(2.54 mm) .100" HLE SERIES
HLE–116–02–L–DV–K
HLE–110–02–L–DV
HLE–130–02–F–DV
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Mates With:
TSW, MTSW, DW,
EW, ZW, TLW, TSM,
MTLW, HW
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
02 PLATING
OPTION
NO. PINS
PER ROW
1
HLE DV
02 thru 50
OTHER
OPTION
(5.08)
.200
02
01
(2.54)
.100
(2.54)
.100
No. of Positions x (2.54) .100
(3.51)
.138
(0.51)
.020
TAIL
OPTION
–BE
= Bottom Entry
(Not available
with –TE)
–A
= Alignment Pin
(4 positions min.)
Metal or plastic at
Samtec discretion
(Not available with
–TE, –PE & –LC)
–LC
= Locking Clip
(2 positions min.)
(Not available
with –A)
(Manual placement
required)
–K
= (6.50 mm) .256"
DIA Polyimide
Film Pick &
Place Pad
(3 positions min.)
Not available
with –TE or
–PE tail option
–P
= Metal Pick &
Place Pad
(3 positions min.)
–TR
= Tape & Reel
Packaging
(29 positions
max.)
–FR
= Full Reel
Tape & Reel
Packaging
(Must order max.
quantities per reel.
Contact Samtec
for parts per reel)
(3.05)
.120
(2.54)
.100
–PE
–TE
–PE
–A –LC
–P
–TE
(3.66)
.144
(6.60)
.260
Leave blank for
Surface Mount
(Requires –BE for
Bottom Entry)
–TE
= Through-hole
Top Entry
–PE
= Through-hole
Pass-through Entry
(Requires –BE for
Bottom Entry)
(7.62)
.300
(2.30)
.090
For complete specifications
and recommended PCB layouts
see www.samtec.com?HLE
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
BeCu
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating (HLE/TSM):
4.1 A per pin
(2 pins powered)
Voltage Rating:
400 VAC
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(1.78 mm) .070" to
(3.43 mm) .135", pass-through,
or (2.59 mm) .102" min
plus board thickness for
bottom entry
RoHS Compliant:
Ye s
SPECIFICATIONS
–F
= Gold flash on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
COST-EFFECTIVE RELIABLE SOCKET
For complete scope
of recognitions see
www.samtec.com/quality
RECOGNITIONS
ALSO AVAILABLE
(MOQ Required)
• Other platings
FILE NO. E111594
PROCESSING
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-20)
(0.15 mm) .006" max (21-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
F-219 (Rev 03MAR20)
(1.27)
.050
(1.42)
.056
(1.27)
.050
(1.60)
.063
DIA
(3.86)
.152
(7.11) .280
x
(5.71) .225
