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©2013 ROHM Co., Ltd. All rights reserved. 1/49 11.May.2015 Rev.006
TSZ22111･14･001
Operational Amplifiers
Low Supply Current
Output Full Swing Operational Amplifiers
LMR821G LMR822xxx LMR824xxx
General Description
LMR821G, LMR822xxx, and LMR824xxx are
low-voltage low-current full-swing operational
amplifiers. These products exhibit high voltage gain
and high slew rate, making them suitable for mobile
equipment, low voltage application and active filters.
Features
Low Operating Supply Voltage
Output Full Swing
High Large Signal Voltage Gain
High Slew Rate
Low Supply Current
Applications
Mobile Equipment
Low Voltage Application
Active Filter
Buffer
Consumer Electronics
Key Specifications
Operating Supply Voltage (Single Supply):
+2.5V to +5.5V
Voltage Gain (RL=600Ω): 105dB (Typ)
Temperature Range: -40°C to +85°C
Slew Rate: 2.0V/μs (Typ)
Input Offset Voltage:
LMR821G 3.5mV (Max)
LMR822xxx 5mV (Max)
LMR824xxx 5mV (Max)
Input Bias Current: 30nA (Typ)
Packages W(Typ) x D(Typ) x H(Max)
SSOP5 2.90mm x 2.80mm x 1.25mm
SOP8 5.00mm x 6.20mm x 1.71mm
SOP-J8 4.90mm x 6.00mm x 1.65mm
SSOP-B8 3.00mm x 6.40mm x 1.35mm
TSSOP-B8 3.00mm x 6.40mm x 1.20mm
MSOP8 2.90mm x 4.00mm x 0.90mm
TSSOP-B8J 3.00mm x 4.90mm x 1.10mm
SOP14 8.70mm x 6.20mm x 1.71mm
SOP-J14 8.65mm x 6.00mm x 1.65mm
TSSOP-B14J 5.00mm x 6.40mm x 1.20mm
Pin Configuration
LMR821G : SSOP5
Pin No.
Pin Name
1
+IN
2
VSS
3
-IN
4
OUT
5
VDD
LMR822F : SOP8
LMR822FJ : SOP-J8
LMR822FV : SSOP-B8
LMR822FVT : TSSOP-B8
LMR822FVM : MSOP8
LMR822FVJ : TSSOP-B8J
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VSS
5
+IN2
6
-IN2
7
OUT2
8
VDD
+
CH2
-
+
CH1
-
+
1
2
3
4
8
7
6
5
VSS
OUT1
-IN1
+IN1
OUT2
VDD
+IN2
-IN2
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
1
-
+
2
3
4
5
VSS
-IN
+IN
VDD
OUT
Datashee
t
Datasheet
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©2013 ROHM Co., Ltd. All rights reserved. 2/49 11.May.2015 Rev.006
TSZ22111･15･001
LMR821G LMR822xxx LMR824xxx
LMR824F : SOP14
LMR824FJ : SOP-J14
LMR824FVJ : TSSOP-B14J
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VDD
5
+IN2
6
-IN2
7
OUT2
8
OUT3
9
-IN3
10
+IN3
11
VSS
12
+IN4
13
-IN4
14
OUT4
Ordering Information
L
M
R
8
2
x
x
x
x
-
x
x
Part Number
Package
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5/MSOP8)
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/TSSOP-B8/
TSSOP-B8J/SOP14/SOP-J14/TSSOP-B14J)
LMR821G
G
: SSOP5
LMR822F
F
: SOP8
LMR822FJ
: SOP14
LMR822FV
FJ
: SOP-J8
LMR822FVT
: SOP-J14
LMR822FVM
FV
: SSOP-B8
LMR822FVJ
FVT
: TSSOP-B8
LMR824F
FVM
: MSOP8
LMR824FJ
FVJ
: TSSOP-B8J
LMR824FVJ
: TSSOP-B14J
VDD
CH1
-
+
CH4
-
+
CH3
CH2
-
+
-
+
1
2
3
4
14
13
12
11
5
6
7
10
9
8
OUT4
OUT3
-IN4
+IN4
VSS
+IN3
-IN3
OUT1
OUT2
-IN1
+IN1
+IN2
-IN2
Datasheet
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©2013 ROHM Co., Ltd. All rights reserved. 3/49 11.May.2015 Rev.006
TSZ22111･15･001
LMR821G LMR822xxx LMR824xxx
Line-up
Topr
Channels
Package
Orderable Part
Number
-40°C to +85°C
1ch
SSOP5
Reel of 3000
LMR821G-TR
2ch
SOP8
Reel of 2500
LMR822F-E2
SOP-J8
Reel of 2500
LMR822FJ-E2
SSOP-B8
Reel of 2500
LMR822FV-E2
TSSOP-B8
Reel of 3000
LMR822FVT-E2
MSOP8
Reel of 3000
LMR822FVM-TR
TSSOP-B8J
Reel of 2500
LMR822FVJ-E2
4ch
SOP14
Reel of 2500
LMR824F-E2
SOP-J14
Reel of 2500
LMR824FJ-E2
TSSOP-B14J
Reel of 2500
LMR824FVJ-E2
Absolute Maximum Ratings (TA=25°C)
Parameter
Symbol
Ratings
Unit
LMR821G
LMR822xxx
LMR824xxx
Supply Voltage
VDD-VSS
+7
V
Power Dissipation
Pd
SSOP5
0.67 (Note 1,8)
-
-
W
SOP8
-
0.68 (Note 2,8)
-
SOP-J8
-
0.67 (Note 1,8)
-
SSOP-B8
-
0.62 (Note 3,8)
-
TSSOP-B8
-
0.62 (Note 3,8)
-
MSOP8
-
0.58 (Note 4,8)
-
TSSOP-B8J
-
0.58 (Note 4,8)
-
SOP14
-
-
0.56 (Note 5,8)
SOP-J14
-
-
1.02 (Note 6,8)
TSSOP-B14J
-
-
0.84 (Note 7,8)
Differential Input Voltage (Note 9)
VID
VDD – VSS
V
Input Common-mode
Voltage Range
VICM
(VSS - 0.3) to (VDD + 0.3)
V
Input Current (Note 10)
II
±10
mA
Operating Supply Voltage
Vopr
+2.5 to +5.5
V
Operating Temperature
Topr
- 40 to +85
°C
Storage Temperature
Tstg
- 55 to +150
°C
Maximum
Junction Temperature
Tjmax
+150
°C
(Note 1) Pd is reduced by 5.4mW/°C above TA= 25°C.
(Note 2) Pd is reduced by 5.5mW/°C above TA= 25°C.
(Note 3) Pd is reduced by 5.0mW/°C above TA= 25°C.
(Note 4) Pd is reduced by 4.7mW/°C above TA= 25°C.
(Note 5) Pd is reduced by 4.5mW/°C above TA= 25°C.
(Note 6) Pd is reduced by 8.2mW/°C above TA= 25°C.
(Note 7) Pd is reduced by 6.8mW/°C above TA= 25°C.
(Note 8) Mounted on an FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
(Note 9) Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs.
The input pin voltage is set to more than VSS.
(Note 10) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Datasheet
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©2013 ROHM Co., Ltd. All rights reserved. 4/49 11.May.2015 Rev.006
TSZ22111･15･001
LMR821G LMR822xxx LMR824xxx
Electrical Characteristics
○LMR821G (Unless otherwise specified VDD=+2.5V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Conditions
Min
Typ
Max
Input Offset Voltage (Note 11)
VIO
25°C
-
1
3.5
mV
VDD=2.5V to 5.5V
Full Range
-
-
4
Maximum Output Voltage(High)
VOH
25°C
2.30
2.37
-
V
RL=600Ω (Note 12)
2.40
2.46
-
RL=2kΩ (Note 12)
Maximum Output Voltage(Low)
VOL
25°C
-
130
200
mV
RL=600Ω (Note 12)
-
80
120
RL=2kΩ (Note 12)
(Note 11) Absolute value
(Note 12) Output load resistance connects to a half of VDD.
○LMR821G (Unless otherwise specified VDD=+2.7V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Conditions
Min
Typ
Max
Input Offset Voltage (Note 13,14)
VIO
25°C
-
1
3.5
mV
VDD=2.5V to 5.5V
Full Range
-
-
4
Input Offset Voltage Drift
ΔVIO/ΔT
25°C
-
1
-
μV/°C
-
Input Offset Current (Note 13)
IIO
25°C
-
0.5
30
nA
-
Input Bias Current (Note 13)
IB
25°C
-
30
90
nA
-
Supply Current (Note 14)
IDD
25°C
-
280
340
μA
AV=0dB, V+IN=1.35V
Full Range
-
-
500
Maximum Output Voltage(High)
VOH
25°C
2.50
2.58
-
V
RL=600Ω (Note 16)
2.60
2.66
-
RL=2kΩ (Note 16)
Maximum Output Voltage(Low)
VOL
25°C
-
130
200
mV
RL=600Ω (Note 16)
-
80
120
RL=2kΩ (Note 16)
Large Signal Voltage Gain
AV
25°C
-
100
-
dB
RL=600Ω (Note 16)
95
100
-
RL=2kΩ (Note 16)
Input Common-mode
Voltage Range
VICM
25°C
0
-
1.8
V
VSS to (VDD-0.9V)
Common-mode Rejection Ratio
CMRR
25°C
70
85
-
dB
-
Power Supply Rejection Ratio
PSRR
25°C
75
85
-
dB
VDD=2.7V to 5.5V
VICM=1V
Output Source Current (Note 15)
ISOURCE
25°C
12
16
-
mA
VOUT=0V
Short Circuit Current
Output Sink Current (Note 15)
ISINK
25°C
12
26
-
mA
VOUT=2.7V
Short Circuit Current
Slew Rate
SR
25°C
-
2.0
-
V/μs
CL=25pF
Gain Bandwidth
GBW
25°C
-
5.0
-
MHz
CL=25pF, AV=40dB
f=1MHz
Phase Margin
θ
25°C
-
50
-
deg
CL=25pF, AV=40dB
Gain Margin
GM
25°C
-
4.5
-
dB
CL=25pF, AV=40dB
Input Referred Noise Voltage
VN
25°C
-
30
-
HznV/
f=1kHz
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.01
-
%
VOUT=2.2VP-P, f=1kHz
RL=10kΩ
AV=0dB, DIN-AUDIO
(Note 13) Absolute value
(Note 14) Full Range: TA=-40°C to +85°C
(Note 15) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
(Note 16) Output load resistance connects to a half of VDD.
Datasheet
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©2013 ROHM Co., Ltd. All rights reserved. 5/49 11.May.2015 Rev.006
TSZ22111･15･001
LMR821G LMR822xxx LMR824xxx
Electrical Characteristics - continued
○LMR821G (Unless otherwise specified VDD=+5.0V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Conditions
Min
Typ
Max
Input Offset Voltage (Note 17,18)
VIO
25°C
-
1
3.5
mV
VDD=2.5V to 5.5V
Full Range
-
-
4
Input Offset Voltage Drift
ΔVIO/ΔT
25°C
-
1
-
μV/°C
-
Input Offset Current (Note 17)
IIO
25°C
-
0.5
30
nA
-
Input Bias Current (Note 17)
IB
25°C
-
40
100
nA
-
Supply Current (Note 18)
IDD
25°C
-
325
425
μA
AV=0dB, V+IN=2.5V
Full Range
-
-
600
Maximum Output Voltage(High)
VOH
25°C
4.75
4.84
-
V
RL=600Ω (Note 20)
4.85
4.90
-
RL=2kΩ (Note 20)
Maximum Output Voltage(Low)
VOL
25°C
-
170
250
mV
RL=600Ω (Note 20)
-
100
150
RL=2kΩ (Note 20)
Large Signal Voltage Gain
AV
25°C
-
105
-
dB
RL=600Ω (Note 20)
95
105
-
RL=2kΩ (Note 20)
Input Common-mode
Voltage Range
VICM
25°C
0
-
4.1
V
VSS to (VDD-0.9V)
Common-mode Rejection Ratio
CMRR
25°C
72
90
-
-
Power Supply Rejection Ratio
PSRR
25°C
75
85
-
dB
VDD=2.7V to 5.5V
VICM=1V
Output Source Current (Note 19)
ISOURCE
25°C
20
45
-
mA
VOUT=0V
Short Circuit Current
Output Sink Current (Note 19)
ISINK
25°C
20
40
-
mA
VOUT=5V
Short Circuit Current
Slew Rate
SR
25°C
-
2.0
-
V/μs
CL=25pF
Gain Bandwidth
GBW
25°C
-
5.5
-
MHz
CL=25pF, AV=40dB
f=1MHz
Phase Margin
θ
25°C
-
50
-
deg
CL=25pF, AV=40dB
Gain Margin
GM
25°C
-
4.5
-
dB
CL=25pF, AV=40dB
Input Referred Noise Voltage
VN
25°C
-
30
-
HznV/
f=1kHz
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.01
-
%
VOUT=4.1VP-P, f=1kHz
RL=10kΩ
AV=0dB, DIN-AUDIO
(Note 17) Absolute value
(Note 18) Full Range: TA=-40°C to +85°C
(Note 19) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
(Note 20) Output load resistance connects to a half of VDD.
Datasheet
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©2013 ROHM Co., Ltd. All rights reserved. 6/49 11.May.2015 Rev.006
TSZ22111･15･001
LMR821G LMR822xxx LMR824xxx
Electrical Characteristics - continued
○LMR822xxx (Unless otherwise specified VDD=+2.5V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Conditions
Min
Typ
Max
Input Offset Voltage (Note 21)
VIO
25°C
-
1
5
mV
VDD=2.5V to 5.5V
Full Range
-
-
5
Maximum Output Voltage(High)
VOH
25°C
2.30
2.37
-
V
RL=600Ω (Note 22)
2.40
2.46
-
RL=2kΩ (Note 22)
Maximum Output Voltage(Low)
VOL
25°C
-
130
200
mV
RL=600Ω (Note 22)
-
80
120
RL=2kΩ (Note 22)
(Note 21) Absolute value
(Note 22) Output load resistance connects to a half of VDD.
○LMR822xxx (Unless otherwise specified VDD=+2.7V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Conditions
Min
Typ
Max
Input Offset Voltage (Note 23,24)
VIO
25°C
-
1
5
mV
VDD=2.5V to 5.5V
Full Range
-
-
5
Input Offset Voltage Drift
ΔVIO/ΔT
25°C
-
1
-
μV/°C
-
Input Offset Current (Note 23)
IIO
25°C
-
0.5
30
nA
-
Input Bias Current (Note 23)
IB
25°C
-
30
90
nA
-
Supply Current (Note 24)
IDD
25°C
-
560
680
μA
AV=0dB, V+IN=1.35V
Full Range
-
-
1000
Maximum Output Voltage(High)
VOH
25°C
2.50
2.58
-
V
RL=600Ω (Note 26)
2.60
2.66
-
RL=2kΩ (Note 26)
Maximum Output Voltage(Low)
VOL
25°C
-
130
200
mV
RL=600Ω (Note 26)
-
80
120
RL=2kΩ (Note 26)
Large Signal Voltage Gain
AV
25°C
-
100
-
dB
RL=600Ω (Note 26)
95
100
-
RL=2kΩ (Note 26)
Input Common-mode
Voltage Range
VICM
25°C
0
-
1.8
V
VSS to (VDD-0.9V)
Common-mode Rejection Ratio
CMRR
25°C
70
85
-
dB
-
Power Supply Rejection Ratio
PSRR
25°C
75
85
-
dB
VDD=2.7V to 5.5V
VICM=1V
Output Source Current (Note 25)
ISOURCE
25°C
12
16
-
mA
VOUT=0V
Short Circuit Current
Output Sink Current (Note 25)
ISINK
25°C
12
26
-
mA
VOUT=2.7V
Short Circuit Current
Slew Rate
SR
25°C
-
2.0
-
V/μs
CL=25pF
Gain Bandwidth
GBW
25°C
-
5.0
-
MHz
CL=25pF, AV=40dB
f=1MHz
Phase Margin
θ
25°C
-
50
-
deg
CL=25pF, AV=40dB
Gain Margin
GM
25°C
-
4.5
-
dB
CL=25pF, AV=40dB
Input Referred Noise Voltage
VN
25°C
-
30
-
HznV/
f=1kHz
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.01
-
%
VOUT=2.2VP-P, f=1kHz
RL=10kΩ
AV=0dB, DIN-AUDIO
Channel Separation
CS
25°C
-
100
-
dB
AV=40dB, VOUT=0.5Vrms
(Note 23) Absolute value
(Note 24) Full Range: TA=-40°C to +85°C
(Note 25) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
(Note 26) Output load resistance connects to a half of VDD.
Datasheet
www.rohm.com TSZ02201-0RAR0G200490-1-2
©2013 ROHM Co., Ltd. All rights reserved. 7/49 11.May.2015 Rev.006
TSZ22111･15･001
LMR821G LMR822xxx LMR824xxx
Electrical Characteristics - continued
○LMR822xxx (Unless otherwise specified VDD=+5.0V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Conditions
Min
Typ
Max
Input Offset Voltage (Note 27,28)
VIO
25°C
-
1
5
mV
VDD=2.5V to 5.5V
Full Range
-
-
5
Input Offset Voltage Drift
ΔVIO/ΔT
25°C
-
1
-
μV/°C
-
Input Offset Current (Note 27)
IIO
25°C
-
0.5
30
nA
-
Input Bias Current (Note 27)
IB
25°C
-
40
100
nA
-
Supply Current (Note 28)
IDD
25°C
-
650
850
μA
AV=0dB, V+IN=2.5V
Full Range
-
-
1200
Maximum Output Voltage(High)
VOH
25°C
4.75
4.84
-
V
RL=600Ω (Note 30)
4.85
4.90
-
RL=2kΩ (Note 30)
Maximum Output Voltage(Low)
VOL
25°C
-
170
250
mV
RL=600Ω (Note 30)
-
100
150
RL=2kΩ (Note 30)
Large Signal Voltage Gain
AV
25°C
-
105
-
dB
RL=600Ω (Note 30)
95
105
-
RL=2kΩ (Note 30)
Input Common-mode
Voltage Range
VICM
25°C
0
-
4.1
V
VSS to (VDD-0.9V)
Common-mode Rejection Ratio
CMRR
25°C
72
90
-
dB
-
Power Supply Rejection Ratio
PSRR
25°C
75
85
-
dB
VDD=2.7V to 5.5V
VICM=1V
Output Source Current (Note 29)
ISOURCE
25°C
20
45
-
mA
VOUT=0V
Short Circuit Current
Output Sink Current (Note 29)
ISINK
25°C
20
40
-
mA
VOUT=5V
Short Circuit Current
Slew Rate
SR
25°C
-
2.0
-
V/μs
CL=25pF
Gain Bandwidth
GBW
25°C
-
5.5
-
MHz
CL=25pF, AV=40dB
f=1MHz
Phase Margin
θ
25°C
-
50
-
deg
CL=25pF, AV=40dB
Gain Margin
GM
25°C
-
4.5
-
dB
CL=25pF, AV=40dB
Input Referred Noise Voltage
VN
25°C
-
30
-
HznV/
f=1kHz
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.01
-
%
VOUT=4.1VP-P, f=1kHz
RL=10kΩ
AV=0dB, DIN-AUDIO
Channel Separation
CS
25°C
-
100
-
dB
AV=40dB, VOUT=0.5Vrms
(Note 27) Absolute value
(Note 28) Full Range: TA=-40°C to +85°C
(Note 29) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
(Note 30) Output load resistance connects to a half of VDD.
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LMR821G LMR822xxx LMR824xxx
Electrical Characteristics - continued
○LMR824xxx (Unless otherwise specified VDD=+2.5V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Condition
Min.
Typ.
Max.
Input Offset Voltage (Note 31)
VIO
25°C
-
1
5
mV
VDD=2.5V to 5.5V
Full Range
-
-
5
Maximum Output Voltage(High)
VOH
25°C
2.30
2.37
-
V
RL=600Ω (Note 32)
2.40
2.46
-
RL=2kΩ (Note 32)
Maximum Output Voltage(Low)
VOL
25°C
-
130
200
mV
RL=600Ω (Note 32)
-
80
120
RL=2kΩ (Note 32)
(Note 31) Absolute value
(Note 32) Output load resistance connects to a half of VDD.
○LMR824xxx (Unless otherwise specified VDD=+2.7V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Condition
Min.
Typ.
Max.
Input Offset Voltage (Note 33,34)
VIO
25°C
-
1
5
mV
VDD=2.5V to 5.5V
Full Range
-
-
5
Input Offset Voltage Drift
ΔVIO/ΔT
25°C
-
1
-
μV/°C
-
Input Offset Current (Note 33)
IIO
25°C
-
0.5
30
nA
-
Input Bias Current (Note 33)
IB
25°C
-
30
90
nA
-
Supply Current (Note 34)
IDD
25°C
-
1120
1360
μA
AV=0dB, V+IN=1.35V
Full Range
-
-
2000
Maximum Output Voltage(High)
VOH
25°C
2.50
2.58
-
V
RL=600Ω (Note 36)
2.60
2.66
-
RL=2kΩ (Note 36)
Maximum Output Voltage(Low)
VOL
25°C
-
130
200
mV
RL=600Ω (Note 36)
-
80
120
RL=2kΩ (Note 36)
Large Signal Voltage Gain
AV
25°C
90
100
-
dB
RL=600Ω (Note 36)
95
100
-
RL=2kΩ (Note 36)
Input Common-mode
Voltage Range
VICM
25°C
0
-
1.8
V
VSS to (VDD-0.9V)
Common-mode Rejection Ratio
CMRR
25°C
70
85
-
dB
-
Power Supply Rejection Ratio
PSRR
25°C
75
85
-
dB
VDD=2.7V to 5.5V
VICM=1V
Output Source Current (Note 35)
ISOURCE
25°C
12
16
-
mA
VOUT=0V
Short Circuit Current
Output Sink Current (Note 35)
ISINK
25°C
12
26
-
mA
VOUT=2.7V
Short Circuit Current
Slew Rate
SR
25°C
-
2.0
-
V/μs
CL=25pF
Gain Bandwidth
GBW
25°C
-
5.0
-
MHz
CL=25pF, AV=40dB
f=1MHz
Phase Margin
θ
25°C
-
50
-
deg
CL=25pF, AV=40dB
Gain Margin
GM
25°C
-
4.5
-
dB
CL=25pF, AV=40dB
Input Referred Noise Voltage
VN
25°C
-
30
-
HznV/
f=1kHz
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.01
-
%
VOUT=2.2VP-P, f=1kHz
RL=10kΩ
AV=0dB, DIN-AUDIO
Channel Separation
CS
25°C
-
100
-
dB
AV=40dB, VOUT=0.5Vrms
(Note 33) Absolute value
(Note 34) Full Range: TA=-40°C to +85°C
(Note 35) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
(Note 36) Output load resistance connects to a half of VDD.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Electrical Characteristics - continued
○LMR824xxx (Unless otherwise specified VDD=+5V, VSS=0V)
Parameter
Symbol
Temperature
Range
Limits
Unit
Condition
Min.
Typ.
Max.
Input Offset Voltage (Note 37,38)
VIO
25°C
-
1
5
mV
VDD=2.5V to 5.5V
Full Range
-
-
5
Input Offset Voltage Drift
ΔVIO/ΔT
25°C
-
1
-
μV/°C
-
Input Offset Current (Note 37)
IIO
25°C
-
0.5
30
nA
-
Input Bias Current (Note 37)
IB
25°C
-
40
100
nA
-
Supply Current (Note 38)
IDD
25°C
-
1130
1700
μA
AV=0dB, V+IN=2.5V
Full Range
-
-
2400
Maximum Output
Voltage(High)
VOH
25°C
4.75
4.84
-
V
RL=600Ω (Note 40)
4.85
4.90
-
RL=2kΩ (Note 40)
Maximum Output
Voltage(Low)
VOL
25°C
-
170
250
mV
RL=600Ω (Note 40)
-
100
150
RL=2kΩ (Note 40)
Large Signal Voltage Gain
AV
25°C
-
105
-
dB
RL=600Ω (Note 40)
95
105
-
RL=2kΩ (Note 40)
Input Common-mode
Voltage Range
VICM
25°C
0
-
4.1
V
VSS to (VDD-0.9V)
Common-mode Rejection
Ratio
CMRR
25°C
72
90
-
dB
-
Power Supply Rejection Ratio
PSRR
25°C
75
85
-
dB
VDD=2.7V to 5.5V
VICM=1V
Output Source Current (Note 39)
ISOURCE
25°C
20
45
-
mA
VOUT=0V
Short Circuit Current
Output Sink Current (Note 39)
ISINK
25°C
20
40
-
mA
VOUT=5V
Short Circuit Current
Slew Rate
SR
25°C
1.4
2.0
-
V/μs
CL=25pF
Gain Bandwidth
GBW
25°C
-
5.5
-
MHz
CL=25pF, AV=40dB
f=1MHz
Phase Margin
θ
25°C
-
50
-
deg
CL=25pF, AV=40dB
Gain Margin
GM
25°C
-
4.5
-
dB
CL=25pF, AV=40dB
Input Referred Noise Voltage
VN
25°C
-
30
-
HznV/
f=1kHz
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.01
-
%
VOUT=4.1VP-P, f=1kHz
RL=10kΩ
AV=0dB, DIN-AUDIO
Channel Separation
CS
25°C
-
100
-
dB
AV=40dB, VOUT=0.5Vrms
(Note 37) Absolute value
(Note 38) Full Range: TA=-40°C to +85°C
(Note 39) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
(Note 40) Output load resistance connects to a half of VDD.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Description of Electrical Characteristics
Described below are the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that
the item names, symbols, and their meanings may differ from those of another manufacturer’s document or a general
document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the conditions which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration
of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between the non-inverting terminal and inverting terminal without
damaging the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration of
electrical characteristics. The input common-mode voltage range of the maximum ratings does not assure normal
operation of IC. For normal operation, use the IC within the input common-mode voltage range.
(4) Power Dissipation (Pd)
Indicates the power that can be consumed by the IC when mounted on a specific board at ambient temperature (normal
temperature), 25°C. As for the packaged product, Pd is determined by the temperature that can be permitted by the IC
in the package (maximum junction temperature) and thermal resistance of the package.
2. Electrical Characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between the non-inverting terminal and inverting terminal. It can be translated to the
input voltage difference required for setting the output voltage to 0 V.
(2) Input Offset Voltage Drift (△VIO/△T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
(3) Input Offset Current (IIO)
Indicates the difference of input bias current between non-inverting and inverting terminals.
(4) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the
non-inverting and inverting terminals.
(5) Supply Current (IDD)
Indicates the current that that is consumed by the IC under specified no-load conditions.
(6) Maximum Output Voltage (High) / Maximum Output Voltage (Low) (VOH/VOL)
Indicates the output voltage range under a specified load condition. It can be differentiated to maximum output voltage
high and low. Maximum output voltage high indicates the upper limit of the output voltage, and maximum output
voltage low indicates the lower limit.
(7) Large Signal Voltage Gain (AV)
Indicates the amplification rate (gain) of output voltage against the voltage difference between the non-inverting and
inverting terminal. It is normally the amplification rate (gain) in reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(8) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range at which the IC operates normally.
(9) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage to the change of common-mode input voltage.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(10) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage to the change in supply voltage.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
(11) Output Source Current/ Output Sink Current (ISOURCE / ISINK)
The maximum current that the IC can output under specific conditions. The output source current indicates the current
flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(12) Slew Rate (SR)
Indicates the rate of the change in output voltage with time when a step input signal is applied.
(13) Gain Band Width (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases by 6dB/octave.
(14) Phase Margin (θ)
Indicates the margin of phase from 180° phase lag at unity gain frequency.
(15) :Gain Margin (GM)
Indicates the difference between 0dB and gain where the operational amplifier has 180° phase delay.
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LMR821G LMR822xxx LMR824xxx
(16) Total Harmonic Distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
(17) Input Referred Noise Voltage (VN)
Indicates the noise voltage generated inside the operational amplifier equivalent to an ideal voltage source connected
in series with input terminal.
(18) Channel Separation (CS)
Indicates the fluctuation of the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves
○LMR821G
200
250
300
350
400
-50 -25 0 25 50 75 100
Supply Current [μA]
Ambient Temperature [°C]
0
1
2
3
4
5
6
2 3 4 5 6
Maximum Output Voltage (High) [V]
Supply Voltage [V]
0.0
0.2
0.4
0.6
0.8
025 50 75 100 125 150
Power Dissipation [W]
Ambient Temperature [°C]
Figure 2. Supply Current vs Supply Voltage
2.7V
5.0V
Figure 3. Supply Current vs Ambient
Temperature
Figure 1. Power Dissipation vs Ambient
Temperature (Derating Curve)
85
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Figure 4. Maximum Output Voltage (High) vs
Supply Voltage (RL=2kΩ)
-40°C
25°C
85°C
LMR821G
G
200
250
300
350
400
2 3 4 5 6
Supply Current [uA]
Supply Voltage [V]
-40°C
25°C
85°C
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR821G
0
1
2
3
4
5
6
-50 -25 0 25 50 75 100
Maximum Output Voltage (High) [V]
Ambient Temperature [°C]
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Maximum Output Voltage (Low) [mV]
Ambient Temperature [°C]
0
5
10
15
20
25
30
0 1 2 3
Output Source Current [mA]
Output Voltage [V]
0
10
20
30
40
50
60
70
80
90
100
2 3 4 5 6
Maximum Output Voltage (Low) [mV]
Supply Voltage [V]
-40°C
25°C
85°C
-40°C
25°C
85°C
Figure 8. Output Source Current vs Output
Voltage (VDD=2.7V)
Figure 5. Maximum Output Voltage (High) vs
Ambient Temperature (RL=2kΩ)
5.0V
2.7V
Figure 6. Maximum Output Voltage (Low) vs
Supply Voltage (RL=2kΩ)
Figure 7. Maximum Output Voltage (Low) vs
Ambient Temperature (RL=2kΩ)
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR821G
0
5
10
15
20
25
30
35
40
0 1 2 3
Output Sink Current [mA]
Output Voltage [V]
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Output Sink Current [mA]
Ambient Temperature [°C]
-4
-3
-2
-1
0
1
2
3
4
23456
Input Offset Voltage [mV]
Supply Voltage [V]
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Output Source Current [mA]
Ambient Temperature [°C]
Figure 9. Output Source Current vs Ambient
Temperature
-40°C
25°C
85°C
Figure 10. Output Sink Current vs Output
Voltage (VDD=2.7V)
Figure 11. Output Sink Current vs Ambient
Temperature
Figure 12. Input Offset Voltage vs Supply
Voltage (VICM=VDD/2, EK=-VDD/2)
25°C
-40°C
85°C
5.0V
2.7V
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR821G
-4
-3
-2
-1
0
1
2
3
4
-1 0 1 2 3
Input Offset Voltage [mV]
Input Voltage [V]
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100
Large Signal Voltage Gain [dB]
Ambient Temperature [°C]
80
90
100
110
120
130
140
2 3 4 5 6
Large Signal Voltage Gain [dB]
Supply Voltage [V]
-4
-3
-2
-1
0
1
2
3
4
-50 -25 0 25 50 75 100
Input Offset Voltage [mV]
Ambient Temperature [°C]
-40°C
25°C
85°C
Figure 14. Input Offset Voltage vs Input
Voltage (VDD=2.7V)
Figure 13. Input Offset Voltage vs Ambient
Temperature (VICM=VDD/2, EK=-VDD/2)
Figure 16. Large Signal Voltage Gain vs
Ambient Temperature
-40°C
25°C
85°C
Figure 15. Large Signal Voltage Gain vs
Supply Voltage
5.0V
2.7V
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR821G
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100
Slew Rate L-H [V/μs]
Ambient Temperature [°C]
80
90
100
110
120
130
140
2 3 4 5 6
Common-mode Rejection Ratio [dB]
Supply Voltage [V]
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100
Common-mode Rejection Ratio [dB]
Ambient Temperature [°C]
Figure 17. Common-mode Rejection Ratio vs
Supply Voltage (VDD=2.7V)
Figure 19. Power Supply Rejection Ratio vs
Ambient Temperature (VDD=2.7V to 5.0V)
Figure 18. Common-mode Rejection Ratio vs
Ambient Temperature
Figure 20. Slew Rate L-H vs Ambient
Temperature
5.0V
2.7V
-40°C
25°C
85°C
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100
Power Supply Rejection Ratio [dB]
Ambient Temperature [°C]
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR821G
0
50
100
150
200
0
20
40
60
80
100
1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
Phase [deg]
Voltage Gain [dB]
Frequency [Hz]
103 104 105 106 107 108
Figure 22. Voltage Gain・Phase vs Frequency
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100
Slew Rate H-L [V/μs]
Ambient Temperature [°C]
Figure 21. Slew Rate H-L vs Ambient
Temperature
Phase
Gain
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR822xxx
400
450
500
550
600
650
700
750
800
2 3 4 5 6
Supply Current [uA]
Supply Voltage [V]
2
3
4
5
6
23456
Maximum Output Voltage (High) [V]
Supply Voltage [V]
400
500
600
700
800
-50 -25 0 25 50 75 100
Supply Current [μA]
Ambient Temperature [°C]
-40°C
25°C
85°C
Figure 24. Supply Current vs Supply Voltage
2.7V
5.0V
Figure 25.
Supply Current vs Ambient Temperature
0.0
0.2
0.4
0.6
0.8
025 50 75 100 125 150
Power Dissipation [W]
Ambient Temperature [°C]
Figure 23. Power Dissipation vs Ambient
Temperature (Derating Curve)
85
Figure 26. Maximum Output Voltage (High) vs
Supply Voltage (RL=2kΩ)
-40°C
25°C
85°C
LMR822F
LMR822FJ
LMR822FV
LMR822FVT
LMR822FVM
LMR822FVJ
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR822xxx
0
5
10
15
20
25
30
0 1 2 3
Output Source Current [mA]
Output Voltage [V]
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Maximum Output Voltage (Low) [mV]
Ambient Temperature [°C]
0
10
20
30
40
50
60
70
80
90
100
2 3 4 5 6
Maximum Output Voltage (Low) [mV]
Supply Voltage [V]
0
1
2
3
4
5
6
-50 -25 0 25 50 75 100
Maximum Output Voltage (High) [V]
Ambient Temperature [°C]
-40°C
25°C
85°C
-40°C
25°C
85°C
Figure 30. Output Source Current vs Output
Voltage (VDD=2.7V)
Figure 27. Maximum Output Voltage (High) vs
Ambient Temperature (RL=2kΩ)
5.0V
2.7V
Figure 28. Maximum Output Voltage (Low) vs
Supply Voltage (RL=2kΩ)
Figure 29. Maximum Output Voltage (Low) vs
Ambient Temperature (RL=2kΩ)
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR822xxx
0
5
10
15
20
25
30
35
40
0 1 2 3
Output Sink Current [mA]
Output Voltage [V]
Figure 31. Output Source Current vs Ambient
Temperature
-4
-3
-2
-1
0
1
2
3
4
23456
Input Offset Voltage [mV]
Supply Voltage [V]
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Output Sink Current [mA]
Ambient Temperature [°C]
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Output Source Current [mA]
Ambient Temperature [°C]
85°C
-40°C
25°C
Figure 32. Output Sink Current vs Output
Voltage (VDD=2.7V)
Figure 33. Output Sink Current vs Ambient
Temperature
Figure 34. Input Offset Voltage vs Supply
Voltage (VICM=VDD/2, EK=-VDD/2)
25°C
-40°C
85°C
5.0V
2.7V
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR822xxx
-4
-3
-2
-1
0
1
2
3
4
-1 0123
Input Offset Voltage [mV]
Input Voltage [V]
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100
Large Signal Voltage Gain [dB]
Ambient Temperature [°C]
80
90
100
110
120
130
140
23456
Large Signal Voltage Gain [dB]
Supply Voltage [V]
-4
-3
-2
-1
0
1
2
3
4
-50 -25 0 25 50 75 100
Input Offset Voltage [mV]
Ambient Temperature [°C]
-40°C
25°C
85°C
Figure 36. Input Offset Voltage vs Input
Voltage (VDD=2.7V)
Figure 35. Input Offset Voltage vs Ambient
Temperature (VICM=VDD/2, EK=-VDD/2)
Figure 38. Large Signal Voltage Gain vs
Ambient Temperature
-40°C
25°C
85°C
Figure 37. Large Signal Voltage Gain vs
Supply Voltage
5.0V
2.7V
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR822xxx
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100
Slew Rate L-H [V/μs]
Ambient Temperature [°C]
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100
Common-mode Rejection Ratio [dB]
Ambient Temperature [°C]
80
90
100
110
120
130
140
2 3 4 5 6
Common-mode Rejection Ratio [dB]
Supply Voltage [V]
-40°C
25°C
85°C
Figure 41. Power Supply Rejection Ratio vs
Ambient Temperature (VDD=2.7V to 5.0V)
Figure 40. Common-mode Rejection Ratio vs
Ambient Temperature
Figure 42. Slew Rate L-H vs Ambient
Temperature
5.0V
2.7V
5.0V
2.7V
Figure 39. Common-mode Rejection Ratio vs
Supply Voltage (VDD=2.7V)
(*)The data above are measurement values of a typical sample, it is not guaranteed.
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100
Power Supply Rejection Ratio [dB]
Ambient Temperature [°C]
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR822xxx
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100
Slew Rate H-L [V/μs]
Ambient Temperature [°C]
0
50
100
150
200
0
20
40
60
80
100
1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
Phase [deg]
Voltage Gain [dB]
Frequency [Hz]
Figure 43. Slew Rate H-L vs Ambient
Temperature
Phase
Gain
Figure 44. Voltage Gain・Phase vs Frequency
5.0V
2.7V
103 104 105 106 107 108
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR824xxx
2
2.5
3
3.5
4
4.5
5
5.5
6
2 3 4 5 6
Maximum Output Voltage (High) [V]
Supply Voltage [V]
800
900
1000
1100
1200
1300
1400
1500
1600
2 3 4 5 6
Supply Current [uA]
Supply Voltage [V]
800
900
1000
1100
1200
1300
1400
1500
1600
-50 -25 0 25 50 75 100
Supply Current [μA]
Ambient Temperature [°C]
0.0
0.4
0.8
1.2
025 50 75 100 125 150
Power Dissipation [W]
Ambient Temperature [°C]
-40°C
25°C
85°C
Figure 46. Supply Current vs Supply Voltage
Figure 47. Supply Current vs Ambient
Temperature
Figure 48. Maximum Output Voltage (High) vs
Supply Voltage (RL=2kΩ)
-40°C
25°C
Figure 45. Power Dissipation vs Ambient
Temperature (Derating Curve)
85°C
2.7V
5.0V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
85
LMR824FVJ
LMR824F
LMR824FJ
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR824xxx
0
5
10
15
20
25
30
0 1 2 3
Output Source Current [mA]
Output Voltage [V]
0
20
40
60
80
100
120
-50 -25 0 25 50 75 100
Maximum Output Voltage (Low) [mV]
Ambient Temperature [°C]
0
20
40
60
80
100
2 3 4 5 6
Maximum Output Voltage (Low) [mV]
Supply Voltage [V]
0
1
2
3
4
5
6
-50 -25 0 25 50 75 100
Maximum Output Voltage (High)
Ambient Temperature [°C]
Figure 52. Output Source Current vs Output
Voltage (VDD=2.7V)
Figure 51. Maximum Output Voltage (Low) vs
Ambient Temperature (RL=2kΩ)
Figure 50. Maximum Output Voltage (Low) vs
Supply Voltage (RL=2kΩ)
Figure 49. Maximum Output Voltage (High) vs
Ambient Temperature (RL=2kΩ)
-40°C
2.7V
5.0V
25°C
-40°C
85°C
25°C
85°C
(*)The data above are measurement values of a typical sample, it is not guaranteed.
2.7V
5.0V
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR824xxx
-4
-3
-2
-1
0
1
2
3
4
23456
Input Offset Voltage [mV]
Supply Voltage [V]
0
5
10
15
20
25
30
35
40
0 1 2 3
Output Sink Current [mA]
Output Voltage [V]
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Output Sink Current [mA]
Ambient Temperature [°C]
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Output Source Current [mA]
Ambient Temperature [°C]
Figure 53. Output Source Current vs Ambient
Temperature
-40°C
25°C
85°C
Figure 54. Output Sink Current vs Output
Voltage (VDD=2.7V)
Figure 55. Output Sink Current vs Ambient
Temperature
Figure 56. Input Offset Voltage vs Supply
Voltage (VICM=VDD/2, EK=-VDD/2)
25°C
-40°C
85°C
5.0V
2.7V
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR824xxx
-4
-3
-2
-1
0
1
2
3
4
-1 0 1 2 3
Input Offset Voltage [mV]
Input Voltage [V]
Figure 57. Input Offset Voltage vs Ambient
Temperature (VICM=VDD/2, EK=-VDD/2)
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100
Large Signal Voltage Gain [dB]
Ambient Temperature [°C]
80
90
100
110
120
130
140
2 3 4 5 6
Large Signal Voltage Gain [dB]
Supply Voltage [V]
-4
-3
-2
-1
0
1
2
3
4
-50 -25 0 25 50 75 100
Input Offset Voltage [mV]
Ambient Temperature [°C]
-40°C
25°C
85°C
Figure 58. Input Offset Voltage vs Input
Voltage (VDD=2.7V)
Figure 60. Large Signal Voltage Gain vs
Ambient Temperature
-40°C
25°C
85°C
Figure 59. Large Signal Voltage Gain vs
Supply Voltage
5.0V
2.7V
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR824xxx
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100
Slew Rate L-H [V/μs]
Ambient Temperature [°C]
Figure 62. Common-mode Rejection Ratio vs
Ambient Temperature
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100
Common-mode Rejection Ratio [dB]
Ambient Temperature [°C]
80
90
100
110
120
130
140
2 3 4 5 6
Common-mode Rejection Ratio [dB]
Supply Voltage [V]
-40°C
25°C
85°C
Figure 61. Common-mode Rejection Ratio vs
Supply Voltage (VDD=2.7V)
Figure 63. Power Supply Rejection Ratio vs
Ambient Temperature (VDD=2.7V to 5.0V)
Figure 64. Slew Rate L-H vs Ambient
Temperature
5.0V
2.7V
5.0V
2.7V
(*)The data above are measurement values of a typical sample, it is not guaranteed.
0
20
40
60
80
100
120
140
160
180
200
-50 -25 0 25 50 75 100
Power Supply Rejection Ratio [dB]
Ambient Temperature [°C]
Datasheet
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LMR821G LMR822xxx LMR824xxx
Typical Performance Curves – continued
○LMR824xxx
Figure 66. Voltage Gain・Phase vs Frequency
0
50
100
150
200
0
20
40
60
80
100
1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
Phase [deg]
Voltage Gain [dB]
Frequency [Hz]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100
Slew Rate H-L [V/μs]
Ambient Temperature [°C]
Figure 65. Slew Rate H-L vs Ambient
Temperature
Phase
Gain
5.0V
2.7V
103 104 105 106 107 108
(*)The data above are measurement values of a typical sample, it is not guaranteed.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Application Information
NULL method condition for Test Circuit 1
VDD, VSS, EK, VICM Unit:V
Parameter
VF
S1
S2
S3
VDD
VSS
EK
VICM
Calculation
Input Offset Voltage
VF1
ON
ON
OFF
5
0
-2.5
2.5
1
Large Signal Voltage Gain
VF2
ON
ON
ON
2.7
0
-0.5
1.35
2
VF3
-2.1
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
VF4
ON
ON
OFF
2.7
0
-1.35
0
3
VF5
1.8
Power Supply Rejection Ratio
VF6
ON
ON
OFF
2.5
0
-1.2
0
4
VF7
5.0
－ Calculation－
1. Input Offset Voltage (VIO)
2. Large Signal Voltage Gain (AV)
3. Common-mode Rejection Ratio (CMRR)
4. Power Supply Rejection Ratio (PSRR)
Figure 67. Test Circuit1
VDD
RF=50kΩ
RI=10kΩ
0.1µF
RS=50Ω
RL
SW2
500kΩ
500kΩ
0.01µF
EK
15V
DUT
VSS
VRL
50kΩ
VICM
SW1
0.1µF
RI=10kΩ
Vout
VF
RS=50Ω
1000pF
0.1µF
-15V
NULL
SW3
ΔVDD × (1+ RF/RS)
VIO
|VF1|
=
1+RF/RS
[V]
Av
|VF2-VF3|
=
ΔEK × (1+RF/RS)
[dB]
20Log
CMRR
|VF4 - VF5|
=
ΔVICM × (1+RF/RS)
[dB]
20Log
PSRR
|VF6 - VF7|
=
[dB]
20Log
Datasheet
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LMR821G LMR822xxx LMR824xxx
Application Information - continued
Switch Condition for Test Circuit 2
SW No.
SW1
SW2
SW3
SW4
SW5
SW6
SW7
SW8
SW9
SW10
SW11
SW12
Supply Current
OFF
OFF
ON
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
Maximum Output Voltage RL=10kΩ
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
Output Current
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
Slew Rate
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
ON
OFF
OFF
ON
Unity Gain Frequency
ON
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
OFF
OFF
ON
Figure 69. Slew Rate Input and Output Wave
VH
VL
Input Wave
t
Input Voltage
VH
VL
Δt
ΔV
Output Wave
SR=ΔV/Δt
t
Output Voltage
90%
10%
Figure 68. Test Circuit 2
SW3
●
SW1
SW2
－
＋
SW9
SW10
SW11
SW8
SW5
SW6
SW7
CL
SW12
SW4
R1=
1kΩ
R2=100kΩ
RL
VSS
VDD=3V
Vo
-IN
+IN
Figure 70. Test Circuit 3 (Channel Separation)
R1=1kΩ
R2=100kΩ
VDD
VSS
OUT1=0.5Vrms
IN
R1//R2
R2=100kΩ
R1=1kΩ
VDD
VSS
OUT2
R1//R2
CS=20Log
100×OUT1
OUT2
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LMR821G LMR822xxx LMR824xxx
Application Example
○Voltage Follower
○Inverting Amplifier
○Non-inverting Amplifier
Figure 72. Inverting Amplifier Circuit
Figure 73. Non-inverting Amplifier Circuit
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
VOUT=-(R2/R1)・VIN
This circuit has input impedance equal to R1.
For non-inverting amplifier, input voltage (IN) is amplified
by a voltage gain, which depends on the ratio of R1 and
R2. The output voltage (OUT) is in-phase with the input
voltage (IN) and is shown in the expression below:
VOUT=(1 + R2/R1)・VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
Figure 71. Voltage Follower
Voltage gain is 0dB.
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage (VOUT) due to high input
impedance and low output impedance. Computation for
output voltage (VOUT) is shown below.
VOUT=VIN
VSS
VOUT
VIN
VDD
VSS
R
2
VDD
VIN
VOUT
R
1
R
2
R
1
VSS
R
1
//
R
2
VIN
VOUT
VDD
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85
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to rise above the ambient temperature. There is an allowable
temperature that the IC can handle, and this depends on the circuit configuration, manufacturing process, and consumable
power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal
resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 74(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(Pd).
θJA = (TJmax－TA) / Pd °C/W
The derating curve in Figure 74(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by thermal resistance
(θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity,
etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figures 74(c), 74(d), and 74(e) show the example of the derating curves for LMR821G,
LMR822xxx, and LMR824xxx.
0.0
0.2
0.4
0.6
0.8
025 50 75 100 125 150
Power Dissipation [W]
Ambient Temperature [°C]
(c) LMR821G
(d) LMR822xxx
LMR821G (Note 41)
0.0
0.2
0.4
0.6
0.8
025 50 75 100 125 150
Power Dissipation [W]
Ambient Temperature [°C]
LMR822F (Note 42)
LMR822FJ (Note 41)
LMR822FV (Note 43)
LMR822FVT (Note 43)
LMR822FVM (Note 44)
LMR822FVJ (Note 44)
85
θJA=(Tjmax-TA)/ Pd °C/W
Ambient Temperature, TA [ °C ]
Chip Surface Temperature, TJ [ °C ]
(a) Thermal Resistance
(b) Derating Curve
Ambient Temperature, TA [ °C ]
Power Dissipation of LSI [W]
Pdmax
θJA2 < θJA1
0
50
75
100
125
150
25
P1
P2
θJA2
θJA1
TJmax
Power Dissipation of IC
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LMR821G LMR822xxx LMR824xxx
When
using
the unit above TA=25°C, subtract the value above per °C. Power dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted.
(Note 41)
(Note 42)
(Note 43)
(Note 44)
(Note 45)
(Note 46)
(Note 47)
Unit
5.4
5.5
5.0
4.7
4.5
8.2
6.8
mW/°C
0.0
0.4
0.8
1.2
025 50 75 100 125 150
Power Dissipation [W]
Ambient Temperature [°C]
Figure 74. Thermal Resistance and Derating Curve
LMR824F (Note 45)
85
(e) LMR824xxx
LMR824FJ (Note 46)
LMR824FVJ (Note 47)
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LMR821G LMR822xxx LMR824xxx
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
A rise in temperature that causes the chip to exceed its power dissipation rating may result in deterioration of the
properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on
a 70mm x 70mm x 1.6mm glass epoxy board. In case the absolute maximum rating is exceeded, increase the board
size and copper area to prevent exceeding the PD rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. In-rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result to
IC damage. Avoid adjacent pins from being shorted to each other, especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in a very humid environment),
and unintentional solder bridge deposited in between pins during assembly.
Datasheet
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LMR821G LMR822xxx LMR824xxx
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When VSS > Pin A and VSS > Pin B, the P-N junction operates as a parasitic diode.
When VSS > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the VSS voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 75. Example of Monolithic IC Structure
12. Unused Circuits
When there are unused op-amps, it is recommended that they are
connected as in Figure 76, setting the non-inverting input terminal to a
potential within the –IN phase input voltage range (VICM).
13. Input Voltage
Applying VSS-0.3V to VDD+0.3V to the input terminal is possible without
causing deterioration of the electrical characteristics or destruction.
However, this does not ensure normal circuit operation. Please note that
the circuit operates normally only when the input voltage is within the
common mode input voltage range of the electric characteristics.
14. Power Supply (Single/Dual)
The operational amplifiers operate as long as voltage is supplied between VDD and VSS. Therefore, the single supply
operational amplifiers can be used as dual supply operational amplifiers as well.
15. Output Capacitor
If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into
the output pin and may destroy the IC when the VCC pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1µF between output pin and VSS pin.
16. Oscillation by Output Capacitor
Pay attention to the oscillation by caused by the output capacitor and in designing an application of negative feedback
loop circuit with these ICs.
17. Latch-up
Be careful not to set the input voltage higher than VDD or lower than VSS because a peculiar latch-up state in CMOS
device might occur. In addition, protect the IC from any abormal noise.
18. Decoupling Capacitor
Insert a decoupling capacitor between VDD and VSS.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
Figure 76. Example of Application
Circuit for Unused Op-Amp
Keep this potential
in VICM
VSS
VDD
VICM
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LMR821G LMR822xxx LMR824xxx
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP8
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
(Max 5.35 (include.BURR))
Datasheet
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LMR821G LMR822xxx LMR824xxx
Marking Diagram
Part Number Marking
SSOP5(TOP VIEW)
LOT Number
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SOP-J8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B8J(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SOP14(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SOP-J14(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B14J (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Datasheet
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LMR821G LMR822xxx LMR824xxx
Marking Diagram - continued
Land Pattern Data All dimensions in mm
PKG
Land pitch
e
Land space
MIE
Land length
≥ℓ 2
Land width
b2
SSOP5
0.95
2.4
1.0
0.6
SOP8
SOP14
1.27
4.60
1.10
0.76
SOP-J8
SOP-J14
1.27
3.90
1.35
0.76
SSOP-B8
TSSOP-B8
TSSOP-B14J
0.65
4.60
1.20
0.35
MSOP8
0.65
2.62
0.99
0.35
TSSOP-B8J
0.65
3.20
1.15
0.35
Product Name
Package Type
Marking
LMR821
G
SSOP5
L3
LMR822
F
SOP8
L822
FJ
SOP-J8
R822
FV
SSOP-B8
R822
FVT
TSSOP-B8
R822
FVM
MSOP8
R822
FVJ
TSSOP-B8J
R822
F
SOP14
LMR824F
LMR824
FJ
SOP-J14
LMR824FJ
FVJ
TSSOP-B14J
R824
SOP8, SOP-J8, SSOP-B8, MSOP8, TSSOP-B8, TSSOP-B8J,
SOP14, SOP-J14, TSSOP-B14J
MIE
ℓ2
b2
e
SSOP5
?
e
e
ℓ2
b2
MIE
Datasheet
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LMR821G LMR822xxx LMR824xxx
Revision History
Date
Revision
Changes
18.Jan.2013
001
New Release
2.Aug.2013
002
LMR822F is added.
15.Oct.2013
003
The Limit value change of LMR822F (MAX value change in Input Offset Voltage.)
3.Dec.2013
004
LMR822FJ, LMR822FV, LMR822FVT, LMR822FVM, and LMR822FVJ added
10.Oct.2014
005
LMR824F is added.
11.May.2015
006
LMR824FJ, and LMR824FVJ are added.
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Po wer Dissipation (P d) depe nding on Ambient temper ature (Ta). When us ed in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for fai lure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be i n any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the pl aces where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier ba g. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
