1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) very
small and flat lead Surface Mounted Device (SMD) plastic package.
1.2 Features
■Forward current: ≤1A
■Reverse voltage: ≤20 V
■Very low forward voltage
■Very small and flat lead SMD plastic package
1.3 Applications
■Low voltage rectification
■High efficiency DC-to-DC conversion
■Switch mode power supply
■Inverse polarity protection
■Low power consumption applications
1.4 Quick reference data
[1] Pulse test: tp≤300 µs; δ≤0.02.
PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier in
SOD323F package
Rev. 02 — 14 October 2005 Product data sheet
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current Tsp ≤55 °C --1A
VRreverse voltage - - 20 V
VFforward voltage IF= 1000 mA [1] - 480 550 mV
PMEG2010AEJ_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 14 October 2005 2 of 9
Philips Semiconductors PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
4. Marking
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
Table 2: Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode 21
sym001
12
Table 3: Ordering information
Type number Package
Name Description Version
PMEG2010AEJ SC-90 plastic surface mounted package; 2 leads SOD323F
Table 4: Marking codes
Type number Marking code
PMEG2010AEJ EM
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 20 V
IFforward current Tsp ≤55 °C-1A
IFRM repetitive peak forward current tp≤1 ms; δ≤0.25 - 5.5 A
IFSM non-repetitive peak forward
current square wave;
tp=8ms -10A
Ptot total power dissipation Tamb ≤25 °C[1] - 360 mW
[2] - 830 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
PMEG2010AEJ_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 14 October 2005 3 of 9
Philips Semiconductors PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating are available on request.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Solder point of cathode tab.
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 6: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] [2] - - 350 K/W
[1] [3] - - 150 K/W
Rth(j-sp) thermal resistance from
junction to solder point [4] --55K/W
Table 7: Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage [1]
IF= 10 mA - 240 270 mV
IF= 100 mA - 300 350 mV
IF= 500 mA - 400 460 mV
IF= 1000 mA - 480 550 mV
IRreverse current VR=5V - 5 10 µA
VR=8V - 7 20 µA
VR=10V - 8 30 µA
VR=15V - 10 50 µA
VR=20V - 15 70 µA
Cddiode capacitance VR= 1 V; f = 1 MHz - 40 50 pF
PMEG2010AEJ_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 14 October 2005 4 of 9
Philips Semiconductors PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
Tamb =25°C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
006aaa361
10
10−1
1
103
102
104
IF
(mA)
10−2
VF (V)
0 0.70.5 0.60.20.1 0.3 0.4
(1)
(2)
(3)
(5)
(4)
006aaa362
10
10−2
10−1
1
103
104
102
105
IR
(µA)
10−3
VR (V)
02015510
(2)
(3)
(4)
(1)
(5)
VR (V)
02015510
006aaa363
40
20
60
80
Cd
(pF)
0
PMEG2010AEJ_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 14 October 2005 5 of 9
Philips Semiconductors PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 17.
10. Soldering
Fig 4. Package outline SOD323F (SC-90)
04-09-13Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3 1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 8: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PMEG2010AEJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5. Reflow soldering footprint SOD323F (SC-90)
001aab169
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
PMEG2010AEJ_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 14 October 2005 6 of 9
Philips Semiconductors PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier
11. Mounting
PCB thickness: d = 1.6 mm PCB thickness: d = 1.6 mm
Fig 6. FR4 PCB, standard footprint
SOD323F (SC-90) Fig 7. FR4 PCB, mounting padforcathode
1cm
2 SOD323F (SC-90)
006aaa487
40
Dimensions in mm
0.6
0.6
0.5
0.6
43.4
0.6
006aaa488
40
0.6
0.6
10
0.5
10
43.4
Dimensions in mm
PMEG2010AEJ_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 14 October 2005 7 of 9
Philips Semiconductors PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
PMEG2010AEJ_2 20051014 Product data sheet - - PMEG2010AEJ_1
Modifications: •Section 1.1 “General description”: amended
•Section 1.2 “Features”: amended
•Section 1.3 “Applications”: amended
•Table 5 “Limiting values”: IFSM non-repetitive peak forward current condition amended
•Table 5 “Limiting values”: typing error for value Ptot total power dissipation corrected
•Table 6 “Thermal characteristics”:Table note 1 amended
•Table 6:Table note 4 added to Rth(j-sp) thermal resistance from junction to solder point
•Figure 4 “Package outline SOD323F (SC-90)”: superseded by minimized package outlines
•Table 8 “Packing methods”: table description amended
•Section 11 “Mounting”: added
•Section 16 “Trademarks”: added
PMEG2010AEJ_1 20050302 Product data sheet - 9397 750 14595 -
Philips Semiconductors PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier
PMEG2010AEJ_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 14 October 2005 8 of 9
13. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
14. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
15. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
16. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains datafrom the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.Date of release: 14 October 2005
Document number: PMEG2010AEJ_2
Published in The Netherlands
Philips Semiconductors PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier
18. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 5
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
11 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . . 8
14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
15 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
17 Contact information . . . . . . . . . . . . . . . . . . . . . 8
