Absolute Maximum Ratings (Note 8)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Total Supply Voltage 36V
Output to Negative Supply Voltage 36V
Ground to Negative Supply Voltage 25V
Ground to Positive Supply Voltage 18V
Differential Input Voltage ±5V
Input Voltage (Note 2) ±15V
ESD rating (1.5 kΩin series with
100 pF) 800V
Power Dissipation (Note 3) 500 mW
Output Short Circuit Duration 10 sec
Storage Temperature Range −65˚C to 150˚C
Lead Temperature
(Soldering, 10 sec.) 260˚C
Soldering Information
Dual-In-Line Package
Soldering (10 seconds) 260˚C
Small Outline Package
Vapor Phase (60 seconds) 215˚C
Infrared (15 seconds) 220˚C
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
Operating Temperature Range
LM119 −55˚C to 125˚C
LM219 −25˚C to 85˚C
Electrical Characteristics (Note 4)
Parameter Conditions LM119/LM219 Units
Min Typ Max
Input Offset Voltage (Note 5) T
A
=25˚C, R
S
≤5k 0.7 4.0 mV
Input Offset Current (Note 5) T
A
=25˚C 30 75 nA
Input Bias Current T
A
=25˚C 150 500 nA
Voltage Gain T
A
=25˚C (Note 7) 10 40 V/mV
Response Time (Note 6) T
A
=25˚C, V
S
=±15V 80 ns
Saturation Voltage V
IN
≤−5 mV, I
OUT
=25 mA
T
A
=25˚C 0.75 1.5 V
Output Leakage Current V
IN
≥5 mV, V
OUT
=35V
T
A
=25˚C 0.2 2 µA
Input Offset Voltage (Note 5) R
S
≤5k 7 mV
Input Offset Current (Note 5) 100 nA
Input Bias Current 1000 nA
Input Voltage Range V
S
=±15V −12 ±13 +12 V
V
+
=5V, V
−
=013V
Saturation Voltage V
+
≥4.5V, V
−
=0
V
IN
≤−6 mV, I
SINK
≤3.2 mA
T
A
≥0˚C 0.23 0.4 V
T
A
≤0˚C 0.6 V
Output Leakage Current V
IN
≥5 mV, V
OUT
=35V, 1 10 µA
V
−
=V
GND
=0V
Differential Input Voltage ±5V
Positive Supply Current T
A
=25˚C, V
+
=5V, V
−
=0 4.3 mA
Positive Supply Current T
A
=25˚C, V
S
=±15V 8 11.5 mA
Negative Supply Current T
A
=25˚C, V
S
=±15V 3 4.5 mA
Note 2: For supply voltages less than ±15V the absolute maximum input voltage is equal to the supply voltage.
Note 3: The maximum junction temperature of the LM119 is 150˚C, while that of the LM219 is 110˚C. For operating at elevated temperatures, devices in the H10
package must be derated based on a thermal resistance of 160˚C/W, junction to ambient, or 19˚C/W, junction to case. The thermal resistance of the J14 and N14
packages is 100˚C/W, junction to ambient.
Note 4: These specifications apply for VS=±15V, and the Ground pin at ground, and −55˚C ≤TA≤+125˚C, unless otherwise stated. With the LM219, however, all
temperature specifications are limited to −25˚C ≤TA≤+85˚C. The offset voltage, offset current and bias current specifications apply for any supply voltage from a
single 5V supply up to ±15V supplies. Do not operate the device with more than 16V from ground to VS.
Note 5: The offset voltages and offset currents given are the maximum values required to drive the output within a volt of either supply witha1mAload. Thus, these
parameters define an error band and take into account the worst case effects of voltage gain and input impedance.
Note 6: The response time specified (see definitions) is for a 100 mV input step with 5 mV overdrive.
Note 7: Output is pulled up to 15V through a 1.4 kΩresistor.
Note 8: Refer to RETS119X for LM119H/883 and LM119J/883 specifications.
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