
MICROCIRCUIT DATA SHEET
MNLMH6722-X REV 1A0
(Absolute Maximum Ratings)
(Note 1)
Supply voltage (Vs) +6.75Vdc
Common mode input voltage (Vcm) V- to V+
Differential input voltage (Vid) 2.2V
Maximum Power dissipation (Pd)
(Note 2) 1W
Lead temperature (soldering, 10 seconds) +300 C
Junction temperature (Tj) +175 C
Storage temperature range -65 C < Ta < +150 C
Thermal Resistance
(ThetaJA) Junction -to-ambient 130 C/WCERAMIC DIP (Still Air) 83 C/W (500LF/Min Air Flow) 165 C/WCERAMIC SOIC (Still Air) 110 C/W (500LF/Min Air Flow)
(ThetaJC) Junction-to-case 24 C/WCERAMIC DIP 26 C/WCERAMIC SOIC
Package Weight
(typical) 2190 mgCERAMIC DIP 410 mgCERAMIC SOIC
ESD Tolerance
(Note 3) 4000V
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur.
Operating Ratings are conditions for which the device is functional, but do not
guarantee specific performance limits. For guaranteed specifications apply only for
the test conditions listed. Some performance characteristics may degrade when the
device is not operated under the listed test conditions.
Note 2: The maximum power dissipation must be derated at elevated temperatures and is
dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to
ambient thermal resistance), and TA (ambient temperature). The maximum allowable
power dissipation at any temperature is Pdmax = (Tjmax - TA) / ThetaJA or the number
given in the Absolute Maximum Ratings, whichever is lower.
Note 3: Human body model, 100pF discharged through 1.5K Ohms.
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