Pipeline
A/D
Reference
Ladder
Timing
Circuitry
Error
Correction
Logic
3-State
Outputs
T/H 10-Bit
Digital
Data
CLK
ADS901
LVDD
OEPwrdn
REFBCMREFT
IN
DESCRIPTION
The ADS901 is a high-speed pipelined analog-to-digital
converter that operates from a +3V power supply. This
complete converter includes a wide bandwidth track/hold
and a 10-bit quantizer. The full scale input range is set by
external references.
The ADS901 employs digital error correction techniques to
provide excellent differential linearity for demanding imag-
ing applications. Its low distortion and high SNR give the
extra margin needed for telecommunications, video and test
instrumentation applications. The ADS901 is available in an
SSOP-28 package.
10-Bit, 20MHz, +3V Supply
ANALOG-TO-DIGITAL CONVERTER
APPLICATIONS
BATTERY POWERED EQUIPMENT
CAMCORDERS
DIGITAL CAMERAS
COMPUTER SCANNERS
COMMUNICATIONS
FEATURES
LOW POWER: 48mW at +3V
SUPPLY RANGE: +2.7V to +3.7V
ADJUSTABLE FULL SCALE RANGE WITH
EXTERNAL REFERENCES
NO MISSING CODES
WIDEBAND TRACK/HOLD: 350MHz
POWER DOWN: 15mW
SSOP-28 PACKAGE
TM
ADS901E
ADS901
SBAS054A – MAY 2001
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1997, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ADS901
2SBAS054A
ELECTRICAL CHARACTERISTICS
At TA = +25°C, VS = LVDD = +3V, REFB = 1V, REFT = 2V, Specified Input Range = 1V to 2V, Sampling Rate = 20MHz, unless otherwise specified.
+VS....................................................................................................... +6V
Logic VDD ............................................................................................. +6V
Analog Input............................................................................... +VS +0.3V
Logic Input ................................................................................. +VS +0.3V
Case Temperature ......................................................................... +100°C
Junction Temperature .................................................................... +150°C
Storage Temperature..................................................................... +125°C
ABSOLUTE MAXIMUM RATINGS
ADS901E
PARAMETER CONDITIONS TEMP MIN TYP MAX UNITS
Resolution 10 Bits
Specified Temperature Range Ambient Air –40 +85 °C
ANALOG INPUT
Specified Full Scale Input Range
(1)
1Vp-p V
Common-Mode Voltage (Midscale) 1.5 V
Analog Input Bias Current 1µA
Input Impedance 1.25 || 5 M || pF
DIGITAL INPUT
Logic Family CMOS Compatible
Convert Command (Start Conversion) Start Conversion Rising Edge of Convert Clock
CONVERSION CHARACTERISTICS
Sample Rate Full 10k 20M Samples/s
Data Latency 5 Clk Cyc
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE SPECIFIED
DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE NUMBER RANGE MARKING NUMBER(1) MEDIA
ADS901E SSOP-28 324 –40°C to +85°C ADS901E ADS901E Rail
ADS901E SSOP-28 324 –40°C to +85°C ADS901E ADS901E/1K Tape and Reel
NOTES: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces
of “ADS901E/1K” will get a single 1000-piece Tape and Reel.
PACKAGE/ORDERING INFORMATION
ADS901 3
SBAS054A
ADS901E
PARAMETER CONDITIONS TEMP MIN TYP MAX UNITS
ELECTRICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = LVDD = +3V, REFB = 1V, REFT = 2V, Specified Input Range = 1V to 2V, Sampling Rate = 20MHz, unless otherwise specified.
DYNAMIC CHARACTERISTICS
Differential Linearity Error (Largest Code Error)
f = 500kHz Full ±0.8 LSB
f = 9MHz Full ±0.9 ±1.0 LSB
No Missing Codes Full Guaranteed
Integral Nonlinearity Error, f = 500kHz Full ±3.5 LSB
Spurious Free Dynamic Range(2)
f = 500kHz (–1dBFS(3) input) Full 50 dBFS(3)
f = 9MHz (–1dBFS input) Full 45 49 dBFS
Signal-to-Noise Ratio (SNR) Referred to Sinewave Input Signal
f = 500kHz (–1dBFS input) Full 53 dB
f = 9MHz (–1dBFS input) Full 48 53 dB
Maximum SNR
Referred to DC Full Scale Input Signal
f = 9MHz (–1dBFS input) 62 dB
Signal-to-(Noise + Distortion) (SINAD)
f = 500kHz (–1dBFS input) Full 50 dB
f = 3.58MHz (–1dBFS input) Full 50 dB
f = 9MHz (–1dBFS input) Full 45 49 dB
Effective Number of Bits(4) fIN = 3.58MHz 8.0 Bits
Differential Gain Error NTSC, PAL 2.3 %
Differential Phase Error NTSC, PAL 1.0 degrees
Output Noise Input Grounded 0.2 LSB rms
Aperture Delay Time 3ns
Aperture Jitter 7 ps rms
Analog Input Bandwidth
Small Signal –20dBFS Input 350 MHz
Full Power 0dBFS Input 100 MHz
Overvoltage Recovery Time(5) 2ns
DIGITAL OUTPUTS CL = 15pF
Logic Family CMOS Compatible
Logic Coding Straight Offset Binary
High Output Voltage, VOH +2.4 LVDD V
Low Output Voltage, VOL +0.4 V
3-State Enable Time OE = L 20 40 ns
3-State Disable Time OE = H 18 10 ns
Internal Pull-Down to Gnd 50 k
Power-Down Enable Time Pwrdn = L 133 ns
Power-Down Disable Time Pwrdn = H 18 ns
Internal Pull-Down to Gnd 50 k
ACCURACY fS = 2.5MHz
Gain Error Full 2.5 %FS
Input Offset(6) Full 0.4 %FS
Power Supply Rejection (Gain) VS = +10% Full 56 dB
Power Supply Rejection (Offset) Full 68 dB
External REFT Voltage Range Full REFB +0.5 2 VS–0.8 V
External REFB Voltage Range Full 0.8 1 REFT –0.5 V
Reference Input Resistance 4k
POWER SUPPLY REQUIREMENTS
Supply Voltage: +VSOperating Full +2.7 +3.0 +3.7 V
Supply Current: +ISOperating Full 16 mA
Power Dissipation Operating Full 49 60 mW
Power Dissipation (Power Down) Operating Full 15 mW
Thermal Resistance,
θ
JA
28-Lead SSOP 89 °C/W
NOTES: (1) The single-ended input range is set by REFB and REFT values. (2) Spurious Free Dynamic Range refers to the magnitude of the largest harmonic.
(3) dBFS is dB relative to full scale. (4) Based on (SINAD - 1.76)/6.02. (5) No “Rollover” of bits. (6) Offset Deviation from Ideal Negative Full Scale.
ADS901
4SBAS054A
5 Clock Cycles
Data Invalid
t
D
t
L
t
H
t
CONV
N5N4N3N2N1 N N+1 N+2
Data Out
Clock
Analog In N
t
2
N+1 N+2 N+3 N+4 N+5 N+6 N+7
t
1
TOP VIEW SSOP
PIN CONFIGURATION
PIN DESIGNATOR DESCRIPTION
1+V
SAnalog Supply
2LV
DD Output Logic Driver Supply Voltage
3 Bit 10 Data Bit 10 (D0) (LSB)
4 Bit 9 Data Bit 9 (D1)
5 Bit 8 Data Bit 8 (D2)
6 Bit 7 Data Bit 7 (D3)
7 Bit 6 Data Bit 6 (D4)
8 Bit 5 Data Bit 5 (D5)
9 Bit 4 Data Bit 4 (D6)
10 Bit 3 Data Bit 3 (D7)
11 Bit 2 Data Bit 2 (D8)
12 Bit 1 Data Bit 1 (D9) (MSB)
13 GND Analog Ground
14 GND Analog Ground
15 CLK Convert Clock Input
16 OE Output Enable, Active Low
17 Pwrdn Power Down Pin
18 +VSAnalog Supply
19 GND Analog Ground
20 GND Analog Ground
21 LpBy Positive Ladder Bypass
22 REFT Top Reference Input
23 NC No Connection
24 REFB Bottom Reference Input
25 LnBy Negative Ladder Bypass
26 CM Common-Mode Voltage Output
27 IN Analog Input
28 +VSAnalog Supply
PIN DESCRIPTIONS
TIMING DIAGRAM
SYMBOL DESCRIPTION MIN TYP MAX UNITS
tCONV Convert Clock Period 50 100µsns
tLClock Pulse Low 24 25 ns
tHClock Pulse High 24 25 ns
tDAperture Delay 3 ns
t1Data Hold Time, CL = 0pF 3.9 ns
t2New Data Delay Time, CL = 15pF max 12 ns
+V
S
LV
DD
(LSB) Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
(MSB) Bit 1
GND
GND
+V
S
IN
CM
LnBy
REFB
NC
REFT
LpBy
GND
GND
+V
S
Pwrdn
OE
CLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
ADS901
ADS901 5
SBAS054A
SPECTRAL PERFORMANCE
Frequency (MHz)
0
20
40
60
80
100 0246810
Amplitude (dB)
f
IN
= 9MHz
SPECTRAL PERFORMANCE
Frequency (MHz)
0
20
40
60
80
100 0246810
Amplitude (dB)
f
IN
= 500kHz
DIFFERENTIAL LINEARITY ERROR
Output Code
2
1
0
1
20 256 512 768 1024
DLE (LSB)
f
IN
= 500kHz
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = Logic VDD = +3V, REFB = 1V, REFT = 2V, Specified Input Range = 1V to 2V, Sampling Rate = 20MHz, unless otherwise specified.
SPECTRAL PERFORMANCE
Frequency (MHz)
0
20
40
60
80
100 0246810
Amplitude (dB)
f
IN
= 3.58MHz
TWO-TONE INTERMODULATION
Frequency (MHz)
0
20
40
60
80
100 0 2.5 5 7.5 10
Amplitude (dB)
f1 = 4.5MHz
f2 = 5.0MHz
DIFFERENTIAL LINEARITY ERROR
Output Code
2
1
0
1
2
DLE (LSB)
f
IN
= 9MHz
0 256 512 768 1024
ADS901
6SBAS054A
UNDERSAMPLING
Frequency (MHz)
0
20
40
60
80
100
120 0 16.2 32.4 48.6 64.8 81.0
Amplitude (dB)
f
IN
= 20MHz
f
S
= 16MHz
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = Logic VDD = +3V, REFB = 1V, REFT = 2V, Specified Input Range = 1V to 2V, Sampling Rate = 20MHz, unless otherwise specified.
INTEGRAL LINEARITY ERROR
Output Code
10
5
0
5
10
ILE (LSB)
fIN = 500kHz
0 256 512 768 1024
DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE
Temperature (°C)
0.9
0.8
0.7
0.650 0 2525 50 75 100
DLE (LSB)
fIN = 9MHz
fIN = 500kHz
SWEPT POWER SFDR
Input Amplitude (dBFS)
100
80
60
40
20
060 4050 30 20 10 0
SFDR (dBc, dBFS)
dBFS
dBc
SPURIOUS FREE DYNAMIC RANGE (SFDR)
vs TEMPERATURE
Temperature (°C)
56
54
52
50
4850 0 2525 50 75 100
SFDR (dBFS)
fIN = 500kHz
fIN = 9MHz
DYNAMIC PERFORMANCE vs INPUT FREQUENCY
Frequency (MHz)
54
53
52
51
500.1 1 10
SFDR (dBFS), SNR (dB)
SNR
SFDR
ADS901 7
SBAS054A
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS, Logic VDD = +3V, REFB = 1V, REFT = 2V, Specified Input Range = 1V to 2V, Sampling Rate = 20MHz, unless otherwise specified.
POWER DISSIPATION vs TEMPERATURE
Temperature (°C)
50
49
48
47
46
4550 0 2525 50 75 100
Power Dissipation (mW)
OFFSET ERROR vs TEMPERATURE
Temperature (°C)
50 0 2525 50 75 100
Offset Error (% FS)
0.6
0.5
0.4
0.3
OUTPUT NOISE HISTOGRAM (DC Input)
Output Code
8
6
4
2
0N-2 N-1 N+1N N+2
Counts (x105)
SIGNAL-TO-NOISE RATIO vs TEMPERATURE
Temperature (°C)
55
54
53
5250 0 2525 50 75 100
SNR (dB)
f
IN
= 9MHz
f
IN
= 500kHz
GAIN ERROR vs TEMPERATURE
Temperature (°C)
2.8
2.7
2.6
2.5
2.450 0 2525 50 75 100
Gain Error (%FS)
POWER DISSIPATION vs SAMPLING FREQUENCY
Frequency (MHz)
55
50
45
40
35 1 10 100
Power Dissipation (mW)
ADS901
8SBAS054A
402
A1
V
IN
402
R
1
1k
V
CM
C
1
0.1µF
0.1µF
IN
CM
+5V R
1
50
5V
+3V
ADS901
THEORY OF OPERATION
The ADS901 is a high speed sampling analog-to-digital
converter that utilizes a pipeline architecture. The fully
differential topology and digital error correction guarantee
10-bit resolution. The differential track/hold circuit is shown
in Figure 1. The switches are controlled by an internal clock
which has a non-overlapping two phase signal, φ1 and φ2. At
the sampling time the input signal is sampled on the bottom
plates of the input capacitors. In the next clock phase, φ1, the
bottom plates of the input capacitors are connected together
and the feedback capacitors are switched to the op amp
output. At this time the charge redistributes between CI and
CH, completing one track/hold cycle. The differential output
is a held DC representation of the analog input at the sample
time. The track/hold circuit can also convert a single-ended
input signal into a fully differential signal for the quantizer.
Consequently, the input signal-to-noise performance. Other
parameters such as small-signal and full-power bandwidth,
and wideband noise are also defined in this stage.
To accommodate a bipolar signal swing, the ADS901 oper-
ates with a common-mode voltage (VCM) which is derived
from the external references. Due to the symmetric resistor
ladder inside the ADS901, the VCM is situated between the
top and bottom reference voltage. Equation (1) can be used
for calculating the common-mode voltage level.
VCM = (REFT +REFB)/2 (1)
There is a 5.0 clock cycle data latency from the start convert
signal to the valid output data. The standard output coding
is Straight Offset Binary where a full scale input signal
corresponds to all “1’s” at the output. The digital outputs of
the ADS901 can be set to a high impedance state by driving
the three-state (pin 16) with a logic “HI”. Normal operation
is achieved with pin 16 “LO” or Floating due to internal
pull-down resistors. This function is provided for testability
purposes but is not recommended to be used dynamically.
APPLICATIONS
SIGNAL SWING AND COMMON-MODE
CONSIDERATIONS
The ADS901 is designed to operate on a +3V single supply
voltage. The nominal input signal swing is 1Vp-p, situated
between +1V and +2V. This means that the signal swings
±0.5V around a common-mode voltage of +1.5V, which is
half the supply voltage (VCM = VS/2). In some applications
it might be advantageous to increase the input signal swing.
This will improve the achievable signal-to-noise perfor-
mance. However, considerations should be made to keep the
signal swing within the linear range of operation of the
driving circuitry to avoid any excessive distortion. In ex-
treme situations the performance of the converter will start
to degrade due to variations of the input’s switch on-
resistance over the input voltage. Therefore, the signal swing
should remain approximately 0.5V away from each rail
during normal operation.
DRIVING THE ANALOG INPUTS
AC-COUPLED DRIVER
Figure 2 shows an example of an ac-coupled, single-ended
interface circuit using a high-speed op amp that operates on
φ
1
φ
1
φ
2
φ
1
φ
1
φ
1
φ
1
φ
1
φ
2
φ
1
φ
2
φ
1
φ
2
IN
IN
OUT
OUT
Op Amp
Bias V
CM
Op Amp
Bias V
CM
C
H
C
I
C
I
C
H
Input Clock (50%)
Internal Non-overlapping Clock
FIGURE 1. Input Track/Hold Configuration with Timing
Signals.
The pipelined quantizer architecture has 9 stages with each
stage containing a two-bit quantizer and a two bit digital-
to-analog converter, as shown in Figure 2. Each two-bit
quantizer stage converts on the edge of the sub-clock, which
is the same frequency of the externally applied clock. The
output of each quantizer is fed into its own delay line to
time-align it with the data created from the following quan-
tizer stages. This aligned data is fed into a digital error
correction circuit which can adjust the output data based on
the information found on the redundant bits. This technique
provides the ADS901 with excellent differential linearity
and guarantees no missing codes at the 10-bit level. FIGURE 2. AC-Coupled, Single-Ended Interface Circuit.
ADS901 9
SBAS054A
R
1
1k
OPA680
V
IN
R
F
402
V
CM
C
1
0.1µF
0.1µF
IN
CM
+5V
R
S
50
+3V
R
G
402
C
G
0.1µF
402
22pF ADS901
FIGURE 4. DC-Coupled Interface Circuit for +3V Single-Supply Operation.
dual supplies (OPA650, OPA658). The mid-point reference
voltage, VCM, biases the bipolar, ground-referenced input
signal. The capacitor C1 and resistor R1 form a high-pass
filter with the –3dB frequency set at
f–3dB = 1/(2 π R1 C1) (2)
The values for C1 and R1 are not critical in most applications
and can be set freely. The values shown correspond to a
frequency of 1.6kHz.
Figure 3 depicts a circuit that can be used in single-supply
applications. The mid-reference voltage biases the op amp
up to the appropriate common-mode voltage, for example
VCM = +1.5V. With the use of capacitor CG the DC gain for
the non-inverting op amp input is set to +1V/V. As a result
the transfer function is modified to
VOUT = VIN {(1 + RF/RG) + VCM} (3)
Again, the input coupling capacitor C1 and resistor R1 form
a high-pass filter. At the same time the input impedance is
defined by R1. Resistor RS isolates the op amp’s output from
the capacitive load to avoid gain peaking or even oscillation.
It can also be used to establish a defined bandwidth to reduce
the wideband noise. The recommended value is usually
between 10 and 100.
DC-COUPLED INTERFACE CIRCUIT
Many systems are now requiring +3V single supply capabil-
ity of both the A/D converter and its driver. Figure 4 shows
an example for DC-coupled configuration operating solely
on a +3V supply voltage. The OPA632 provides excellent
performance in this demanding application. Its wide input
and output voltage ranges, an low distortion, supports the
ADS901 well. The OPA632 is configured for a gain of +2.
The 374 and 2.26k resistors at the input level-shift VIN
so that VOUT is within the allowed output voltage range
when VIN = 0. The input impedance of the driver circuit is
set to match to a 50 source impedance. The input level-
shifting was designed that VIN can be between 0V and 5V,
while delivering an output voltage of 1V to 2V into the
ADS901. Both the OPA632 and ADS901 have a power-
down function pin with the same polarity for those systems
the need to conserve power.
EXTERNAL REFERENCE
The ADS901 requires external references on pin 22 (REFT)
and 24 (REFB). Internally those pins are connected through a
resistor ladder, which has a nominal resistance of 4k
(±15%). In order to establish a correct voltage drop across the
ladder the external reference circuit must be able to typically
supply 250µA of current. With this current the full-scale input
range of the ADS901 is set between +1V and +2V, or 1Vp-p.
In general, the voltage drop across REFT and REFB deter-
mines the input full-scale range (FSR) of the ADS901. Equa-
tion (4) can be used to calculate the span.
FSR = REFT - REFB (4)
Depending on the application, several options are possible to
supply the external reference voltages to the ADS901 without
degrading the typical performance.
FIGURE 3. Interface Circuit. Example using the voltage feedback amplifier OPA680.
OPA632
V
IN
750562
2.26k
374
22pF
+3V
100Pwrdn
DIS
Disable +3V
ADS901
10-Bit
20Msps
57.6
ADS901
10 SBAS054A
1k
1kLpBy
+2V
+1V
REFT
REFB
LnBy
+VS
IN
CM
RT
4k
1k
RB
4k
1k
0.1µF
0.1µF
0.1µF
0.1µF
0.1µF
+3V
VIN
ADS901
0.1µF
1k
0.1µF10µF
LOW-COST REFERENCE SOLUTION
The easiest way to achieve the required reference voltages is
to place the reference ladder of the ADS901 between the
supply rails, as shown in Figure 5. Two additional resistors
(RT, RB) are necessary to set the correct current through the
ladder. However depending on the desired full-scale swing
and supply voltage different resistor values might be se-
lected.
The trade-offs, when selecting this reference circuit, are
variations in the reference voltages due to component toler-
ances and power supply variations. In any case, it is recom-
mended to bypass the reference ladder with at least 0.1µF
ceramic capacitors, as shown in Figure 5. The capacitors
serve a dual purpose. They will bypass most of the high
frequency transient noise which results from feedthrough of
the clock and switching noise from the T/H stages. Sec-
ondly, they serve as a charge reservoir to supply instanta-
neous current to internal nodes.
FIGURE 5. Low Cost Solution to Supply External Reference Voltages and Recommended Reference Bypassing.
PRECISE REFERENCE SOLUTION
For those applications requiring a higher level of dc accu-
racy and drift, a reference circuit with a precision reference
element might be used (see Figure 6). A stable +1.2V
reference voltage is established by a two terminal bandgap
reference diode, the REF1004-1.2. Using a general-purpose
single-supply dual operational amplifier (A1), like an
OPA2237, OPA2234 or OPA2343, the two required refer-
ence voltages for the ADS901 can be generated by setting
each op amp to the appropriate gain; for example: set REFT
to +2V and REFB to +1V.
CLOCK INPUT
The clock input of the ADS901 is designed to accommodate
either +5V or +3V CMOS logic levels. To drive the clock
input with a minimum amount of duty cycle variation and
support maximum sampling rates (20Msps), high speed or
advanced CMOS logic should be used (HC/HCT, AC/ACT).
When digitizing at high sampling rates, a 50% duty cycle
clock with fast rise and fall times (2ns or less) are recom-
mended to meet the rated performance specifications. How-
ever, the ADS901 performance is tolerant to duty cycle
variations of as much as ±10% without degradation. For
applications operating with input frequencies up to Nyquist
or undersampling applications, special consideration must
be made to provide a clock with very low jitter. Clock jitter
leads to aperture jitter (tA) which can be the ultimate limita-
tion to achieving good SNR performance. Equation (5)
shows the relationship between aperture jitter, input fre-
quency and the signal-to-noise ratio:
SNR = 20log10 [1/(2 π fIN tA)] (5)
For example, with a 10MHz full-scale input signal and an
aperture jitter of tA = 20ps, the SNR is clock jitter limited to
58dB.
+FS (IN = +2V) 1111111111
+FS 1LSB 1111111111
+FS 2LSB 1111111110
+3/4 Full Scale 1110000000
+1/2 Full Scale 1100000000
+1/4 Full Scale 1010000000
+1LSB 1000000001
Bipolar Zero (IN +1.5V) 1000000000
1LSB 0111111111
1/4 Full Scale 0110000000
1/2 Full Scale 0100000000
3/4 Full Scale 0010000000
FS +1LSB 0000000001
FS (IN = +1V) 0000000000
STRAIGHT OFFSET BINARY
(SOB)
PIN 12
SINGLE-ENDED INPUT FLOATING or LO
TABLE I. Coding Table for the ADS901.
ADS901 11
SBAS054A
DIGITAL OUTPUTS
There is a 5.0 clock cycle data latency from the start convert
signal to the valid output data. The standard output coding
is Straight Offset Binary where a full scale input signal
corresponds to all “1’s” at the output. The digital outputs of
the ADS901 can be set to a high impedance state by driving
the three-state (pin 16) with a logic “HI”. Normal operation
is achieved with pin 16 “LO” or Floating due to internal
pull-down resistors. This function is provided for testability
purposes but is not recommended to be used dynamically.
The digital outputs of the ADS901 are standard CMOS
stages and designed to be compatible to both high speed
TTL and CMOS logic families. The logic thresholds are for
low-voltage CMOS: VOL = 0.4V, VOH = 2.4V, which allows
the ADS901 to directly interface to 3V-logic. The digital
outputs of the ADS901 use a dedicated digital supply pin
(pin 2, LVDD). By adjusting the voltage on LVDD, the digital
output levels will vary respectively. In any case, it is recom-
mended to limit the fan-out to one, to keep the capacitive
loading on the data lines below the specified 15pF. If
necessary, external buffers or latches may be used to provide
the added benefit of isolating the A/D converter from any
digital activities on the bus coupling back high frequency
noise and degrading the performance.
POWER-DOWN MODE
The ADS901’s low power consumption can be further
reduced by initiating a power down mode. For this, the
Pwrdn-Pin (Pin 17) must be tied to a logic “High” reducing
the current drawn from the supply by approximately 70%. In
normal operation the power-down mode is disabled by an
internal pull-down resistor (50k).
FIGURE 6. Precise Solution to Supply External Reference
Voltages.
+V
S
+LV
DD
ADS901 Digital
Output
Stage
FIGURE 7. Independent Supply Connection for Output
Stage.
During power-down the digital outputs are set in 3-state.
With the clock applied, the converter does not accurately
process the sampled signal. After removing the power-down
condition the output data from the following 5 clock cycles
is invalid (data latency).
DECOUPLING AND GROUNDING
CONSIDERATIONS
The ADS901 converter have several supply pins, one of
which is dedicated to supply only the output driver. The
remaining supply pins are not, as is often the case, divided
into analog and digital supply pins since they are internally
connected on the chip. For this reason it is recommended to
treat the converter as an analog component and to power it
from the analog supply only. Digital supply lines often carry
high levels of noise which can couple back into the converter
and limit the achievable performance.
Because of the pipeline architecture, the converter also
generates high frequency transients and noise that are fed
back into the supply and reference lines. This requires that
the supply and reference pins be sufficiently bypassed.
Figure 8 shows the recommended decoupling scheme for the
analog supplies. In most cases 0.1µF ceramic chip capacitors
are adequate to keep the impedance low over a wide fre-
quency range. Their effectiveness largely depends on the
proximity to the individual supply pin. Therefore they should
be located as close to the supply pins as possible.
FIGURE 8. Recommended Bypassing for Analog Supply
Pins.
+V
S
113 14
GND
ADS901
0.1µF
+V
S
18 19 20
GND
0.1µF
+V
S
28
0.1µF
1/2 A
1
R
F1
R
G1
3k
5k
REF1004
+1.2V
10k
10Top
Reference
(REFT)
+V
S
+V
S
1/2 A
1
R
F2
R
G2
10Bottom
Reference
(REFB)
A
1
= OPA2237 or Equivalent.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
ADS901E ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS901EG4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 26-Aug-2009
Addendum-Page 1
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