.0 −nA/°C
Supply Current ICC − − 8.0 10.5 −8.0 16 mA
−Overtemperature − − 13 − − −
Common-Mode Input Range VCM −"12 "13 −"12 "13 −V
Common-Mode Rejection Ratio CMRR −80 100 −70 100 −dB
Power Supply Rejection Ratio PSRR − − 10 50 −10 100 mV/V
Large-Signal Voltage Gain AVOL RL w2.0 kW; VO = "10 V 50 100 −25 100 −V/mV
Overtemperature 25 − − 15 − −
RL w600 W; VO = "10 V 40 50 −15 50 −
Overtemperature 20 − − 10 − −
Output Swing VOUT RL w 600 W"12 "13 −"12 "13 −V
Overtemperature "10 "12 −"10 "12 −
RL w 600 W; VS = "18 V "15 "16 −"15 "16 −
Overtemperature "12 "14 −"12 "14 −
RL w 2.0 kW"13 "13.5 −"13 "13.5 −
Overtemperature "12 "12.5 −"10 "12.5 −
Input Resistance RIN −30 300 −30 300 −kW
Output Short Circuit Current ISC −10 38 60 10 38 60 mA
2. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input
voltage exceeds 0.6 V. Maximum current should be limited to "10 mA.
3. For operation at elevated temperature, derate packages based on the package thermal resistance.
4. Output may be shorted to ground at VS = "15 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating
is not exceeded.
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
4
AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.)
Characteristic Symbol Test Conditions
NE/SE5532/A, SA5532
Unit
Min Typ Max
Output Resistance ROUT AV = 30 dB Closed-loop
f = 10 kHz, RL = 600 W
−0.3 −W
Overshoot −Voltage-Follower %
VIN = 100 mVP-P −10 −
CL = 100 pF; RL = 600 W
Gain AVf = 10 kHz −2.2 −V/mV
Gain Bandwidth Product GBW CL = 100 pF; RL = 600 W−10 −MHz
Slew Rate SR − − 9.0 −V/ms
Power Bandwidth −VOUT = "10 V −140 −kHz
VOUT = "14 V;
RL = 600 W
−100 −
VCC = "18 V
ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.)
Characteristic Symbol Test Conditions
NE/SE5532 NE/SA/SE5532A
Unit
Min Typ Max Min Typ Max
Input Noise Voltage VNOISE fO = 30 Hz −8.0 − − 8.0 12 nV/√Hz
fO = 1.0 kHz −5.0 − − 5.0 6.0
Input Noise Current INOISE fO = 30 Hz −2.7 − − 2.7 −pA/√Hz
fO = 1.0 kHz −0.7 − − 0.7 −
Channel Separation −f = 1.0 kHz; RS = 5.0 kW−110 − − 110 −dB
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
5
TYPICAL PERFORMANCE CHARACTERISTICS
GAIN (dB)
GAIN (dB)
10 102103104105106107
120
80
40
0
-40
f (Hz)
80
60
40
20
0
-55 -25 0 25 50 75 100 +125 -55 -25 0 25 50 75 100 +125
1,4
1,2
0,8
0,4
0
30
20
10
0
01020
Tamb (oC)
TYP
IO
(mA)
II
(mA) VIN (V)
Vp; −VN (V)
Figure 2. Open-Loop Frequency
Response
60
40
20
0
-20
103104105106107108
f (Hz)
RF = 10 kW; RE = 100 W
RF = 9 kW; RE = 1 kW
RF = 1 kW; RE = ∞
102103104105106107
40
30
20
10
0
f (Hz)
(V)
Vo(p-p)
(nVńHz
Ǹ)
IO = 0
010 20
0
2
4
6
10−2
10
1
10−1
10−2
10 102103104
f (Hz)
TYP
TYP
IP
IN
(mA)
Vp; −VN (V)
Tamb (oC)
Figure 3. Closed-Loop Frequency
Response
Figure 4. Large−Signal Frequency
Response
Figure 5. Output Short−Circuit
Current
Figure 6. Input Bias Current Figure 7. Input Common−Mode
Voltage Range
Figure 8. Supply Current Figure 9. Input Noise Voltage
Density
TYPICAL VALUES
TYPICAL VALUES VS = "15 V
TYPICAL VALUES
VS = "15 V VS = "15 V TYPICAL VALUES
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
6
Closed-Loop Frequency Response Voltage-Follower
+
−
5532 (1/2)
100 pF
RS
VIRE
RF
800 W
25 W
+
−
5532
VIN VOUT
100 pF
600 W
V+
V−
1 kW
Figure 10. Test Circuits
MARKING DIAGRAMS
SOIC−8
D SUFFIX
CASE 751
PDIP−8
N SUFFIX
CASE 626
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G= Pb−Free Packagee
NE5532AN
AWL
YYWWG
NE5532N
AWL
YYWWG
SA5532N
AWL
YYWWG
SE5532N
AWL
YYWWG
SOIC−16 WB
D SUFFIX
CASE 751G
16
1
NE5532D
AWLYYWWG
S5532
ALYWA
G
1
8
N5532
ALYW
G
1
8
N5532
ALYWA
G
1
8
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
7
ORDERING INFORMATION
Device Description Temperature Range Shipping†
NE5532AD8 8−Pin Plastic Small Outline (SO−8) Package
0 to 70°C
98 Units / Rail
NE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
98 Units / Rail
NE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel
NE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
2500 / Tape & Reel
NE5532AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail
NE5532ANG 8−Pin Plastic Dual In−Line Package (PDIP−8)
(Pb−Free)
50 Units / Rail
NE5532D 16−Pin Plastic Small Outline (SO−16 WB) Package 47 Units / Rail
NE5532DG 16−Pin Plastic Small Outline (SO−16 WB) Package
(Pb−Free)
47 Units / Rail
NE5532DR2 16−Pin Plastic Small Outline (SO−16 WB) Package 1000 Tape & Reel
NE5532DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package
(Pb−Free)
1000 Tape & Reel
NE5532D8 8−Pin Plastic Small Outline (SO−8) Package 98 Units / Rail
NE5532D8G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
98 Units / Rail
NE5532D8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel
NE5532D8R2G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
2500 / Tape & Reel
NE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail
NE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)
(Pb−Free)
50 Units / Rail
SA5532N 8−Pin Plastic Dual In−Line Package (PDIP−8)
−40 to +85°C
50 Units / Rail
SA5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)
(Pb−Free)
50 Units / Rail
SE5532AD8 8−Pin Plastic Small Outline (SO−8) Package
−55 to +125°C
98 Units / Rail
SE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
98 Units / Rail
SE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel
SE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package
(Pb−Free)
2500 / Tape & Reel
SE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail
SE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)
(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
8
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
9
PACKAGE DIMENSIONS
8−Pin Plastic Dual In−Line Package (PDIP−8)
N SUFFIX
CASE 626−05
ISSUE N
14
58
b2
NOTE 8
D
b
L
A1
A
eB
E
A
TOP VIEW
C
SEATING
PLANE
0.010 CA
SIDE VIEW
END VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM MIN MAX
INCHES
A−−−− 0.210
A1 0.015 −−−−
b0.014 0.022
C0.008 0.014
D0.355 0.400
D1 0.005 −−−−
e0.100 BSC
E0.300 0.325
M−−−− 10
−−− 5.33
0.38 −−−
0.35 0.56
0.20 0.36
9.02 10.16
0.13 −−−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT
TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −−− 10.92
0.060 TYP 1.52 TYP
E1
M
8X
c
D1
B
A2 0.115 0.195 2.92 4.95
L0.115 0.150 2.92 3.81
°°
H
NOTE 5
e
e/2 A2
NOTE 3
MBMNOTE 6
M
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
10
PACKAGE DIMENSIONS
SOIC−16 WB
D SUFFIX
CASE 751G−03
ISSUE D
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B S
T
16 9
81
hX 45_
M
B
M
0.25
H8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A2.35 2.65
A1 0.10 0.25
B0.35 0.49
C0.23 0.32
D10.15 10.45
E7.40 7.60
e1.27 BSC
H10.05 10.55
h0.25 0.75
L0.50 0.90
q0 7
__
11.00
16X 0.58
16X
1.62 1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products
for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including
without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different
applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components
in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product
could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall
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fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was
negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws
and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NE5532/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
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Order Literature: http://www.onsemi.com/orderlit
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a
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