© 2006 Microchip Technology Inc. DS21390D-page 1
TC1411/TC1411N
Features
• Latch-Up Protected: Will Withstand 500 mA
Reverse Current
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected: 4 kV
• High Peak Output Current: 1A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 1000 pF in 25 nsec
• Short Delay Time: 30 nsec Typ.
• Matched Delay Times
• Low Supply Current
- With Logic ‘1’ Input: 500 µA
- With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 8Ω
• Available in Space-Saving 8-pin MSOP Package
• Pinout Same as TC1410/TC1412/TC1413
Applications
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
• Relay Driver
Description
The TC1411/TC1411N are 1A CMOS buffers/drivers.
They will not latch-up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
As MOSFET drivers, the TC1411/TC1411N can easily
charge a 1000 pF gate capacitance in 25 nsec with
matched rise and fall times, and provide low enough
impedance in both the ON and the OFF states to
ensure the MOSFET’s intended state will not be
affected, even by large transients. The leading and
trailing edge propagation delay times are also matched
to allow driving short-duration inputs with greater
accuracy.
Package Types
VDD
IN
NC
GND
VDD
OUT
GND
OUT
1
2
3
45
6
7
8
8-Pin MSOP/PDIP/SOIC
VDD
OUT
GND
VDD
IN
NC
GND
OUT
TC1411
NC = No Internal Connection
26,7
Inverting
26,7
Non-Inverting
1
2
3
45
6
7
8
TC1411N
Note: Duplicate pins must be connected
together for proper operation.
1A High-Speed MOSFET Drivers
TC1411/TC1411N
DS21390D-page 2 © 2006 Microchip Technology Inc.
Functional Block Diagram
Effective
Input C = 10 pF
TC1411N
Output
Input
GND
VDD
300 mV
4.7V
Inverting
Non-Inverting
Outputs
Outputs
TC1411
© 2006 Microchip Technology Inc. DS21390D-page 3
TC1411/TC1411N
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .....................................................+20V
Input Voltage ......................VDD + 0.3V to GND – 5.0V
Power Dissipation (TA ≤ 70°C)
MSOP.......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Storage Temperature Range .............. -65°C to +150°C
Maximum Junction Temperature...................... +150°C
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters Sym Min Typ Max Units Conditions
Input
Logic ‘1’, High Input Voltage VIH 2.0 — — V
Logic ‘0’, Low Input Voltage VIL ——0.8V
Input Current IIN -1.0 — 1.0 µA 0V ≤ VIN ≤ VDD, TA = +25°C
-10 — 10 -40°C ≤ TA ≤ +85°C
Output
High Output Voltage VOH VDD – 0.025 — — V DC Test
Low Output Voltage VOL — — 0.025 V DC Test
Output Resistance RO—811ΩVDD = 16V, IO = 10 mA, TA = +25°C
—1014 0°C ≤ TA ≤ +70°C
— 10 14 -40°C ≤ TA ≤ +85°C
Peak Output Current IPK —1.0—AV
DD = 16V
Latch-Up Protection
Withstand Reverse Current
IREV — 0.5 — A Duty cycle ≤ 2%, t ≤ 300 µs,
VDD = 16V
Switching Time (Note 1)
Rise Time tR—2535nsT
A = +25°C
—2740 0°C ≤ TA ≤ +70°C
— 29 40 -40°C ≤ TA ≤ +85°C, Figure 4-1
Fall Time tF—2535nsT
A = +25°C
—2740 0°C ≤ TA ≤ +70°C
— 29 40 -40°C ≤ TA ≤ +85°C, Figure 4-1
Delay Time tD1 —3040nsT
A = +25°C,
—3345 0°C ≤ TA ≤ +70°C
— 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1
Delay Time tD2 —3040nsT
A = +25°C
—3345 0°C ≤ TA ≤ +70°C
— 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1
Power Supply
Power Supply Current IS—0.51.0mAV
IN = 3V, VDD = 16V
— 0.1 0.15 VIN = 0V
Note 1: Switching times ensured by design.
TC1411/TC1411N
DS21390D-page 4 © 2006 Microchip Technology Inc.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range (C) TA0—+70ºC
Specified Temperature Range (E) TA-40 — +85 ºC
Specified Temperature Range (V) TA-40 — +125 ºC
Maximum Junction Temperature TJ——+150ºC
Storage Temperature Range TA-65 — +150 ºC
Package Thermal Resistances
Thermal Resistance, 8L-MSOP θJA —206—ºC/W
Thermal Resistance, 8L-PDIP θJA —125—ºC/W
Thermal Resistance, 8L-SOIC θJA —155—ºC/W
© 2006 Microchip Technology Inc. DS21390D-page 5
TC1411/TC1411N
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
FIGURE 2-1: Quiescent Supply Current
vs. Supply Voltage.
FIGURE 2-2: Input Threshold vs. Supply
Voltage.
FIGURE 2-3: High-State Output
Resistance vs. Supply Voltage.
FIGURE 2-4: Quiescent Supply Current
vs. Temperature.
FIGURE 2-5: Input Threshold vs.
Temperature.
FIGURE 2-6: Low-State Output
Resistance vs. Supply Voltage.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
100
200
300
400
500
16141210864
VIN = 3V
VIN = 0V
TA = +25°C
ISUPPLY (µA)
VDD (V)
1.1
1.2
1.3
1.4
1.5
1.6
16141210864
T
A
= +25°C
V
DD
(V)
V
THRESHOLD
(V)
V
IH
V
IL
R
DS-ON
(Ohms)
V
DD
(V)
0
5
10
15
20
25
16141210864
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
-40 -20 0 20 40 60 80
0
100
200
300
400
500
ISUPPLY (µA)
VIN = 3V
VIN = 0V
VSUPPLY = 16V
TEMPERATURE (°C)
-40 -20 0 20 40 60 80
1.1
1.2
1.3
1.4
1.5
1.6 VSUPPLY = 16V
TEMPERATURE (°C)
VTHRESHOLD (V)
VIH
VIL
RDS-ON (Ohms)
VDD (V)
0
5
10
15
20
25
16141210864
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
TC1411/TC1411N
DS21390D-page 6 © 2006 Microchip Technology Inc.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
FIGURE 2-7: Rise Time vs. Supply
Voltage.
FIGURE 2-8: Propagation Delay vs.
Supply Voltage.
FIGURE 2-9: Rise and Fall Times vs.
Capacitive Load.
FIGURE 2-10: Fall Time vs. Supply
Voltage.
FIGURE 2-11: Propagation Delay vs.
Supply Voltage.
FIGURE 2-12: Propagation Delays vs.
Capacitive Load.
VDD (V)
tRISE (nsec)
0
20
40
60
80
100
16141210864
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
C
LOAD
= 1000 pF
0
20
40
60
80
100
16141210864
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
VDD (V)
C
LOAD
= 1000 pF
tD1 (nsec)
0 500 1000 1500 2000 2500 3000 3500
0
20
40
60
80
100
tFALL
tRISE
tRISE, tFALL (nsec)
CLOAD (pF)
T
A
= +25°C
V
DD
= 16V
tFALL (nsec)
0
20
40
60
80
100
16141210864
T
A
= +85°C
T
A
= -40°C
T
A
= +25°C
C
LOAD
= 1000 pF
VDD (V)
VDD (V)
tD2 (nsec)
0
20
40
60
80
100
16141210864
C
LOAD
= 1000 pF
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
CLOAD (pF)
Propagation Delays (nsec)
t
D1
0 500 1000 1500 2000 2500 3000 3500
26
28
30
32
34
36
tD2
TA = +25°C
VDD = 16V
© 2006 Microchip Technology Inc. DS21390D-page 7
TC1411/TC1411N
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2 Control Input (INPUT)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input has 300 mV of
hysteresis between the high and low thresholds that
prevents output glitching even when the rise and fall
time of the input signal is very slow.
3.3 CMOS Push-pull Output (OUTPUT)
The MOSFET driver output is a low impedance, CMOS
push-pull style output, capable of driving a capacitive
load with 1A peak currents.
3.4 Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents which discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
3.5 No Connect (NC)
No internal connection.
Pin
No. Symbol Description
1V
DD Supply input, 4.5V to 16V
2INPUT Control input
3 NC No connection
4 GND Ground
5 GND Ground
6 OUTPUT CMOS push-pull output, common to pin 7
7 OUTPUT CMOS push-pull output, common to pin 6
8V
DD Supply input, 4.5V to 16V
TC1411/TC1411N
DS21390D-page 8 © 2006 Microchip Technology Inc.
4.0 APPLICATION INFORMATION
FIGURE 4-1: Switching Time Test Circuit.
CL = 1000 pF
0.1 µF
4.7 µF
Inverting Driver
Non-Inverting Driver
Input
VDD = 16V
Input
Output
tD1
tF
tR
tD2
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 nsec
Output
Input
Output
tD1
tF
tR
tD2
+5V
10%
90%
10%
90%
10%
90%
VDD
0V
90%
10%
10% 10%
90%
+5V
VDD
0V
0V
0V
90%
4, 5
26, 7
1, 8
TC1411
TC1411N
TC1411N
TC1411
© 2006 Microchip Technology Inc. DS21390D-page 9
TC1411/TC1411N
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
TC1411
CPA^^256
0635
8-Lead SOIC (150 mil) Example:
XXXXXXXX
XXXXYYWW
NNN
TC1411C
OA^^0635
256
8-Lead MSOP Example:
XXXXXXX
YWWNNN
1411NE
635256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
TC1411/TC1411N
DS21390D-page 10 © 2006 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
D
A
A1
L
c
α
A2
E1
E
p
Bn1
2
φ
β
F
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
.037 REFFFootprint (Reference)
Notes:
Revised 07-21-05
*
Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 BSC
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0°
0.23
0.40
8°
MILLIMETERS
*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15°5° -
15°5° -
JEDEC Equivalent: MO-187
0° - 8°
5°
5° -
-
15°
15°
--
--
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
See ASME Y14.5M
Drawing No. C04-111
Note: For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
© 2006 Microchip Technology Inc. DS21390D-page 11
TC1411/TC1411N
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units INCHES*MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n88
Pitch p.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing §eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top α51015 51015
Mold Draft Angle Bottom β51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
§ Significant Characteristic
Note: For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC1411/TC1411N
DS21390D-page 12 © 2006 Microchip Technology Inc.
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Foot Angle φ048048
1512015120
β
Mold Draft Angle Bottom
1512015120
α
Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length
0.510.380.25.020.015.010hChamfer Distance
5.004.904.80.197.193.189DOverall Length
3.993.913.71.157.154.146
E1
Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004A1Standoff §
1.551.421.32.061.056.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27
.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
β
c
45°
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
Note: For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
© 2006 Microchip Technology Inc. DS21390D-page 13
TC1411/TC1411N
APPENDIX A: REVISION HISTORY
Revision D (September 2006)
• Added -40°C to +125°C temperature range to
Temperature Characteristics table and Product
Information System page.
• Added disclaimer to package outline drawings.
Revision C (March 2003)
• Added 8-Lead MSOP Package.
Revision B (May 2002)
• Converted TELCOM data sheet for Embedded
Control Handbook
Revision A (March 2001)
• Original Release of this Document.
TC1411/TC1411N
DS21390D-page 14 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS21390D-page 15
TC1411/TC1411N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: TC1411: 1 A Single MOSFET Driver, Inverting
TC1411N: 1 A Single MOSFET Driver, Non-Inverting
Temperature Range: C = 0°C to +70°C
E = -40°C to +85°C
V = -40°C to +125°C
Package: OA = Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA = Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA = Plastic DIP (300 mil Body), 8-lead
* MSOP package is only available in E-Temp.
PART NO. X/XX
PackageTemperature
Range
Device
Examples:
a) TC1411COA: 1A Single MOSFET driver,
8LD SOIC pkg,
0°C to +70°C.
b) TC1411CPA: 1A Single MOSFET driver,
8LD PDIP package,
0°C to +70°C.
c) TC1411EUA713: Tape and Reel,
1A Single MOSFET driver,
8LD MSOP package,
-40°C to +85°C.
d) TC1411VOA713: Tape and Reel,
1A Single MOSFET driver,
8LD SOIC pkg,
-40°C to +125°C.
a) TC1411NCPA: 1A Single MOSFET driver,
8LD PDIP package,
0°C to +70°C.
b) TC1411NEPA: 1A Single MOSFET driver,
8LD PDIP package,
-40°C to +85°C.
c) TC1411NEUA: 1A Single MOSFET driver,
8LD MSOP package,
-40°C to +85°C.
d) TC1411NVPA: 1A Single MOSFET driver,
8LD PDIP package,
-40°C to +125°C
TC1411/TC1411N
DS21390D-page 16 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS21390D-page 17
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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FITNESS FOR PURPOSE. Microchip disclaims all liability
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
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All other trademarks mentioned herein are property of their
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© 2006, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
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• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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DS21390D-page 18 © 2006 Microchip Technology Inc.
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Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-3910
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
WORLDWIDE SALES AND SERVICE
08/29/06
