Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 LM2611 1.4-MHz Cuk Converter 1 Features 3 Description * * * * * * * * * The LM2611 is a current mode, PWM inverting switching regulator. Operating from a 2.7-V to 4-V supply, it is capable of producing a regulated negative output voltage of up to -(36 VIN(MAX)). The LM2611 utilizes an input and output inductor, which enables low voltage ripple and RMS current on both the input and the output. With a switching frequency of 1.4 MHz, the inductors and output capacitor can be physically small and low cost. High efficiency is achieved through the use of a low RDS(ON) FET. 1 1.4-MHz Switching Frequency Low RDS(ON) DMOS FET 1-mVp-p Output Ripple -5 V at 300 mA From 5-V Input Better Regulation Than a Charge Pump Uses Tiny Capacitors and Inductors Wide Input Range: 2.7 V to 14 V Low Shutdown Current: <1 A 5-Pin SOT-23 Package The LM2611 features a shutdown pin, which can be activated when the part is not needed to lower the Iq and save battery life. A negative feedback (NFB) pin provides a simple method of setting the output voltage, using just two resistors. Cycle-by-cycle current limiting and internal compensation further simplify the use of the LM2611. 2 Applications * * * * * MR Head Bias Digital Camera CCD Bias LCD Bias GaAs FET Bias Positive to Negative Conversion The LM2611 is available as a small 5-pin, SOT-23 package and comes in two grades. Grade A has a 1.2-A current limit and 0.5- RDS(ON), and Grade B has a 0.9-A current limit and 0.7- RDS(ON). Device Information(1) PART NUMBER LM2611 PACKAGE SOT-23 (5) BODY SIZE (NOM) 1.60 mm x 2.90 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Circuit L2 47 PH CCUK L1 15 PH 1 PF VIN VOUT - 5V 300 mA 5V 5 VIN CIN 22 PF 4 SHDN LM2611A 1 RFB1 CFF SW 29.4k 330 pF NFB 3 D COUT 22 PF GND 2 RFB2 10k CIN: TAIYO YUDEN X5R JMK325BJ226MM CCUK: TAIYO YUDEN X5R EMK316BJ105MF COUT: TAIYO YUDEN X5R JMK325BJ226MM D: ON SEMICONDUCTOR MBR0520 L1: SUMIDA CR32-150 L2: SUMIDA CR32-470 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 3 3 4 4 4 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 8 7.4 Device Functional Modes........................................ 12 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application .................................................. 13 9 Power Supply Recommendations...................... 19 10 Layout................................................................... 20 10.1 Layout Guidelines ................................................. 20 10.2 Layout Example .................................................... 20 11 Device and Documentation Support ................. 21 11.1 11.2 11.3 11.4 Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 21 21 21 21 12 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (April 2013) to Revision J * Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 Changes from Revision H (April 2013) to Revision I * 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 19 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 5 Pin Configuration and Functions DBV Package 5-Pin SOT-23 Top View SW 1 GND 5 VIN 4 SHDN 2 NFB 3 Pin Functions PIN NO. NAME TYPE (1) DESCRIPTION 1 SW A 2 GND GND 3 NFB A Negative feedback. Connect to output via external resistor divider to set output voltage. 4 SHDN I Shutdown control input. VIN = Device on. Ground = Device in shutdown. 5 VIN PWR (1) Drain of internal switch. Connect at the node of the input inductor and Cuk capacitor. Analog and power ground. Analog and power input. Filter out high frequency noise with a 0.1-F ceramic capacitor placed close to the pin. A = Analog, I = Input, GND = Ground, PWR = Power 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN Input voltage, VIN MAX UNIT 14.5 V SW voltage -0.4 36 V NFB voltage -6 0.4 V -0.4 14.5 V 125 C SHDN voltage Maximum junction temperature Power dissipation (2) Internally limited Lead temperature -65 Storage temperature, Tstg (1) (2) 300 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, JA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance of various layouts. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) - TA)/JA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. 6.2 ESD Ratings VALUE V(ESD) (1) (2) (3) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) 2000 Machine Model (MM) (3) 200 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body model is a 100-pF capacitor discharged through a 1.5-k resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 3 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com 6.3 Recommended Operating Conditions MIN Supply voltage Operating junction temperature, TJ NOM MAX UNIT 2.7 14 V -40 125 C 6.4 Thermal Information LM2611 THERMAL METRIC (1) DBV (SOT-23) UNIT 5 PINS RJA Junction-to-ambient thermal resistance 163.5 C/W RJC(top) Junction-to-case (top) thermal resistance 115.2 C/W RJB Junction-to-board thermal resistance 27.4 C/W JT Junction-to-top characterization parameter 12.9 C/W JB Junction-to-board characterization parameter 26.9 C/W RJC(bot) Junction-to-case (bottom) thermal resistance n/a C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics Specifications in standard type face are for TJ = 25C, unless otherwise specified. VIN = 5 V and IL = 0 A, unless otherwise specified. PARAMETER VIN Input voltage TEST CONDITIONS TJ = -40C to +85C MIN (1) Switch current limit Grade A; TJ = -40C to +85C RDSON Switch ON resistance SHDNTH Shutdown threshold ISHDN Shutdown pin bias current 1 Negative feedback reference INFB NFB pin bias current 0.5 0.65 0.7 0.9 Device enabled; TJ = -40C to +85C 1.5 Device disabled; TJ = -40C to +85C 0.5 VSHDN = 0 V 0 VSHDN = 5 V 0 VSHDN = 5 V, Not Switching -1.205 -1.255 -4.7 -2.7 -6.7 (1) (2) 4 V A 1.8 3.5 mA 270 VSHDN = 5 V, Not Switching; TJ = -40C to +85C 2.7 V VIN 14 V V A -1.23 VNFB =-1.23 V VNFB =-1.23 V; TJ = -40C to +85C 1 VIN = 3 V VIN = 3 V; TJ = -40C to +85C A 0.7 500 0.024 VSHDN = 0 V; TJ = -40C to +85C Reference line regulation V Grade B VSHDN = 0 V %VOUT/ VIN 14 0.9 VSHDN = 5 V, Switching; TJ = -40C to +85C Quiescent current UNIT Grade A VSHDN = 5 V, Switching Iq (1) 2 VSHDN = 5 V; TJ = -40C to +85C NFB MAX 1.2 Grade B Grade B; TJ = -40C to +85C (2) 2.7 Grade A ISW TYP 1 0.02 A A %/V All limits are specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% tested through statistical analysis. All limits at temperature extremes via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Typical numbers are at 25C and represent the expected value of the parameter. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 Electrical Characteristics (continued) Specifications in standard type face are for TJ = 25C, unless otherwise specified. VIN = 5 V and IL = 0 A, unless otherwise specified. PARAMETER fS Switching frequency DMAX Maximum duty cycle IL Switch leakage TEST CONDITIONS MIN (1) TJ = 25C TJ = -40C to +85C VSW = 5 V, Not Switching (2) MAX (1) 1.4 1 TJ = 25C TJ = -40C to +85C TYP 1.8 UNIT MHz 88% 82% 1 A Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 5 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com 0.55 1 0.5 0.8 RDS(ON) (:) RDS(ON) (:) 6.6 Typical Characteristics 0.45 0.4 0.6 0.4 0.2 0.35 0 -50 0.3 2 4 6 8 10 12 14 0 50 100 150 TEMPERATURE (oC) VIN (V) VIN = 5 V Figure 1. RDS(ON) vs VIN Figure 2. RDS(ON) vs Ambient Temperature 1.4 1.4 SWITCH CURRENT LIMIT (A) SWITCH CURRENT LIMIT (A) 1.45 1.35 1.3 1.25 1.2 4 6 12 10 8 1.38 1.37 1.36 1.35 -50 1.15 2 1.39 0 50 100 150 TEMPERATURE (oC) VIN (V) VIN = 5 V Figure 4. Switch Current Limit vs Ambient Temperature 1.50 1.46 1.48 OSCILLATOR FREQUENCY (MHz) OSCILLATOR FREQUENCY (MHz) Figure 3. Switch Current Limit vs VIN 1.48 1.44 1.42 1.40 1.38 1.36 1.34 1.32 1.30 0 2 4 6 8 VIN (V) 10 12 1.46 1.44 1.42 1.40 1.38 1.36 1.34 1.32 1.30 -60 -40 -20 0 20 40 60 80 100120 140 160 TEMPERATURE (oC) 14 VIN = 5 V Figure 5. Oscillator Frequency vs VIN 6 Figure 6. Oscillator Frequency vs Ambient Temperature Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 -1.215 -1.218 -1.22 -1.220 -1.225 -1.222 VNFB (V) VNFB (V) Typical Characteristics (continued) -1.23 -1.235 -1.224 -1.226 -1.24 -1.228 -1.245 -1.230 -1.25 -1.232 0 TA = 25C 10 5 VOUT -55 15 VIN (V) = -5 V 20 45 70 95 120 VIN = 5 V Figure 8. VNFB vs Ambient Temperature 4.45 4.4 4.4 4.3 4.35 4.2 INFB (PA) INFB (PA) -5 TEMPERATURE (oC) Figure 7. VNFB vs VIN 4.3 4.1 4.0 4.25 4.2 5 0 3.9 -50 -25 15 10 VOUT = -5 V TA = 25C 25 50 75 100 125 150 VOUT = -5 V VIN = 3.5 V Figure 9. INFB vs VIN Figure 10. INFB vs Ambient Temperature 255 0.85 SHUTDOWN VOLTAGE (V) 260 0.9 250 245 240 235 230 0.8 0.75 On Threshold 0.7 0.65 Off Threshold 0.6 0.55 225 220 -50 0 TEMPERATURE (oC) VIN (V) IQ(PA) -30 0 50 100 0.5 -50 150 0 50 100 150 TEMPERATURE (oC) TEMPERATURE (oC) VIN = 5 V Figure 11. Iq vs Ambient Temperature (No Load) Figure 12. VSHUTDOWN vs Ambient Temperature Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 7 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com 7 Detailed Description 7.1 Overview The LM2611 consists of a current mode controller with an integrated primary switch and integrated current sensing circuitry. The feedback is connected to the internal error amplifier and a type II/III internal compensation scheme is used. A ramp generator provides some slope compensation to the system. SHDN pin is a logic input designed to shut down the converter. 7.2 Functional Block Diagram VI N 1 SW 5 R5 R6 - gm - RC Q2 x10 R + FF DRIVER Q s CURRENT LIMIT COMPARATOR 1.4MHz OSCILLATOR R4 140k 0.05 3 NFB - R1 EXTERNAL | CC R3 30k VO RAMP GENERATOR R R + Q1 THERMAL SHUTDOWN PWM COMPARATOR + CFF (OPTIONAL) SHDN 4 SHUTDOWN 2 GND R2 EXTERNAL 7.3 Feature Description 7.3.1 Cuk Converter + CCUK - + L1 - - L2 + + L1 - + CCUK - - L2 + + + VIN COUT VIN COUT VOUT - - a VOUT b Figure 13. Operating Cycles of a Cuk Converter The LM2611 is a current mode, fixed frequency PWM switching regulator with a -1.23-V reference that makes it ideal for use in a Cuk converter. The Cuk converter inverts the input and can step up or step down the absolute value. Using inductors on both the input and output, the Cuk converter produces very little input and output current ripple. This is a significant advantage over other inverting topologies such as the buck-boost and flyback. The operating states of the Cuk converter are shown in Figure 13. During the first cycle, the transistor switch is closed and the diode is open. L1 is charged by the source and L2 is charged by CCUK, while the output current is provided by L2. In the second cycle, L1 charges CCUK and L2 discharges through the load. By applying the voltsecond balance to either of the inductors, use Equation 1 to determine the relationship of VOUT to the duty cycle (D). 8 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 Feature Description (continued) VOUT = - VIN D 1-D (1) The following sections review the steady-state design of the LM2611 Cuk converter. 7.3.2 Output and Input Inductor Figure 14 and Figure 15 show the steady-state voltage and current waveforms for L1 and L2, respectively. Referring to Figure 13 (a), when the switch is closed, VIN is applied across L1. In the next cycle, the switch opens and the diode becomes forward biased, and VOUT is applied across L1 (the voltage across CCUK is VIN - VOUT.) vL1(V) VIN t VOUT iL1(A) 'IL1 IL1 t Figure 14. Voltage and Current Waveforms in Inductor L1 of a Cuk Converter The voltage and current waveforms of inductor L2 are shown in Figure 15. During the first cycle of operation, when the switch is closed, VIN is applied across L2. When the switch opens, VOUT is applied across L2. CCUK 2.2PF L1A 22PH VOUT-5V 375mA L1B 22PH VIN 12V 1 5 VDD 5V 4 CIN 22PF SW VIN SHDN LM2611A NFB RFB1 29.4k CFF 1000pF 3 D COUT 22PF GND 2 RFB2 10k CIN: VISHAY/SPRAGUE 595D226X0020C2T CCUK: TAIYO YUDEN X5R LMK212BJ105MG COUT: TAIYO YUDEN X5R JMK325BJ226MM D: ON SEMICONDUCTOR MBR0520 L1: SUMIDA CLS62-220 or MURATA LZH3C220 (UNCOUPLED) Figure 15. Schematic of the Cuk Converter Using LM2611 Equation 2 to Equation 5 define the values given in Figure 14 and Figure 15: IL2 = IOUT (2) Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 9 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com Feature Description (continued) DiL2 = VIN D TS 2 L2 (3) D D IL2 = IOUT 1-D 1-D V D TS DiL1 = IN 2 L1 IL1 = (4) (5) Use these equations to choose correct core sizes for the inductors. The design of the LM2611's internal compensation assumes L1 and L2 are equal to 10 to 22 H, thus TI recommends staying within this range. 7.3.3 Switch Current Limit The LM2611 incorporates a separate current limit comparator, making current limit independent of any other variables. The current limit comparator measures the switch current versus a reference that represents current limit. If at any time the switch current surpasses the current limit, the switch opens until the next switching period. To determine the maximum load for a given set of conditions, both the input and output inductor currents must be considered. The switch current is equal to iL1 + iL2, and is drawn in Figure 16. In summary, Equation 6 shows: iSW(PEAK) = iL1 + iL2 = IL1 + IL2 + DiL1 + DiL2 D o VIN D TS ae 1 1 o ae = IOUT c 1 + + + c / / 2 e 1-D o e L1 L 2 o (6) ISW(PEAK) must be less than the current limit (1.2 A typical), but will also be limited by the thermal resistivity of the LM2611 device's 5-pin, SOT-23 package (JA = 265C/W). iSW(A) ICL 'iL1 +'iL2 IL1+ IL2 ISW t iSW The peak value is equal to the sum of the average currents through L1 and L2 and the average-to-peak current ripples through L1 and L2. Figure 16. Switch Current Waveform in a Cuk Converter. 7.3.4 Input Capacitor The input current waveform to a Cuk converter is continuous and triangular, as shown in Figure 14. The input inductor insures that the input capacitor sees fairly low ripple currents. However, as the input inductor gets smaller, the input ripple goes up. The RMS current in the input capacitor is shown in Equation 7. ICIN(RMS) = 1 VIN 2 3 ae V o fsL1 c i + 1/ c Vo / e o (7) The input capacitor should be capable of handling the RMS current. Although the input capacitor is not so critical in a Cuk converter, a 10-F or higher value good quality capacitor prevents any impedance interactions with the input supply. TI recommends connecting a 0.1-F or 1-F ceramic bypass capacitor on the VIN pin (pin 5) of the IC. This capacitor must be connected very close to pin 5 (within 0.2 inches). 10 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 Feature Description (continued) 7.3.5 Output Capacitor Like the input current, the output current is also continuous, triangular, and has low ripple (see IL2 in Figure 15). The output capacitor must be rated to handle its RMS current: ICOUT(RMS) = DiL2 = 3 1 VIN 2 3 ae V o fsL 2 c i + 1/ c Vo / e o (8) For example, ICOUT(RMS) can range from 30 mA to 180 mA with 10 H L1,2 22 H, -10 V VOUT -3.3 V, and 2.7 V VIN 30 V (VIN may be 30 V if using separate power and analog supplies, see Split Supply Operation in the Typical Application section). The worst case conditions are with L1,2, VOUT(MAX), and VIN(MAX). Many capacitor technologies will provide this level of RMS current, but ceramic capacitors are ideally suited for the LM2611. Ceramic capacitors provide a good combination of capacitance and equivalent series resistance (ESR) to keep the zero formed by the capacitance and ESR at high frequencies. Use Equation 9 to calculate the ESR zero. 1 fESR = (Hz) 2pCOUTESR (9) A general rule of thumb is to keep fESR > 80 kHz for LM2611 Cuk designs. Low ESR tantalum capacitors will usually be rated for at least 180 mA in a voltage rating of 10 V or above. However the ESR in a tantalum capacitor (even in a low ESR tantalum capacitor) is much higher than in a ceramic capacitor and could place fESR low enough to cause the LM2611 to become unstable. 7.3.6 Improving Transient Response and Compensation The compensator in the LM2611 is internal. However, a zero-pole pair can be added to the open-loop frequency response by inserting a feed-forward capacitor, CFF, in parallel to the top feedback resistor (RFB1). Phase margin and bandwidth can be improved with the added zero-pole pair. This in turn improves the transient response to a step load change (see Figure 17 and Figure 18). The position of the zero-pole pair is a function of the feedback resistors and the capacitor value: wZ = wp = 1 (rad / s) CFFRFB1 (10) ae RFB1 o 1 c1 + / (rad / s) CFFRFB1 e RFB2 o (11) The optimal position for this zero-pole pair will vary with circuit parameters such as D, IOUT, COUT, L1, L2, and CCUK. For most cases, the value for the zero frequency is between 5 kHz to 20 kHz. Notice how the pole position, p, is dependant on the feedback resistors RFB1 and RFB2, and therefore also dependant on the output voltage. As the output voltage becomes closer to -1.26 V, the pole moves towards the zero, tending to cancel it out. If the absolute magnitude of the output voltage is less than 3.3 V, adding the zero-pole pair will not have much effect on the response. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 11 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com Feature Description (continued) Figure 17. 130-mA to 400-mA Transient Response of the Circuit in Figure 24 With CFF= 1 nF Figure 18. 130-mA to 400-mA Transient Response of the Circuit in Figure 24 With CFF Disconnected 7.4 Device Functional Modes 7.4.1 Hysteretic Mode As the output current decreases, the energy stored in the Cuk capacitor eventually exceeds the energy required by the load. The excess energy is absorbed by the output capacitor, causing the output voltage to increase out of regulation. The LM2611 detects when this happens and enters a pulse-skipping, or hysteretic mode. In pulseskipping mode, the output voltage increases as illustrated in Figure 20 as opposed to the regular PWM operation shown in Figure 19. Figure 19 shows the LM2611 in PWM Mode with very-low ripple. Figure 20 shows the LM2611 in pulse-skipping mode at low loads. In this mode, the output ripple increases slightly. Figure 19. PWM Mode Figure 20. Pulse-Skipping Mode 7.4.1.1 Thermal Shutdown If the junction temperature of the LM2611 exceeds 163C, the device enters thermal shutdown. In thermal shutdown, the part deactivates the driver and the switch turns off. The switch remains off until the junction temperature drops to 155C, at which point the part begins switching again. It will typically take 10 ms for the junction temperature to drop from 163C to 155C with the switch off. 12 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM2611 is a Cuk controller with an integrated switch. The following section provides an approach to sizing the components for the target application and shows some typical examples of applications to help the designer. 8.2 Typical Application 8.2.1 Cuk Converter With Integrated Switch CCUK 2.2PF L1A 22PH VOUT-5V 375mA L1B 22PH VIN 12V 1 5 VDD 5V 4 CIN 22PF SW VIN SHDN LM2611A NFB RFB1 29.4k CFF 1000pF 3 D COUT 22PF GND 2 RFB2 10k CIN: VISHAY/SPRAGUE 595D226X0020C2T CCUK: TAIYO YUDEN X5R LMK212BJ105MG COUT: TAIYO YUDEN X5R JMK325BJ226MM D: ON SEMICONDUCTOR MBR0520 L1: SUMIDA CLS62-220 or MURATA LZH3C220 (UNCOUPLED) Figure 21. Typical Cuk Converter Implementation Using LM26211 8.2.1.1 Design Requirements The first variables needed are the output voltage and the input voltage range (min to max). The input voltage range ensures that the IC is suitable for the application and that the absolute maximum voltage are respected. The expected maximum output current is also needed to verify that the IC can deliver the required current. 8.2.1.2 Detailed Design Procedure The first components to choose are the power inductors. Typically a smaller inductance yields a smaller solution footprint and lower cost but the higher ripple makes a smaller inductance not compatible with every application. Due to the internal compensation, TI recommends a 10-H to 22-H inductor. Try to choose the inductors so that the peak-to-peak ripple is lower than 0.3 A of the average current by using Equation 3 and Equation 5. Using the maximum output current and the input voltage range, calculate the worst case peak current in the switch using Equation 6. If the peak current is above the peak current limit for this part, consider increasing the inductance and re-calculate. If the inductance is above 22 H for each inductor, the designer will have to pay special attention to stability over the extended range of operation (it's always a good practice to do so even if the inductance is within the recommended range). Using the desired output voltage, calculate the value of the feedback resistors. The reference voltage is 1.23 V. Resistors of 50 k or less must be used due to the leakage at the NFB pin. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 13 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com Typical Application (continued) It is a good idea to add a placeholder for a small capacitor across the top feedback resistor to act as a feedforward component to optimize transient response. Optimization of the feed-forward capacitor depends a lot on the specific parameters including the parasitic components associated with the capacitors. Experimentation is key to ensure ideal sizing of the capacitor (either using load transient response or a loop response analyzer). See Improving Transient Response and Compensation for details regarding the CFF capacitor. 8.2.1.3 Application Curves 700 MAXIMUM OUTPUT CURRENT (mA) MAXIMUM OUTPUT CURRENT (mA) 700 600 500 400 300 200 100 600 500 400 300 200 100 0 0 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 OUTPUT VOLTAGE (-V) OUTPUT VOLTAGE (-V) Figure 22. Maximum Output Current vs Output Voltage at VIN = 12 V (L1 = L2 = 22 H) Figure 23. Maximum Output Current vs Output Voltage at VIN = 5 V (L1 = L2 = 22 H) 8.2.2 5-V to -5-V Inverting Converter L2 47 PH CCUK L1 15 PH 1 PF VIN VOUT - 5V 300 mA 5V 5 VIN CIN 4 22 PF SHDN LM2611A 1 RFB1 CFF SW 29.4k 330 pF NFB 3 D COUT 22 PF GND RFB2 2 10k CIN: TAIYO YUDEN X5R JMK325BJ226MM CCUK: TAIYO YUDEN X5R EMK316BJ105MF COUT: TAIYO YUDEN X5R JMK325BJ226MM D: ON SEMICONDUCTOR MBR0520 L1: SUMIDA CR32-150 L2: SUMIDA CR32-470 Figure 24. 5-V to -5-V Inverting Converter Schematic 8.2.2.1 Design Requirements This design converts 5 V (VIN) to -5 V (VOUT). Adjust RFB2 to set a different output voltage. 14 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 Typical Application (continued) 8.2.2.2 Application Curves 90 MAXIMUM OUTPUT CURRENT (mA) 700 85 EFFICIENCY (%) 80 75 70 65 60 55 50 45 600 500 400 300 200 100 40 0.05 0.15 0 0.25 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 LOAD CURRENT (A) OUTPUT VOLTAGE (-V) Figure 25. Efficiency vs Load Current Figure 26. Maximum Output Current vs Output Voltage, 5 V to -5 V 8.2.3 9-V to -5-V Inverting Converter L2 10 PH CCUK L1 10 PH VIN 1 PF VOUT - 5V 9V 1 5 VIN CIN 4 22 PF SHDN SW LM2611A NFB GND RFB1 CFF 29.4k 330 pF D 3 COUT 22 PF RFB2 2 10k CIN: TAIYO YUDEN X5R JMK325BJ226MM CCUK: TAIYO YUDEN X5R EMK316BJ105MF COUT: TAIYO YUDEN X5R JMK325BJ226MM D: ON SEMICONDUCTOR MBR0520 L1: SUMIDA CR32-100 L2: SUMIDA CR32-100 Figure 27. 9-V to -5-V Inverting Converter Schematic 8.2.3.1 Design Requirements This design converts 9 V (VIN) to -5 V (VOUT). Adjust RFB2 to set a different output voltage. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 15 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com Typical Application (continued) 8.2.3.2 Application Curve MAXIMUM OUTPUT CURRENT (mA) 700 60060 0 50 500 0 40 400 0 30 300 0 20 200 0 10 100 0 0 0 4 6 8 10 12 14 16 18 20 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 OUTPUT VOLTAGE (-V) Figure 28. Maximum Output Current vs Output Voltage, 9 V to - 5 V 8.2.4 12-V to -5-V Inverting Converter CCUK L1 22 PH VIN L2 22 PH 2.2 PF VOUT - 5V 12V 5 CIN VIN 4 22 PF SHDN LM2611A 1 RFB1 CFF SW 29.4k 1000 pF NFB 3 D COUT 22 PF GND RFB2 2 10k CIN: TAIYO YUDEN X5R JMK325BJ226MM CCUK: TAIYO YUDEN X5R EMK316BJ225ML COUT: TAIYO YUDEN X5R JMK325BJ226MM D: ON SEMICONDUCTOR MBR0520 L1: SUMIDA CR32-220 L2: SUMIDA CR32-220 The maximum output current vs output voltage (adjust RFB2 to set a different output voltage) when the input voltage is 12 V. Figure 29. 12-V to -5-V Inverting Converter Schematic 8.2.4.1 Design Requirements This design converts 12 V (VIN) to -5 V (VOUT). Adjust RFB2 to set a different output voltage. 16 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 Typical Application (continued) 8.2.4.2 Application Curve MAXIMUM OUTPUT CURRENT (mA) 700 600 500 400 300 200 100 0 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 OUTPUT VOLTAGE (-V) Figure 30. Maximum Output Current vs Output Voltage, 12 V to -5 V 8.2.5 LM2611 Operating With Separate Power and Biasing Supplies CCUK 2.2PF L1A 22PH VOUT-5V 375mA L1B 22PH VIN 12V CIN 22PF CBYP 0.1PF 1 5 VDD 5V SW VIN 4 SHDN LM2611A NFB RFB1 29.4k CFF 1000pF 3 D COUT 22PF GND 2 RFB2 10k CIN: VISHAY/SPRAGUE 595D226X0020C2T CCUK: TAIYO YUDEN X5R EMK316BJ225ML COUT: TAIYO YUDEN X5R JMK325BJ226MM D: ON SEMICONDUCTOR MBR0520 L1: SUMIDA CR32-220 Figure 31. LM2611 Operating With Separate Power and Biasing Supplies Schematic 8.2.5.1 Design Requirements Follow the design requirements in Cuk Converter With Integrated Switch. 8.2.5.2 Detailed Design Procedure 8.2.5.2.1 Split Supply Operation The LM2611 may be operated with separate power and bias supplies. In the circuit shown in Figure 31, VIN is the power supply that the regulated voltage is derived from, and VDD is a low current supply used to bias the LM2611. Equation 12 and Equation 13 show the conditions for the supplies are: 2.7 V VDD 14 V 0 V VIN (36 - IVOUTI) V (12) (13) Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 17 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com Typical Application (continued) As the input voltage increases, the maximum output current capacbility increases. Using a separate, higher voltage supply for power conversion enables the LM2611 to provide higher output currents than it would with a single supply that is limited in voltage by VIN(MAX). 8.2.6 Shutdown and Soft-Start VSHDN RSS 100k L1A 22uH VIN CCUK 1uF 1 5 CIN 22uF VIN 4 SHDN RFB1 29.4k SW LM2611A NFB GND 2 CSS 0.1uF L1B 22uH CFF 1000pF 3 VOUT D COUT 22uF RFB2 10k Figure 32. LM2611 Soft-Start Circuit 8.2.6.1 Design Requirements Follow the design requirements in Cuk Converter With Integrated Switch. 8.2.6.2 Detailed Design Procedure 8.2.6.2.1 Shutdown and Soft-Start A soft-start circuit is used in switching power supplies to limit the input inrush current upon start-up. Without a soft-start circuit, the inrush current can be several times the steady-state load current, and thus apply unnecessary stress to the input source. The LM2611 does not have soft-start circuitry, but implementing the circuit in Figure 32 lowers the peak inrush current. The SHDN pin is coupled to the output through CSS. The LM2611 is toggled between shutdown and run states while the output slowly decreases to its steady-state value. The energy required to reach steady state is spread over a longer time and the input current spikes decrease (see Figure 33 and Figure 34). 8.2.6.3 Application Curves Figure 33. Start-Up Waveforms With a Soft-Start Circuit 18 Figure 34. Start-Up Waveforms Without a Soft-Start Circuit Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 Typical Application (continued) 8.2.7 High Duty Cycle and Load Current L1 22uH 2.7V d VIN d 14V 5 1 VIN CIN 10uF L2 22uH CCUK 1uF RFB1 29.4k SW 4 CFF1 1000pF D 3 SHDN LM2611A VOUT -5V COUT 22uF NFB GND RFB2 1k 2 RFB3 9k CFF2 1uF CIN: TAIYO YUDEN X5R JMK325BJ106MN CCUK: TAIYO YUDEN X5R TMK316BJ105ML COUT: TAIYO YUDEN X5R JMK325BJ226MM D: ON SEMICONDUCTOR MBR0520 L1, L2: SUMIDA CDRH6D28-220 Figure 35. LM2611 High Current Schematic 8.2.7.1 Design Requirements Follow the design requirements in Cuk Converter With Integrated Switch. 8.2.7.2 Detailed Design Procedure 8.2.7.2.1 High Duty Cycle and Load Current Operation The circuit in Figure 35 is used for high duty cycles (D > 0.5) and high load currents. The duty cycle begins to increase beyond 50% as the input voltage drops below the absolute magnitude of the output voltage. RFB3 and CFF2 are added to the feedback network to introduce a low frequency lag compensation (pole-zero pair) necessary to stabilize the circuit under the combination of high duty cycle and high load currents. 9 Power Supply Recommendations The power supply must never exceed the absolute maximum rating of the device given in Absolute Maximum Ratings. If the regulator is connected to the input supply through long wires or PCB traces, special care is required to achieve good performance. The parasitic inductance and resistance of the input cables can have an adverse effect on the operation of the regulator. The parasitic inductance, in combination with the low ESR ceramic input capacitors, can form an under-damped resonant circuit. This circuit may cause overvoltage transients at the VIN pin, each time the input supply is cycled on and off. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 19 LM2611 SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 www.ti.com 10 Layout 10.1 Layout Guidelines * * * * * * Connection between L1 and SW pin should be kept as short as possible to minimize inductance Connection between CCUK and SW should also be kept short The feedback resistor should be placed close to the NFB pin to minimize the path of the higher impedance feedback node The feedback trace leading from Vout to the output to the feedback resistors should not pass under the switch node between L1 and CCUK and the switch node between CCUK, L2 and D The feedback trace leading from Vout to the output to the feedback resistors should not pass under the inductors L1 and L2 A bypass capacitor CBYP of 0.1 F should be placed close to VIN and GND pin 10.2 Layout Example Figure 36. Example Layout Top Figure 37. Example Layout Bottom 20 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J - JUNE 2001 - REVISED DECEMBER 2015 11 Device and Documentation Support 11.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.4 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM2611 21 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM2611AMF NRND SOT-23 DBV 5 1000 Non-RoHS & Non-Green Call TI Call TI -40 to 125 S40A LM2611AMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 S40A LM2611AMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 S40A LM2611BMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 S40B LM2611BMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 S40B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM2611AMF SOT-23 DBV 5 1000 178.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 LM2611AMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2611AMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2611BMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2611BMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2611AMF SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2611AMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2611AMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM2611BMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2611BMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 0.90 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. 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