© 2009 Microchip Technology Inc. DS22186B-page 1
MCP2036
Features:
Complete Inductance Measurement System:
- Low-Impedance Current Driver
- Sensor/Reference Coil Multiplexer
- High-Frequency Detector
Operating Voltage: 2.7 to 5.5V
Low-Power Standby Mode
Gain and Frequency set by external passive
components
Typi cal Applications:
Harsh environment inductive keyboards
Inductive rotational sensor interface
Inductive displacement sensor interface
Inductive force sensor interface
Description:
The MCP2036 Inductive Sensor Analog Front End
(AFE) combines all the necessary analog functions for
a complete inductance measurement system.
The device includes:
High-frequency, current-mode coil driver for
exciting the sensor coil.
Synchronous detector for converting AC sense
voltages into DC levels.
Output amplifier/filter to improve resolution and
limit noise.
Virtual ground reference generator for single
supply operation.
The device is available in 14-pin PDIP, SOIC and
16-pin QFN packages:
Package Types
1
2
3
6
7
4
5
14
13
8
9
10
11
12
VREF
LREF
LBTN
VDD
DRVOUT
DRVIN
CLK
VDET+
VDET-
VDETOUT
VSS
CS
REFSEL
Reserved
9
10
11
12
6
7
5
8
1
2
3
4
LREF
LBTN
VDD
DRVOUT
16
15
14
13
DRVIN
CLK
REFSEL
CS
VDET-
VDETOUT
VSS
Reserved
VDET+
VREF
NC
NC
MCP2036 16-pin QFN
MCP2036 14-pin PDIP, SOIC
Inductive Sensor Analog Front End Device
MCP2036
DS22186B-page 2 © 2009 Microchip Technology Inc.
1.0 FUNCTIONAL DESCRIPTION
The MCP2036 measures a sensor coil’s impedance by
exciting the coil with a pulsed DC current and
measuring the amplitude of the resulting AC voltage
waveform. The drive current is generated by the
on-chip current amplifier/driver which takes the
high-frequency triangular waveform present on the
DRVIN input, and amplifies it into the pulsed DC current
for exciting the series combination of the sensor coils.
The AC voltages generated across the coils, are then
capacitively coupled into the LBTN and LREF inputs.
An input resistance of 2K between the inputs and the
virtual ground offsets the AC input voltages up to the
signal ground generated by the reference voltage
generator, as shown in Figure 1-1.
FIGURE 1-1: MCP2036 Block Diagram
Voltage
Reference
REFSEL
VDETOUT
DRVIN
CLK
DRVOUT
LBTN
LREF
VREF
VDD
VSS
0
1
Input MUX
CS
Key Inductor Driver
Mixer
VDET+
VDET-
+
-
10K
10K
Op. Amp. Block
© 2009 Microchip Technology Inc. DS22186B-page 3
MCP2036
FIGURE 1-2: MCP2036 Typical Application
The coil voltages are then multiplexed into the
Synchronous Detector section by the LBTN/LREF
multiplexer. This allows the microcontroller to select
which signal is sampled by the detector. The detector
converts the coil voltages into a DC level using a
frequency mixer, amplifier, and filter.
The mixer is composed of two switches driven by the
clock present on the CLK signal input. The switches
toggle the amplifier/filter between an inverting and
non-inverting topology, at a rate equal to the clock input
frequency. This inverts and amplifies the negative side
of the signal, while amplifying the positive side. The
result is a pulsed DC signal with a peak voltage,
proportional to the amplitude of the AC coil voltage.
The gain of the detector is set by two pairs of resistors;
one pair are the internal fixed series resistors between
the frequency mixer and the amplifier. The second
resistor pair are the two external gain set resistors
(RGAIN). The two capacitors (CFILTER) in parallel with
the external gain setting resistors form a low pass filter
which converts the pulsed DC output signal into a
smooth DC voltage which is proportional to the AC
sensor voltage input. The output of the system is
present on the VDETOUT pin, which drives the
microcontroller’s ADC input for conversion into a digital
value.
The virtual ground reference for the detector/amplifier
is generated by a second internal op amp which
produces a virtual ground equal to ½ the supply
voltage. The virtual ground is available externally at the
VREF output and used internally throughout the
detector circuit, allowing single supply operation. A
small external capacitance is required to stabilize this
output and limit noise.
MCP2036
LREF
LBTN
LREF
DRVOUT
10Ω
10nF
REFSEL
10nF
I/O
I/O
I/O
0
1
2
3
0
1
3
2
CD4052
Key Coils
PIC® Microcontroller
CS
I/O
VDET-
VDETOUT
VDET+
VREF
CLK
DRVIN
PWM
ADC
CFILTER
CFILTER
RGAIN
RGAIN
CRGND
RIN
CIN
RADC
CADC
MCP2036
DS22186B-page 4 © 2009 Microchip Technology Inc.
1.1 Coil Driver
The coil driver produces the excitation current for the
sensor coils.
The coil driver input is derived from the digital clock
supplied to the CLK input. The digital signal is first
filtered through a low-pass filter, composed of RIN and
CIN, and passed to the DRVIN input. The driver will
create a triangular current in phase and proportional
with the input voltage. Because the digital drive into the
RIN-CIN filter has a 50% duty cycle, the voltage on the
DRVIN input will be centered at VDD/2. The relationship
between voltage, current, inductance and frequency is
shown in Equation 1-1.
EQUATION 1-1:
1.2 Synchronous Detec tor and Output
Amplifier
The Synchronous Detector has two inputs, LREF and
LBTN, selectable by REFSEL. This routes either signal
into the frequency mixer of the detector. The frequency
mixer then converts the AC waveform into a pulsed DC
signal which is amplified and filtered.
The gain of the amplifier is user-settable, using an
external resistor, RGAIN (see Equation 1-2).
EQUATION 1-2:
An ADC plus firmware algorithm then digitizes the
detector output voltage and uses the resulting data to
detect a key press event.
1.3 Virtual Ground Voltage Reference
Circuit
To create both an inverting and non-inverting amplifier
topology, a pseudo split supply design is required. To
generate the dual supplies required, a rail splitter is
included, which generates the virtual ground by creat-
ing a voltage output at VDD/2. The output is used by the
external passive network of the Detector/Amplifier sec-
tion as a reference on the non-inverting input. A bypass
capacitor of 0.1uF is required to ensure the stability of
the output. For reference accuracy, no more than 3mA
should be supplied to, or drawn from the reference
output pin.
ΔVOUT ΔIDRV LCOIL
2FDRV
()=
VOUT Pulse d Output Voltage=
ΔIDRV AC Drive Current Amp litude=
FDRV AC Drive Current Frequenc y=
LCOIL Inductance of t he Sensor Coil=
Note: These equations assume a 50% duty cycle.
Note: The output amplifier/filter uses a
differential connection, so its output is
centered to VREF (VDD/2). The amplitude
of the detected signal should be calculated
as the difference between voltages at the
output of the detector and the reference
voltage.
Gain RGAIN 10kOhm
© 2009 Microchip Technology Inc. DS22186B-page 5
MCP2036
2.0 PIN DESCRIPTION
Descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
2.1 Chip Select (CS)
The circuit is fully enabled when a logic-low is applied
to the CS input. The circuit enters in Low-Power mode
when a logic-high is applied to this input. During
Low-Power mode, the detector output voltage falls to
VREF and the supply current is reduced to 0.5 μA (typ.).
This pin has an internal pull-up resistor to ensure
proper selection of the circuit.
2.2 Voltage Reference (VREF)
VREF is a mid-scale reference output. It can source and
sink small currents and has low output impedance. A
load capacitor between 100nF and 1μF needs to be
located close to this pin.
2.3 Power Supply (VDD, VSS)
The VDD pin is the power supply pin for the analog and
digital circuitry within the MCP2036. This pin requires
an appropriate bypass capacitor of 100nF. The voltage
on this pin should be maintained in the 2.7V-5.5V range
for specified operation.
The VSS pin is the ground pin and the current return
path for both analog and digital circuitry of the
MCP2036. If an analog ground plane is available, it is
recommended that this device be tied to the analog
ground plane of the PCB.
2.4 Inductor Inputs (LREF, LBTN)
These pins are inputs for the external coils (reference
and sensor). The inputs should be AC coupled to the
coils by a 10nF ceramic capacitor.
2.5 Input Selection (REFSEL)
Digital input that is used to select between coil inputs
(reference and sensor).
2.6 Clock (CLK)
The external clock input is used for synchronous
detection of the AC waveforms on the coils. The clock
signal is also used to generate a triangular waveform
applied to coil driver input.
2.7 Inductor Driver Input (DRVIN)
The analog input to the coil driver. The triangular
waveform applied to this input should be in phase with
the clock signal for best performance.
2.8 Inductor Driver Output (DRVOUT)
Driver output used to excite the sensor coils. It is a
current-mode output designed to drive small inductive
loads.
Pad Name Pin Number I/O Type Description
14 Pins 16 Pins
VREF 1 16 OUT AN Voltage Reference
LREF 2 1 IN AN Reference Inductor Input
LBTN 3 2 IN AN Active Inductor Input
VDD 4 3 PWR AN Power Supply
DRVOUT 5 4 OUT AN Current Driver Output for Inductors
DRVIN 6 5 IN AN Current Driver Input
CLK 7 6 IN CMOS Clock Signal
REFSEL 8 7 IN CMOS Detector Select Input
CS 9 8 IN CMOS Chip Select, Active low
Reserved 10 9 Must be tied to GND for proper
operation.
VSS 11 10 PWR AN Power Supply Return
VDETOUT 12 11 OUT AN Detector Output Voltage
VDET- 13 12 IN AN Negative Input for Output Detector
VDET+ 14 13 IN AN Positive Input for Output Detector
NC 14 No connect
NC 15 No connect
MCP2036
DS22186B-page 6 © 2009 Microchip Technology Inc.
2.9 Detector Output Voltage (VDETOUT)
The amplifier/filter output from the detector. This is a
low-impedance analog output pin (VOUT) for driving the
microcontroller ADC. The detector output is rail-to-rail.
2.10 Inputs for Output Detect or (VDET+,
VDET-)
The non-inverting and inverting inputs for the
amplifier/filter op amp. The two inputs are connected to
the output of the mixer circuit through two internal
10KΩ resistors.
© 2009 Microchip Technology Inc. DS22186B-page 7
MCP2036
3.0 APPLICATIONS
The MCP2036 is an Analog Front End device that uses
the electromagnetic interaction between a conductive
target and a sensing coil to detect the pressure applied
by the user on the surface of a touch panel. The device
incorporates all analog blocks for a simple inductor
impedance measurement circuit.
For an inductive touch system, two methods are used
for switching the driver and measurement circuitry
between the different sensor coils: analog multiplexers
and GPIO grounding (see Figure 3-1 and Figure 3-2).
The MCP2036 is designed to work with both
configurations:
FIGURE 3-1: Using Analog-Multiplexer for Key Selection (Example)
MCP2036
LREF
LBTN
LREF
DRVOUT
10Ω
10nF
REFSEL
10nF
I/O
I/O
I/O
0
1
2
3
0
1
3
2
CD4052
Key Coils
PIC® Microcontroller
LREF
MCP2036
LBTN
LREF
DRVOUT
REFSEL
I/O
I/O
10Ω
10nF
I/O
I/O
10nF
4K7
4K7
PIC® Microcontroller
I/O
4K7
4K7
Key Coils
MCP2036
DS22186B-page 8 © 2009 Microchip Technology Inc.
FIGURE 3-2: Using GPIO for Key Selection (Example)
3.1 Application example
Figure 3-3 shows an example for a 4-key Inductive
Touch keyboard with key controlled by the IO pins of
the PIC® MCU.
FIGURE 3-3: MCP2036 Typical Application
The PIC® microcontroller is used to generate a square
wave signal and to do all the necessary operations for
proper detection of the key press event.
Then, RIN-CIN filter converts the square wave output of
the PWM into a quasi-triangular waveform.
To calculate the amplitude of the triangular signal, the
standard charging time equation for an RC network will
be used, as shown in Equation 3-1:
EQUATION 3-1:
For the first half of the square wave, the capacitor CIN
is charged through RIN, for the second half, it is
discharged through RIN, and assuming that clock
signal has a 50% duty cycle factor, we can consider:
EQUATION 3-2:
MCP2036
LREF
LBTN
LREF
DRVOUT
10Ω
10nF
REFSEL
10nF
I/O
I/O
I/O
0
1
2
3
0
1
3
2
CD4052
Key Coils
PIC® Microcontroller
CS
I/O
VDET-
VDETOUT
VDET+
VREF
CLK
DRVIN
PWM
ADC
CFILTER
CFILTER
RGAIN
RGAIN
CRGND
RIN
CIN
RADC
CADC
Vt() Vstep 1tRC()exp[]=
Vstart VDD 2-ΔV=
Vstop VDD 2+ΔV=
© 2009 Microchip Technology Inc. DS22186B-page 9
MCP2036
When the PWM signal switches from low-to-high or
from high-to-low, the step voltage applied to the
capacitor CIN will be:
EQUATION 3-3:
Substituting in the equation for an RC network:
EQUATION 3-4:
Vstep VDD 2⁄ΔV+()=
ΔVVDD
2
-----------
1t
RINCIN
------------------
⎝⎠
⎛⎞
exp
1t
RINCIN
------------------
⎝⎠
⎛⎞
exp+
-------------------------------------------=
2ΔVV
DD 2⁄ΔV+()1tRC()exp[]=
MCP2036
DS22186B-page 10 © 2009 Microchip Technology Inc.
The peak-to-peak amplitude of the resulting triangular
waveform, at the coil driver input, is shown in
Equation 3-5:
EQUATION 3-5:
From the previous equation, the designer should
choose values for VPKPK and RIN. Using the equation
above, the value of CIN will be:
EQUATION 3-6:
The amplitude of the pulsed current applied to key
inductors will be:
EQUATION 3-7:
This current produces a pulsed voltage to key inductors
ends. The amplitude of this voltage will be:
EQUATION 3-8:
The total voltage across both the reference and sensor
coils would be double (two series inductors). For a
specific power supply voltage, half of this power supply,
relative to the voltage reference, is available for output
amplifier/detector. Assuming a 30% margin, the
desired gain for the detector should be about:
EQUATION 3-9:
The gain of the amplifier is user-settable, using an
external resistor, RGAIN. The value of that resistor will
be determined using the following equation:
EQUATION 3-10:
With a 10-bit ADC, using oversampling and averaging
techniques, the effective resolution is close to 11 bits.
As shown in AN1239, “Inductive Touch Sensor
Design”, the typical shift in sensor impedance is typi-
cally 3-4%, so the actual number of counts per press is
typically between 20 and 40 counts. In this way, the
microcontroller firmware could easily detect press
event.
Note: VPKPK should not exceed specified value
(600mV) for best performance.
Note: Assuming a power supply of 5V and
VPKPK=500mV, for RIN=3.9KΩ, CIN should
have about 320pF. A 330pF capacitor will
be used.
Note: For a PWM frequency of 2 MHz and
inductor value of 2.7µH, the amplitude of
pulsed voltage will be:
VPKPK 2ΔV=
VPKPK VDD
1t
RINCIN
------------------
⎝⎠
⎛⎞
exp
1t
RINCIN
------------------
⎝⎠
⎛⎞
exp+
-------------------------------------------=
CIN t
RIN ln VDD VPKPK
VDD VPKPK
+
----------------------------------------
⎝⎠
⎜⎟
⎛⎞
-------------------------------------------------------------------1
2FR
IN
VDD VPKPK
VDD VPKPK
+
----------------------------------------
⎝⎠
⎜⎟
⎛⎞
ln
-------------------------------------------------------------------------------------==
ΔIV
PKPK GDRV
=
GDRV - Gain of Coil Driver
ΔULΔI
Δt
------LV
PKPK GDRV
2F==
F - PWM Frequency
L - Inductance of Key Inductor
ΔU10.8mV=
Note: For a power supply of 5V and ΔU = 10mV,
the resulted gain is 81. To obtain this gain,
RGAIN = 820kOhm should be used.
Gain 70% VDD
2
-----------
⎝⎠
⎛⎞
2ΔU
---------------------------------=
Gain RGAIN/10kOhm
© 2009 Microchip Technology Inc. DS22186B-page 11
MCP2036
4.0 ELECTRICAL CHARAC TERISTICS
4.1 Absolute Maximum Ratings
Ambient temperature under bias.................-40°C to +125°C
Storage temperature .................................. -65°C to +150°C
Voltage on VDD with respect to VSS............. -0.3V to +6.5V
Analog Inputs (VDET+, VDET-).............VSS-1.0V to VDD+1.0V
Voltage on all other pins with
respect to VSS ..................................... -0.3V to (VDD + 0.3V)
Current at Output and Supply Pins.............................±30 mA
Human Body ESD Rating............................................2000 V
Machine Model ESD Rating ..........................................200 V
Maximum Junction Temperature ……………………....+150°C
4.2 Specifications
TABLE 4-1: DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.7V to +5.5V, VSS = GND.
Parameters Sym. Min. Typ. Max. Units Conditions
General Device Parameters
Supply Voltage VDD 2.7 5.5 V
Power-Down Current IPD —12nACS = 1, VDD = +2.7V, (N ote 1)
IPD —25nACS = 1, VDD = +5.5V, (N ote 1)
Quiescent Current IDD —2mAV
DD = +2.7V,
DRVIN = 0V, CLK = Low
IDD —3.7mAV
DD = +5.5V
DRVIN = 0V, CLK = Low
Active Current IDD —3.4mAV
DD = +2.7V,
CLK = 2 MHz
IDD —6.8mAV
DD = +5.5V
CLK = 2 MHz
Digital IO Parameters
Digital Input High Voltage VIH 0.7VDD —— V
Digital Input Low Voltage VIL ——0.3V
DD V
Input Pins Leakage Current ILKG ——±100nACS, CLK, REFSEL, LREF, LBTN
Output Ampl ifier /Filter Speci fic Param e ters
System Parameters
DC Open Loop Gain AOL 90 110 dB
Power Supply Rejection Ratio PSRR 86 dB
Common Mode Rejection Ratio CMMR 60 76 dB
Amplifier Input Characteristics
Input Offset Voltage VOS ——±7mV
Input Bias Current IB——±20pA(Note 1)
——±1nA(Note 1)
Input Offset Current IOS ——±1pA(Note 1)
Input Impedance ZIN —10
13||6 Ω||pF Common mode impedance
——10
13||6 Ω||pF Differential impedance
Amplifie r Output Charac t e r is tics
Minimum Output Voltage VOMIN VSS+20 mV
Maximum Output Voltage VOMAX ——V
DD-20 mV
MCP2036
DS22186B-page 12 © 2009 Microchip Technology Inc.
TABLE 4-2: AC CHARACTERISTICS
Short Circuit Current ISC —±6mAV
DETOUT
, VDD = 3V
——±10mAV
DETOUT
, VDD = 5V
Voltage Reference Specific Parameters
Output Voltage VREF —V
DD/2 mV
Output Short Circuit Current ISC —6mAV
DD = 3V
——10mA V
DD = 5V
Maximum Output Capacitance COUT ——1 µF(Note 1)
Series Output Resistance RSER 250 ΩInternal resistor used to stabilize
op amp output for pure
capacitive loads
Coil Driver Specific Parameters
System Parameters
Amplifier Current Gain AOL —3mA/VV
DD = +2.7V
AOL —3.6mA/VV
DD = +5.5V
Power Supply Rejection Ratio PSRR 60 dB
Input Characteristics
Input Voltage Range VMAX VDD/2
-300
—V
DD/2
+300
mV VDD = 5V
Input Bias/Leakage Current IB ±20 pA T = 85°C (Note 1)
IB ±1 nA T = 125°C (Note 1)
Input Impedance ZIN —10
13||6— Ω||pF Common mode impedance
——10
13||6— Ω||pF Differential impedance
Output Characteristics
Minimum Output Voltage VOMIN VSS+20 mV
Maximum Output Voltage VOMAX ——V
DD-20 mV
Short Circuit Current ISC ±6 mA DRVOUT, VDD = 3V
ISC ±10 mA DRVOUT, VDD = 5V
Resistor Specifications
Resistance Value of R1 R1 8 KΩResistor between pass gates
and output amplifier input
Resistance Value of R2 R2 2 KΩResistor between LBTN and
LREF inputs and voltage
reference
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to +5.5V, and VSS = GND.
Parameters Sym. Min. Typ. Max. Units Conditions
Output Ampl ifier /Filter Speci fic Param e ters
Gain Bandwidth Product GBWP 1 MHz
Slew Rate SR 0.6 V/µs
Coil Driver Amplifier Parameters
Gain Bandwidth Product GBWP 17.8 MHz
Voltage Reference Specific Parameters
Gain Bandwidth Product GBWP 1 MHz
Slew Rate SR 0.6 V/µs
TABLE 4-1: DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.7V to +5.5V, VSS = GND.
Parameters Sym. Min. Typ. Max. Units Conditions
© 2009 Microchip Technology Inc. DS22186B-page 13
MCP2036
TABLE 4-4: TIMING DIAGRAM
TABLE 4-3: TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to +5.5V, and VSS = GND.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Industrial Temperature
Range
TA-40 +85 °C
Extended Temperature
Range
TA-40 +125 °C
Operating Temperature
Range
TA-40 +125 °C
Storage Temperature Range TA-65 +150 °C
Thermal Package Resistances
Thermal Resistance,
14L-PDIP
θJA —70 °C/W
Thermal Resistance,
14L-SOIC
θJA 120 °C/W
Thermal Resistance,
16L-QFN
θJA —47 °C/W
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to +5.5V, and VSS = GND.
Parameters Sym. Min. Typ. Max. Units Conditions
Input Clock Frequency FCLK —2 MHz
Duty Factor D 50 %
Device Turn-On Time tON 4 10 µs Time from CS= 0 to valid
VDETOUT output (Note 1)
Device Power-Down Time tOFF —1 µsTime from CS= 1 to High-Z
outputs on all drivers
(Note 1)
Note 1: Not tested in production but it is
characterized.
MCP2036
DS22186B-page 14 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22186B-page 15
MCP2036
5.0 TYPICAL PERFORMANCE CURV ES
5.1 Performance Plots
FIGURE 5-1: Driver Input Waveforms
MCP2036
DS22186B-page 16 © 2009 Microchip Technology Inc.
FIGURE 5-2: Inductor Driver Transfer Function (Rload = 100 Ohm)
FIGURE 5-3: Pulsed Voltage on Active Key Inductor (I/O Configuration)
© 2009 Microchip Technology Inc. DS22186B-page 17
MCP2036
FIGURE 5-4: Pulsed voltage on Reference Inductor Series with Active Inductor
MCP2036
DS22186B-page 18 © 2009 Microchip Technology Inc.
FIGURE 5-5: Output Detector Response Time
© 2009 Microchip Technology Inc. DS22186B-page 19
MCP2036
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
14-Lead PDIP
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
Example
MCP2036-I/P
0610017
14-Lead SOIC (.150”)
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
Example
MCP2036
-I/SL
0610017
XXXXXXX
16-Lead QFN
XXXXXXX
YYWWNNN
MCP2036
Example
-I/MG
0610017
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
MCP2036
DS22186B-page 20 © 2009 Microchip Technology Inc.
6.2 Package Details
The following sections give the technical details of the packages.
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  !"#$%!&'(!%&! %(%")%%%"
 *$%+% %
, &  "-"%!"&"$ %!  "$ %!   %#". "
 & "%-/0
1+21 & %#%! ))%!%% 
 3%& %!%4") '  %4$%%"%
%%255)))&&54
6% 7+8-
& 9&% 7 7: ;
7!&($ 7 
% 1+
%% < < 
""44  0 , 0
1 %%  0 < <
!"%!"="% -  , ,0
""4="% -  0 >
:9% ,0 0 0
%% 9 0 , 0
9"4 >  0
69"="% ( 0 ? 
9)9"="% (  > 
:)* 1 < < ,
N
E1
D
NOTE 1
123
E
c
eB
A2
L
A
A1 b1
be
  ) +01
© 2009 Microchip Technology Inc. DS22186B-page 21
MCP2036
!"!##$%&'!"(

  !"#$%!&'(!%&! %(%")%%%"
 *$%+% %
, &  "-"%!"&"$ %!  "$ %!   %#"0&& "
 & "%-/0
1+2 1 & %#%! ))%!%% 
-32 $& '! !)%!%%'$$&%!  
 3%& %!%4") '  %4$%%"%
%%255)))&&54
6% 99--
& 9&% 7 7: ;
7!&($ 7 
% 1+
:8% < < 0
""44  0 < <
%"$$*   < 0
:="% - ?1+
""4="% - ,1+
:9% >?01+
+&$@%A 0 < 0
3%9% 9  < 
3%% 9 -3
3% IB < >B
9"4  < 0
9"="% ( , < 0
"$% D0B < 0B
"$%1%%& E0B < 0B
NOTE 1
N
D
E
E1
123
b
e
A
A1
A2
L
L1
c
h
hα
β
φ
  ) +?01
MCP2036
DS22186B-page 22 © 2009 Microchip Technology Inc.
 3%& %!%4") '  %4$%%"%
%%255)))&&54
© 2009 Microchip Technology Inc. DS22186B-page 23
MCP2036
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP2036
DS22186B-page 24 © 2009 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009 Microchip Technology Inc. DS22186B-page 25
MCP2036
APPENDIX A: REVISION HISTORY
Revision A (05/2009)
Original release of the document.
Revision B (09/2009)
Replaced the 4X4 QFN Package with the 3X3 QFN
Package; Replaced ML with MG in the 16-Lead QFN
Example; Added SOIC (SL) Land Pattern.
MCP2036
DS22186B-page 26 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22186B-page 27
MCP2036
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: MCP2036
VDD range 2.7V to 5.5V
Temperature
Range: I= -40°C to +85°C (Industrial)
E= -40°C to +125°C (Extended)
Package: MG = QFN
SL = SOIC
P=PDIP
Pattern: QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
MCP2036 - I/P 301 = Industrial temp., PDIP package,
QTP pattern #301.
MCP2036
DS22186B-page 28 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22186B-page 29
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS22186B-page 30 © 2009 Microchip Technology Inc.
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Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Ma dri d
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
WORLDWIDE SALES AND SERVICE
03/26/09