PLA140 Single-Pole Normally Open OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 400 250 8 Units VP mArms / mADC Features * * * * * * * * * * * Description The PLA140 is a single-pole normally open (1-Form-A) Solid State Relay that uses optically coupled MOSFET technology to provide 3750Vrms of input-to-output isolation. MOSFET output switches, which use IXYS Integrated Circuits' patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Low On-Resistance, High Current Handling Low Drive Power Requirements 3750Vrms Input/Output Isolation High Reliability VDE Compatible FCC Compatible Arc-Free With No Snubbing Circuits No EMI/RFI Generation Flammability Rating UL 94 V-0 Small 6-Pin Package Surface Mount Tape & Reel Version Available The PLA140's combination of low on-resistance and high load current handling makes it suitable for a variety of industrial applications. Because Solid State Relays like the PLA140 have no moving parts, they offer faster, bounce-free switching in a more compact surface mount or though hole package than traditional electromechanical relays. Applications Approvals * Telecommunications * Telecomm Switching * Hook Switch * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security * Aerospace * Industrial Controls * Automotive * UL Certified Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part Number PLA140 PLA140S PLA140STR Switching Characteristics of Normally Open Devices Pin Configuration AC/DC Configuration 1 + Control - Control Do Not Use 6 2 5 3 4 Form-A Load Do Not Use IF Load DC Only Configuration + Control - Control Do Not Use DS-PLA140-R09 1 Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1,000/Reel) 6 2 5 3 4 90% + Load 10% ILOAD - Load ton www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA140 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Ratings 400 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameter Output Characteristics Load Current (Continuous) AC/DC Configuration DC Configuration Peak Load Current On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IF=5mA IL - - 250 350 500 mArms / mADC mADC mAP IF=5mA , t=10ms ILPK 5.5 1.5 - 8 3 1 ILEAK - IF=0mA , VL=50V, f=1MHz ton toff COUT - 0.4 0.19 18 3 1 - IL=250mA IF=5mA VR=5V IF IF VF IR 0.2 0.9 - 0.46 0.44 1.2 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA , IL=250mA IF=5mA , IL=350mA VL=400VP IF=5mA, VL=10V RON www.ixysic.com A ms pF R09 INTEGRATED CIRCUITS DIVISION PLA140 PERFORMANCE DATA* 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical IF for Switch Operation (IL=250mA) 20 Typical On-Resistance Distribution (N=50, IF=5mA, IL=250mA) 20 20 15 10 Device Count (N) Device Count (N) Device Count (N) 25 15 10 5 15 10 5 5 0 0.28 0.34 0.40 0.46 0.52 0.58 0.64 0.70 LED Current (mA) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 25 15 10 5 20 20 15 10 5 0 4.8 4.9 5.0 5.1 5.2 On-Resistance (:) 5.3 5.4 Typical Blocking Voltage Distribution (N=50, IF=0mA) 15 10 5 0 0 0.675 0.750 0.825 0.900 0.975 1.050 1.125 1.200 Turn-On Time (ms) 0.13 0.15 0.17 0.19 0.21 0.23 0.25 0.27 Turn-Off Time (ms) Typical LED Forward Voltage Drop vs. Temperature Typical Turn-On Time vs. LED Forward Current (IL=100mA) 1.6 1.6 442 448 454 460 466 472 478 Blocking Voltage (VP) 484 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 0.26 1.5 1.4 1.3 1.1 -40 0.60 1.0 0.8 0.6 0.4 0.0 -20 0 20 40 60 Temperature (C) 80 0.22 0.20 0.18 0.16 0 100 Typical IF for Switch Operation vs. Temperature (IL=100mA) 1.4 10 20 30 LED Current (mA) 40 50 0 Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mA) 0.26 1.3 Turn-On Time (ms) 0.56 0.54 0.52 0.50 0.48 0.46 1.2 1.1 1.0 0.9 0.8 0.7 0 20 40 60 Temperature (C) 80 100 0.5 -40 10 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mA) 0.24 0.22 0.20 0.18 0.16 0.6 -20 0.24 0.2 0.58 0.44 -40 1.2 Turn-Off Time (ms) 1.2 IF=50mA IF=20mA IF=10mA IF=5mA Turn-Off Time (ms) 1.4 Turn-On Time (ms) LED Forward Voltage (V) 4.7 Device Count (N) 20 Device Count (N) Device Count (N) 25 LED Current (mA) 0 0 1.235 1.240 1.245 1.250 1.255 1.260 1.265 LED Forward Voltage (V) -20 0 20 40 60 Temperature (C) 80 100 0.14 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA140 PERFORMANCE DATA* 0.3 8 0.2 7 6 5 0.1 0.0 -0.1 -0.2 3 -40 -0.3 -1.5 -20 0 20 40 60 Temperature (C) 80 100 275 225 200 175 150 125 100 -1.0 -0.5 0.0 0.5 Load Voltage (V) 1.0 1.5 -40 Typical Load Current vs. Load Voltage DC-Only Configuration (IF=5mA) 0.35 350 2.0 0.30 325 1.6 1.4 0.20 0.15 0.10 1.2 0.05 1.0 -40 0.00 -20 0 20 40 60 Temperature (C) 80 Load Current (mA) 1.8 80 500 70 Leakage Current (nA) 510 490 480 470 460 450 440 -40 -20 0 20 40 60 Temperature (C) 80 100 20 40 60 Temperature (C) 80 100 300 275 250 225 200 175 0.0 100 0 375 0.1 0.2 0.3 0.4 Load Voltage (V) 0.5 150 -40 0.6 Typical Leakage vs. Temperature Measured Across Pins 4&6 (VL=400V) -20 0 20 40 60 Temperature (C) 80 100 10s 100s Energy Rating Curve 1.2 60 Load Current (A) Load Current (A) 0.40 2.2 0.25 -20 Maximum Load Current vs. Temperature - DC-Only Configuration (IF=5mA) 2.4 Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) Maximum Load Current vs. Temperature - AC/DC Configuration (IF=5mA) 250 4 Typical On-Resistance vs. Temperature DC-Only Configuration (IF=5mA, IL=100mA) On-Resistance (:) Typical Load Current vs. Load Voltage AC/DC Configuration (IF=5mA) Load Current (mA) 9 Load Current (A) On-Resistance (:) Typical On-Resistance vs. Temperature AC/DC Configuration (IF=5mA, IL=100mA) 50 40 30 20 1.0 0.8 0.6 0.4 10 0 -40 -20 0 20 40 60 Temperature (C) 80 100 0.2 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION PLA140 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA140 / PLA140S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles PLA140 PLA140S 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA140 MECHANICAL DIMENSIONS PLA140 8.382 0.381 (0.330 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 0.127 (0.100 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) Pin 1 7.620 0.254 (0.300 0.010) 1.651 0.254 (0.065 0.010) 3.302 0.051 (0.130 0.002) 0.254 0.0127 (0.010 0.0005) 6.350 0.127 (0.250 0.005) 5.080 0.127 (0.200 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 0.076 (0.018 0.003) PLA140S 8.382 0.381 (0.330 0.015) 9.524 0.508 (0.375 0.020) Pin 1 0.635 0.127 (0.025 0.005) PCB Land Pattern 2.54 0.127 (0.100 0.005) 2.54 (0.10) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) Dimensions mm (inches) 1.651 0.254 (0.065 0.010) 6 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION PLA140 PLA140STR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) P1 = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-PLA140-R09 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/27/2018