TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 FAMILY OF MICROPOWER RAIL-TO-RAIL INPUT AND OUTPUT OPERATIONAL AMPLIFIERS FEATURES DESCRIPTION D D D D D D D D The TLV238x single supply operational amplifiers provide rail-to-rail input and output capability. The TLV238x takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range, while adding the rail-to-rail output swing feature. The TLV238x also provides 160-kHz bandwidth from only 7 A. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (8 V supplies down to 1.35 V) two rechargeable cells. D BiMOS Rail-to-Rail Input/Output Input Bias Current . . . 1 pA High Wide Bandwidth . . . 160 kHz High Slew Rate . . . 0.1 V/s Supply Current . . . 7 A (per channel) Input Noise Voltage . . . 90 nV/Hz Supply Voltage Range . . . 2.7 V to 16 V Specified Temperature Range - -40C to 125C . . . Industrial Grade Ultra-Small Packaging - 5 Pin SOT-23 (TLV2381) The combination of rail-to-rail inputs and outputs make them good upgrades for the TLC27Lx family--offering more bandwidth at a lower quiescent current. The offset voltage is lower than the TLC27LxA variant. APPLICATIONS D D D D To maintain cost effectiveness the TLV2381/2 are only available in the extended industrial temperature range. This means that one device can be used in a wide range of applications that include PDAs as well as automotive sensor interface. Portable Medical Power Monitoring Low Power Security Detection Systems Smoke Detectors All members are available in SOIC, with the singles in the small SOT-23 package, duals in the MSOP. SELECTION GUIDE DEVICE VS [V] IQ/ch [A] VICR [V] VIO [mV] IIB [pA] GBW [MHz] SLEW RATE [V/s] Vn, 1 kHz [nV/Hz] TLV238x 2.7 to 16 10 -0.2 to VS + 0.2 4.5 60 0.16 0.06 100 TLV27Lx 2.7 to 16 11 -0.2 to VS - 1.2 5 60 0.16 0.06 100 TLC27Lx 4 to 16 17 -0.2 to VS - 1.5 10/5/2 60 0.085 0.03 68 OPAx349 1.8 to 5.5 2 -0.2 to VS + 0.2 10 10 0.070 0.02 300 OPAx347 2.3 to 5.5 34 -0.2 to VS + 0.2 6 10 0.35 0.01 60 60 0.200 0.02 19 TLC225x 2.7 to 16 62.5 0 to VS - 1.5 1.5/0.85 NOTE: All dc specs are maximums while ac specs are typicals. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001-2003 Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com 1 TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE CODE SYMBOL TLV2381ID SOIC-8 D 2381I TLV2381IDBV SOT-23 DBV VBKI TLV2382ID SOIC-8 D 2382I SPECIFIED TEMPERATURE RANGE -40 C to 125 C -40C 125C ORDER NUMBER TRANSPORT MEDIA TLV2381ID Tube TLV2381IDR Tape and Reel TLV2381IDBVR TLV2381IDBVT Tape and Reel TLV2382ID Tube TLV2382IDR Tape and Reel absolute maximum ratings over operating free-air temperature (unless otherwise noted) Supply voltage, VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V Input voltage, VI (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VS + 0.2 V Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VS Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Operating free-air temperature range, TA: I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to 125C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 125C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Relative to GND pin. 2. Maximum is 16.5 V or VS+0.2 V whichever is the lesser value. DISSIPATION RATING TABLE 2 PACKAGE JC (C/W) JA (C/W) TA 25C POWER RATING TA = 85C POWER RATING D (8) 38.3 176 710 mW 370 mW DBV (5) 55 324.1 385 mW 201 mW DBV (6) 55 294.3 425 mW 221 mW www.ti.com TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 recommended operating conditions Supply voltage, (VS) Dual supply Single supply Input common-mode voltage range Operating free air temperature, TA I-suffix MIN MAX 1.35 8 2.7 16 -0.2 VS+0.2 125 -40 UNIT V V C electrical characteristics at recommended operating conditions, VS = 2.7 V, 5 V, and 15 V (unless otherwise noted) dc performance PARAMETER VIO Input offset voltage VIO Offset voltage drift TEST CONDITIONS VIC = VS/2, RL = 100 k VO = VS/2 RS = 50 VIC = 0 V to VS, RS = 50 VIC = 0 V to VS-1.3 V, RS = 50 CMRR Common-mode rejection ratio VIC = 0 V to VS, RS = 50 VIC = 0 V to VS-1.3 V, RS = 50 VIC = 0 V to VS, RS = 50 VIC = 0 V to VS-1.3 V, RS = 50 VS = 2.7 V VS = 5 V VS = 15 V VS = 2.7 V AVD Large-signal differential voltage amplification VO(PP)=VS/2, RL = 100 k VS = 5 V VS = 15 V TA 25C MIN TYP MAX 0.5 4.5 Full range 6.5 25C 54 Full range 53 25C 71 Full range 70 25C 58 Full range 57 25C 72 Full range 70 25C 65 Full range 64 25C 72 Full range 70 25C 80 Full range 77 25C 80 Full range 77 25C 77 Full range 74 mV V/C 1.1 25C UNIT 69 dB 86 74 dB 88 80 dB 90 100 100 dB 83 Full range is -40C to 125C. input characteristics PARAMETER IIO TEST CONDITIONS VIC = VS/2, RL = 100 k , Input bias current ri(d) Differential input resistance CIC Common-mode input capacitance MIN TYP MAX 1 60 70C Input offset current IIB TA 25C VO = VS/2, RS = 50 100 125C 25C 60 200 125C www.ti.com pA 1000 1 70C f = 1 kHz UNIT pA 1000 25C 1000 G 25C 8 pF 3 TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 electrical characteristics at recommended operating conditions, VS = 2.7 V, 5 V, and 15 V (unless otherwise noted) (continued) power supply PARAMETER TA 25C TEST CONDITIONS IDD Supply current (per channel) VO = VS/2 PSRR Power supply rejection ratio (VS/VIO) VS = 2.7 V to 16V, VIC = VS/2 V MIN TYP MAX 7 10 Full range No load, 15 25C 74 Full range 70 82 UNIT A dB Full range is -40C to 125C for I suffix. output characteristics PARAMETER TEST CONDITIONS VS = 2.7 V VIC = VS/2, IO = 100 A VO VS = 5 V Output voltage swing from rail VS = 15 V VS = 5 V VIC = VS/2, IO = 500 A IO Output current Full range is -40C to 125C for I suffix. VS = 15 V VO = 0.5 V from rail VS = 2.7 V TA 25C MIN TYP 200 160 Full range 220 25C 120 Full range 200 25C 120 Full range 150 25C 800 Full range 900 25C 400 Full range 500 25C MAX 85 UNIT mV 50 420 mV 200 A 400 dynamic performance PARAMETER TEST CONDITIONS GBP Gain bandwidth product RL = 100 k , CL = 10 pF, SR Slew rate at unity gain VO(pp) = 2 V, CL = 10 pF RL = 100 k, k RL = 100 k, CL = 50 pF M Phase margin Gain margin ts Settling time (0.1%) f = 1 kHz V(STEP)pp = 1 V, AV = -1, CL = 10 pF, RL = 100 k Rise Fall TA 25C MIN TYP MAX 160 25C 0.06 -40C 0.05 125C 0.08 UNIT kHz V/ s V/s 25C 62 25C 6.7 dB 31 25C s 61 noise/distortion performance PARAMETER Vn 4 Equivalent input noise voltage TEST CONDITIONS f = 1 kHz www.ti.com TA 25C MIN TYP 90 MAX UNIT nV/Hz TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 TYPICAL CHARACTERISTICS Table of Graphs FIGURE VIO IIB/IIO Input offset voltage vs Common-mode input voltage Input bias and offset current vs Free-air temperature VOH VOL High-level output voltage vs High-level output current 5, 7, 9 Low-level output voltage vs Low-level output current 6, 8, 10 IQ Quiescent current 1, 2, 3 4 vs Supply voltage 11 vs Free-air temperature 12 Supply voltage and supply current ramp up 13 AVD GBP Differential voltage gain and phase shift vs Frequency 14 Gain-bandwidth product vs Free-air temperature 15 m CMRR Phase margin vs Load capacitance 16 Common-mode rejection ratio vs Frequency 17 PSRR Power supply rejection ratio vs Frequency 18 Input referred noise voltage vs Frequency 19 SR Slew rate vs Free-air temperature 20 VO(PP) Peak-to-peak output voltage vs Frequency 21 Inverting small-signal response 22 Inverting large-signal response 23 Crosstalk vs Frequency INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 500 0 -500 -1000 -1500 1500 V IO - Input Offset Voltage - A 1000 2000 VS = 5 V TA = 25C 1500 V IO - Input Offset Voltage - A V IO - Input Offset Voltage - A 1500 1000 500 0 -500 -1000 -1500 -2000 -2000 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 VIC - Common-Mode Input Voltage - V Figure 1 INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 2000 2000 VS = 2.7 V TA = 25C 24 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 VIC - Common-Mode Input Voltage - V Figure 2 www.ti.com 5 VS = 15 V TA = 25C 1000 500 0 -500 -1000 -1500 -2000 -0.2 7.5 15.2 VIC - Common-Mode Input Voltage - V Figure 3 5 TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 TYPICAL CHARACTERISTICS INPUT BIAS AND INPUT OFFSET CURRENT vs FREE-AIR TEMPERATURE 15 VIC = 0 80 VO = 0 70 RS = 50 60 50 40 30 IIB IIO 20 10 -40C 12.5 0C 25C 10 70C 7.5 5 125C 2.5 0 0 25 45 65 85 105 TA - Free-Air Temperature - C 0 125 2 4 6 25C 3 70C 2.5 2 1.5 125C 0.5 0 2 2.5 125C 4 70C 3.5 3 25C 2.5 0C 2 1.5 1 -40C 0.5 3 3.5 4 4.5 25C 0C 0.9 0.6 -40C 0.6 0.8 1 1.2 IOL - Low-Level Output Current - mA Figure 10 70C 1.2 0.9 125C 0.6 0.3 0.2 7 1.4 0.4 0.6 0.8 1 1.2 1.4 8 16 V 7 70C 6 5 -40C 25C 4 0C 3 2 5V 6 5 2.7 V 4 3 2 1 0 0.4 1.5 QUIESCENT CURRENT vs FREE-AIR TEMPERATURE 1 0 0.2 25C Figure 9 I (Q) - Quiescent Currenr - A 1.8 0 0C 1.8 IOH - High-Level Output Current - mA QUIESCENT CURRENT vs SUPPLY VOLTAGE 8 I (Q) - Quiescent Currenr - A V OL- Low-Level Output Voltage - V 70C 0.3 VS = 2.7 V 0 125C 125C 16 18 20 0 VS = 2.7 V 2.1 10 12 14 -40C Figure 8 2.7 8 2.1 IOL - Low-Level Output Current - mA LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 1.2 6 2.4 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 5 Figure 7 1.5 4 2.7 IOH - High-Level Output Current - mA 2.4 2 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 0 1.5 -40C Figure 6 VOH - High-Level Output Voltage - V V OL- Low-Level Output Voltage - V VOH - High-Level Output Voltage - V 0C 3.5 1 0C VS = 5 V 4.5 -40C 0.5 70C 25C IOL - Low-Level Output Current - mA 5 VS = 5 V 0 125C 0 8 10 12 14 16 18 20 22 24 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 5 4.5 1 VS = 15 V Figure 5 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 4 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 IOH - High-Level Output Current - mA Figure 4 6 VS = 15 V V OL- Low-Level Output Voltage - V VDD = 2.5 V VOH - High-Level Output Voltage - V I IB and I IO - Input Bias and Input Offset Currents - pA 100 90 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 0 2 4 6 8 10 12 VS - Supply Voltage - V Figure 11 www.ti.com 14 16 0 -40 -25-10 5 20 35 50 65 80 95 110 125 TA - Free-Air Temperature - C Figure 12 TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 TYPICAL CHARACTERISTICS DIFFERENTIAL VOLTAGE GAIN AND PHASE SHIFT vs FREQUENCY 40 120 10 5 A VD - Differential Voltage Gain - dB VS VO 0 VS = 0 to 15 V, RL = 100 , CL = 10 pF, TA = 25C 15 IQ 10 5 0 5 10 15 20 25 0 30 VS = 5 V RL = 100 k CL = 10 pF TA = 25C 100 80 60 40 90 20 120 0 150 -20 0.1 1 10 160 70 VS = 2.7 V VS = 15 V 130 120 110 VS = 5 V RL = 100 k TA = 25C 60 50 40 30 20 10 0 20 35 50 65 80 95 110 125 10 TA - Free-Air Temperature - C 100 80 70 60 50 40 30 20 10 0 10 100 80 70 60 50 40 30 20 10 0 10 k f - Frequency - Hz Figure 18 100 k 1M Hz 1k 10 k 100 k 1M f - Frequency - Hz Figure 17 SLEW RATE vs FREE-AIR TEMPERATURE 0.09 250 VS = 5 V, G = 2, RF = 100 k 200 0.08 SR - Slew Rate - V/ s VS =2.5 V TA = 25C 1k VS = 5 V TA = 25C 90 INPUT REFERRED NOISE VOLTAGE vs FREQUENCY Vn- Input Referred Noise Voltage - nV/ PSRR - Power Supply Rejection Ratio - dB 100 100 110 100 Figure 16 POWER SUPPLY REJECTION RATIO vs FREQUENCY 10 1000 120 CL - Load Capacitance - pF Figure 15 90 180 10 k 100 k 1 M COMMON-MODE REJECTION RATIO vs FREQUENCY CMRR - Common-Mode Rejection Ratio - dB 80 Phase Margin - Degrees GBP - Gain-Bandwidth Product - kHz PHASE MARGIN vs LOAD CAPACITANCE 170 100 -40 -25 -10 5 1k Figure 14 GAIN-BANDWIDTH PRODUCT vs FREE-AIR TEMPERATURE 140 100 f - Frequency - Hz t - Time - ms VS = 5 V 30 60 Figure 13 150 0 Phase Shift 15 I CC - Supply Current - A VS - Supply Voltage - V/dc SUPPLY VOLTAGE AND SUPPLY CURRENT RAMP UP 150 100 SR+ 0.07 0.06 SR- 0.05 0.04 0.03 0.02 50 0.01 0 1 10 100 1k f - Frequency - Hz Figure 19 www.ti.com 10 k 100 k 0 -40 -25 -10 5 VS = 5 V Gain = 1 VO = 1 RL = 100 k CL = 50 pF 20 35 50 65 80 95 110 125 TA - Free-air Temperature - C Figure 20 7 TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 TYPICAL CHARACTERISTICS PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY INVERTING SMALL-SIGNAL RESPONSE V OPP - Output Voltage Peak-to-Peak - V 16 2 VI = 3 VPP VS = 15 V 14 1.5 1 Amplitude - VPP 12 RL = 100 k, CL = 10 pF, THD+N <= 5% 10 8 6 2 -1.5 VS = 2.7 V VO = 3 VPP -2 -100 0 10 100 0 -0.5 -1 VS = 5 V 4 Gain = -1, RL = 100 k, CL = 10 pF, VS = 5 V, VO = 3 VPP, f = 1 kHz 0.5 1000 1k 10 k 0 100 200 300 400 500 600 700 t - Time - s f - Frequency - Hz Figure 22 Figure 21 CROSSTALK vs FREQUENCY INVERTING LARGE-SIGNAL RESPONSE 0 0.06 VI = 100 mVPP Gain = -1, RL = 100 k, CL = 10 pF, VS = 5 V, VO = 100 mVPP, f = 1 kHz 0.02 0 -40 Crosstalk - dB Amplitude - VPP 0.04 -0.02 -80 -120 VO = 100 mVPP -140 0 10 100 200 300 400 500 600 700 100 1k f - Frequency - Hz t - Time - s Figure 23 8 -60 -100 -0.04 -0.06 -100 VS = 5 V RL = 2 k CL = 10 pF TA = 25C Channel 1 to 2 -20 Figure 24 www.ti.com 10 k 100 k TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 APPLICATION INFORMATION offset voltage The output offset voltage (VOO) is the sum of the input offset voltage (VIO) and both input bias currents (IIB) times the corresponding gains. The following schematic and formula can be used to calculate the output offset voltage: RF RG IIB- + - VI + RS V VO OO + VIO 1 ) R R F G " IIB) RS 1 ) R R F G " IIB- RF IIB+ Figure 25. Output Offset Voltage Model general configurations When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see Figure 26). RG RF O V I VDD/2 VI V - VO + R1 f -3dB + 1 ) RRF G ) sR1C1 1 1 1 + 2pR1C1 C1 Figure 26. Single-Pole Low-Pass Filter If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this task. For best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth. Failure to do this can result in phase shift of the amplifier. C1 + _ VI R1 R1 = R2 = R C1 = C2 = C Q = Peaking Factor (Butterworth Q = 0.707) R2 f C2 RG RF -3dB RG = + 2p1RC ( RF 1 2- Q ) VDD/2 Figure 27. 2-Pole Low-Pass Sallen-Key Filter www.ti.com 9 TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 APPLICATION INFORMATION circuit layout considerations To achieve the levels of high performance of the TLV238x, follow proper printed-circuit board design techniques. A general set of guidelines is given in the following. D D D D D 10 Ground planes--It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize the stray capacitance. Proper power supply decoupling--Use a 6.8-F tantalum capacitor in parallel with a 0.1-F ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1-F ceramic capacitor should always be used on the supply terminal of every amplifier. In addition, the 0.1-F capacitor should be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors. Sockets--Sockets can be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation. Short trace runs/compact part placements--Optimum high performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at the input of the amplifier. Surface-mount passive components--Using surface-mount passive components is recommended for high performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. www.ti.com TLV2381 TLV2382 SLOS377A - SEPTEMBER 2001- REVISED JULY 2003 APPLICATION INFORMATION general power dissipation considerations For a given JA, the maximum power dissipation is shown in Figure 28 and is calculated by the following formula: P + D T -T MAX A q JA Where: PD = Maximum power dissipation of TLV238x IC (watts) TMAX = Absolute maximum junction temperature (150C) TA = Free-ambient air temperature (C) JA = JC + CA JC = Thermal coefficient from junction to case CA = Thermal coefficient from case to ambient air (C/W) MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 2 Maximum Power Dissipation - W 1.75 TJ = 150C PDIP Package Low-K Test PCB JA = 104C/W 1.5 1.25 MSOP Package Low-K Test PCB JA = 260C/W SOIC Package Low-K Test PCB JA = 176C/W 1 0.75 0.5 0.25 SOT-23 Package Low-K Test PCB JA = 324C/W 0 -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 TA - Free-Air Temperature - C NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 28. Maximum Power Dissipation vs Free-Air Temperature TLV2381 D PACKAGE (TOP VIEW) TLV2381 DBV PACKAGE (TOP VIEW) OUT GND IN+ 1 5 VDD 2 3 4 NC IN - IN + GND 1 8 2 7 3 6 4 5 TLV2382 D PACKAGE (TOP VIEW) NC VDD OUT NC 1OUT 1IN - 1IN + GND 1 8 2 7 3 6 4 5 VDD 2OUT 2IN - 2IN+ IN - NC - No internal connection www.ti.com 11 PACKAGE OPTION ADDENDUM www.ti.com 11-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TLV2381ID ACTIVE SOIC D 8 TLV2381IDBVR ACTIVE SOT-23 DBV TLV2381IDBVRG4 ACTIVE SOT-23 TLV2381IDBVT ACTIVE TLV2381IDBVTG4 75 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2381IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2381IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2381IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2381IP PREVIEW PDIP P 8 TBD Call TI TLV2382ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2382IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2382IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2382IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2382IP OBSOLETE PDIP P 8 TBD Call TI Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Dec-2006 reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) TLV2381IDBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 TLV2381IDBVT SOT-23 DBV 5 250 TLV2381IDR SOIC D 8 2500 180.0 9.0 3.15 3.2 1.4 330.0 12.4 6.4 5.2 2.1 TLV2382IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 Pack Materials-Page 1 W Pin1 (mm) Quadrant 8.0 Q3 4.0 8.0 Q3 8.0 12.0 Q1 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2381IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0 TLV2381IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0 TLV2381IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2382IDR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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