IXYS reserves the right to change limits, test conditions, and dimensions.
IXTC240N055T
Notes: 1. Pulse test, t ≤ 300 μs, duty cycle d ≤ 2 %;
2. Drain and Source Kelvin contacts must be located less than 5 mm from
the plastic body.
Symbol Test Conditions Characteristic Values
(TJ = 25°C unless otherwise specified)
Min. Typ. Max.
gfs VDS= 10 V; ID = 60 A, Note 1 80 132 S
Ciss 7600 pF
Coss VGS = 0 V, VDS = 25 V, f = 1 MHz 1240 pF
Crss 260 pF
td(on) 40 ns
trVGS = 10 V, VDS = 0.5 VDSS, ID = 25 A 54 ns
td(off) RG = 5 Ω (External) 63 ns
tf75 ns
Qg(on) 170 nC
Qgs VGS= 10 V, VDS = 0.5 VDSS, ID = 25A 32 nC
Qgd 48 nC
RthJC 1.0 °C/W
RthCS 0.25 °CW
Source-Drain Diode Characteristic Values
TJ = 25°C unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
ISVGS = 0 V 240 A
ISM Pulse width limited by TJM 650 A
VSD IF = 50 A, VGS = 0 V, Note 1 1.0 V
trr IF = 25 A, -di/dt = 100 A/μs30ns
VR = 30 V, VGS = 0 V
Note: Bottom heatsink (Pin 4) is
electrically isolated from Pins 1,2, and 3.
1.Gate 2. Drain
3.Source
ISOPLUS240 (IXTC) Outline
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2
one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6771478 B2 7,071,537
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications
offered are derived from data gathered during objective characterizations of preliminary
engineering lots; but also may yet contain some information supplied during a pre-
production design evaluation. IXYS reserves the right to change limits, test conditions,
and dimensions without notice.