VEMD2000X01, VEMD2020X01
www.vishay.com Vishay Semiconductors
Rev. 1.3, 23-Aug-11 1Document Number: 81962
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Silicon PIN Photodiode
DESCRIPTION
VEMD2000X01 and VEMD2020X01 are high speed and high
sensitive PIN photodiodes in a miniature surface mount
package (SMD) with dome lens and daylight blocking filter.
Filter is matched with IR emitters operating at wavelength of
830 nm to 950 nm. The photo sensitive area of the chip is
0.23 mm2.
FEATURES
Package type: surface mount
Package form: GW, RGW
Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8
AEC-Q101 qualified
High radiant sensitivity
Daylight blocking filter matched with 830 nm
to 950 nm IR emitters
Fast response times
Angle of half sensitivity: ϕ = ± 15°
Package matched with IR emitter series
VSMB2000X01
Floor life: 4 weeks, MSL 2a, acc. J-STD-020
Lead (Pb)-free reflow soldering
Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
Note
** Please see document “Vishay Material Category Policy”:
www.vishay.com/doc?99902
APPLICATIONS
High speed photo detector
Infrared remote control
Infrared data transmission
Photo interrupters
Shaft encoders
Note
Test conditions see table “Basic Characteristics”
Note
MOQ: minimum order quantity
21568-1 VEMD2020X01 VEMD2000X01
PRODUCT SUMMARY
COMPONENT Ira (μA) ϕ (deg) λ0.5 (nm)
VEMD2000X01 12 ± 15 750 to 1050
VEMD2020X01 12 ± 15 750 to 1050
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
VEMD2000X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing
VEMD2020X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR60 V
Power dissipation Tamb 25 °C PV215 mW
Junction temperature Tj100 °C
Operating temperature range Tamb - 40 to + 100 °C
Storage temperature range Tstg - 40 to + 100 °C
Soldering temperature Acc. reflow solder profile fig. 7 Tsd 260 °C
Thermal resistance junction/ambient Acc. J-STD-051 RthJA 250 K/W
VEMD2000X01, VEMD2020X01
www.vishay.com Vishay Semiconductors
Rev. 1.3, 23-Aug-11 2Document Number: 81962
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Reverse Dark Current vs. Ambient Temperature Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage IF = 50 mA VF1V
Breakdown voltage IR = 100 μA, E = 0 V(BR) 32 V
Reverse dark current VR = 10 V, E = 0 Iro 110nA
Diode capacitance VR = 0 V, f = 1 MHz, E = 0 CD4pF
VR = 5 V, f = 1 MHz, E = 0 CD1.3 pF
Open circuit voltage Ee = 1 mW/cm2, λ = 950 nm Vo350 mV
Temperature coefficient of VoEe = 1 mW/cm2, λ = 950 nm TKVo - 2.6 mV/K
Short circuit current Ee = 1 mW/cm2, λ = 950 nm Ik11 μA
Temperature coefficient of IkEe = 1 mW/cm2, λ = 950 nm TKIk 0.1 %/K
Reverse light current Ee = 1 mW/cm2, λ = 950 nm,
VR = 5 V Ira 8.5 12 17 μA
Angle of half sensitivity ϕ± 15 deg
Wavelength of peak sensitivity λp940 nm
Range of spectral bandwidth λ0.5 750 to 1050 nm
Rise time VR = 10 V, RL = 1 kΩ,
λ = 820 nm tr100 ns
Fall time VR = 10 V, RL = 1 kΩ,
λ = 820 nm tf100 ns
20
1
10
100
1000
Iro - Reverse Dark Current (nA)
Tamb - Ambient Temperature (°C)
94 8427
VR = 10 V
100
806040
0.6
0.8
1.0
1.2
1.4
I
ra, rel
- Relative Reverse Light Current
T
amb
- Ambient Temperature (°C)
94 8416
VR = 5 V
λ = 950 nm
010080
60
4020
VEMD2000X01, VEMD2020X01
www.vishay.com Vishay Semiconductors
Rev. 1.3, 23-Aug-11 3Document Number: 81962
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 3 - Reverse Light Current vs. Irradiance
Fig. 4 - Diode Capacitance vs. Reverse Voltage
Fig. 5 - Relative Spectral Sensitivity vs. Wavelength
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
0.1
1.0
10
100
0.01
I
ra
- Reverse Light Current (µA)
E
e
- Irradiance (mW/cm²)
16055
VCE = 5 V
λ = 950 nm
10
1
0.1
0
2
4
6
8
0.1
C
D
- Diode Capacitance (pF)
VR- Reverse Voltage (V)
94 8430
E = 0
f = 1 MHz
100
10
1
0
0.2
0.4
0.6
0.8
1.0
1.2
600 700 800 900 1000 1100
21554 λ - Wavelength (nm)
S (λ)
rel
- Relative Spectral Sensitivity
Srel - Relative Sensitivity
94 8248
0.6
0.9
0.8
30°
10° 20°
40°
50°
60°
70°
80°
0.7
1.0
0
0.20.4
ϕ - Angular Displacement
VEMD2000X01, VEMD2020X01
www.vishay.com Vishay Semiconductors
Rev. 1.3, 23-Aug-11 4Document Number: 81962
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
REFLOW SOLDER PROFILE
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
PACKAGE DIMENSIONS in millimeters: VEMD2000
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C 245 °C
max. 260 °C
max. 120 s max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s max. ramp down 6 °C/s
19841
255 °C
2.2
5.8 ± 0.2
2.77 ± 0.2
2.3 ± 0.2
Cathode
0.5
0.05 ± 0.1
0.254
1.1 ± 0.1
Anode
0.4
2.2
0.19
0.3
1.6
0.4
Z
Ø 1.8 ± 0.1
2.3 ± 0.2
specications
according to DIN
technical drawings
Not indicated tolerances ± 0.1
Drawing-No.: 6.544-5391.02-4
Pin ID
exposed copper
Issue: 2; 18.03.10
21517
0.75
6.7
1.7
Ø 2.3 ± 0.1
Solder pad proposal
acc. IPC 7351
Z 20:1
VEMD2000X01, VEMD2020X01
www.vishay.com Vishay Semiconductors
Rev. 1.3, 23-Aug-11 5Document Number: 81962
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: VEMD2020
2.2
4.2 ± 0.2
2.77 ± 0.2
0.05
0.254
0.6
2.2
0.19
0.3
1.6
0.4 Ø 1.8
specifications
according to DIN
technical drawings
Not indicated tolerances ± 0.1
Drawing-No.: 6.544-5383.02-4
Issue: 4; 18.03.10
exposed copper
0.75
2.45
5.15
Solder pad proposal
acc. IPC 7351
21488
X
X 20:1
Cathode Anode
0.4
2.3 ± 0.2
2.3 ± 0.2
0.5
Pin ID
VEMD2000X01, VEMD2020X01
www.vishay.com Vishay Semiconductors
Rev. 1.3, 23-Aug-11 6Document Number: 81962
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VEMD2000
Issue: 2; 18.03.10
Drawing-No.: 9.800-5100.01-4
Leader and trailer tape:
Parts mounted
Empty (400 mm min.)
Empty (160 mm min.)
Direction of pulling out
Unreel direction
Ø 62 ± 0.5
Ø 330 ± 1
Reel
2.5± 0.5
Label posted here
coming out from reel
Tape position
X
Ø13± 0.5
12.4 ± 1.5
X 2:1
I
II
6000 pcs/reel
12 ± 0.3
5.5 ± 0.05 1.75 ± 0.1
2 ± 0.05
4 ± 0.1
4 ± 0.1
Ø 1.55 ± 0.05
3.05 ± 0.1
21572
Technical drawings
according to DIN
specifications
Terminal position in tape
Devicce
VEMD2000
VEMD2500
Cathode Anode
Anode Cathode
VSMB2000
VSMG2000
VSMY2850RG
VEMT2000
VEMT2500 Collector Emitter
Lead I Lead II
VEMD2000X01, VEMD2020X01
www.vishay.com Vishay Semiconductors
Rev. 1.3, 23-Aug-11 7Document Number: 81962
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VEMD2020
Drawing-No.: 9.800-5091.01-4
Leader and trailer tape:
Parts mounted
Empty (400 mm min.)
Empty (160 mm min.)
Direction of pulling out
Unreel direction
Ø 62 ± 0.5
Ø 330 ± 1
Reel
2.5± 0.5
Label posted here
coming out from reel
Tape position
X
Ø13 ± 0.5
12.4 ± 1.5
X 2:1
I
II
6000 pcs/reel
12 ± 0.3
5.5 ± 0.05 1.75 ± 0.1
2 ± 0.05
4 ± 0.1
4 ± 0.1
Ø 1.55 ± 0.05
3.05 ± 0.1
21571
technical drawings
according to DIN
specifications
Issue: 3; 18.03.10
Terminal position in tape
Devicce
VSMB2020
VSMG2020
Cathode Anode
Anode Cathode
VEMD2020
VEMD2520
VSMY2850G
VEMT2020
VEMT2520 Collector Emitter
Lead I Lead II
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 12-Mar-12 1Document Number: 91000
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.