PMEG2010AEJ 20 V, 1 A very low VF MEGA Schottky barrier rectifier in SOD323F package Rev. 02 -- 14 October 2005 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) very small and flat lead Surface Mounted Device (SMD) plastic package. 1.2 Features Forward current: 1 A Reverse voltage: 20 V Very low forward voltage Very small and flat lead SMD plastic package 1.3 Applications Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Inverse polarity protection Low power consumption applications 1.4 Quick reference data Table 1: Quick reference data Symbol Parameter Conditions IF forward current Tsp 55 C VR reverse voltage VF forward voltage [1] Pulse test: tp 300 s; 0.02. IF = 1000 mA Min [1] Typ Max Unit - - 1 A - - 20 V - 480 550 mV PMEG2010AEJ Philips Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 2. Pinning information Table 2: Pinning Pin Description 1 cathode 2 anode Simplified outline Symbol [1] 1 1 2 2 sym001 [1] The marking bar indicates the cathode. 3. Ordering information Table 3: Ordering information Type number PMEG2010AEJ Package Name Description Version SC-90 plastic surface mounted package; 2 leads SOD323F 4. Marking Table 4: Marking codes Type number Marking code PMEG2010AEJ EM 5. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VR reverse voltage Max Unit - 20 V IF forward current Tsp 55 C - 1 A IFRM repetitive peak forward current tp 1 ms; 0.25 - 5.5 A IFSM non-repetitive peak forward current square wave; tp = 8 ms - 10 A Ptot total power dissipation Tamb 25 C [1] - 360 mW [2] - 830 mW Tj junction temperature - 150 C Tamb ambient temperature -65 +150 C Tstg storage temperature -65 +150 C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. PMEG2010AEJ_2 Product data sheet Min (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 -- 14 October 2005 2 of 9 PMEG2010AEJ Philips Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 6. Thermal characteristics Table 6: Thermal characteristics Symbol Parameter Rth(j-a) Rth(j-sp) Conditions thermal resistance from junction to ambient in free air thermal resistance from junction to solder point Min Typ Max Unit [1] [2] - - 350 K/W [1] [3] - - 150 K/W [4] - - 55 K/W [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating are available on request. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Solder point of cathode tab. 7. Characteristics Table 7: Characteristics Tamb = 25 C unless otherwise specified. Symbol VF IR Cd [1] Parameter Conditions Min Typ Max Unit IF = 10 mA - 240 270 mV IF = 100 mA - 300 350 mV IF = 500 mA - 400 460 mV IF = 1000 mA - 480 550 mV [1] forward voltage reverse current diode capacitance VR = 5 V - 5 10 A VR = 8 V - 7 20 A VR = 10 V - 8 30 A VR = 15 V - 10 50 A VR = 20 V - 15 70 A VR = 1 V; f = 1 MHz - 40 50 pF Pulse test: tp 300 s; 0.02. PMEG2010AEJ_2 Product data sheet (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 -- 14 October 2005 3 of 9 PMEG2010AEJ Philips Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 006aaa361 104 IF (mA) 103 (1) (2) 103 (1) 102 006aaa362 105 IR (A) 104 (2) (3) 102 10 (4) 10 1 (3) 1 (4) 10-1 (5) 10-1 (5) 10-2 10-2 10-3 0 0.1 0.2 0.3 0.4 0.5 0 0.6 0.7 VF (V) 5 10 15 20 VR (V) (1) Tamb = 150 C (1) Tamb = 150 C (2) Tamb = 125 C (2) Tamb = 125 C (3) Tamb = 85 C (3) Tamb = 85 C (4) Tamb = 25 C (4) Tamb = 25 C (5) Tamb = -40 C (5) Tamb = -40 C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values 006aaa363 80 Cd (pF) 60 40 20 0 0 5 10 15 20 VR (V) Tamb = 25 C; f = 1 MHz Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2010AEJ_2 Product data sheet (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 -- 14 October 2005 4 of 9 PMEG2010AEJ Philips Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 8. Package outline 1.35 1.15 0.80 0.65 0.5 0.3 1 2.7 2.3 1.8 1.6 2 0.40 0.25 0.25 0.10 Dimensions in mm 04-09-13 Fig 4. Package outline SOD323F (SC-90) 9. Packing information Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number PMEG2010AEJ [1] Package SOD323F Description Packing quantity 4 mm pitch, 8 mm tape and reel 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 17. 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2x) 001aab169 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 5. Reflow soldering footprint SOD323F (SC-90) PMEG2010AEJ_2 Product data sheet (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 -- 14 October 2005 5 of 9 PMEG2010AEJ Philips Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 11. Mounting 43.4 43.4 10 0.6 10 0.6 0.6 40 40 0.6 0.6 0.5 0.5 Dimensions in mm 0.6 006aaa487 PCB thickness: d = 1.6 mm Fig 6. FR4 PCB, standard footprint SOD323F (SC-90) PMEG2010AEJ_2 Product data sheet Dimensions in mm 006aaa488 PCB thickness: d = 1.6 mm Fig 7. FR4 PCB, mounting pad for cathode 1 cm2 SOD323F (SC-90) (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 -- 14 October 2005 6 of 9 PMEG2010AEJ Philips Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 12. Revision history Table 9: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes PMEG2010AEJ_2 20051014 Product data sheet - - PMEG2010AEJ_1 Modifications: PMEG2010AEJ_1 * * * * * * * * * * * Section 1.1 "General description": amended Section 1.2 "Features": amended Section 1.3 "Applications": amended Table 5 "Limiting values": IFSM non-repetitive peak forward current condition amended Table 5 "Limiting values": typing error for value Ptot total power dissipation corrected Table 6 "Thermal characteristics": Table note 1 amended Table 6: Table note 4 added to Rth(j-sp) thermal resistance from junction to solder point Figure 4 "Package outline SOD323F (SC-90)": superseded by minimized package outlines Table 8 "Packing methods": table description amended Section 11 "Mounting": added Section 16 "Trademarks": added 20050302 Product data sheet - PMEG2010AEJ_2 Product data sheet 9397 750 14595 - (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 -- 14 October 2005 7 of 9 PMEG2010AEJ Philips Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 13. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 14. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 16. Trademarks 15. Disclaimers Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners. Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 17. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com PMEG2010AEJ_2 Product data sheet (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 -- 14 October 2005 8 of 9 PMEG2010AEJ Philips Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 18. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 5 6 7 8 8 8 8 8 (c) Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 14 October 2005 Document number: PMEG2010AEJ_2 Published in The Netherlands