23
ULTRA SMALL
HIGHLY SEMICONDUCT OR
PRESSURE SENSOR
PS PRESSURE
SENSOR
PS (ADP4)
FEATURES
• Ultra-miniature size: much more
compact than the PF pressure sen-
sors offered in the past
• Base area:
7.2(W) x 7.2(D) mm
.283(W) x .283(D)
inch
• Only 60% in mounting
area and 91% in over-
all height of previous
models (PF)
• High-level precision and linearity
A high degree of precision and linear detector
response have been achieved by applying the
semiconductor strain gauge system. Highly
reproducible based on repeated pressure.
• Impressive line-up of models
• Taking their place alongside the standard
5kΩbridge resistance models are those
with a 3.3kΩresistance which is optimally
suited to 5V drive circuits.
• Economy model (no glass base) gives out-
standing value for consumer appliances
40 kPa (0.4 kgf/cm2) and 49 kPa (0.5
Example of pressure characteristics
(when the rated pressure is between 98.1 kPa
{1.0 kgf/cm2})
Drive current: 1.5 mA rated current; ambient temperature: 25°C 77°F
0 {0}
0
50
100
49 {0.5} 98.1 {1}
Output voltage, mV
Pressure (gauge pressure), (kPa {kgf/cm2})
TYPICAL APPLICATIONS
• Medical equipment: Electronic hemody-
namometer
• Home appliance: Vacuum cleaner
• Gas equipment: Microprocessor gas
meter, gas leakage detector
• Industrial equipment: Absorption
device, etc.
<Cross-section of Sensor Chip>
Silicon Piezo resistance
strain gauge
Anode
junction
Glass
base
Pressure
Pressure
High reliability
die bonding
technology
Very strong,
heat resistant body
Highly reliable wire
bonding technology
4
Bridge resistance 5.0kΩ3.3kΩ
DIP terminal:
Direction opposite
the pressure inlet
direction
Terminal
Pressure
DIP terminal:
Pressure inlet
direction
DIP terminal:
Direction opposite
the pressure inlet
direction
DIP terminal:
Pressure inlet
direction
approx. 0.05kgf/cm2
approx. 0.15kgf/cm2
approx. 0.35kgf/cm2
approx. 0.5kgf/cm2
approx. 1.0kgf/cm2
approx. 2.0kgf/cm2
approx. 3.5kgf/cm2
approx. 5.0kgf/cm2
approx. 8.5kgf/cm2
approx. 10.0kgf/cm2
approx. 0.4kgf/cm2
approx. 0.5kgf/cm2
Standard
type
(With glass
base)
Economy type
(Without glass
base)
ADP41010
ADP41110
ADP41210
ADP41310
ADP41410
ADP41510
ADP41610
ADP41710
ADP41810
ADP41910
——
ADP41320
ADP42010
ADP42110
ADP42210
ADP42310
ADP42410
ADP42510
ADP42610
ADP42710
ADP42810
ADP42910
——
ADP42320
——
——
——
——
ADP41413
——
——
——
——
ADP41913
ADP41A23
——
——
——
——
——
ADP42413
——
——
——
——
ADP42913
ADP42A23
——
4.9kPa
14.7kPa
34.3kPa
49.0kPa
98.1kPa
196.1kPa
343.2kPa
490.3kPa
833.6kPa
980.7kPa
40.0kPa
49.0kPa
ADP4:
PS pressure sensor
Terminal profile and direction
1: DIP terminal: Direction opposite the
pressure inlet direction
2: DIP terminal: Pressure inlet direction
Rated pressure
0: 4.9 kPa {approx. 0.05 kgf/cm2}
1: 14.7 kPa {approx. 0.15 kgf/cm2}
2: 34.3 kPa {approx. 0.35 kgf/cm2}
3: 49.0 kPa {approx. 0.5 kgf/cm2}
4: 98.1 kPa {approx. 1.0 kgf/cm2}
5: 196.1 kPa {approx. 2.0 kgf/cm2}
6: 343.2 kPa {approx. 3.5 kgf/cm2}
7: 490.3 kPa {approx. 5.0 kgf/cm2}
8: 833.6 kPa {approx. 8.5 kgf/cm2}
9: 980.7 kPa {approx. 10.0 kgf/cm2}
A: 40.0 kPa {approx. 0.4 kgf/cm2}
Type
1 : Standard type
(With glass base)
2: Economy type
(Without glass
base)
ORDERING INFORMATION
Ex. ADP
Bridge resistance
0 : 5.0kΩ
3 : 3.3kΩ
Part No.
Ultra-small
miniature
<Actual size>
7.2 .283
7.2
.283
8.6 .339
10.0
.394
Existing products
PS
kgf/cm2) units are also available.
• Improved ease of DIP pin insertion
into printed circuit boards
The ends of the DIP pins are chamfered to
ensure easy insertion into printed circuit
PS PRESSURE SENSOR 2002.10.23 7:58 PM Page 23
24
PS (ADP4)
DATA
1. Characteristics data
1-<1> Output characteristics
ADP41913
Drive current: 1.0 mA; temperature: 30°C 86°F
1-<2> Offset voltage – temperature
characteristics
ADP41913
Drive current: 1.0 mA; rating ±3.5%FS
1-<3> Sensitivity – temperature
characteristics (%FS)
ADP41913
Drive current: 1.0 mA; rating ±2.5%FS
60
40
50
20
30
10
0980.7/2 {5}0 980.7 {10}
kpa {kgf/cm2}
Output voltage (mV)
Rated pressure
4
3
2
1
0
–2
–1
30
+86
0
+32 60
+140
Temperature (°C °F)
Offset voltage – temperature characteristics (%FS)
4
3
2
1
0
–2
–1
Sensitivity – temperature characteristics (%FS)
30
+86
0
+32 60
+140
Temperature (°C °F)
2. Pressure cycle range (0 to rated pressure)
Tested sample: ADP41913, temperature: 100°C 212°F, No. of cycle: 1×106
–3
–2
0
1
–1
3
2
5×1051×106
0
Output span voltage range (%FS)
Pressure cycle (cycle)
Even after testing for 1 million times, the vari-
ations in the offset voltage and output span
voltage are minimal.
2-<1> Offset voltage range 2-<2> Output span voltage range
SPECIFICATIONS
Gauge pressure
Standard type (With glass base) Economy type
(Without glass base)
Type of pressure
Type
Air (For other medium, please consult us.)
Pressure medium
4.9
Rated
pressure
0.05 14.7
0.15 34.3
0.35 49.0
0.5 98.1
1.0 196.1
2.0 343.2
3.5 490.3
5.0 833.6
8.5 98.1
1.0 980.7
10.0
1.5 times
the rated pressure
1.5 times the
rated pressure
980.7
10.0 40.0
0.4 Twice
the rated pressure
49.0
0.5
Unit: kPa
Unit: kgf/cm2 (approx.)
Twice the rated pressure
Twice the
rated pressure
Max. applied pressure
–20 to 100°C –4 to 212°F (no freezing or condensation)
Ambient temperature
–40 to 120°C –40 to 248°F (no freezing or condensation)
Storage temperature
0 to 50°C 32 to 122°F0 to 60°C
32 to 140°F5 to 45°C
41 to 113°F
0 to 50°C
32 to 122°F
–20 to +70°C
–4 to +158°F–40 to +120°C
–40 to +248°F
–5 to +50°C
+23 to +122°F–20 to +100°C
–4 to +212°F
Temperature compensation range
1.5 mA DC 1.0 mA DC 1.5 mA DC
Drive current (constant current)
100±40 mV 65±25 mV
43.5±22.5 mV
85±45 mV40±20 mV
Output span voltage
±20 mV ±15 mV ±25 mV
Offset voltage
5000±1000 Ω3300±700 Ω
3300±600 Ω5000±1000 Ω
Bridge resistance
±0.7%FS
±0.6%FS
±15%FS
±10%FS
±5.0%FS ±3.5%FS
±2.5%FS
±10%FS
±1.3%FS
±8%FS
±2.5%FS
±0.5%FS
±0.4%FS ±0.3%FS ±1.0%FS
±0.2%FS ±1.0%FS
±0.5%FS ±0.6%FS ±0.3%FS
±0.4%FS ±0.7%FS
Linearity
Pressure hysteresis
Offset voltage-temperature
characteristics (0 to 50°C 32 to 122°F)
Sensitivity-temperature
characteristics (0 to 50°C 32 to 122°F)
Notes) 1. Unless otherwise specified, measurements were taken with a drive current of ±0.01 mA and humidity ranging from 25% to 85%.
2. Please consult us if a pressure medium other than air is to be used.
3. This is the regulation which applies within the compensation temperature range.
4. Please consult us if the intended use involves a negative pressure.
PS PRESSURE SENSOR 2002.10.23 7:58 PM Page 24
25
PS (ADP4)
DIMENSIONS
1. Terminal direction: Direction opposite the pressure inlet
derection ADP41mmm
2. Terminal direction: Pressure inlet direction ADP42mmm
General tolerance: ±0.3 ±.012 mm inch
3. Terminal connection diagram
+Input −Input
−Output
+Output
R2R1
R4R3
Terminal No. Name
1Power supply (+)
2Output (+)
3Power supply (−)
4Power supply (−)
5Output (−)
6No connection
Note: Leave terminal 6 unconnected.
Tolerance: ±0.1 .004
Tested item Tested condition Result
Environmental
characteristics
Endurance
characteristics
Storage at high
temperature Left in a 120°C 248°F constant temperature bath
1,000 hrs. Passed
Temperature:
Time:
High temperature/high
humidity operation 40°C 104°F, 90% RH
106, rated voltage applied Passed
Temperature/humidity:
Operation times:
Dropping resistance 75 cm 29.528 inch
2 times Passed
Dropping height:
Times:
Terminal strength 9.8 N {1 kgf}, 10 sec.
4.9 N {0.5 kgf}, left and right 90° 1 time Passed
Pulling strength:
Bending strength:
Mechanical
characteristics
Vibration resistance
1.5 mm .059 inch
10 to 55 Hz
X, Y, Z 3 directions
2 hrs each Passed
Double amplitude:
Vibration:
Applied vibration direction:
Times:
Storage at low
temperature Left in a –40°C –40°F constant temperature bath
1,000 hrs. Passed
Temperature:
Time:
Humidity Left at 40°C 104°F, 90% RH
1,000 hrs. Passed
Temperature/humidity:
Time:
Temperature cycle –40°C to 120°C –40°F to 248°F
30 min.
100 Passed
Temperature:
1 cycle:
Times of cycle:
Soldering
Resistance
Soldered in
DIP soldering bath 230°C 446°F
5 sec. Passed
Temperature:
Time:
Temperature 260°C 500°F
10 sec. Passed
Temperature:
Time:
3. Evaluation test
Note: For details other than listed above, please consult us.
3
JAPAN
12
654
R0.2
R.008
7.2
.283
7.2
.283
4
.157 5
.197
3.5
.138
4.6
.181
Pressure
inlet hole
1.1 dia.
.043 dia.
2.5 dia.
–0.1
0
.098 dia.
–.004
0
4 dia.
.157 dia.
±0.1
0.5 ±.004
.020
±0.25
2.5 ±.010
.098
±.010
.098
±0.25
2.5
Atmospheric
Pressure
inlet hole
8.2Max
.323Max
±0.1
0.25
±.004
.010
9.5±1.5
.374±.059
Tolerance: ±0.1 .004
456
21
JAPAN
3
R0.2
R.008
8.2Max
.323Max
4 dia.
.157 dia.
±.059
.374±1.5
9.5
Pressure
inlet hole
1.1 dia.
.043 dia.
Atmospheric
Pressure
inlet hole
7.2
.283
3.7
.164
7.2
.283
±.010
.098
±0.25
2.5 ±.010
.098
±0.25
2.5
±0.1
0.5 ±.004
.020
4
.157 5
.197
3.5
.138
2.5 dia.
–0.1
0
.098 dia.
–.004
0
±0.1
0.25±.004
.010
Recommended PC board pattern
(BOTTOM VIEW)
7.5
.295
6-0.9 dia.
6-.035 dia.
2.52.5 .098.098
Recommended PC board pattern
(BOTTOM VIEW)
5 dia.
.197 dia.
6-0.9 dia.
6-.035 dia.
7.5
.295
2.52.5 .098.098
PS PRESSURE SENSOR 2002.10.23 7:58 PM Page 25
PS (ADP4)
NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely fixed.
2. Soldering
1) Due to its small size, the thermal
capacity of the pressure sensor DIP type
is low. Therefore, take steps to minimize
the effects of external heat.
Dip soldering bath: Max. 260°C 500°F, 5
sec.
Soldering iron: 260 to 300°C 500 to
572°F (30W) within 5 sec.
2) Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
3. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
4. Environment
Consult with us before using or storing
the pressure sensor chip in a place
exposed to corrosive gases (such as the
gases given off by organic solvents, sul-
fites, hydrogen sulfides, etc.) which will
adversely affect the performance of the
pressure sensor chip.
5. Quality check under actual loading
conditions
1) To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect
its performance.
2) As for test data, please contact us.
6. Other handling precautions
1) That using the wrong pressure range
or mounting method may result in acci-
dents.
2) Air can be used directly as a pressure
medium. Consult with us before using a
corrosive gas (such as a gas given off by
an organic solvent, sulfite or hydrogen
sulfide) as the pressure medium.
3) The pressure sensor chip is posi-
tioned inside the pressure inlet. Never
poke wires or other foreign matter
through the pressure inlet since they
may damage the chip or block the inlet.
Avoid use when the atmospheric pres-
sure inlet is blocked.
4) Leave pin No. 6 unconnected since
the pressure sensor chip may be dam-
aged if a voltage is applied to this pin.
5) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
6) Since this pressure sensor chip does
not have a water-proof construction, con-
sult with us if it is to be used in a location
where it may be sprayed with water, etc.
7) Avoid using the pressure sensor chip
in an environment where condensation
may form. Furthermore, its output may
fluctuate if any moisture adhering to it
freezes.
8) The pressure sensor chip is construct-
ed in such a way that its output will fluc-
tuate when it is exposed to light.
Especially when pressure is to be
applied by means of a transparent tube,
take steps to prevent the pressure sen-
sor chip from being exposed to light.
9) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic
or other high-frequency vibration.
10) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
•When storing the pressure sensor
chips, use a conductive material to
short the pins or wrap the entire chip in
aluminum foil. Plastic containers
should not be used to store or transport
the chips since they readily become
charged.
•When using the pressure sensor chips,
all the charged articles on the bench
surface and the work personnel should
be grounded so that any ambient static
will be safely discharged.
11) Due to the pressures involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
APPLICATION CIRCUIT
DIAGRAM (EXAMPLE)
The pressure sensor is designed to con-
vert a voltage by means of constant cur-
rent drive and then, if necessary, it
amplifies the voltage for use. The circuit
shown below is a typical example of a
circuit in which the pressure sensor is
used.
OP
AMP
OP
AMP
OP
AMP
Constant current
circuit unit Pressure
sensor
Amplifier circuit unit
MOUNTING METHOD
The general method for transmitting air
pressures differs depending on whether
the pressure is low or high.
• Checkpoints for use
<1> Select a pressure inlet pipe which is
sturdy enough to prevent pressure
leaks.
<2> Fix the pressure inlet pipe securely
so as to prevent pressure leaks.
<3> Do not block the pressure inlet pipe.
Methods of transmitting air pressures
When the pressure
is low When the pressure
is high
(4.9 to 98.1 kPa) (196.1 to 980.7 kPa)
If a tube is used as the pressure inlet pipe,
it may become disengaged. Therefore, use
a sturdy tube and secure it using O-rings.
Tube
Printed-
circuit
board
Printed-
circuit
board
O-ring
Pressure
inlet pipe
PS PRESSURE SENSOR 2002.10.23 7:58 PM Page 26
12/1/2002 All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.